JPH0737436Y2 - Piezoelectric support structure for transducers - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a piezoelectric support structure for a transducer which can be used for measuring the speed of sound in the sea.

[Conventional technology]

The wave transmitter / receiver emits sound from the wave transmitter in order to measure the speed of sound in the sea, and the wave receiver receives the reflected sound. By keeping the distance between the wave transmitter and the wave receiver of the wave transmitter / receiver constant at this time, the time difference at that time can be measured and the speed of sound in the seawater can be measured.

The wave transmitter / receiver generally uses ceramic piezoelectric electrons, and these are urethane rubber molded to keep honey. So, if a voltage is applied to the piezoelectric electrons, sound will be emitted and it will become a wave transmitter,
When the sound reaches the piezoelectric surface, it vibrates and generates piezoelectricity, which becomes a signal and serves as a wave receiver.

A conventional example of the transceiver will be described below with reference to the sectional view of FIG. 3 and the side view of FIG.

In the figure, reference numeral 1 denotes a disc type piezoelectric device, and a mounting plate 2
Is attached to the support cylinder 3 and is fixed to one side of the support cylinder 3 at the same time as being positioned.

The back side of the piezoelectric material 1 is filled with an epoxy resin 4 so that the water pressure resistance can be maintained even if external water pressure is applied to the piezoelectric material 1.

A buffer cord 6 made of silicone resin is applied to the lead wire 5 extending from the piezoelectric element 1 in order to alleviate the transmission of stress when the epoxy resin 4 is cured.

The lead wire 5 passes through the bush 7 and is wired to the outside through the communication hole 8.

The whole of the wave transmitter / receiver thus constructed is made watertight by using a urethane rubber mold 9, and further, a neoprene rubber mold 10 is applied to a boundary surface between the supporting cylinder 3 and the metal so that the urethane rubber mold 9 is closely attached. I'm trying to keep it watertight.

[Problems to be solved by the device]

According to the conventional technique described above, when the epoxy resin filled on the back side of the piezoelectric electrons undergoes a temperature change, it expands and contracts, which serves as a force for pressing the piezoelectric electrons and destroys the piezoelectric electrons. There was a problem.

In addition, the buffer coat applied to the lead wire so that it does not adhere to the epoxy resin so that it does not follow the movement of the epoxy resin during expansion and contraction is not adhesive and has excellent releasability. If it adheres to the urethane rubber mold, the adhesiveness to the urethane rubber mold may be deteriorated to cause peeling, resulting in a problem that the sensitivity of the wave transmitter / receiver is lost.

Further, in manufacturing, there are many bonding steps because the bonding process of each of the piezoelectric element, the mounting plate, and the supporting cylinder, the coating process of the lead wire buffer coat, the epoxy resin filling process, and the like are difficult and the assembly time is long. There is also the problem of this.

[Means for Solving the Problems]

According to the present invention, a conductive hole through which a lead wire is inserted is provided on one side of a support made of glass epoxy resin, a communication hole is connected to this conductive hole, and a piezoelectric electron is directly bonded to the one side to connect the lead wire. The lead wire is passed through the conduction hole and the communication hole, and is attached to the mounting base through a support fitting that is a separate member, and the support stand and the support fitting are covered with a urethane rubber mold to integrally form the lead wire. It is characterized by being taken out from.

[Action]

According to the above configuration, the lead wire is connected to the piezoelectric (+),
Solder to the (-) pole, bond and fix this lead wire to the mounting part of the support base, take out the lead wire from the support fitting connected to the support base through the conduction hole and the communication hole to the outside,
The outer surface of the support base and the metal support is covered with a urethane rubber mold to make it watertight, and when a voltage is applied to the piezoelectric electrons, it produces sound and becomes a wave transmitter. It vibrates to generate a voltage and becomes a signal that serves as a wave receiver, which allows the speed of sound in seawater to be measured.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view and FIG. 2 is a side view.
Is a piezoelectric electron, and 12 is a support base made of glass epoxy resin (FRP), which is provided with a through hole 12a and a communication hole 12b.

Reference numeral 13 is a support fitting connected to the support base 12, and 14 is a urethane rubber mold, which is a watertight jacket.

The glass epoxy resin material used for the support 12 was selected because of its small thermal expansion, good adhesiveness with epoxy adhesive, low hygroscopicity, and good adhesion with urethane rubber. The support base 12 is a separate member that absorbs vibrations from the mounting base 16 so as not to be transmitted to the support fittings 13 so as to reduce the influence on the piezoelectric electrons 11.

Lead wires 15 are soldered to the (+) and (-) poles of the piezoelectric element 11, and the lead wires 15 are connected to the conduction holes 12 a of the support base 12.
From the support metal fitting 13 to the outside through the communication hole 12b. Further, this piezoelectric element 11 is positioned and adhered so as to be fitted to a mounting portion 12c provided on the support base 12, and is on the same surface as the support base 12. 12d piezo 1 of lead 15
This is a recess that accommodates the soldering parts of the (+) and (-) poles of 1.

Further, a neoprene rubber 17 is baked on the portion of the support fitting 13 where the urethane rubber mold 14 is formed. This is because the adhesion between the support metal fitting 13 and the urethane rubber is poor, and the watertightness cannot be maintained. Therefore, the neoprene rubber 17 having good adhesion with the urethane rubber is used in advance to cover the periphery of the support metal fitting 13 to improve the adhesion. I have kept it. When the urethane rubber is molded, the support fitting 13 is set in a mold (not shown) using the positioning screw 18 provided on the side surface of the support 12, and the urethane rubber is injected and cured.

According to the above configuration, when a voltage is applied to the piezoelectric electrons, a sound is emitted to become a wave transmitter, and when the sound reaches the piezoelectric surface, it vibrates to generate a voltage and becomes a signal to become a wave receiver. It is possible to measure the speed of sound in seawater.

In addition, the support base 12 can sufficiently absorb the vibration from the mounting base 16 to reduce the influence of the vibration on the piezoelectric electrons 11.

[Effect of device]

According to the present invention described in detail above, by directly bonding and attaching piezoelectric electrons to a solid support made of glass-epoxy resin, thermal expansion that conventionally occurs when the back surface of piezoelectric resin is filled with epoxy resin. The contraction force does not press the piezoelectric electrons, and the piezoelectric electrons are not destroyed.

Further, since the lead wire connected to the piezoelectric electron is taken out through the conduction hole and the communication hole formed in the support base, the buffer coat application step for applying the lead wire, which has been conventionally required, is not required. It is possible to eliminate the occurrence of accidents such as peeling when the coat adheres to unnecessary places.

Furthermore, by making the support base and the support fittings separate members,
This has the effect of reducing the vibration transmission from the mounting base to the piezoelectric electrons.

Further, the filling process, the buffer coat applying process, the adhesion of the attachment plate with the piezoelectric electrons attached to the support cylinder, the positioning process, etc., which have been conventionally required, are reduced, so that the assembling process is simplified and the assembling time is reduced. It has the effect of being able to significantly shorten the time.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a side view, FIG. 3 is a sectional view of a conventional example, and FIG. 4 is a sectional view. 11 …… Piezoelectric 12 …… Supporting base 13 …… Supporting metal fitting 14 …… Urethane rubber mold 15 …… Lead wire

Claims (1)

[Scope of utility model registration request] 1. A lead hole for passing a lead wire is provided on one side of a support made of glass epoxy resin, a communicating hole is connected to the lead hole, and a piezoelectric electron is directly adhered to the one side to form the lead wire. Through the through hole and the communication hole, attach this support base to the mounting base via a support bracket that is a separate member, and cover the support base and support bracket with urethane rubber mold to integrally form them to support the lead wires. Piezoelectric support structure for transducers characterized by being taken out from the metal fittings.