CN117311533A - Touch control panel assembly - Google Patents

Touch control panel assembly Download PDF

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Publication number
CN117311533A
CN117311533A CN202210714156.0A CN202210714156A CN117311533A CN 117311533 A CN117311533 A CN 117311533A CN 202210714156 A CN202210714156 A CN 202210714156A CN 117311533 A CN117311533 A CN 117311533A
Authority
CN
China
Prior art keywords
touch
feedback
force sensing
assembly
pad assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210714156.0A
Other languages
Chinese (zh)
Inventor
叶财金
魏财魁
张振炘
林伟義
郑怀彬
张哲嘉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TPK Advanced Solutions Inc
Original Assignee
TPK Advanced Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TPK Advanced Solutions Inc filed Critical TPK Advanced Solutions Inc
Priority to CN202210714156.0A priority Critical patent/CN117311533A/en
Publication of CN117311533A publication Critical patent/CN117311533A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

A touch pad assembly includes a cover plate, a touch printed circuit board, and a piezoelectric force feedback sensing assembly. The touch printed circuit board is arranged below the cover plate and comprises a two-dimensional sensing component and a circuit aggregation layer. The circuit aggregation layer is positioned below the two-dimensional sensing component and comprises a force sensing circuit group and a touch feedback circuit group. The piezoelectric force feedback sensing component is arranged on the surface of the touch control printed circuit board, which is far away from the cover plate. The piezoelectric force feedback sensing assembly is configured to generate and provide a force sensing signal to the force sensing circuit set and is configured to receive a haptic feedback signal via the haptic feedback circuit set. Therefore, the whole thickness of the touch control plate component can be thinned, and meanwhile, the material cost is saved and the manufacturing flow is reduced.

Description

Touch control panel assembly
Technical Field
The disclosure relates to a touch pad assembly.
Background
The current trend in touch pad assemblies is from pure touch functionality to integration of touch, force sensing and haptic feedback. One known way of haptic feedback is by means of a Linear Resonant Actuator (LRA), for example chinese patent application publication No. 109669581. Another known tactile feedback approach is to use piezoelectric patches, such as us patent No. 10976824. However, the foregoing known techniques have problems of thicker thickness, and poor overall signal uniformity due to difficulty in assembling the mechanism to meet the flatness requirement.
Therefore, how to provide a touch pad assembly capable of solving the above-mentioned problems is one of the problems in the industry to be solved by the research and development resources.
Disclosure of Invention
Accordingly, an objective of the present disclosure is to provide a touch pad assembly that can solve the above-mentioned problems.
In order to achieve the above objective, according to one embodiment of the present disclosure, a touch pad assembly includes a cover plate, a touch printed circuit board, and a piezoelectric force feedback sensor assembly. The touch printed circuit board is arranged below the cover plate and comprises a two-dimensional sensing component and a circuit aggregation layer. The circuit aggregation layer is positioned below the two-dimensional sensing component and comprises a force sensing circuit group and a touch feedback circuit group. The piezoelectric force feedback sensing component is arranged on the surface of the touch control printed circuit board, which is far away from the cover plate. The piezoelectric force feedback sensing assembly is configured to generate and provide a force sensing signal to the force sensing circuit set and is configured to receive a haptic feedback signal via the haptic feedback circuit set.
In one or more embodiments of the present disclosure, the piezoelectric force feedback sensing element includes a plurality of force sensing electrode elements and a plurality of haptic feedback elements. The force sensing electrode assembly is arranged on the surface of the touch control printed circuit board, is connected with the force sensing circuit group and is configured to generate a force sensing signal. The touch feedback component is arranged on the surface of the touch control printed circuit board, connected with the touch feedback circuit group and configured to receive the touch feedback signal.
In one or more embodiments of the present disclosure, the force sensing electrode assemblies and the haptic feedback assemblies are staggered.
In one or more embodiments of the present disclosure, the force sensing electrode assembly is a strain gauge sensor.
In one or more embodiments of the present disclosure, the force sensing electrode assembly is composed of a pressure sensing carbon material.
In one or more embodiments of the present disclosure, the force sensing electrode assemblies are arranged in two directions parallel to the surface of the touch printed circuit board.
In one or more embodiments of the present disclosure, the two directions are perpendicular to each other.
In one or more embodiments of the present disclosure, each haptic feedback assembly includes a conductive gel layer and a piezoelectric sensor. The conductive adhesive layer is connected with the touch feedback circuit group. The piezoelectric sensor is arranged on the conductive adhesive layer and is configured to receive the touch feedback signal.
In one or more embodiments of the present disclosure, the thickness of the haptic feedback assembly is greater than the thickness of the force sensing electrode assembly.
In one or more embodiments of the present disclosure, the touch printed circuit board further includes a shielding layer. The shielding layer is arranged between the two-dimensional sensing component and the circuit aggregation layer.
In one or more embodiments of the present disclosure, the circuit assembly layer further includes another circuit layer. The other circuit layer is electrically independent from the force sensing circuit set and the tactile feedback circuit set.
In one or more embodiments of the present disclosure, the cover plate is opaque.
In summary, in the touch pad assembly disclosed in the disclosure, the force sensing circuit set and the haptic feedback circuit set are integrated in the circuit assembly layer of the touch printed circuit board, and the force sensing circuit set and the haptic feedback circuit set are respectively connected to the force sensing circuit set and the haptic feedback circuit set at one side of the touch printed circuit board, so that the overall thickness reduction of the touch pad assembly can be realized while the material cost is saved and the manufacturing process is reduced.
The above description is merely illustrative of the problems to be solved by the present disclosure, the technical means for solving the problems, the effects thereof and the like, and the specific details of the present disclosure are set forth in the following description and related drawings.
Drawings
The foregoing and other objects, features, advantages and embodiments of the present disclosure will be apparent from the following description of the drawings in which:
FIG. 1 is a perspective view of an electronic device according to an embodiment of the disclosure;
FIG. 2 is a schematic cross-sectional view of a touch pad assembly according to an embodiment of the disclosure;
FIG. 3 is a partial bottom view of a touch printed circuit according to an embodiment of the present disclosure;
FIG. 4 is an enlarged partial bottom view of a touch printed circuit and force sensing electrode assembly according to one embodiment of the present disclosure;
fig. 5 is an enlarged partial bottom view illustrating a touch printed circuit and a force sensing electrode assembly according to another embodiment of the present disclosure.
[ symbolic description ]
100 electronic device
110 host computer
120 display device
200 touch pad assembly
210 cover plate
220 touch control printed circuit board
220a surface
221 two-dimensional sensing component
221a first touch sensing electrode layer
221b second touch sensing electrode layer
222 circuit aggregation layer
222a force sensing circuit set
222b tactile feedback circuit set
222c circuit layer
230 connecting layer
240 piezoelectric force feedback sensing assembly
241,341,441 force sensing electrode assembly
242 tactile feedback assembly
242a conductive adhesive layer
242b piezoelectric sensor
250 masking layer
A1, A2, A3, A4: direction
Detailed Description
Various embodiments of the present disclosure are disclosed in the following figures, in which numerous practical details are set forth in the following description for purposes of clarity. However, it should be understood that these practical details are not to be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are not necessary. Furthermore, for the purpose of simplifying the drawings, some known and conventional structures and elements are shown in the drawings in a simplified schematic manner.
Referring to fig. 1, a perspective view of an electronic device 100 according to an embodiment of the invention is shown. As shown in fig. 1, in the present embodiment, the electronic device 100 includes a host 110, a display 120, and a touch pad assembly 200. The touch pad assembly 200 is disposed in the host 110 and is exposed through an opening of a housing of the host 110. The touch pad assembly 200 is an input device disposed on the host 110, but the invention is not limited thereto. In addition, the rectangular area of the touch pad assembly 200 formed by the length and the width can be elongated according to different models (i.e. the longer touch pad assembly 200), and the size is not limited to the length shown in fig. 1. In practical applications, the touch pad assembly 200 may also be an electronic product (e.g., a personal digital assistant, a keyboard … including a touch pad, etc.) using the touch pad as an input or operation interface. In other words, the concept of the touch pad assembly 200 of the present invention can be applied to electronic products using Ren Heyi touch pads as input or operation interfaces. The structure, function, and connection and actuation relationships of some of the elements included in the touch pad assembly 200 will be described in detail below.
Please refer to fig. 2 and fig. 3. Fig. 2 is a schematic cross-sectional view illustrating a touch pad assembly 200 according to an embodiment of the disclosure. Fig. 3 is a partial bottom view of a touch printed circuit according to an embodiment of the disclosure. As shown in fig. 2 and 3, in the present embodiment, the touch pad assembly 200 includes a cover 210, a touch printed circuit board 220, a connection layer 230, and a piezoelectric force feedback sensor assembly 240. The touch printed circuit board 220 is disposed under the cover 210 and connected to the cover 210 via the connection layer 230. The touch printed circuit board 220 includes a two-dimensional sensing element 221 and a circuit aggregation layer 222. The touch printed circuit board 220 is disposed under the cover 210.
In some embodiments, the material of the cover plate 210 comprises glass or plastic. In some embodiments, the plastic comprises a polyester film (Mylar), but the disclosure is not limited thereto. In some embodiments, cover 210 is opaque. For example, cover 210 is a dark colored mylar or dark colored baked good glass.
In some embodiments, the connection layer 230 is a pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA), but the disclosure is not limited thereto.
In some embodiments, the two-dimensional sensing device 221 includes a first touch sensing electrode layer 221a and a second touch sensing electrode layer 221b. The first touch sensing electrode layer 221a includes a plurality of first axial electrodes spaced apart from each other. The second touch sensing electrode layer 221b includes a plurality of second axial electrodes spaced apart from each other. The first touch sensing electrode layer 221a and the second touch sensing electrode layer 221b are electrically insulated by an insulating material such as the touch printed circuit board 220 itself. The "first axis" and the "second axis" extend along the X direction and the Y direction, respectively, for example. In other words, the first axial electrodes are conductive lines extending along the X direction and are arranged at intervals. The second axial electrodes are conductive lines extending along the Y direction and are arranged at intervals.
As shown in fig. 2 and 3, in the present embodiment, the circuit assembly layer 222 includes a force sensing circuit group 222a and a tactile feedback circuit group 222b, wherein portions of the force sensing circuit group 222a and the tactile feedback circuit group 222b located inside the touch printed circuit board 220 are shown by dotted lines, and portions exposed outside the touch printed circuit board 220 are shown by solid lines. The piezoelectric force feedback sensing element 240 is disposed on a surface 220a of the touch pcb 220 away from the cover 210. The piezoelectric force feedback sensing element 240 is configured to generate and provide a force sensing signal to the force sensing circuit set 222a and is configured to receive a haptic feedback signal via the haptic feedback circuit set 222b.
Specifically, the piezoelectric force feedback sensing element 240 includes a plurality of force sensing electrode elements 241 and a plurality of haptic feedback elements 242. The force sensing electrode assembly 241 is disposed on the surface 220a of the touch printed circuit board 220 away from the cover 210, connected to the force sensing circuit set 222a, and configured to generate a force sensing signal. The haptic feedback assembly 242 is disposed on a surface 220a of the touch printed circuit board 220 remote from the cover 210, connected to the haptic feedback circuit group 222b, and configured to receive the haptic feedback signal.
As can be seen from the above configuration, in the touch pad assembly 200 of the present embodiment, the force sensing circuit group 222a and the tactile feedback circuit group 222b are integrated in the circuit assembly layer 222 of the touch printed circuit board 220, and the force sensing circuit group 222a and the tactile feedback circuit group 222b are respectively connected to the force sensing circuit group 222a and the tactile feedback circuit group 222b at one side of the touch printed circuit board 220, so that the overall thickness reduction of the touch pad assembly 200 can be realized, and meanwhile, the material cost and the manufacturing process can be reduced.
As shown in fig. 2 and 3, in the present embodiment, the force sensing electrode assemblies 241 and the haptic feedback assemblies 242 are staggered. Thereby, the vibration uniformity of the haptic feedback assembly 242 may be improved.
In some embodiments, the force sensing electrode assembly 241 is a strain gauge sensor, but the disclosure is not limited thereto.
In some embodiments, as shown in fig. 2 and with reference to fig. 3, the force sensing electrode assembly 241 is disposed at a position where the force sensing circuit set 222a is exposed on a portion of the touch printed circuit board 220 away from the surface 220a of the cover 210. Accordingly, the force sensing electrode assemblies 241 are arranged in two directions A1, A2 parallel to the surface 220a of the touch printed circuit board 220. In some embodiments, the two directions A1 and A2 are perpendicular to each other. Therefore, the force sensing electrode assembly 241 can sense different strains in the two directions A1 and A2, thereby realizing force sensing.
As shown in fig. 2, in the present embodiment, each haptic feedback device 242 includes a conductive adhesive layer 242a and a piezoelectric sensor 242b. The conductive paste layer 242a connects the haptic feedback circuit group 222b. Piezoelectric sensor 242b is disposed on conductive adhesive layer 242a and configured to receive a tactile feedback signal. Piezoelectric sensor 242b vibrates upon receiving the haptic feedback signal to provide haptic feedback.
In some embodiments, the material of the conductive adhesive layer 242a includes a pressure sensitive adhesive, but the disclosure is not limited thereto.
As shown in fig. 2, in the present embodiment, the thickness of the haptic feedback assembly 242 is greater than the thickness of the force sensing electrode assembly 241. Thus, the thickness of the haptic feedback assembly 242 may create a gap to create a press deformation condition for the touch printed circuit board 220.
As shown in fig. 2, in the present embodiment, the touch printed circuit board 220 further includes a shielding layer 250. The shielding layer 250 is disposed between the two-dimensional sensing device 221 and the circuit aggregation layer 222. Therefore, the shielding layer 250 can effectively improve the electrical interference of the touch printed circuit board 220 integrating the two-dimensional sensing device 221 and the circuit assembly layer 222. In some embodiments, the material of the shielding layer 250 includes metal, but the disclosure is not limited thereto.
As shown in fig. 3, in the present embodiment, the circuit aggregation layer 222 further includes another circuit layer 222c. The other circuit layer 222c is electrically independent from the force sensing circuit set 222a and the haptic feedback circuit set 222b, and is configured to transmit other signals in the circuit assembly layer 222.
Referring to fig. 4, a partially enlarged bottom view of a touch printed circuit 220 and a force sensing electrode assembly 341 according to an embodiment of the disclosure is shown. As shown in fig. 4, in the present embodiment, the force sensing electrode assembly 341 is made of a pressure sensing carbon material and may be manufactured by a printing process. Each force sensing electrode assembly 341 comprises four separate pieces of pressure sensing carbon material; however, the pressure sensing signal can be processed by, for example, a Wheatstone bridge method, but not limited thereto. The pressure-sensitive carbon materials are annularly arranged along the directions A1 and A2. Specifically, as shown in fig. 4, the upper and lower blocks of the pressure-sensitive carbon material extend along the direction A1 and are aligned in the direction A2. The left and right blocks of pressure-sensitive carbon material extend along the direction A2 and are aligned in the direction A1. Therefore, the force sensing electrode assembly 341 can sense different strains in the two directions A1 and A2, thereby realizing force sensing.
Referring to fig. 5, a partially enlarged bottom view of a touch printed circuit 220 and a force sensing electrode assembly 441 according to another embodiment of the disclosure is shown. As shown in fig. 5, in the present embodiment, the force sensing electrode assembly 441 is composed of a pressure sensing carbon material and may be manufactured through a printing process. Each force sensing electrode assembly 441 comprises four separate pieces of pressure sensing carbon material; however, the pressure sensing signal can be processed by, for example, a Wheatstone bridge method, but not limited thereto. The pressure-sensitive carbon materials are annularly arranged along the directions A3 and A4. The directions A3, A4 are inclined with respect to the directions A1, A2. Specifically, as shown in fig. 5, the upper right and lower left blocks of the pressure-sensitive carbon material extend along the direction A3 and are aligned in the direction A4. The upper left and lower right blocks of pressure-sensitive carbon material extend along the direction A4 and are aligned in the direction A3. Therefore, the force sensing electrode assembly 441 can sense different strains in the two directions A3 and A4, thereby realizing force sensing.
As is apparent from the above description of the embodiments of the present disclosure, in the touch pad assembly of the present disclosure, by integrating the force sensing circuit group and the tactile feedback circuit group in the circuit assembly layer of the touch printed circuit board, and connecting the force sensing circuit group and the tactile feedback circuit group to one side of the touch printed circuit board respectively, the overall thickness reduction of the touch pad assembly can be achieved, and meanwhile, the material cost and the manufacturing process can be reduced.
While the present disclosure has been described with reference to the exemplary embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the disclosure, and it is therefore intended that the scope of the disclosure be limited only by the scope of the appended claims.

Claims (12)

1. A touch pad assembly, comprising:
a cover plate;
the touch control printed circuit board is arranged below the cover plate and comprises:
a two-dimensional sensing component; and
a circuit assembly layer under the two-dimensional sensing component and comprising a force sensing circuit group and a touch feedback circuit group; and
the piezoelectric force feedback sensing component is arranged on a surface of the touch printed circuit board, which is far away from the cover plate, wherein the piezoelectric force feedback sensing component is configured to generate and provide a force sensing signal to the force sensing circuit group and is configured to receive a touch feedback signal through the touch feedback circuit group.
2. The touch pad assembly of claim 1, wherein the piezoelectric force feedback sensing assembly comprises:
the force sensing electrode assemblies are arranged on the surface of the touch printed circuit board, are connected with the force sensing circuit group and are configured to generate force sensing signals; and
the touch control printed circuit board is provided with a plurality of touch control feedback components, and the touch control printed circuit board is provided with a touch control feedback circuit group.
3. The touch pad assembly of claim 2, wherein the plurality of force sensing electrode assemblies are staggered with respect to the plurality of tactile feedback assemblies.
4. The touch pad assembly of claim 2, wherein the plurality of force sensing electrode assemblies are strain gauge sensors.
5. The touch pad assembly of claim 2, wherein the plurality of force sensing electrode assemblies are comprised of a pressure sensing carbon material.
6. The touch pad assembly of claim 2, wherein the plurality of force sensing electrode assemblies are aligned in two directions parallel to the surface of the touch printed circuit board.
7. The touch pad assembly of claim 6, wherein the two directions are perpendicular to each other.
8. The touch pad assembly of claim 2, wherein each of the plurality of haptic feedback assemblies comprises:
a conductive adhesive layer connected with the touch feedback circuit group; and
and the piezoelectric sensor is arranged on the conductive adhesive layer and is configured to receive the touch feedback signal.
9. The touch pad assembly of claim 2, wherein a thickness of the plurality of tactile feedback assemblies is greater than a thickness of the plurality of force sensing electrode assemblies.
10. The touch pad assembly of claim 1, wherein the touch printed circuit board further comprises a shielding layer disposed between the two-dimensional sensing assembly and the circuit assembly layer.
11. The touch pad assembly of claim 1, wherein the circuit assembly layer further comprises another circuit layer electrically independent of the force sensing circuit set and the haptic feedback circuit set.
12. The touch pad assembly of claim 1, wherein the cover is opaque.
CN202210714156.0A 2022-06-22 2022-06-22 Touch control panel assembly Pending CN117311533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210714156.0A CN117311533A (en) 2022-06-22 2022-06-22 Touch control panel assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210714156.0A CN117311533A (en) 2022-06-22 2022-06-22 Touch control panel assembly

Publications (1)

Publication Number Publication Date
CN117311533A true CN117311533A (en) 2023-12-29

Family

ID=89287203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210714156.0A Pending CN117311533A (en) 2022-06-22 2022-06-22 Touch control panel assembly

Country Status (1)

Country Link
CN (1) CN117311533A (en)

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