JPH0735312Y2 - Electronic component silver migration suppression structure - Google Patents

Description

[Detailed Description of the Invention] A. Field of Industrial Application This invention relates to a silver migration suppressing structure in which silver is deposited on the periphery of silver-plated terminals of electronic parts such as connectors and sockets.

B. Outline of the Invention The present invention relates to an electronic component having a silver-plated terminal pin, and a migration suppressing protrusion, which is a series of small protrusions that crosses a portion between adjacent terminal pins on an insulator side surface. By providing the above, it is possible to prevent silver migration from progressing beyond the migration suppressing protrusion.

C. Conventional Technology In general, terminal pins of electronic parts such as connectors and sockets are usually plated with silver, gold, tin or the like.

Further, gold plating is expensive, and tin plating has high contact resistance. For this reason, silver plating, which has low contact resistance and is cheaper than gold, has been widely used, but it is known that silver migration (silver migration) occurs depending on the use environment and use conditions. ing.

This phenomenon is a type of electrolysis, and when a DC voltage is applied to electronic parts such as connectors and sockets, if the surrounding temperature is high, the moisture is ionized and H ₂ O → H ⁺ +
OH ^- ionized to. Meanwhile the influence of silver plated to the terminal pin also water, AgAg ^{+ +} e ^- and ionization, Further, H ⁺ becomes H ₂ gas at the cathode, OH ^- is the AgOH bonded to the cathode of Ag ^+. That is, it reacts so as to become silver hydroxide of 2Ag + 2OH → 2AgOH.

This silver hydroxide becomes colloidal silver in the vicinity of the anode and is in a very chemically unstable state, and becomes 2AgOHAg ₂ O + H ₂ O, which is deposited as brown silver oxide in the vicinity of the anode.

Furthermore, at the cathode _{side, 2Ag 2 O + H 2 O2AgOH2Ag} + + OH - results in the reaction, are eventually deposited as metallic silver to the cathode vicinity becomes Ag ^+, gradually toward the anode side growth To go.

This silver migration is first accelerated as the direct current applied voltage is higher and the humidity is higher.

D. Problems to be Solved by the Invention In the conventional electronic parts such as connectors and sockets having a silver-plated terminal pin, the designer can determine the voltage and conditions to be applied to the multiple terminal pins installed. However, there is no means to prevent silver migration. Therefore, if it is used for a long period of time, silver is deposited and grown on the insulator between the adjacent terminal pins by silver migration, and a thin film of silver connects the adjacent terminal pins and breaks the insulation. There is a problem that electrical troubles such as short circuit may occur.

SUMMARY OF THE INVENTION In view of the above points, the present invention has an object to suppress silver migration that occurs in silver-plated electronic components and prevent the occurrence of electrical troubles such as a short circuit accident.

E. Means for Solving the Problems The silver migration suppressing structure for an electronic component according to the present invention is arranged so that it crosses between the adjacent silver-plated terminal pins on the side surface of the insulator of the electronic component. Is characterized in that a series of small protrusions are provided as migration suppressing protrusions.

F. Action With the above-described configuration, the action of preventing the silver migration from diffusing and precipitating beyond the migration suppressing protrusion near the terminal pin is exerted.

G. Example Hereinafter, an example of the silver migration suppressing structure for electronic parts of the present invention will be described with reference to FIGS.

FIG. 1 is a perspective view of a connector which is an example of an electronic component having silver-plated terminal pins, where 1 is a connector body and 2 is a terminal pin.

The connector body 1 is made of an insulating material and has a large number of terminal pins 2 provided upright on its side surface. This terminal pin 2
Has been surface treated by silver plating.

Further, as shown in FIGS. 2 and 3, migration suppressing protrusions 3 are integrally formed between the adjacent terminal pins 2 on the side surface of the connector body 1.

The migration suppressing protrusion 3 is formed as a protrusion having a small rectangular cross section that surrounds the vicinity of each terminal pin 2 in a semi-circular shape in a region between the adjacent terminal pins 2.

In addition, in this example, the migration suppressing protrusion 3 is
Although it is formed in double with respect to one terminal pin 2, it may be formed in single or multiple.

Further, in this embodiment, the migration suppressing protrusion 3 has a width of 0.2 to 0.5 mm and a height of 0.2 to 0.5 mm, and is integrally formed on the connector body 1.

In addition, in the case where such a migration suppressing protrusion 3 is provided, even if a silver migration phenomenon occurs between the terminal pins 2, it stops at the root portion of the migration suppressing protrusion 3 and progresses after that. It does not.

This is because the width and height of the migration suppressing protrusion 3 are 0.25.
It was confirmed by an experiment actually conducted for 6 years as mm.
That is, as a result of using the same connector body 1 where the migration suppression protrusion 3 was provided and not provided, the silver migration from the portion where the migration suppression protrusion 3 was provided to the beginning could be stopped. . Further, in a portion where the migration suppressing protrusion 3 is not provided, silver migration spreads and is connected between the adjacent terminal pins 2, which causes an electrical trouble such as a short circuit. This also proves the effect of the migration suppressing protrusion 3.

H. Effect of the Invention As described in detail above, according to the silver migration suppressing structure of the electronic component of the present invention, in the side surface of the insulator of the electronic component, between the adjacent silver-plated terminal pins,
Since a series of small protrusions, which are migration suppressing protrusions, are provided so as to cross between them, silver migration diffuses beyond the migration suppressing protrusions even when the use environment and use conditions of electronic components are poor. There is an effect that it is possible to prevent the progress and to prevent an electrical trouble such as a short circuit from occurring due to silver migration generated between the adjacent terminal pins.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing an embodiment of a silver migration suppressing structure for electronic parts according to the present invention, FIG. 2 is an enlarged plan view of an essential part thereof, and FIG. 3 is an enlarged sectional view of the essential part thereof. 1 ... Connector body, 2 ... Terminal pin, 3 ... Migration suppressing protrusion.

Claims (1)

[Scope of utility model registration request] 1. An electronic component having a silver-plated terminal pin, characterized in that a series of small ridges crossing a position between adjacent terminal pins are provided on a side surface of an insulator. Migration suppression structure.