JPH0744863U - Membrane switch device with electronic parts - Google Patents

Membrane switch device with electronic parts

Info

Publication number
JPH0744863U
JPH0744863U JP7559493U JP7559493U JPH0744863U JP H0744863 U JPH0744863 U JP H0744863U JP 7559493 U JP7559493 U JP 7559493U JP 7559493 U JP7559493 U JP 7559493U JP H0744863 U JPH0744863 U JP H0744863U
Authority
JP
Japan
Prior art keywords
spacer
hole
substrate
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7559493U
Other languages
Japanese (ja)
Other versions
JP2511733Y2 (en
Inventor
敏博 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ishii Hyoki Co Ltd
Original Assignee
Ishii Hyoki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishii Hyoki Co Ltd filed Critical Ishii Hyoki Co Ltd
Priority to JP7559493U priority Critical patent/JP2511733Y2/en
Publication of JPH0744863U publication Critical patent/JPH0744863U/en
Application granted granted Critical
Publication of JP2511733Y2 publication Critical patent/JP2511733Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Push-Button Switches (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】 (修正有) 【目的】 構造簡単でコンパクト化され、且つ製造コス
トの低減化の図れる電子部品付メンブレンスイッチ装置
を提供する。 【構成】 スイッチ群の接点に関連したプリント配線が
上面に施され、且つ該プリント配線と連結するリード線
用の多数の透孔が穿設された基板1を有し、基板1の上
面に対し押出発泡成形ポリプロピレンからなる一定肉厚
のスペーサ2を重設し、スペーサ2の厚さ方向へ比較的
大きな寸法の透孔2aを設け、該透孔内にはスイッチの
構成部品としてクリック板、押し板等を収納し、透孔2
aと隣接する箇所に対し発光ダイオード9を収納するた
めの比較的小さな透孔を基板の側からスペーサ2側へ対
応一致する状態に穿設し、プリント配線と連結する発光
ダイオード9のリード線9aを基板の裏面側てU字状に
折り曲げ、基板1の透孔及びスペーサの透孔を利用し上
向きに収納し、スペーサ2上面には透光可能な被膜シー
ト3を設けた。
(57) [Summary] (Correction) [Objective] To provide a membrane switch device with an electronic component, which has a simple structure, is made compact, and can reduce the manufacturing cost. A printed wiring board associated with contacts of a switch group is provided on an upper surface of the printed wiring board, and a plurality of through holes for lead wires connected to the printed wiring board are formed in the printed wiring board. A spacer 2 of extruded foam molded polypropylene having a constant thickness is stacked, and a through hole 2a having a relatively large size is provided in the thickness direction of the spacer 2, and a click plate and a push member are provided in the through hole as a switch component. Stores plates, etc.
A lead wire 9a of the light-emitting diode 9 is formed in a position adjacent to a to form a relatively small through hole for accommodating the light-emitting diode 9 in a corresponding state from the substrate side to the spacer 2 side and connects with the printed wiring. Was bent in a U-shape on the back side of the substrate, and was housed upward using the through hole of the substrate 1 and the through hole of the spacer, and the translucent coating sheet 3 was provided on the upper surface of the spacer 2.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は主として制御盤の操作スイッチ部として利用される電子部品付メンブ レンスイッチ装置に関する。 The present invention mainly relates to a membrane switch device with an electronic component used as an operation switch portion of a control panel.

【0002】[0002]

【従来の技術】[Prior art]

多数の電子回路用スイッチを平面状に一体配設してなるメンブレンスイッチ装 置は従来より存在している。 しかして、該スイッチ装置に対しスイッチ群に関連した電子部品であるダイオ ードや抵抗等を装着する際は、通常該スイッチ装置の他に前記電子部品等を装着 した別の基板を形成し、該基板と前記スイッチ装置とを適宜結線するようになし ている。 Membrane switch devices that have a large number of electronic circuit switches integrally arranged in a plane have been available. Therefore, when mounting a diode, a resistor, or the like, which is an electronic component related to the switch group, to the switch device, usually, another board on which the electronic component or the like is mounted is formed in addition to the switch device The substrate and the switch device are appropriately connected.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

上記スイッチ装置の有用性を増大させるには、該装置に対しスイッチ群に関連 する電子部品を簡易且つコンパクトに装着することが望まれる。 しかし、上記した従来の電子部品装着手段では未だ十分なるコンパクト化が図 れず、又スイッチ装置以外に電子部品の装着される基板が必要となるなど構造が 複雑化し、コスト高となる等の問題がある。 In order to increase the usefulness of the switch device, it is desirable to mount the electronic components related to the switch group in the device simply and compactly. However, the above-mentioned conventional electronic component mounting means is not yet sufficiently compact and requires a substrate on which electronic components are mounted in addition to the switch device, thus complicating the structure and increasing the cost. is there.

【0004】 本考案は斯有る問題点を解消させるためになされたもので、構造が簡易且つコ ンパクト化し、しかも製造コストの低廉性を可能ならしめるものとした電子部品 付メンブレンスイッチ装置を提供することを目的とする。The present invention has been made to solve the above problems, and provides a membrane switch device with an electronic component having a simple structure, a compact structure, and a low manufacturing cost. The purpose is to

【0005】[0005]

【課題を解決するための手段】[Means for Solving the Problems]

本考案は、スイッチ群の接点に関連したプリント配線が上面に施され、且つ該 プリント配線と連結するリード線用の多数の透孔が穿設された基板を有し、該基 板の上面に対し押出発泡成形ポリプロピレンからなる一定肉厚のスペーサを重設 し、上記スペーサの厚さ方向へ比較的大きな寸法の透孔を設け、該透孔内にはス イッチの構成部品としてクリック板、押し板等を収納し、上記押し板の左右端縁 部には縦溝を穿設し、一方クリック板の左右端は垂直方向へ一定高さ立ち上がる 突起片を形成して該突起片を上記押し板の縦溝内に嵌入するようにし、上記透孔 と隣接する箇所に対し発光ダイオードを収納するための比較的小さな透孔を基板 の側からスペーサ側へ対応一致する状態に穿設し、プリント配線と連結する発光 ダイオードのリード線を基板の裏面側でU字状に折り曲げ、上記基板の透孔及び スペーサの透孔を利用し上向きに収納し、スペーサ上面には透光可能な被覆シー トを設けたことを特徴とする。 The present invention has a substrate on which printed wirings related to contacts of a switch group are provided, and a large number of through holes for lead wires connected to the printed wirings are formed on the upper surface of the substrate. On the other hand, a spacer of a constant thickness made of extruded foamed polypropylene is stacked, and a relatively large-sized through hole is provided in the thickness direction of the spacer. A plate or the like is housed, and vertical grooves are formed in the left and right edges of the push plate, while the left and right ends of the click plate are formed with protrusions that rise vertically to a certain height. Of the printed wiring board.A relatively small through hole for accommodating the light emitting diode is formed in a position adjacent to the above through hole so as to correspond from the substrate side to the spacer side. The light emitting diode connected to The bent line is bent in a U shape on the back side of the substrate and is housed upward by using the through hole of the substrate and the through hole of the spacer, and a translucent cover sheet is provided on the upper surface of the spacer. To do.

【0006】[0006]

【作用】[Action]

本考案品ではメンブレンスイッチ装置を構成する基板が電子部品装着用として 共用されるものとなる。 又、電子部品のリード先端を直接に前記基板の厚み方向の透孔に嵌入させる際 前記リードをなるべく短い一定長に切断し、適宜屈曲させるようになす。これに より本考案品は可及的に薄厚のものになる。 In the product of the present invention, the substrate constituting the membrane switch device is commonly used for mounting electronic parts. Also, when the tip ends of the leads of the electronic component are directly fitted into the through holes in the thickness direction of the substrate, the leads are cut into a fixed length as short as possible and bent appropriately. This makes the product of the present invention as thin as possible.

【0007】[0007]

【実施例】【Example】

図1は本考案品の表側を示す斜視図、図2は同品の裏面を示す斜視図、及び図 3は同品の断面構造を示す説明図である。 図に於て、1は基板、2は基板1の上面に重設したスペーサ、そして3はスペ ーサ2の上面に重設した被覆シートである。 FIG. 1 is a perspective view showing the front side of the product of the present invention, FIG. 2 is a perspective view showing the back surface of the product, and FIG. 3 is an explanatory view showing a sectional structure of the product. In the figure, 1 is a substrate, 2 is a spacer that is provided on the upper surface of the substrate 1, and 3 is a cover sheet that is provided on the upper surface of the spacer 2.

【0008】 前記基板1は通常使用される比較的硬質の材料で形成されてなり、図3に示す ように、少なくともその上面には次述するスイッチの接点に関連したプリント配 線4を施すようになす。尚、本例では基板1の裏面にもプリント配線5が施して ある。The substrate 1 is formed of a relatively hard material which is usually used, and as shown in FIG. 3, at least the upper surface of the substrate 1 is provided with a printed wiring line 4 associated with the contacts of the switch described below. Eggplant In this example, the printed wiring 5 is also provided on the back surface of the substrate 1.

【0009】 前記スペーサ2は一定肉厚を有し、該肉厚内にスイッチ6構成部品を装設する べき方形状透孔2aが厚み方向に多数形成されている。本例のスイッチ6構成部 品は+接点6a、−接点6b、クリック板6c及び押し板6dからなる。又、前 記クリック板6cは電導性の弾性薄板からなっていて、弾性変形する際に「カチ ッ」という音を発するように成してある。前記スペーサ2の材質は押出発泡成形 ポリプロピレンを使用してスペーサの加工を容易になさしめ、低廉性に優れたも のとしてある。The spacer 2 has a constant thickness, and a large number of rectangular through holes 2 a for mounting the switch 6 components are formed in the thickness in the thickness direction. The components of the switch 6 of this example include a plus contact 6a, a minus contact 6b, a click plate 6c and a push plate 6d. Further, the above-mentioned click plate 6c is made of an electrically conductive elastic thin plate, and is configured to emit a clicking sound when elastically deformed. As the material of the spacer 2, extruded foamed polypropylene is used, which facilitates the processing of the spacer and is inexpensive.

【0010】 又、前記被覆シート3は撓曲自在な合成樹脂剤からなりスイッチ6構成部品の 抜け出しを規制する等の役目を果たすもので、その表面には着色がなされると共 に、スイッチ6の存在位置を表示する方形枠3aやスイッチ名称を示す文字3b 等が記入されている。The cover sheet 3 is made of a flexible synthetic resin agent and has a function of restricting the escape of constituent parts of the switch 6. The surface of the cover sheet 3 is colored, and the switch 6 is also colored. A rectangular frame 3a for indicating the position where the switch is present, characters 3b for indicating the switch name, etc. are entered.

【0011】 上記構成がスイッチ6群を平面配置したメンブレンスイッチ装置であるが、本 考案は該装置に対し前記スイッチ6群に関連した電子部品、例えばダイオード、 抵抗等を一定態様に装着したものになすのである。The above-mentioned configuration is a membrane switch device in which switches 6 are arranged in a plane, but the present invention is a device in which electronic parts related to the switches 6 such as diodes and resistors are mounted in a fixed manner on the device. Eggplant.

【0012】 ここで上記の電子部品をメンブレンスイッチ装置に装着する際の一例を説明す る。即ち、ダイオードを装着する際は予め図3に示すように、基板1にあってダ イオードを装着するべき箇所にその厚み方向の透孔を対となるように形成し、各 透孔には鍔付の電導環7を嵌入させて前記プリント配線4、5に適宜連結させる ようになす。Here, an example of mounting the above electronic component on the membrane switch device will be described. That is, when the diodes are mounted, as shown in FIG. 3, through holes are formed in the substrate 1 at the positions where the diodes are to be mounted so as to form pairs of through holes in the thickness direction, and each through hole has a collar. A conductive ring 7 is attached so as to be appropriately connected to the printed wirings 4 and 5.

【0013】 そして、装着すべきダイオード8のリード8aを適宜長さに切断した後、各リ ード8aを概略90度に屈曲させるようになし、次いで基板1が単独状態にある 時ダイオード8を一定配置とした状態で各リード8a先端を前記電導環7、7に 挿し込み、該先端を基板1の上面に一致させ、その後リード8a先端と電導環7 をはんだ付け等により結合させるようになす。尚、抵抗を装着する際もダイオー ドに準じて行い得る。Then, after cutting the lead 8a of the diode 8 to be mounted to an appropriate length, each lead 8a is bent at about 90 degrees, and then when the substrate 1 is in the single state, the diode 8 is removed. The tips of the leads 8a are inserted into the conductive rings 7 and 7 in a fixed arrangement, the tips are aligned with the upper surface of the substrate 1, and then the tips of the leads 8a and the conductive ring 7 are joined by soldering or the like. . It should be noted that the resistance may be attached in accordance with the diode.

【0014】 又、発光ダイオード(LED)9を装着する際は、同図に示すように基板1の 厚み方向が少し大径の透孔1aを形成しておくと共に、前述同様の電導環7を対 となるように設ける。そして、装着すべき発光ダイオード9の各リード9aを適 宜長さに切断した後、これらリード9a...を概略180度屈曲させるように なし、基板1が単独状態にある時該ダイオード9が一定配置となるように各リー ド9a先端と電導環7とをはんだ付け等により結合させるようになす。When the light emitting diode (LED) 9 is mounted, the through hole 1a having a slightly larger diameter in the thickness direction of the substrate 1 is formed as shown in FIG. It is provided in pairs. Then, after cutting each lead 9a of the light emitting diode 9 to be mounted to an appropriate length, these leads 9a. . . Is bent approximately 180 degrees, and the tips of the leads 9a and the conductive ring 7 are joined by soldering or the like so that the diodes 9 are arranged in a fixed state when the substrate 1 is in a single state.

【0015】 他方、スペーサ2に於ける発光ダイオード9の位置すべき空所になす必要があ り、このため予めスペーサ2の該箇所には厚み方向の透孔2bを形成するように なす。On the other hand, it is necessary to form a space in the spacer 2 in which the light emitting diode 9 should be located. Therefore, a through hole 2b in the thickness direction is formed in advance in the spacer 2 at that position.

【0016】 そしてこれらの作業の後、基板1上面にスペーサ2を重設するのである。この 際、本例ではスペーサ2として押出発泡成形ポリプロピレンを用いてあることか ら、該重設作業に於て図3に示すようなはんだの盛り上がりpは何等の支障も生 じさせない。ただし、該スペーサ2が他の硬質の材料であれば前記はんだの盛り 上がりpに対処するためスペーサ2等の加工が必要となる。After these operations, the spacer 2 is placed on the upper surface of the substrate 1 in an overlapping manner. At this time, in this example, since extruded foamed polypropylene is used as the spacer 2, the solder swelling p as shown in FIG. 3 does not cause any trouble in the heavy installation work. However, if the spacer 2 is made of another hard material, it is necessary to process the spacer 2 or the like in order to cope with the swelling p of the solder.

【0017】 又、発光ダイオード9の真上となる被覆シート3の部位3cは透光可能な状態 になす。 更に本例のように多数の発光ダイオード9を装着する時は、図1に示すように 各ダイオード9に対応させてその機能を一覧表3dとして表示するのが良い。Further, the portion 3c of the cover sheet 3 which is directly above the light emitting diode 9 is made in a light transmissive state. Further, when a large number of light emitting diodes 9 are mounted as in this example, it is preferable to display the function as a list 3d corresponding to each diode 9 as shown in FIG.

【0018】 尚、他の電子部品を装着する際の例は省略してあるが、前記ダイオード8、9 等に準じた構成とすれば良い。 上記の本考案品は薄板状で構造簡易なるものであるが、基板1及びスペーサ2 が強度部材として機能するため堅牢なるものである。Although an example of mounting other electronic components is omitted, it may be configured according to the diodes 8 and 9 and the like. The above-described product of the present invention is thin and has a simple structure, but is robust because the substrate 1 and the spacer 2 function as a strength member.

【0019】[0019]

【考案の効果】[Effect of device]

以上からなる本考案は、スイッチ群を平面配置したメンブレンスイッチ装置に 電子部品を直接に装着する構成であるから、電子部品を装着するための別の基板 とか該基板とメンブレンスイッチ装置との相対位置を規制するための支持部材等 が不要となって、構造が簡略化すると共に全体の大きさ(特に厚さ)が極めてコ ンパクト化するものとなり、製造コストを大幅に低廉化させ得るのである。 According to the present invention, which is configured as described above, electronic components are directly mounted on a membrane switch device in which switches are arranged in a plane. Therefore, another substrate for mounting electronic components or a relative position between the substrate and the membrane switch device is mounted. This eliminates the need for a supporting member for regulating the structure, simplifies the structure, and makes the overall size (particularly the thickness) extremely compact, which can significantly reduce the manufacturing cost.

【0010】 尚、スペーサを押出発泡成形ポリプロピレンとすることは、スペーサ自体の加 工、及び基板とスペーサとの重設が極めて容易に行え、より一層の低廉化を可能 となす上で著効がある。The use of extrusion-foam-molded polypropylene as the spacer is extremely effective in that the spacer itself can be easily processed and the substrate and the spacer can be superposed on each other, and the cost can be further reduced. is there.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案品の表側を示す斜視図である。FIG. 1 is a perspective view showing the front side of a device of the present invention.

【図2】同品の裏側を示す斜視図である。FIG. 2 is a perspective view showing the back side of the same product.

【図3】同品の断面構造を示す説明図である。FIG. 3 is an explanatory view showing a cross-sectional structure of the same product.

【符号の説明】[Explanation of symbols]

1 基板 2 スペーサ 2a 透孔 4、5 プリント配線 6 スイッチ 8、9 ダイオード 1 substrate 2 spacer 2a through hole 4, 5 printed wiring 6 switch 8, 9 diode

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 スイッチ群の接点に関連したプリント配
線が上面に施され、且つ該プリント配線と連結するリー
ド線用の多数の透孔が穿設された基板を有し、該基板の
上面に対し押出発泡成形ポリプロピレンからなる一定肉
厚のスペーサを重設し、上記スペーサの厚さ方向へ比較
的大きな寸法の透孔を設け、該透孔内にはスイッチの構
成部品としてクリック板、押し板等を収納し、上記押し
板の左右端縁部には縦溝を穿設し、一方クリック板の左
右端は垂直方向へ一定高さ立ち上がる突起片を形成して
該突起片を上記押し板の縦溝内に嵌入するようにし、上
記透孔と隣接する箇所に対し発光ダイオードを収納する
ための比較的小さな透孔を基板の側からスペーサ側へ対
応一致する状態に穿設し、プリント配線と連結する発光
ダイオードのリード線を基板の裏面側でU字状に折り曲
げ、上記基板の透孔及びスペーサの透孔を利用し上向き
に収納し、スペーサ上面には透光可能な被覆シートを設
けたことを特徴とする電子部品付メンブレンスイッチ装
置。
1. A printed circuit board, which is provided with printed wirings related to contacts of a switch group, on a top surface thereof, and has a large number of through holes for lead wires connected to the printed wiring board. On the other hand, a spacer having a constant thickness made of extruded foamed polypropylene is stacked, and a through hole having a relatively large size is provided in the thickness direction of the spacer, and a click plate and a push plate as a switch component are provided in the through hole. Etc., and vertical grooves are formed in the left and right edge portions of the push plate, while the left and right ends of the click plate form projection pieces that rise vertically to a certain height, and the projection pieces are attached to the push plate. A relatively small through hole for accommodating the light emitting diode is formed in a position adjacent to the above through hole so that the light emitting diode is accommodated in the vertical groove so as to correspond from the side of the substrate to the side of the spacer. LED leads to be connected An electronic device characterized in that a wire is bent in a U-shape on the back surface side of a substrate and is housed upward by utilizing the through hole of the substrate and the through hole of the spacer, and a translucent cover sheet is provided on the upper surface of the spacer. Membrane switch device with parts.
JP7559493U 1993-12-16 1993-12-16 Membrane switch device with electronic parts Expired - Fee Related JP2511733Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7559493U JP2511733Y2 (en) 1993-12-16 1993-12-16 Membrane switch device with electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7559493U JP2511733Y2 (en) 1993-12-16 1993-12-16 Membrane switch device with electronic parts

Publications (2)

Publication Number Publication Date
JPH0744863U true JPH0744863U (en) 1995-11-28
JP2511733Y2 JP2511733Y2 (en) 1996-09-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP7559493U Expired - Fee Related JP2511733Y2 (en) 1993-12-16 1993-12-16 Membrane switch device with electronic parts

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Country Link
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