JPH0739233Y2 - 半導体装置の取付構造 - Google Patents

半導体装置の取付構造

Info

Publication number
JPH0739233Y2
JPH0739233Y2 JP1985090600U JP9060085U JPH0739233Y2 JP H0739233 Y2 JPH0739233 Y2 JP H0739233Y2 JP 1985090600 U JP1985090600 U JP 1985090600U JP 9060085 U JP9060085 U JP 9060085U JP H0739233 Y2 JPH0739233 Y2 JP H0739233Y2
Authority
JP
Japan
Prior art keywords
metal plate
dug portion
solder
dug
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985090600U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61207038U (US20110009641A1-20110113-C00185.png
Inventor
真二 柴田
秀司 谷
等 加藤
和弘 山田
清金 梶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
Original Assignee
Toyota Motor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Motor Corp filed Critical Toyota Motor Corp
Priority to JP1985090600U priority Critical patent/JPH0739233Y2/ja
Publication of JPS61207038U publication Critical patent/JPS61207038U/ja
Application granted granted Critical
Publication of JPH0739233Y2 publication Critical patent/JPH0739233Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1985090600U 1985-06-14 1985-06-14 半導体装置の取付構造 Expired - Lifetime JPH0739233Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985090600U JPH0739233Y2 (ja) 1985-06-14 1985-06-14 半導体装置の取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985090600U JPH0739233Y2 (ja) 1985-06-14 1985-06-14 半導体装置の取付構造

Publications (2)

Publication Number Publication Date
JPS61207038U JPS61207038U (US20110009641A1-20110113-C00185.png) 1986-12-27
JPH0739233Y2 true JPH0739233Y2 (ja) 1995-09-06

Family

ID=30645738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985090600U Expired - Lifetime JPH0739233Y2 (ja) 1985-06-14 1985-06-14 半導体装置の取付構造

Country Status (1)

Country Link
JP (1) JPH0739233Y2 (US20110009641A1-20110113-C00185.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4487881B2 (ja) * 1999-03-24 2010-06-23 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5050633B2 (ja) * 2007-05-02 2012-10-17 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板及びパワーモジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168135U (ja) * 1982-05-06 1983-11-09 富士電機株式会社 半導体装置
JPS59175131A (ja) * 1983-03-24 1984-10-03 Fuji Electric Co Ltd 混成集積回路

Also Published As

Publication number Publication date
JPS61207038U (US20110009641A1-20110113-C00185.png) 1986-12-27

Similar Documents

Publication Publication Date Title
US7910952B2 (en) Power semiconductor arrangement
JPH0476212B2 (US20110009641A1-20110113-C00185.png)
KR920020620A (ko) 반도체 집적회로장치의 배선접속구조 및 그 제조방법
US7495924B2 (en) Electronic device
KR20070118065A (ko) 절연 회로 기판 및 냉각 싱크부 부착 절연 회로 기판
JP3070579B2 (ja) 半導体装置の実装構造および実装方法
JPH0739233Y2 (ja) 半導体装置の取付構造
JP2000151060A (ja) 電子部品の実装構造
JPH06196598A (ja) 半導体チップの実装構造
US5866951A (en) Hybrid circuit with an electrically conductive adhesive
JPH1187404A (ja) フリップチップ及びそのマウント方法
JPS6119136A (ja) 半導体装置のワイヤボンデイング方法およびこれに用いるボンデイングパツド
JP2698259B2 (ja) ヒートシンクの製造方法
JPH0155591B2 (US20110009641A1-20110113-C00185.png)
JP2006286897A (ja) 金属−セラミックス接合基板
JP2779537B2 (ja) フィン付き電子部品搭載用基板
JP2546342Y2 (ja) 混成集積回路
JPH11214576A (ja) 半導体チップ搭載用パッケージ
JPH0677631A (ja) チップ部品のアルミ基板への実装方法
JPH07263618A (ja) 混成集積回路装置
JP3522975B2 (ja) 半導体装置
JPH056714Y2 (US20110009641A1-20110113-C00185.png)
JP2521286Y2 (ja) 混成集積回路
JP2743157B2 (ja) 樹脂封止型半導体装置
JPH0739238Y2 (ja) 半導体装置