JPH0732717A - Printing method - Google Patents

Abstract

PURPOSE:To perform good printing by one switch without performing troublesome adjustment by setting printing pressure corresponding to the size of a printed circuit board when the printed circuit board is coated with cream solder through a mask by the movement of a squeegee. CONSTITUTION:A cream solder printer is equipped with the printing squeegees 6a, 6b and outflow preventing squeegee 6c linearly moving on a metal mask 4 having desired pattern aperture parts formed thereto, a squeegee head 9, a temp. control water circulating passage 10 for controlling the temp. of automatically supplied cream solder and a container 11 storing the automatically supplied cream solder and the cream solder is applied to a printed circuit board 1 by the movement of the squeegees. In this case, substrate data (longitudinal and lateral dimension) is set as initial data prior to performing printing. The optimum printing pressure condition is automatically taken out of the substrate data on the basis of preliminarily stored back data to start printing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder printing method for applying cream solder to a desired pattern on a printed circuit board.

[0002]

2. Description of the Related Art In the manufacture of electronic circuit boards, cream solder is used when soldering electronic circuit parts such as chip parts onto a printed circuit board. In order to apply this cream solder to a desired pattern, cream solder is used. A printing machine is used.

Conventional cream solder printing is performed by the method described below. This will be described with reference to FIGS. In FIG. 1, 1 is a printed circuit board, 2 is a land for printing cream solder, 4 is a mask in which a desired pattern opening is formed, 5 is a mask opening, and 6a, 6
Reference numeral b is a squeegee that linearly moves on the mask, and reference numeral 7 is cream solder. In cream solder printing, the squeegee is moved directly on the mask while it is in contact with an appropriate printing pressure to cause the cream solder to perform a rotational movement called rolling (hereinafter referred to as “rolling”) while moving on the mask. The cream solder is printed and applied on the printed circuit board through the mask by filling the mask solder with the cream solder by the rolling force of the cream solder and the pressing force of the squeegee.

Usually, when the cream solder is printed and applied as described above, after a series of set-ups as shown in FIG. 6, a test printing is performed on a printed circuit board, and an operator performs the test printing according to the printing state. Reset the printing conditions (printing pressure, printing speed, plate separation speed, etc.) and repeat until the printing condition becomes good.

[0005]

SUMMARY OF THE INVENTION In the above-mentioned conventional printing machine, at the time of starting the printed circuit board printing and switching the model,
The operator had to set the printing conditions each time. In addition, the setting of the printing condition is actually printed, and the quality (printing state) of the printing is visually changed to be subtly changed.

[0006]

In order to solve the above-mentioned problems, the present invention provides a printing pressure, a printing speed, a printing pressure depending on substrate data (dimension, thickness), metal mask, and cream solder material.
The plate separation speed can be set. (Fig. 2
reference)

[0007]

According to the present invention, as described above, by inputting the optimum printing conditions by the combination of each board data, the metal mask, and the cream solder as the back data, the conventional worker finely adjusts the printing condition, The printing conditions that were being sought can be set automatically by the printing machine. As a result, it is not necessary for the operator to make the above-mentioned troublesome adjustments at the start of production and at the time of changing models, and thus it is possible to print non-defective products with a single switch.

[0008]

【Example】

(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view showing a cream solder printing machine according to this embodiment. 1 is a printed circuit board, 2 is a land for printing cream solder, 4 is a metal mask in which a desired pattern opening is formed, 5 is a mask opening, 6
a and 6b are squeegees for printing which move linearly on the mask, 6
c is an outflow prevention squeegee for preventing the cream solder from flowing out from both ends of the printing squeegee, 7 is cream solder, 8
Is a fixing block for fixing the printing squeegee and the outflow prevention squeegee, 9 is a squeegee head, 10 is a temperature control water circulation circuit for controlling the temperature of automatically supplied cream solder, 11 is a container containing automatically supplied cream solder,
Reference numerals 12, 13, 14, and 15 are head balancers on the right side, left side, front side, and back side, respectively, 16 is a vertical slide block of the squeegee portion, 17 is a balance spring of the squeegee portion, and 18 is a thermometer. In the cream solder printing machine according to the present embodiment configured as described above, board data (dimensions of printed board (vertical direction, horizontal direction)) is set as initial data before printing. The printing machine has
Since the back data as shown in FIG. 3 has been input in advance, the printing machine automatically calls the optimum printing pressure condition from the substrate data based on the back data, and starts printing with that setting with one switch. .

(Embodiment 2) In the cream solder printing machine according to the present embodiment having the above-described structure, the type of metal mask is set as initial data before printing. Back data (see Fig. 4) is input to the printing machine in advance, so the printing machine automatically calls the optimum printing speed and plate separation speed conditions from the metal mask type based on the back data. , With one switch, start printing with that setting.

(Embodiment 3) In the cream solder printing machine of the present embodiment configured as described above, the type (maker, viscosity, etc.) of cream solder is set as initial data before printing. Back data (see Fig. 4) is input to the printing machine in advance, so the printing machine automatically calls the optimum printing speed and plate separation speed conditions from the type of cream solder based on the back data. , With one switch, start printing with that setting.

(Embodiment 4) In addition to the automatic printing condition setting described in Embodiments 1 to 3, when printing on a printed circuit board from the start of production, several sheets of cream solder are not sufficiently familiar with the metal mask. For this reason, the printing state is not stable (see FIG. 5). By providing an automatic test printing mode for several sheets until the printing is stable, the work called test printing at the start of production by the worker is eliminated.

Specifically, as described above, after inputting the initial data, the printing conditions are automatically set and printing is started in the fully automatic operation. However, the first few sheets (ex. 5 sheets) are in the aging mode. The operation is performed (printing is performed, but the substrate is not carried out), and then the metal mask is automatically cleaned to shift to production. This series of operations are all performed automatically.

(Embodiment 5) A mode (valid) in which printing conditions are automatically set for all of Embodiments 1 to 4,
A mode (invalid) is provided to set the printing conditions manually.

[0015]

According to the present invention, as described above, by inputting the optimum printing conditions by the combination of each board data, the metal mask and the cream solder as the back data, the conventional operator finely adjusts the printing conditions. However, the printing conditions that were being sought can be automatically set by the printing machine. As a result, it is not necessary for the operator to make the above-mentioned troublesome adjustments at the start of production and at the time of changing models, and thus it is possible to print non-defective products with a single switch.

[Brief description of drawings]

FIG. 1A is a schematic perspective view of a cream solder printing machine according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view of essential parts of the cream solder printing machine according to an embodiment of the present invention.

FIG. 2 is a flow chart diagram for shifting to production of a cream solder printing machine according to the present invention.

FIG. 3 is a correlation diagram between the printed circuit board size (Y size) and the print setting pressure.

FIG. 4 is a diagram showing back data for setting printing conditions (printing speed, plate separation speed) from metal mask and cream solder types.

[Fig. 5] Relationship between the number of printed sheets and printability from the start of printing

FIG. 6 is a flow chart for shifting to production of a conventional printing machine.

[Explanation of symbols]

 1 printed circuit board 2 land 3 solder resist 4 mask 5 mask opening 6a, 6b squeegee 6c solder leak prevention squeegee 6d, 6e square squeegee 7 cream solder 8 squeegee fixed block 9 squeegee head 10 temperature control water circulation path 11 cream solder was put Container 12, 13, 14, 15 Head balancer 16 Squeegee vertical slide block 17 Balance spring 18 Thermometer 19 Remaining amount detection sensor 20 Atmosphere

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshie Okagami 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (4)

[Claims] 1. A cream solder printing method of applying cream solder to a printed circuit board by moving a squeegee through a mask having openings of a desired pattern, wherein the cream solder is applied to the printed circuit board. A printing method in which the printing pressure can be set according to the size of the printed circuit board. 2. A cream solder printing method of applying cream solder to a printed circuit board by moving a squeegee through a mask having openings of a desired pattern, wherein a metal mask is used when the cream solder is printed on the printed circuit board. A printing method configured to set the printing speed and plate separation speed according to the type. 3. A cream solder printing method of applying cream solder onto a printed circuit board by moving a squeegee through a mask in which openings of a desired pattern are formed, when the cream solder is printed on the printed circuit board. Printing speed, plate separation speed, depending on the type of material,
A printing method configured so that the printing pressure can be set. 4. A cream solder printing method for applying cream solder to a printed circuit board by moving a squeegee through a mask having openings of a desired pattern, wherein a metal mask is used when the cream solder is printed on the printed circuit board. A printing method with a mode to print on the discarded substrate until the solder paste material and the cream solder material are used.