JPH07331493A - Small-width slit nozzle device - Google Patents

Abstract

PURPOSE:To make it possible to uniformly eject a pressurized treating liquid in the form of a film by forming the sectional area of the bore of a center pipe, the sectional area of the entire sparger hole and the sectional area of the small-width slit nozzle of a nozzle pipe to successively smaller sizes. CONSTITUTION:The perpendicular center pipe 36 communicating with a pressurized treating liquid inlet is bored with the many sparger holes 45 in an axial line direction. This center pipe 36 is held by the nozzle pipe 25. The nozzle pipe 25 is formed to a droplet shape and is provided with the small-width slit nozzle 10a heading toward the perpendicular plate to be worked at its front end. At this time, the direction of the sparger holes 45 bored to face the small- width slit nozzle 10a is preferably deviated by an angle alpha of about 10 to 25 deg. from a line connecting the center of the center pipe 36 and the small-width slit nozzle 10a. Further, the sectional area of the bore of the center pipe 36 described above, the sectional area of the entire sparger hole 45 and the sectional area of the small-width slit nozzle 10a are made successively smaller.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a narrow slit nozzle device suitable for performing a plating process on a vertical plate group to be processed.

[0002]

2. Description of the Related Art Conventionally, when a vertical plate group to be processed having a lower end support is plated, a pipe having a large number of small holes is formed on both right and left sides of the vertical plate group to be processed. The pressured plating solution was applied to the vertical plate to be processed to promote plating, but uneven plating occurred where the pressured plating solution hits and where it did not.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to prevent uneven plating even when a pressure plating solution is sprayed from the left and right sides of a vertical plate to be processed in the plating solution.

[0004]

According to the present invention, a vertical center pipe communicating with an inlet of a pressurized treatment liquid is held by a nozzle pipe having a narrow slit nozzle facing a vertical plate to be processed at a tip in a drop-shaped cross section, and a small slit nozzle is provided with a surface. The center pipe is provided with a large number of sparger holes, and the inner diameter cross-sectional area of the center pipe, the cross-sectional area of all sparger holes, and the cross-sectional area of the narrow-width slit nozzle are sequentially reduced.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS 1 in FIG. 1 is a lower cover, 2 is an upper cover (both are P
A resin such as VC or acrylic), and a central rail 3 extending in the front-rear direction (direction perpendicular to the plane of FIG. 1) at the center of the lower cover 1.
(PVC, etc.) is fixed, the lower end of the vertical plate 6 to be processed is fitted into the groove 5 at the upper end of the guide plate 4 which is slightly thin at the upper end of the central rail 3, and the left and right sides of the lower end of the vertical plate 6 to be processed are fitted. Both side surfaces are held by carrier belts 7 and 7a (connected to the cathode electrode) which are formed in a C-shaped cross section in advance.

Supply tank halves 1 having spacers 9 and 9a (PVC or the like) in order from the guide plate 4 side and nozzles 10 and 10a directed to the vertical plate 6 to be processed, on the left and right sides of the guide plate 4.
1, 11a (PVC or the like) and plating tank halves 13 and 13a (PVC or the like) having anodes 12 and 12a are sandwiched and temporarily assembled, and left and right assembling bodies 14 and 14a are horizontal. Common bolt 15, nut 16
(Only one pair is shown). Spacers 9, 9
a is formed integrally with the supply tank halves 11, 11a, or
It can be fixed in advance.

The supply tank halves 11 and 11a are provided with inlet chambers 18 and 18a which communicate with each other in the front and rear, and the inlets 19 and 19a communicate with the discharge ports of the pumps 21 and 21a through the pipes 20 and 20a. Reference numerals 22 and 22a denote strainers communicating with the suction port of the pump. The supply tank halves 11 and 11a are provided with a plurality of holes 24 and 24a in a plate-like portion extending upward from the inlet chambers 18 and 18a, and a nozzle pipe 25 is provided at the upper end thereof.
25a is connected by screwing or other method. Each hole 2
The adjusting bolts 26, 26a are provided below 4, 24a.
Are arranged, and the opening degrees of the inlet chambers 18 and 18a and the holes 24 and 24a can be individually adjusted. 27 and 27a are lock nuts.

The plating bath halves 13 and 13a are substantially U-shaped in cross section having vertical overlapping portions 29 and 29a, and have an inlet 3 at the lower end.
Reference numerals 0 and 30a denote pipes 32 and 3 having diaphragms 31 and 31a.
The pipes 20 and 20a communicate with each other via 2a. Three
Reference numerals 3, 33a are straightening vanes. The anodes 12 and 12a are connected to external titanum bus bars 34 and 34a. The bolt 15 passes through a hole (not shown) in a portion avoiding the holes 24 and 24a.

In order to assemble, first, the conveyor belts 7 and 7a are stretched on the guide plate 4 of the central rail 3, and the spacers 9 and 9a, the supply tank half body 11, and the supply tank halves 11 are provided on the left and right sides of the guide plate 4, respectively.
11a and the plating bath halves 13 and 13a are temporarily assembled in this order in a sandwich type, and the assembling bodies 14 and 14a are fastened with a common bolt 15 and nut 16. The plating solution pressurized by the pumps 21 and 21a is supplied to the inlet chambers 18 and 18a, the holes 24,
Nozzle 1 through 24a and nozzle pipe 25, 25a
Vertical plate 6 to be processed from 0, 10a through the surrounding plating solution
Is sprayed on both left and right sides. The plating solution overflows the upper edges of the plating tank halves 13 and 13a, collects in the lower cover 1, and circulates.

In FIG. 2, which is an enlarged view of a part of FIG.
A center pipe 36 (PVC or the like) is provided at the upper end of the hole 24a.
Of the center pipe 36 is screwed, and a cap 39 is screwed into the threaded portion 38 at the upper end of the center pipe 36 to close it.
In the center pipe 36, a nozzle pipe 25a (transparent PVC or the like) having a drop-shaped cross section is held in a liquid-tight manner between a lower gasket 41 and an upper gasket 42 on a base plate 40, and a substantially cylindrical portion in the right half of the nozzle pipe 25a. Is pressed. The nozzle 10a has a width of 0.05 to extend vertically.
A 0.5 mm micro slit nozzle (small width slit nozzle) faces the vertical plate 6 to be processed (FIG. 1). Between the center pipe 36 and the nozzle pipe 25a, as shown in FIG. 3, a thin rectifying chamber 44 having a triangular cross section with the nozzle 10a as one apex and three concave sides is formed. The sparger hole 45 (SPARGE) is provided on the center pipe 36 which is offset by an angle α (for example, 10 to 25 degrees) from the line connecting the centers of the center pipes 36.
R ... Scatter) are evenly spaced vertically (Fig. 2). The cross-sectional area of the entire sparger hole 45 is smaller than the cross-sectional area of the center pipe 36, and the cross-sectional area of the opening of the nozzle 10a is smaller than the cross-sectional area of the entire sparger hole 45. Therefore, the plating solution is kept under pressure until it is ejected in a film form from the nozzle 10a.

A deviation of an angle α is given to the sparger hole 45, and the plating solution ejected from the sparger hole 45 is
When the inner surface of the nozzle pipe 25a facing the rectifying chamber 44 is collided and bent, the collision with the inner surface of the nozzle pipe 25a is repeated until the nozzle 10a is reached, and rectification is promoted. Vertical spacing (pitch) of sparger holes 45
Of the nozzle 10 by increasing the pressure of the nozzle 10 or increasing the diameter of the sparger hole 45 downward.
It is possible to make uniform the reaching distance of the ejected liquid film from a and perform uniform plating.

[0012]

According to the present invention, since the pressurized plating solution is jetted in a film form from the narrow slit nozzle 10a and uniformly hits the vertical plate to be processed, the plating is promoted and
It is possible to reliably prevent uneven plating.

[Brief description of drawings]

FIG. 1 is a schematic vertical sectional front view.

FIG. 2 is a partially enlarged view of FIG.

3 is a sectional view taken along line III-III in FIG.

[Explanation of symbols]

 6 Vertical plate to be processed 10a Small width slit nozzle 19 Pressure treatment liquid inlet 25a Nozzle pipe 36 Center pipe 45 Sparger hole

Claims (1)

[Claims] 1. A vertical center pipe communicating with an inlet of a pressurized treatment liquid is held by a nozzle pipe having a narrow slit nozzle facing a vertical plate to be processed at a tip with a drop-shaped cross section, and a large number of center pipes facing the narrow slit nozzle are held. The narrow slit nozzle device in which the cross sectional area of the inner diameter of the center pipe, the cross sectional area of all the sparger holes and the cross sectional area of the narrow slit nozzle are sequentially reduced.