JPH07321499A - Electronic device mounter and supporting method for insulating board mounting electronic device - Google Patents

Abstract

PURPOSE:To regulate the top face of an insulating board being supported at a predetermined height regardless of the thickness of board while preventing an obstacle from appearing on the insulating board after regulation. CONSTITUTION:The electronic device mounter comprises a cylinder 1 for elevating/lowering an insulating board 4 while supporting from the underside, a stopper 17 abutting against the top face of the insulating board 4 to regulate the top face at a predetermined height, a lock mechanism 10 for fixing the stroke of the cylinder 1 subjected to limitation in the ascending amount upon abutting against the insulating board 4, and a moving mechanism for retracting a movable table 9 mounting an elevating/lowering mechanism including the cylinder 1 from the stopper installing area along with the insulating board 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on an insulating substrate and a method for supporting an insulating substrate for mounting electronic components.

[0002]

2. Description of the Related Art Generally, in a process of mounting an electronic component on an insulating substrate such as a printed circuit board, an electronic component mounting apparatus as shown in FIG. 4A or 5A is used.

In the electronic component mounting apparatus having the configuration shown in FIG. 4A, the pin holder 2 fixed to the piston of the cylinder 1 is used.
Has a plurality of support pins 3, and the insulating substrate 4 is lifted to a predetermined height by the push-up operation by the support pins 3 as shown in FIG.

Further, in the electronic component mounting apparatus shown in FIG. 5 (a), the pin holder 2 is fixed to the block 7 which is screwed into the feed screw 6 which is rotated by the rotation of the motor 5. In this case as well, the insulating substrate 4 is moved by the push-up operation by the plurality of support pins 3 projecting from the pin holder 2 to the state shown in FIG.
It is lifted to a predetermined height as shown in.

In the electronic component mounting apparatus having such a configuration, electronic components are mounted with the upper surface of the insulating substrate 4 as a reference surface, so that the upper surface of the insulating substrate must always be aligned to a predetermined height.

On the other hand, the thickness t of the insulating substrate 4 to be handled is not always constant, but changes variously depending on the switching of the product type and the like. Particularly, in the case of the structure shown in FIG. 4A, the stroke length S of the piston of the cylinder 1 becomes the upper limit value. Therefore, as shown in FIG. 4C, the insulating substrate having a plate thickness t ′ smaller than the plate thickness t is used. In order to correspond to 4 ′, it is necessary to use a support pin 3 ′ having a length L ′ (where L ′> L) instead of the support pin 3 having a length L, and this replacement work hinders automation of the device. It becomes a factor.

On the other hand, in the structure shown in FIG.
By controlling the amount of rotation of the motor 5, FIG.
Since the stroke length S can be changed to the stroke length S ′ in FIG. 5C, it can be applied to an insulating substrate of any plate thickness. However, since the number of parts is larger than that of the structure using the cylinder, the equipment cost and the maintenance cost are high.

In the structure shown in FIGS. 6 (a) to 6 (c), the cylinder 1 is used as the lifting mechanism, but the upper surface of the raised insulating substrate 4 or 4'abuts on the fixed plate 8 so that the cylinder 1 is lifted. The stroke length of the 1 piston is forcibly limited. Therefore, the insulating substrate 4 or 4'is sandwiched from both sides by the support pin 3 and the fixing plate 8 regardless of the thickness of the insulating substrate 4 or 4 ', and each upper surface of the insulating substrate 4 or 4'can be restricted to a predetermined height. it can.

[0009]

However, in this case, not only the fixed plate 8 needs to be strong, but the fixed plate 8 projects to the upper surface side of each of the insulating substrates 4 and 4 ', so that the insulating substrate 4 Alternatively, when the cream solder is printed on the upper surface of 4 ', the fixing plate 8 becomes an obstacle, which makes it difficult to apply the printing machine or the like.

Therefore, the object of the present invention is not only to deal with the size of the plate immediately, but also to mount an electronic component suitable for automation without an obstacle such as a fixing plate protruding on the upper surface side of the insulating substrate. An object of the present invention is to provide a device and a method of supporting an insulating substrate for mounting an electronic component.

[0011]

According to the present invention, in order to achieve the above-mentioned object, an elevating mechanism for supporting an insulating substrate from a lower surface to perform an elevating operation, and abutting the upper surface of the insulating substrate raised by the elevating mechanism. Stopper for restricting the surface to a predetermined height, a lock mechanism for fixing the stroke length of the elevating mechanism whose amount of ascending is limited by the contact, and a stopper for the elevating mechanism and the insulating substrate mounted on the elevating mechanism. An electronic component mounting apparatus is provided, which is provided with a moving mechanism for escaping from an installation area.

Further, a step of raising the insulating substrate by an elevating mechanism provided on the lower surface side thereof, a step of bringing the upper surface of the raised insulating substrate into contact with a stopper to regulate the surface to a predetermined height, and Electronic component mounting comprising: a step of fixing the stroke length of the lifting mechanism while the upper surface is in contact with the stopper; and a step of escaping the lifting mechanism and the insulating substrate loaded on the lifting mechanism from the stopper installation area. A method of supporting an insulating substrate is provided.

[0013]

According to the present invention, the stroke length of the lifting mechanism is limited by the stopper while the stopper is used to contact the upper surface of the insulating substrate raised by the lifting mechanism to regulate the surface to a predetermined height. Temporarily fixed,
And since it will be made to escape to the stopper installation area after fixing,
The upper surface of the insulating substrate can be positioned at a predetermined height regardless of the thickness of the insulating substrate. Moreover, since there are no stoppers or other obstacles on the upper surface side of the insulating substrate that has escaped outside the stopper installation area, it is possible to print the cream solder on the upper surface of the insulating substrate with a printing machine or the like.

Further, since the insulating substrate in the fixing step is sandwiched by the lifting mechanism and the stopper from both sides, the insulating substrate is not tilted or displaced during the operation of the lock mechanism, and the upper surface of the insulating substrate is prevented. Can be accurately regulated to a predetermined height.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 1, an elevating mechanism comprising a cylinder 1, a pin holder 2 fixed to its piston, and a plurality of support pins 3 protruding from the pin holder 2,
It is mounted on the movable table 9. Further, a pair of lock mechanisms 10 of a cylinder type that can hold (lock) the stroke length of the piston and release it by gripping the piston of the cylinder 1 without slipping are mounted on the movable table 9. There is. Then, the insulating substrate 4 is mounted on the guide receiving tool 11 provided on the upper portion of the movable table 9.

The motor 12, the feed screw 13 that rotates axially as the motor 12 rotates, the block 14 screwed onto the feed screw 13, and the rail 15 constitute a moving mechanism for the movable table 9. Since the block 14 is fixed to the movable table 9 and the LM guide 16 of the movable table 9 straddles the rail 15, the movable table 9 is horizontally moved to the left in the figure by rotating the motor 12 in one direction. It can be moved. When the motor 12 is rotated in the reverse direction, the movable table returns to the right side in the figure.

The right side of the figure is the height control area, and the left side is the cream solder printing area. A plate-shaped stopper 17 is installed in a horizontal position above the height regulation area. This stopper 17 is coated with fluorine resin,
The friction coefficient is reduced. And
Above the cream solder printing area, a plate 18 having a punched printing pattern is installed in a horizontal position. A squeegee 19 that moves in contact with the upper surface of the plate 18 hangs down from the block 20, and the feed screw 2 that rotates axially as the motor 21 rotates.
The block 20 is screwed into the block 2. Reference numeral 23 indicates cream solder.

When the piston of the cylinder 1 rises, the support pin 3 pushes up the insulating substrate 4. Then, as shown in FIG. 2, the upper surface of the insulating substrate 4 contacts the stopper 17 to forcibly stop the rise of the piston of the cylinder 1 before reaching the stroke upper limit. Since the insulating substrate 4 at this stage is strongly sandwiched by the stopper 17 and the support pin 3 from both upper and lower surfaces, the upper surface of the insulating substrate 4 is regulated to a predetermined height regardless of the plate thickness. In this state, the pair of lock mechanisms 10 starts the lock operation and grips the piston of the cylinder 1 with high friction, so that the stroke length of the lifting mechanism is fixed.

Then, the motor 12 starts to rotate,
The movable table 9 is horizontally moved to the cream solder printing area. An elevating mechanism including a cylinder 1 and the like, a lock mechanism 10 and a guide receiver 11 are mounted on the movable table 9, and an insulating substrate 4 is mounted on the support pins 3 of the elevating mechanism, so these are height-controlled. You will move out of the area (stopper installation area) to the cream solder printing area. However, since the lock mechanism 10 continues to grip the piston of the cylinder 1, the upper surface height of the insulating substrate 4 maintains a predetermined value. The stopper 17 has a low friction surface,
Although the insulating substrate 4 is easily ejected, the insulating substrate 4 may be retracted upward in conjunction with this operation when the insulating substrate 4 is ejected.

A plate 18 is superposed on the upper surface of the insulating substrate 4 which has been moved to the cream solder printing area as shown in FIG. At this point, the motor 21 starts rotating, and the squeegee 19 moves on the plate 18 to move the cream solder 23 to the plate 18
Since it is spread on top, cream solder printing can be performed without any problems.

Although the above-described embodiment is a case of the cream solder printing process, it goes without saying that the apparatus and the supporting method of the present invention can be applied to all processes of mounting electronic parts.

[0023]

As described above, according to the present invention, the height of the upper surface of the insulating substrate is regulated in the stopper installation area, and is locked and then escaped from the stopper installation area. It is possible to immediately cope with various types of insulating substrates without being damaged. Moreover, the upper surface position of the insulating substrate can be regulated with a high degree of accuracy at all times, and there are no obstacles on the insulating substrate after exiting the stopper installation area, making it possible to fully automate processes such as cream solder printing. .

[Brief description of drawings]

FIG. 1 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention before operation.

FIG. 2 is a side view of the electronic component mounting apparatus according to the embodiment of the present invention in a height regulating process.

FIG. 3 is a side view in the solder printing process of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 4 is a side view of an insulating substrate supporting portion of a conventional electronic component mounting apparatus.

FIG. 5 is a side view of an insulating substrate supporting portion of a conventional electronic component mounting apparatus.

FIG. 6 is a side view of an insulating substrate supporting portion of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 1 cylinder 4 insulating substrate 9 movable table 10 lock mechanism 17 stopper

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiromi Kinoshita 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. An elevating mechanism for supporting an insulating substrate from a lower surface to ascend / descend, a stopper for abutting the upper surface of the insulating substrate raised by the elevating mechanism to regulate the surface to a predetermined height, An electronic component characterized by comprising a lock mechanism for fixing the stroke length of the elevating mechanism that is limited in the amount of ascent, and a moving mechanism for escaping the elevating mechanism and the insulating substrate loaded on the elevating mechanism from the stopper installation area. Mounting device. 2. A step of raising an insulating substrate by an elevating mechanism provided on the lower surface side thereof, a step of bringing the upper surface of the raised insulating substrate into contact with a stopper to regulate the surface to a predetermined height, and Electronic component mounting including a step of fixing the stroke length of the lifting mechanism while the upper surface is in contact with the stopper, and a step of escaping the lifting mechanism and the insulating substrate loaded on the lifting mechanism from the stopper installation area Method for supporting insulating substrate.