JPH0745151A - Electronic parts, and method and apparatus for manufacturing the same - Google Patents

Abstract

PURPOSE:To prevent deformation of metal pieces and internal contact between them by forming a plurality of resin portions of a substrate body having the two metal pieces by sequentially injecting resin into those resin portions. CONSTITUTION:After a contactor 1 composed of a metal piece is disposed within a die, resin is injected to form a resin portion 3a. Subsequently, a contactor 2 is set on a semifinished product and resin is injected to form a resin portion 3b. Note that when forming the resin portion 3a, a cavity is formed beforehand, and resin is injected also into the cavity to form a head portion 4. Then, the adhesion between the resin portions 3a and 3b is firmly effected. Further, since the substrate body is formed in two divided stages, it is possible to perform resin injection with the contactors 1 and 2 being reliably positioned and it is also possible to reliably prevent the distortion of the metal pieces and mutual contact therebetween.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts such as switches and connectors, and a manufacturing method and manufacturing apparatus for the electronic parts. More specifically, the present invention relates to a highly accurate electronic component capable of preventing deformation of metal pieces and internal contact between metal pieces, and a manufacturing method and manufacturing apparatus for the electronic components.

[0002]

2. Description of the Related Art Electronic parts such as switches and connectors are
It is composed of two or more kinds of metal pieces and a synthetic resin substrate that supports these metal pieces, and is usually manufactured by the following method. That is, first, the metal piece is set in such a manner that the metal piece is erected in a groove formed in the lower mold and having a width slightly larger than the thickness of the metal piece. Then, the upper mold is set on the lower mold, and a synthetic resin such as PBT, polycarbonate, polyacetal or the like is injected into the space between the molds.

[0003]

However, in the conventional method, the metal piece is only positioned by the groove, and when the molten synthetic resin is injected at a resin pressure of 600 to 1000 kg / cm ² , the metal piece is only positioned. In some cases, the metal pieces are deformed and the distance between the metal pieces cannot be maintained at a predetermined value. This means that a predetermined distance between contacts cannot be secured in the case of a switch, which adversely affects the performance of the product. Further, in an extreme case, there is a problem that the metal pieces are internally contacted with each other and have functionally serious defects, so that they cannot be used as products.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic component, a method of manufacturing the electronic component, and a manufacturing apparatus for the electronic component, in which the drawbacks of the prior art are eliminated.
That is, an object of the present invention is to provide an electronic component capable of preventing deformation of metal pieces and internal contact between metal pieces, and a method and an apparatus for manufacturing the electronic component.

[0005]

An electronic component according to the present invention comprises at least two metal pieces and a synthetic resin substrate supporting the metal pieces, and the plurality of resins formed by successively injecting resin into the substrate. It is characterized by being composed of parts.

The method of manufacturing an electronic component according to the present invention is a method of manufacturing an electronic component comprising at least two metal pieces and a synthetic resin substrate that supports the metal pieces. A metal piece is placed on a first lower mold of a lower mold having a rotatable upper plate on which (b) two kinds of upper molds corresponding to the two kinds of lower molds are formed. The upper mold having the above-mentioned upper mold plate is set on the lower mold, and (c) is placed in the space formed by the upper mold and the lower mold via the resin injection passage formed in the upper mold. Inject synthetic resin, (d)
After a predetermined time has passed, the upper mold is moved upward, (e) the upper plate of the lower mold is rotated by 180 °, and (f) the first plate is rotated.
Another metal piece is placed on the semi-finished product for which the resin injection of the second time has been completed, (g) the upper mold is set on the lower mold, and (h) through the resin injection passage formed in the upper mold. Injecting synthetic resin into the space formed by the upper mold and the lower mold,
(I) It is characterized by including moving the upper mold upward after a lapse of a predetermined time.

Further, the electronic component manufacturing apparatus of the present invention is
A lower mold having a rotatable upper plate on which two types of lower molds are formed, and two types of upper molds corresponding to the two types of lower molds are formed. An upper mold having a resin injection passage for injecting a synthetic resin into a space formed by the mold, a rotating mechanism for rotating the upper plate, and a molten synthetic resin in the resin injection passage of the upper mold. It is characterized by comprising a resin supply mechanism for supplying pressure.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component of the present invention, a method of manufacturing the electronic component, and an apparatus for manufacturing the electronic component will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of an embodiment of an electronic component of the present invention, and FIG. 2 is a sectional explanatory view of the same.

The embodiment shown in FIG. 1 represents an opposing switch, and is a contactor 1 made of polycarbonate or the like.
The contactor 2 has a structure in which it is supported by a synthetic resin base body 3. The base 3 can be made of a synthetic resin such as PBT (polybutylene terephthalate), nylon, polycarbonate, polyacetal or the like.

As shown in FIG. 2, the electronic component of the present invention has a plurality of resin portions 3 formed by sequentially injecting synthetic resin.
It is characterized in that it is composed of a and 3b. By thus forming the base body 3 in two stages, resin injection can be performed with the contact pieces 1 and 2 which are metal pieces being reliably positioned, so that the distortion and mutual contact of the metal pieces can be ensured. Can be prevented.

In the embodiment shown in FIG. 2, after the contactor 1 is placed in the mold, resin is injected to form the resin portion 3a,
Then, the contactor 2 is set on the obtained semi-finished product (the vertical direction is reversed in FIG. 2, but the contactor 1 is on the lower side at the time of manufacture), and resin is injected to form the resin portion 3b. Form. In this case, it is preferable to form a recess when forming the resin portion 3a and to inject resin into the recess when forming the resin portion 3a to form the head 4. When the head portion 4 is formed, the resin portions 3a and 3b are firmly fixed to each other, and the accident that the resin portion 3b falls out can be reliably prevented.

In FIG. 3, the number of metal pieces is 3, and the number of bases is 3.
It is a cross-sectional explanatory drawing of the electronic component produced by resin injection of a step. Also in this case, the head portion 14 is formed on the resin portion 13c formed by the resin injection in the third stage to prevent the resin portion from coming off. In FIG. 3, 13a is a resin portion formed by the first-stage resin injection, and 13b is a resin portion formed by the second-stage resin injection.

The electronic parts of the present invention include not only the above-mentioned counter switch but also all types such as connectors, sliding brushes, etc. that support metal pieces with synthetic resin. The number of resin molding steps is not limited to two or three, and may be four or more.

Further, the material of the metal piece and the kind of synthetic resin are not particularly limited, and can be appropriately selected according to the application.

Next, an electronic component manufacturing apparatus of the present invention will be described with reference to FIGS.

FIG. 4 is a plan view of the lower mold in the electronic component manufacturing apparatus of the present invention, and FIG. 5 is a plan view of the upper mold.

The lower mold 5 is provided with an upper plate 14 on which a lower mold 9 for forming the base 3 is formed. The upper plate 14 is arranged in an opening 8 formed in the lower mold plate 7. It is set up. Eight lower molds 9 are formed on the surface of the upper plate 14, and these lower molds 9 are arranged in point symmetry so that four lower molds face each other. That is, when the upper plate 14 is rotated by 180 °, the lower mold in the same state as before is brought to the same position. As shown in FIG. 8, the upper plate 14 is rotated by a rotating mechanism (not shown) such as a motor via a gear 10 provided at one end of the shaft of the upper plate 14.

Reference numeral 11 in FIG. 5 indicates an ejector plate. A plurality of pins 12 (see FIG. 8) are fixed to the ejector plate 11, and these pins 12 pass through the holes formed in the upper plate 14 of the lower mold 5. Then, by raising the ejector plate 11, the pin 12 is raised, and the pin 1
The frame 15 in which the metal pieces are formed in a row by 2 is lifted up on the upper plate 14, and during that, the rotating operation of the upper plate 14 and the conveying operation of the frame 15 are performed.

The lower mold 5 according to this embodiment is a frame 1
A cutting part 16 for cutting the product from 5 is provided on the downstream side of the upper plate 14.

As shown in FIGS. 6 to 7, the upper die 20 has an upper die plate 22 on which an upper die 21 corresponding to the lower die 9 of the lower die 5 and a punch for cutting are fixed. It includes a receiving plate (runner plate) 23 to be placed, a runner strip plate 24 for removing the molded runner, and a mounting plate 25.

The plates 21, 22, 23, 2 described above
A resin injection passage 26, which is a passage for the synthetic resin from a resin supply mechanism (not shown) that melts the synthetic resin and supplies the molten resin under pressure, is formed in each of 4 and 25. The resin injection path 26 reaches the upper mold 21, and the lower mold 9
A synthetic resin is injected into the space formed by the upper mold 21.

In FIG. 8, 27 is a bearing plate, which is the upper plate 14 of the lower mold 6 and the receiving plate 2.
8 (see FIG. 5), which allows the lower mold 6 to rotate smoothly.

Next, a method of manufacturing the electronic component of the present invention will be described.

First, the first lower mold formed on the upper plate 14 of the lower mold 5 (the mold located above in FIG. 4).
Then, the metal pieces supported in a line by the frame 15 are placed.

Then, the upper mold 20 having the upper mold plate 22 having the upper mold corresponding to the first lower mold is set on the lower mold 5.

After that, a synthetic resin in a molten state is pressure-injected into a space formed by the upper mold and the lower mold through a resin injection passage 26 formed in the upper mold 20.

After the predetermined time has elapsed and the synthetic resin in the molten state has solidified, the upper mold is moved upward.

Next, the ejector plate 11 of the lower mold 5 is raised to lift the frame 15 to a predetermined height. In this state, the second gripping portion of the gripping / conveying mechanism gripping the frame 15 is released, the first gripping portion is moved by a predetermined distance, and the frame 15 is moved to the right in FIG. In the case of this embodiment, the moving distance is the length of four metal pieces. After the movement of the first grip portion, the frame is gripped again by the second grip portion. The first gripping portion then releases the grip and returns to the original position, and grips the frame again at that position. Then, the ejector plate 11 and the grip
As the transport mechanism descends, another metal piece is placed on the semi-finished product on which the first resin injection has been completed.

Thereafter, similarly, the upper die is set, the resin is injected, and the upper die is moved upward to complete the formation of the substrate. However, at this stage, since the electronic component is still supported by the frame, it is separated from the frame by the cutting portion after being conveyed rightward twice.

[0031]

As described above, in the electronic component of the present invention, the injection of the synthetic resin forming the base is performed in multiple stages, and the resin is injected with the metal piece accurately positioned. Therefore, the metal pieces are not deformed by the injection pressure of the synthetic resin and do not come into contact with each other, and a highly accurate electronic component can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of an electronic component of the present invention.

FIG. 2 is a cross-sectional explanatory view of the embodiment shown in FIG.

FIG. 3 is a sectional explanatory view of another embodiment of the electronic component of the present invention.

FIG. 4 is an explanatory plan view of a lower mold in the electronic component manufacturing apparatus of the invention.

5 is a cross-sectional explanatory view of the lower die shown in FIG. 4 viewed from the direction A. FIG.

FIG. 6 is an explanatory plan view of the upper mold in the electronic component manufacturing apparatus of the invention.

FIG. 7 is an explanatory cross-sectional view of the upper die shown in FIG. 6 viewed from the B direction.

FIG. 8 is a partial perspective view of the lower mold shown in FIG.

FIG. 9 is a partial plan view of the lower mold shown in FIG.

[Explanation of symbols]

 1, 2 Contactor 3 Base 5 Lower mold 9 Lower mold 14 Upper plate 20 Upper mold 21 Upper mold 22 Upper mold plate 26 Resin injection path

Claims (6)

[Claims] 1. A synthetic resin substrate comprising at least two metal pieces and a metal resin supporting the metal pieces, wherein the substrate is composed of a plurality of resin portions formed by sequentially injecting resin. Electronic components to do. 2. The electronic component according to claim 1, wherein one of the plurality of resin portions has a head portion for preventing it from coming off. 3. A method of manufacturing an electronic component comprising at least two metal pieces and a synthetic resin substrate supporting the metal pieces, wherein the rotatable upper plate has (a) two types of lower molds. A metal piece is placed on a first lower mold of a lower mold having (b) an upper mold plate on which two types of upper molds corresponding to the two types of lower molds are formed. A mold is set on the lower mold, (c) a synthetic resin is injected into a space formed by the upper mold and the lower mold through a resin injection passage formed in the upper mold, (d) After a predetermined time has passed, the upper mold is moved upward, and (e) the upper plate of the lower mold is rotated by 180 °.
Rotating, (f) placing another metal piece on the semi-finished product on which the first resin injection has been completed, (g) setting the upper mold on the lower mold, and (h) forming the upper mold. A synthetic resin is injected into a space formed by the upper mold and the lower mold via the resin injection path, and (i) the upper mold is moved upward after a lapse of a predetermined time. And the manufacturing method of electronic parts. 4. The metal piece is supplied onto an upper plate of a lower mold by a frame punched so that a plurality of metal pieces are arranged in a line, and the metal piece is provided after the steps (d) and (i). The manufacturing method according to claim 3, further comprising the step of separating from the frame. 5. A lower mold having a rotatable upper plate on which two kinds of lower molds are formed, and two kinds of upper molds corresponding to the two kinds of lower molds are formed. An upper die having a resin injecting passage for injecting a synthetic resin into a space formed by the die and the upper die, a rotating mechanism for rotating the upper plate, and melting in the resin injecting passage of the upper die. An apparatus for manufacturing an electronic component, comprising: a resin supply mechanism for supplying a synthetic resin in a state under pressure. 6. The manufacturing apparatus according to claim 5, further comprising a cutting mechanism for cutting the metal pieces from a frame punched so that the plurality of metal pieces are arranged in a line.