JPH0745643A - Semiconductor element packaging method - Google Patents

Abstract

PURPOSE:To simplify the manufacturing process of a semiconductor element and, at the same time, to eliminate the need for gold bumps, etc., on electrodes by forming projections on a substrate by pressing the heated projections of a jig against the substrate and forming a semiconductor element mounting area by forming electrodes on the projections. CONSTITUTION:One main surface 1a of a substrate 1 is used for mounting a semiconductor element and a jig 3 with projections 2 are brought into contact with the other main surface of the substrate 1. The jig 3 is incorporated with a heater 4 which heats the projections 3. By pressing the heated projections 2 of the jig 3 against the main surface 1a of the substrate 1, projections are formed on the surface 1a. Then molded plastic film substrate for mounting semiconductor elements is obtained by forming a semiconductor element mounting area by forming electrodes at least on the projections of the molded plastic film substrate. Thereafter, an adhesive resin is applied to the semiconductor element mounting area. After applying the resin, a semiconductor element is mounted on the film substrate by aligning the electrodes of the semiconductor element with the electrodes on the projections.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element mounting method in which a semiconductor element is mounted on a plastic substrate via an adhesive resin.

[0002]

2. Description of the Related Art In recent years, various devices equipped with semiconductor elements have been developed. For example, there are a liquid crystal module, an EL panel, and the like, and this liquid crystal module is proposed as a COG method in which a semiconductor element is mounted on a glass substrate.

In recent years, light, thin, short and small liquid crystal modules have been required, and accordingly, it has been proposed to use a plastic film substrate instead of a glass substrate.

In the structure in which the semiconductor element is mounted on such a substrate, a technique for wire-bonding the wiring portion on the substrate and the semiconductor element has been established. A face-down method has also been proposed in which the wiring portion on the substrate is directly connected. For this connection, it has been proposed to use an anisotropic conductive film, a conductive paste, a rubber connector, or a photocurable resin (see Japanese Patent Publication No. 27180).

[0005]

However, in the COG type liquid crystal module adopting the plastic film substrate, since the respective electrodes of the semiconductor element and the substrate are directly connected, the manufacturing process is simplified. On the other hand, bumps made of gold or the like have to be formed on the electrodes, which causes a problem that the manufacturing cost increases due to the increase in the material cost.

[0006]

According to the method of mounting a semiconductor element of the present invention, the semiconductor element is fixed to the semiconductor element mounting region on one main surface of the plastic substrate by the following steps (a) to (f). Is characterized by. (A) A jig having a protrusion is brought into contact with the other main surface of the plastic substrate. (B) The protrusion is formed on the substrate by the protrusion heated while pressing the jig against the substrate. (C) An electrode is formed on the protruding portion to form a semiconductor element mounting region. (D) Adhesive resin is applied to the semiconductor element mounting region. (E) The semiconductor element is mounted through the adhesive resin while aligning the electrodes on the protrusion and the electrodes of the semiconductor element so as to face each other. (F) The semiconductor element is fixed on the substrate by solidifying the adhesive resin.

[0007]

According to the method of mounting a semiconductor element having the above structure, a jig having a protrusion is brought into contact with the other main surface of the plastic substrate, and the protrusion is heated by pressing the jig against the substrate. By forming a protrusion on the substrate and forming an electrode on the protrusion to form a semiconductor element mounting region, which directly connects the semiconductor element and the electrode of the substrate, the manufacturing process is simplified, and moreover, It is not necessary to form a bump or the like made of gold on the electrode, and as a result, the material cost is reduced and the manufacturing cost is reduced due to the simplification of the manufacturing process, and the manufacturing yield is improved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for mounting a semiconductor device according to the present invention will be described in detail below with reference to FIGS. In FIG. 1, reference numeral 1 is, for example, a transparent plastic film substrate, and a COG type liquid crystal module has a thickness of 0.1 to 0.3 m.
The range is preferably m, and since the plastic film substrate 1 generally has a high moisture permeability, it is desirable to coat the surface thereof with an epoxy resin or the like to prevent the moisture permeation. The substrate 1 has a film shape, but may have a sheet shape or a plate shape.

One main surface 1a of this substrate 1 is for mounting semiconductor elements, and the other main surface 1b is in contact with a jig 3 having a projection 2. The jig 3 is provided with a heater 4, and the heater 4 heats the protrusion 2 to form a protrusion 5 on the one main surface 1 a of the substrate 1 by pressing the jig 3. (See FIG. 2). It is preferable that the height of the protruding portion 5 is in the range of 7 to 15 μm in order to reduce or eliminate poor electrical connection.

In this example, in order to form the protruding portion 5 most efficiently and accurately, a recess corresponding to the protruding portion 2 is provided on the one main surface 1a side as well as the heater 4.
The jig 6 provided with a was arranged. However, the jig 6 can be used for molding without using the jig 6.

Next, an electrode 7 was formed on at least the projecting portion 5 of the molded plastic film substrate to form a semiconductor element mounting region, which was used as a semiconductor element mounting molded plastic film substrate 8 (see FIG. 3).

Thereafter, as shown in FIG. 4, an adhesive resin 9 was applied to the semiconductor element mounting region (see FIG. 4). The resin 9 is a photocurable resin made of epoxy, acrylic, modified acrylic or the like, and the coating method is a dispensing method, a printing method or the like.

Thereafter, as shown in FIG. 5, the semiconductor element 10 is mounted via the adhesive resin 9 while aligning the electrodes on the protrusion 5 and the electrodes of the semiconductor element 10 so as to face each other. did.

In the next step, while pressing the upper surface of the semiconductor element 10 with the pressing jig 11, the other main surface 1 is pressed.
Ultraviolet rays are irradiated from b, so that the electrodes on the protrusions 5 and the electrodes of the semiconductor element 10 are electrically connected to each other while the protrusions 5 are crushed. (See FIG. 7).

Thus, in the case of the conventional wire bonding, the electrodes are individually connected, whereas according to the semiconductor element mounting method of the above embodiment, the semiconductor element 10 and the electrode 7 of the substrate 8 are directly connected. Therefore, the electrodes are simultaneously connected to simplify the manufacturing process. Moreover, it is not necessary to form a bump or the like made of gold on the electrode, which reduces the material cost and simplifies the manufacturing process, thereby reducing the manufacturing cost.

Next, a method of mounting a semiconductor device of the present invention will be described with reference to FIG.
The COG type liquid crystal module will be described below.
The liquid crystal panel 12 in the figure is a plastic film substrate 1.
3 is a COG type liquid crystal module in which the semiconductor element 10 is mounted on 3, a display area 14 and a wiring area 15 for driving the display area. To manufacture this liquid crystal panel 12, two plastic film substrates 13 and 16 are used.
ITO is formed on each one of the main surfaces, and a plurality of transparent electrodes 17 are arranged in a line in the display area 14, whereby the transparent electrodes extend to the wiring area 15 and the extended transparent electrodes A wiring portion 18 was formed by sequentially stacking a Ni layer and an Au layer on the above. Therefore, the electrode 7 on the protrusion 5 is
Corresponds to the wiring section 18.

After that, an alignment film 19 is formed on the transparent electrodes in the display area 14, and the surface of the alignment film 19 is rubbed to set the orientation of the liquid crystal molecules in a predetermined direction. These two coated substrates 13 and 16 are
The transparent electrode lines 17 are arranged so as to intersect and face each other, and the liquid crystal 20 is injected between them to display the display area 1.
4 and the periphery of the display area 14 is further sealed by the seal portion 21.

The semiconductor element is mounted on the liquid crystal panel 12 having the above structure as follows. First, the liquid crystal panel 12 is ultrasonically cleaned, and then a liquid crystal orientation inspection is performed. This liquid crystal alignment inspection is performed by transmitting light through a polarizing plate. Next, the semiconductor element mounting region of the liquid crystal panel 12 is irradiated with ultraviolet rays to decompose and remove organic substances and the like adhering to the surface of this region. For this, a short wavelength around 184 nm and 254 nm is effective among the main emission wavelengths of a mercury xenon lamp. By this step, the contact angle of the glass surface of the semiconductor element mounting region is increased, and the adhesion of the ultraviolet curable resin to the substrate 13 is significantly improved. Thereafter, the face-down type semiconductor element mounting method according to the present invention is performed on the liquid crystal panel 12.

As described above, by adopting the semiconductor element mounting method of the present invention, a liquid crystal module satisfying the requirements of lightness, thinness, shortness and size can be stably manufactured at a low cost and a high manufacturing yield.

The present invention is not limited to the above embodiments, and various modifications and improvements can be made without departing from the scope of the present invention. For example, instead of using a photo-curable resin as an adhesive resin, a curable resin, an instant adhesive agent, or the like may be adopted, and in that case, it is not necessary to use a transparent plastic substrate.

[0021]

As described above, according to the semiconductor element mounting method of the present invention, a jig provided with a protrusion is brought into contact with a plastic substrate, and the protrusion is heated while pressing the jig against the substrate. The protrusions are formed on the substrate by the parts, and the electrodes are formed on the protrusions to form the semiconductor element mounting region, which directly connects the electrodes of the semiconductor element and the substrate, which makes the manufacturing process easier. It is simplified, and there is no need to form bumps or the like made of gold on the electrodes, and as a result,
Due to the reduction of the material cost and the simplification of the manufacturing process, the manufacturing cost is lowered and the manufacturing yield is improved.

By adopting the method for mounting a semiconductor element of the present invention in a liquid crystal module, a light and thin liquid crystal module can be stably manufactured at a low cost and a high manufacturing yield.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing a step of a method for mounting a semiconductor element in an example.

FIG. 2 is a schematic cross-sectional view showing a step in a method for mounting a semiconductor element in an example.

FIG. 3 is a schematic cross-sectional view showing a step in the semiconductor element mounting method of the example.

FIG. 4 is a schematic cross-sectional view showing a step in a method for mounting a semiconductor element in an example.

FIG. 5 is a schematic sectional view showing a step of a method for mounting a semiconductor element in an example.

FIG. 6 is a schematic cross-sectional view showing a step in a method for mounting a semiconductor element in an example.

FIG. 7 is a schematic cross-sectional view showing a step in a method of mounting a semiconductor element in an example.

FIG. 8 is a schematic cross-sectional view of a liquid crystal module semiconductor device in an example.

[Explanation of symbols]

 1 Plastic Film Substrate 2 Projections 3, 6 Jig 5 Projection 7 Electrode 9 Adhesive Resin 10 Semiconductor Element

Claims (1)

[Claims] 1. A method for mounting a semiconductor element, comprising fixing the semiconductor element to a semiconductor element mounting region on one main surface of a plastic substrate by the following steps (a) to (f). (A) A jig having a protrusion is brought into contact with the other main surface of the plastic substrate. (B) The protrusion is formed on one main surface of the substrate by the protrusion heated while pressing the jig against the substrate. (C) An electrode is formed on the protruding portion to form a semiconductor element mounting region. (D) Adhesive resin is applied to the semiconductor element mounting region. (E) The semiconductor element is mounted through the adhesive resin while aligning the electrodes on the protrusion and the electrodes of the semiconductor element so as to face each other. (F) The semiconductor element is fixed on the substrate by solidifying the adhesive resin.