JPH0744240B2 - How to connect the motherboard and chip carrier - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method of connecting a mother board and a chip carrier.

[Conventional technology]

In recent years, for example, liquid helium or liquid nitrogen has been used to create a cryogenic environment, and in this cryogenic environment, a superconducting circuit configured by using a Josephson element as an active element is a Josephson high-speed computer. -It is expected to be applied to computers.

Conventionally, when constructing such a superconducting circuit, as shown in FIG. 9, a chip carrier 91 for mounting and supporting a chip 90 such as a Josephson element is set to have an impedance of, for example, 50Ω. A large number of microstrip lines 92 are arranged and this microstrip line is
92 and a predetermined terminal of the chip 90 are connected by wire bonding, and at the end of the microstrip line 92 of the chip carrier 91 thus configured, a square land 93 is arranged at a predetermined position. I am configuring. And
The superconducting circuit is connected to the socket via the socket contactor that contacts the corner land 93.

However, with this connection method, the voltage standing wave ratio (Voltage Standing Wave Rati
o, hereinafter simply referred to as VSWR) was too large, and the following was considered. That is, as shown in FIG. 10, a through hole 100 is formed so that the wall surfaces thereof are parallel in a cross-sectional view, and a connecting pin of a motherboard provided corresponding to this through hole 100 is inserted into the through hole to make a chip carrier. It was thought to reduce the VSWR by connecting the and the motherboard.

[Problems to be Solved by the Invention]

However, in the conventional through hole 100 as shown in FIG. 10, when the number of connecting pins on the motherboard is increased to 100, for example, the positions of the connecting pins on the motherboard are accurately positioned without error. It is extremely difficult to manufacture, and as a result, even if you try to completely insert the pins of the motherboard into the through holes of the chip carrier to achieve these connecting or connecting, you can get 100% connecting between the chip carrier and the motherboard. It was difficult to achieve.

Furthermore, in the connecting method from the chip to the motherboard, there are many connecting parts, that is, the connecting parts from the chip to the motherboard, and moreover, the connection type of the connecting part is not the surface contact type, but the point contact type, VSWR at the connection became large, making it difficult to achieve good impedance matching.

Further, as disclosed in JP-A-62-286260, in the method of connecting the pins of the mother board and the connection holes of the chip carrier by the molten solder, good surface contact can be obtained, but the workability is remarkably poor. .

[Means for Solving the Problems]

The subject matter of claim 1 of the present invention is (a) a mother board having a large number of conical connecting pins, (b) a chip, a large number of connecting holes, and a microstrip extending from the chips to the connecting holes. A line, and a chip carrier provided with a closing member made of a plastically deformable conductive material that is connected to the end of the microstrip line and is fixed to cover the opening end of the connection hole, and There is provided a method of connecting a mother board and a chip carrier, wherein the connecting pin and the closing member are brought into surface contact with each other by piercing the closing member with the connecting pin and plastically deforming the connecting pin.

According to a second aspect of the present invention, the connecting pin has a conical shape, and the inner periphery of the opening end of the connecting hole has a taper shape.

[Action]

According to the first aspect of the present invention, the blocking member of the chip carrier is pierced by the connecting pin of the motherboard, so that the blocking member undergoes plastic deformation, and as a result, the conical surface of the connecting pin and the blocking member come into surface contact with each other. A good connection with the chip carrier is achieved. Moreover, since such a connection can be obtained only by piercing the closing member with the connecting pin, workability for the connection can be improved.

According to claim 2, when the blocking member of the chip carrier is pierced by the connecting pin of the motherboard, the blocking member is sandwiched between the conical surface of the connecting pin and the tapered surface of the inner periphery of the connecting hole, so that the blocking member is plastically deformed. The connecting pins are brought into surface contact with pressure, and the connection between the two becomes more reliable.

〔Example〕

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic partial sectional view of an embodiment of a chip carrier according to the present invention.

Referring to FIG. 1, there is shown a schematic partial cross-sectional view of a chip carrier 1 as a substrate to be connected according to the present invention. The chip carrier 1 has, for example, porous polytetrafluoroethylene, epoxy resin or ceramics as a main component. Etc. (in this embodiment, porous polytetrafluoroethylene is used), a semiconductor chip (not shown) is mounted and supported, and copper, niobium, lead, etc. are placed at predetermined positions on the surface thereof. A microstrip line 2 is provided as a conductor layer made of, and the microstrip line 2 and a predetermined terminal of the chip are connected by solder bumps. Therefore, with this solder bump, the connection between the microstrip line 2 and the chip is in a surface contact state, and VSWR can be reduced.
It is possible to easily match the characteristic impedance.

At a predetermined position of the chip carrier 1, a connecting pin 4 made of copper, niobium, lead or the like, which is provided on the lower side of the mother board 3 serving as a connecting board and is formed in a slightly short cone shape, is inserted to connect to the mother board 3. A connection hole, that is, a connection through hole 5 for electrically connecting or connecting the chip carrier 1 is formed.

This connecting through hole 5 is formed in a funnel shape on both opening end sides corresponding to the substantially conical connecting pin 4 so that the substantially conical connecting pin 4 can be easily inserted, that is, a tapered portion. 6 is formed. Although the taper portion is formed in this embodiment, the taper portion 6 may be a wide portion having various shapes corresponding to the shape of the connecting pin 4.

A thin plate-like closing member 7 made of copper, niobium, lead, solder or the like is fixed to the chip carrier 1 so as to completely and largely cover the opening 8 of the through hole 5 on the upper opening end side of the through hole 5. ing. The blocking member 7 can be fixed to the chip carrier 1 by heat fusion, ultrasonic bonding using ultrasonic waves, or the like, and by this fixing, the pin 4 enters the closing member 7 to be described later. It is possible to perform burying, and it is possible to maintain the connection between the opening member 7 and the pin 4.

A ground layer 10 is provided at an intermediate portion in the thickness direction of the chip carrier 1 so as to be interposed between the porous polytetrafluoroethylenes of the chip carrier 1, for example, via an epoxy adhesive layer 9, and the conductor of the through hole 5 is provided. The ground layer 10 is configured to be separated from the layer portion by a predetermined distance d so as to form a coaxial structure.

In the chip carrier of the above-described embodiment configured as described above, when the chip carrier is connected to the motherboard of the computer, the motherboard is inserted into the through hole 5 of the chip carrier 1 through the closing member 7 fixed to the chip carrier 1. The pin 4 of the mother board 3 is brought into contact with the closing member 7 of the chip carrier 1 so that the pin 4 of 3 is inserted. By this abutment, the substantially conical pin 4 of the mother board 3 is embedded so as to penetrate into the soft closing member 7 made of lead, solder, etc., and the chip carrier 1 and the mother board 3 are embedded.
And will be connected or connected.

By embedding the pin 4 in the closing member 7, surface contact between the pin 4 and the closing member 7 is achieved, and as a result, the connection between the chip carrier 1 and the motherboard 3 according to the present invention is low.
VSWR can be achieved. Therefore, VSW
Since the R. is small, it can also be used as a connector for high frequency related chips.

Further, the closing member 7 of the chip carrier 1 to which the pin 4 of the mother board 3 is to be connected is large because it is arranged so as to sufficiently cover the through hole 5, so that the pin 4 of the mother board 3 has a large number of pins, and the arrangement thereof. Even if the position is not manufactured with strict accuracy, in other words, even if the pin 4 cannot be accurately arranged at a predetermined position of the motherboard 3, the connection between the closing member 7 of the chip carrier 1 and the pin 4 of the motherboard 3, that is, the chip The connection between the carrier 1 and the motherboard 3 can be easily achieved.

The connection according to the present invention is made by bringing the pin 4 of the mother board 3 into contact with the closing member 7 fixed to the chip carrier 1 to make the connection. It is possible to easily remove the pin 4, and by such connection, the chip carrier 1 and the mother board 3 can be repeatedly connected and can be reused.

Here, the microstrip line 2, the connecting pin 4, and the opening / closing member 7 are made of a material exhibiting preferable properties in a superconducting state at an extremely low temperature such as a liquid helium atmosphere such as copper, niobium, and lead. By mounting a chip such as a Josephson element on the chip carrier of the present invention by supporting the chip carrier, the chip carrier can be connected to a Josephson computer motherboard used in a cryogenic environment. , Which can be fully used. When a chip such as a Josephson element is mounted on a chip carrier and used by supporting it, the material of this chip carrier is not only the above-mentioned porous polytetrafluoroethylene, epoxy resin or ceramics, but also non-magnetic material. It is also possible to use a material that has been converted into a material. Further, the microstrip line 2, the connecting pin 4, and the opening / closing member 7 are made of a material having a high temperature oxide superconductor exhibiting preferable properties in a superconducting state under a cryogenic temperature such as a liquid helium atmosphere, as described above. It can also be configured with.

If necessary, as shown in FIG. 2, the closing member 7 of the chip carrier 1 and the pin 4 of the mother board 3 are brought into contact with each other to connect the chip carrier 1 and the mother board 3, and then the chip carrier 1 is connected. The connection between the chip carrier 1 and the motherboard 3 may be fixed by using screw holes M, bolts B, springs S, etc. provided at predetermined positions of the carrier 1 and the motherboard 3.

FIG. 3 is a schematic partial sectional view of another embodiment of the chip carrier according to the present invention, the structure of which is substantially the same as that of the embodiment shown in FIG. 1 and the same parts as those of the embodiment shown in FIG. The same reference number is assigned to each of them and the description thereof is omitted.

This embodiment is different from the embodiment shown in FIG. 1 in the shape of the closing member fixed to the chip carrier. In this embodiment, the ball-like closing member 7a completely covers the opening 8 of the through hole 5. It is fixed to the chip carrier 1 so as to cover the chip carrier 1 largely.

Also in the above-described embodiment having such a configuration, the thickness direction (the third
Although a little space is required in the vertical direction in the drawing) as compared with the embodiment shown in FIG. 1, the same effect as that of the embodiment shown in FIG. 1 can be obtained.

FIG. 4 is a schematic partial cross-sectional view of still another embodiment of the chip carrier according to the present invention, the structure of which is almost the same as that of the embodiment shown in FIGS. 1 and 3, and FIG.
The same parts as those in the embodiment shown in the figure are designated by the same reference numerals, and the description thereof will be omitted.

Also in this embodiment, the shape of the closing member fixed to the chip carrier is different from that of the embodiment shown in FIGS. 1 and 3, and in this embodiment, the guide groove having a shape corresponding to the shape of the pin of the mother board is used. A thin plate-shaped closing member 7b having 11 (the upper surface of the closing member as shown) is fixed to the chip carrier 1 so as to completely and largely cover the opening 8 of the through hole 5.

In the above-described embodiment having such a configuration, not only the same effect as that of the embodiment shown in FIG. 1 can be obtained, but also
The pin 4 of the motherboard 3 is used as a closing member for the chip carrier 1.
When abutting on 7b and connecting or connecting,
The guide groove 11 of the closing member 7b guides the pin 4 so that the mother board 3 can be connected to the chip carrier 1 very easily.

FIG. 5 is a schematic partial cross-sectional view of another embodiment of the chip carrier according to the present invention, the structure of which is almost the same as that of the above-mentioned embodiment, except that the coaxial structure forming method is different. It is different.

That is, in this embodiment, the ground through hole 12 is provided around the connecting through hole 5 provided at a predetermined position of the chip carrier 1 instead of providing the ground layer in the middle portion in the thickness direction of the chip carrier as in the above embodiment. It is formed into a coaxial structure. The ground through hole 12 is formed in the same manner as the connecting through hole 5 of the above-described embodiment, and has a tapered portion 6X and an opening portion 8X on both open end sides thereof.
have.

Here, pin 4 of motherboard 3 and through hole 5 for connection
Similarly to the above relationship, a slightly short substantially conical pin 13 is provided around the pin 4 on the lower side of the motherboard 3 so as to be inserted into the through hole 12.

Similarly to the case of the through hole 5, a thin plate-shaped closing member 7 is fixed to the chip carrier 1 also on the upper opening end side of the through hole 12.

In this way, the through hole 5 and the through hole 12 form a coaxial structure.

In this embodiment, the same parts as those in the previous embodiment are designated by the same reference numerals and the description thereof is omitted.

Also in this embodiment, as in the previous embodiment, the connection between the chip carrier 1 and the mother board 3 can be made a low VSWR, and even if the pin 4 of the mother board 3 has a large number of pins, it is It is possible to easily achieve the connection between the chip carrier 1 and the mother board 3 without requiring a particularly strict system.

In the above-described embodiment, the closing member is provided only in the opening on the upper side of the chip carrier, and the pin is provided only on the lower side of the motherboard so as to abut against the closing member. The connection was made, but the sixth
As schematically shown in the figure, pins 4 are provided on both the upper side and the lower side of the mother board 3, and the chip carriers 1 are arranged on both sides of the mother board 3 corresponding to these pins 4, and the through holes are opened. Closure member 7 arranged so as to cover the portion
It is also possible to adopt a laminated structure in which the pin 4 is in contact with the pin 4. If necessary, the laminated structure shown in FIG.
The repeating structure can be used to form a desired number of laminated structures.

In such a laminated structure, since there is a gap between the layers, especially when used in an extremely low temperature environment, it is possible to enhance the cooling effect, and moreover, similar to the above-mentioned embodiment,
Since the connection between the chip carrier 1 and the mother board 3 is easy to remove, even if a chip as an active element mounted on the chip carrier 1 fails, the chip carrier 1 can be easily replaced.

Further, as shown in FIG. 7, a large number of chips C are arranged on the chip carrier 1 having a large number of through holes 5, and pins 4 are provided on the mother board 3 so as to correspond to the through holes 5 of the chip carrier 1, It is also possible to make a multi-chip carrier in which the chip carrier 1 and the mother board 3 are connected.

In this case, a large number of chips can be mounted on one chip carrier, and the chip carrier 1 and the mother board 3 are connected to each other with a low VSWR, as in the above-described embodiment.
And moreover, even if the pins 4 of the mother board 3 have a large number of pins, the chip carrier 1 and the mother board 3 can be easily
A connection with can be achieved.

Here, in order to prevent the solder from entering the through hole 5, for example, when the closing member 7 made of solder is placed in the opening 8 of the through hole 5 in the above-described embodiment by melting the solder, As shown in FIG. 8, the inside of the through hole 5 is coated with resin 80 or the like on the hole wall in advance so that the wettability with the solder attempting to enter the opening 8 is deteriorated. Even when the blocking member 7 is arranged by melting the solder, it is preferable to prevent the solder from entering the through hole 5.

Modification or modification of the structure of the chip carrier according to the present invention without departing from the scope or technical idea of the present invention (for example, when the laminated structure is not used, the through hole of the chip carrier is not used as a through hole as necessary, It is easy for a person skilled in the art to appropriately perform (for example, merely mere holes for closing) as necessary, and it is easy for such modifications or variations to fall within the technical scope of the present invention. Can be understood by.

〔The invention's effect〕

As described above, according to the first aspect of the present invention, good contact between the motherboard and the chip carrier is achieved by the surface contact between the connecting pin and the closing member. Moreover, since such a connection can be obtained only by piercing the closing member with the connecting pin, workability for the connection can be improved.

According to the second aspect, the closing member and the connecting pin are brought into surface contact with each other with pressure, so that the connection between them is further secured.

[Brief description of drawings]

FIG. 1 is a schematic partial sectional view of an embodiment of a chip carrier according to the present invention, FIG. 2 is an explanatory view of an example of fixing the connection between a chip carrier according to the present invention and a mother board, and FIG. FIG. 4 is a schematic partial cross-sectional view of another embodiment of the chip carrier according to the present invention, FIG. 4 is a schematic partial cross-sectional view of another embodiment of the chip carrier according to the present invention, and FIG. FIG. 6 is a schematic partial cross-sectional view of still another embodiment, FIG. 6 is an explanatory view of an example in which the chip carrier according to the present invention and a mother board are connected to each other in a laminated structure, and FIG. FIG. 8 is an explanatory view of an example in which the chip is mounted as a multi-chip carrier, and FIG. 8 is an explanatory view of an example in which a through hole of the chip carrier according to the present invention is formed under specific conditions. Is a plan view of a conventional chip carrier, FIG. 10 is an example schematic partial cross-sectional view of the through-hole portion of the conventional chip carrier. 1: Chip carrier, 2: Microstrip line (conductor layer), 3: Motherboard, 4: Connection pin, 5: Connection through hole (connection hole), 6: Tapered part (wide part), 7, 7a, 7b : Closing member, 8: Opening part, 9: Epoxy resin layer, 10: Ground layer, 12: Ground through hole, 13: Pin, 80: Resin, C: Chip.

Front Page Continuation (72) Inventor Masahiro Suzuki 2-25-25 Miyasaka, Setagaya-ku, Tokyo Junko In-house Examiner, Inc. Shun Gobe (56) References JP 62-286260 (JP, A) JP 63 -56949 (JP, A) JP 59-228739 (JP, A) Actually developed 59-36259 (JP, U)

Claims (2)

[Claims] 1. A mother board having a large number of conical connecting pins; (b) a chip; a large number of connecting holes; a microstrip line extending from the chips to the connecting holes; and a microstrip. A chip carrier provided with a closing member made of a plastically deformable conductive material, which is connected to an end of a line and fixed so as to cover the opening end of the connecting hole, and the closing member is connected to the chip carrier. A method for connecting a mother board and a chip carrier, characterized in that the connecting pin and the closing member are brought into surface contact by being pierced by a working pin and plastically deformed. 2. The method for connecting a mother board and a chip carrier according to claim 1, wherein the connecting pin has a conical shape, and the inner periphery of the opening end of the connecting hole has a taper shape.