JPH07321448A - Electronic parts, recording head consisting of electronic parts, their manufacturing methods, and liquid injection recording device mounting recording head - Google Patents

Abstract

PURPOSE:To completely eliminate contamination or an oxide or the residue, etc., of a treatment substance by cleaning with laser beams. CONSTITUTION:The surface of each pad 10c of an electrical connection part 10a is contaminated by development treatment, etc., in a patterning process while manufacturing a recording head E1, an oxide film, etc., are formed, and dust, etc., adheres. For cleaning, a resin layer 11 of the recording head E., a water-repellent rein coat 12, etc., are covered with a mask and ultraviolet ray laser beams generated from a laser generation device are pulsively applied to the electrical connection part 10 at a repetition frequency of 1Hz for washing. After cleaning the electrical connection part 10a of the recording head E1, external electronic parts are connected by an ultrasonic Al wire bonder, and the miss-wire rate of each pad 10c is set to approximately 5ppm or less, thus achieving an extremely high connection reliability.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a recording head of a liquid jet recording apparatus, a recording head including the electronic component, a method of manufacturing the same, and a liquid jet recording apparatus having the recording head mounted therein. .

[0002]

2. Description of the Related Art Conventionally, ICs such as ink jet recording devices
When packaging or mounting elements, recording heads, and other electronic components, Al or A is used for the electronic components on the Si substrate.
It is common to provide an electrical connection part composed of u metal pads and connect each metal pad to a metal pad of another electronic component by using Al or Au wires, and also use Al or Au wires. Instead, a method of providing a metal bump such as Au on the metal pad has been developed, but in any case, if the surface condition of the metal pad of the electrical connection portion of each electronic component is poor, the reliability of the electrical connection is improved. May be greatly damaged. For example, when the metal pad is left in contact with air for a long time after being manufactured, an oxide film is formed due to moisture and oxygen in the air, which causes a remarkable connection failure.

Particularly, in the manufacture of a recording head for an ink jet recording apparatus or the like, a negative type dry film or resist or a positive type dry film or resist is exposed on a substrate on which an energy generating element for ejecting ink is formed. Resin is applied, and a negative or positive photomask having a pattern such as an ink flow path or an ink buffer is overlaid and exposed. In the case of a negative photosensitive resin, an unexposed portion, a positive photosensitive resin In the case of, a patterning step of removing the exposed portion with a developing solution is required, and in the case of using a positive type photosensitive resin, a photocurable resin was further flown on the positive type photosensitive resin after patterning. In addition, a step of removing the positive photosensitive resin with a solvent (cleaning solution) is also necessary, and in these steps, the developer or the solvent becomes a stain on the metal pad of the electric connection part. If that becomes larger loss cormorants based on reliability of electrical connection with another electronic component similar to the oxide film described above.

Therefore, a method of cleaning the electric connection portion by plasma treatment (plasma ashing) or UV / O ₃ cleaning before connecting to other electronic parts is adopted, and a considerable effect is obtained.

[0005]

However, according to the above-mentioned prior art, since the apparatus for performing plasma processing and UV / O ₃ cleaning is generally of the batch type, it cannot be incorporated in an in-line process, which results in labor saving of the production line. Cost to increase. Recently, improved plasma processing equipment and UV / O ₃ cleaning equipment have been developed so that they can be incorporated into in-line processes. However, both of these have long processing time, and the plasma processing equipment is basically a batch type. Therefore, the number of processed products is small and it is not suitable for mass production. Further, in the case of a UV / O ₃ cleaning device, the temperature tends to rise remarkably during the treatment, so that it cannot be applied to a material having low heat resistance, and it cannot be applied to a case where a material which is deteriorated by UV light is included.

In addition, in the manufacture of recording heads for ink jet recording apparatuses and the like, organic chlorine compounds that have been used in developing solutions and cleaning solutions in patterning processes and the like have recently been regulated as substances causing ozone layer depletion, and acetone has been regulated. Although an alternative solvent such as or xylene must be used, since such an alternative solvent generally has poor cleaning power, a large amount of residue remains on the metal pad of the electrical connection part after cleaning, which may lead to a plasma treatment device or a UV treatment device. Sufficient cleaning cannot be achieved with the / O ₃ cleaning device.

The present invention has been made in view of the above-mentioned problems of the prior art, and has an extremely effectively cleaned electric connection portion, and when connected to an external electronic component or the like. An object of the present invention is to provide an electronic component that can obtain high connection reliability, a recording head including the electronic component, a method of manufacturing the same, and a liquid jet recording apparatus including the recording head.

[0008]

In order to achieve the above object, an electronic component of the present invention is an electronic component electrically connected to an external component by a contact means provided on the surface of a substrate, wherein the contact means is It has a surface cleaned by laser light.

The recording head of the present invention is characterized by comprising the above-mentioned electronic component and having a plurality of liquid flow paths and a resin layer or a metal layer forming a common liquid chamber communicating with each liquid flow path on a substrate. .

The laser beam is preferably an ultraviolet laser beam.

The method of manufacturing an electronic component according to the present invention comprises the steps of bringing the surface of the substrate having the contact means into contact with the liquid, and cleaning the surface of the contact means of the substrate in contact with the liquid with laser light. Characterize.

[0012]

By cleaning the surface of the contact means with a laser beam, stains such as stains and dust adhered to the surface of the contact means by leaving the electronic part in the air during the process of manufacturing the electronic part and after the manufacturing. The oxide film, the liquid after the liquid treatment in the manufacturing process, the residue of the treatment substance, or the like can be completely removed, and the connection reliability when electrically connected to the external component can be greatly improved. Cleaning with laser light is easy to incorporate into the in-line process of electronic component manufacturing, and
There is no fear that the temperature of the electronic component will rise remarkably during the irradiation of the laser light, and it is also easy to prevent the contact means from being excessively exposed by adjusting the light amount and the exposure time of the laser light. Since the unnecessary portion of the laser beam can be completely shielded by the mask, there is no fear that the material and performance of the electronic component will be impaired.

As a result, it is possible to realize an electronic component such as a recording head which is inexpensive and has high performance, which is easy to electrically connect to an external component.

[0014]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 illustrates a laser cleaning apparatus used in each of the embodiments described later, which is a laser oscillator G such as a KrF excimer laser for generating a pulsed laser beam L ₀ , which is a laser beam, and an alignment light. An alignment light source A for generating La, a beam splitter S made of synthetic quartz for coaxially aligning the pulse laser beam L ₀ and the alignment light La, and an optical lens system F arranged between this and the work W are provided. Alignment light source A has H
An eNe laser or the like is used, and the alignment light La generated from this is reflected by a mirror R such as an Al vapor deposition mirror and then introduced into a beam splitter S. Further, the optical lens system F is for adjusting the laser power density of the pulse laser beam L ₀ applied to the work W, and between the optical lens system F and the work W, a portion other than the cleaning portion of the work W is provided. A mask M for blocking the pulsed laser beam L _{0 and the} like is provided.

First Embodiment A recording head E ₁ which is an electronic component shown in FIG. 2 is manufactured, an electric connecting portion which is a contact means thereof is cleaned by the apparatus shown in FIG. 1, and a driving IC which is an external component. Electrically connect to external electronic components. The recording head E ₁ is a silicon substrate 10 which is a substrate on which an energy generating element which is an ejection energy generating means for ejecting ink which is a recording liquid of the recording head is patterned, and an electric connection portion 10 on the surface thereof.
a resin layer 11 laminated on the remaining part except a,
The resin layer 11 has a plurality of orifices 11a which are ejection ports for ejecting a recording liquid, an ink channel 11b which is a liquid channel communicating with each orifice 11a, and a common liquid chamber which supplies ink to the orifices 11a. Is provided, and the ink buffer 11c is opened upward in the drawing. A metal layer is laminated instead of the resin layer 11,
The metal layer may be provided with an orifice, a liquid flow path and a common liquid chamber. The electrical connection portion 10a of the silicon substrate 10 has an electrical wiring 10b connected to each energy generating element and a pad 10c made of Al which is a metal pad provided at the tip of the electrical wiring 10b, and the orifice 11a of the resin layer 11 is provided. The water-repellent resin coat 12 is applied to the end surface on the side where the openings are formed and the end surface of the silicon substrate 10 following the end surface.

During the manufacture of the recording head E ₁ , the surface of each pad 10c of the electrical connection portion 10a is contaminated by the development process in the patterning process. In addition, the recording head E
After making ₁ and waiting for a long time before connecting to external electronic components such as a driving IC, an oxide film or the like is formed on the surface of each pad 10c of the electric connection part 10a due to oxygen or moisture in the air. Being dusted or attached. The dirt, oxide film, and the like on the electrical connecting portion 10a are not recorded on the recording head E ₁
Since the connection reliability may be significantly impaired when is connected to an external electronic component, the electrical connection portion 10a is cleaned using the apparatus of FIG. 1 as follows.

The resin layer 11 and the water repellent resin coat 12 of the recording head E ₁ are covered with a mask M, and a KrF excimer laser is used as a laser oscillator G to record a pulsed laser beam which is an ultraviolet laser beam generated from this. The electric connection portion 10a of the head E ₁ is irradiated.

The irradiation condition of the KrF excimer laser is set to a laser power density of 100 mJ / pulses · cm ² and a repetition frequency of 1 Hz, and the irradiation pulse number is changed in the range of 1 to 100 pulses to show the surface condition of the electrical connection portion 10a after cleaning. As a result of examination, it was found that one pulse can remove almost 100% of the dirt and oxide film on each pad 10c. On the other hand, it was observed with a metallurgical microscope that the surface of the pad 10c began to become rough at 60 pulses or more. Further, the electric wiring 10b of the electric connection portion 10a is an Al wiring and SiO that covers the Al wiring.
_When the pulse laser beam of the KrF excimer laser is excessively irradiated, it may penetrate through the SiO ₂ insulating protective film and damage the Al wiring. From this point of view, it was determined that irradiation with 5 pulses (5 seconds) at a repetition frequency of 1 Hz was optimal.

After cleaning the electrical connection portion 10a of the recording head E ₁ in this way and connecting it to an external electronic component by wire bonding using an ultrasonic Al wire bonder, the mis-wire rate of each pad 10c is It was about 5 ppm, and it was found that extremely high connection reliability was obtained. For comparison, when an ultrasonic Al wire bonder was used to connect to an external electronic component under the same conditions without cleaning, the miswire rate was 100 ppm. It was also found that cleaning the electrical connection portion 10a with a KrF excimer laser significantly improves the connection strength of the Al wire and the thermal shock resistance.

According to the present embodiment, the surface of the metal pad such as the pad made of Al is irradiated with the laser beam to effectively remove the dirt and oxide film on the surface of the metal pad. The connection reliability with electronic components can be greatly improved. In addition, such cleaning with a laser beam is easier to incorporate into an in-line process than plasma treatment or UV / O ₃ cleaning, and therefore,
The cost reduction due to mass production can be greatly promoted. In addition, unlike the UV / O ₃ cleaning, there is no possibility that the work temperature is significantly increased and the resin layer, the water-repellent resin coat, etc. are damaged.

In place of the Al wire bonder, Au
It has been found that a wire bonder may be used, and that flip-chip bonding or TAB bonding in which a metal bump is used for connection is used instead of such wire bonding to obtain good connection reliability. There is.

Second Embodiment A recording head E ₂ similar to the recording head E ₁ shown in FIG.
Produced a driving IC component D ₂ which is an electronic component shown in FIG. 3, these, as shown in FIG. 4, after made inkjet element J ₂ is mounted together with the PCB substrate P ₂ on Al substrate 40, The apparatus shown in FIG. 1 cleans the electric connection portions of the recording head E ₂ , the driving IC component D _2, and the PCB substrate P ₂ , and then electrically connects them. The driving IC component D ₂ is provided with an IC logic unit 21 provided on a main part of the surface of a silicon substrate 20 which is a substrate.
And a plurality of electric wirings 20b extending from both sides thereof and an electric connecting portion 20a which is a contact means composed of a pad 20c of Au or the like which is a metal pad formed at the tip end thereof, and the PCB substrate P ₂ has The front end of the surface has an electrical connection portion 30a including a plurality of pads 30c.

Each pad 10c, 20c, 30c is in the process of manufacturing the recording head E ₂ , the driving IC component D ₂ and the PCB substrate P ₂ of the ink jet element J ₂ or while waiting until they are electrically connected.
Are contaminated with developer, dust, oxide film, and the like. Then, using the device of FIG.
0a, 20a, 30a were cleaned.

Electrical connection portions 10a, 20a, 30a of the recording head E ₂ , the driving IC component D ₂ and the PCB substrate P _2.
The surface other than the above is covered with a mask M, and a laser oscillator G
Was irradiated with a pulsed laser beam using a Q-switched ruby laser oscillator. The irradiation conditions are laser power density of 30 mJ / pulses · cm ² , repetition frequency of 1 Hz,
The number of irradiation pulses was 5 (5 seconds). After cleaning the electrical connection parts 10a, 20a, 30a in this manner and connecting them to each other using an ultrasonic Al wire bonder, the miswire rate is about 30 ppm, which is extremely high in connection reliability. was gotten. For comparison,
When the electrical connection parts 10a, 20a, 30a were connected using the same ultrasonic Al wire bonder without cleaning, the miswire rate was 100 ppm.

In the present embodiment, the electrical connection of each electronic component is achieved by assembling the recording head, the driving IC component and the PCB substrate constituting the ink jet element to the Al substrate and simultaneously cleaning the respective electrical connection portions. It has the advantages that the reliability of the connection can be improved, the manufacturing process of the inkjet recording apparatus can be significantly shortened, and the cost reduction can be greatly promoted. The other points are similar to those of the first embodiment.

Third Embodiment When the recording head E ₃ is manufactured by using the positive type resist by the method shown in FIGS. 5 to 11, the chlorine-containing organic solvent having a large cleaning power is used in the cleaning process of the photocurable resin. A cleaning liquid, which is a liquid consisting of a distillation mixture of an alkylbenzene derivative, is used, and a large amount of stains remaining on the electrical connection portion in this cleaning process is removed by using the apparatus shown in FIG. In addition,
If a chlorine-containing organic solvent is used, few stains remain after cleaning, and a cleaning method such as plasma treatment or UV / O ₃ cleaning can be adopted, but the chlorine-containing organic solvent is used as a causative agent of ozone layer depletion. The current situation is that there is a tendency to be regulated, and wet cleaning using an alternative solvent having a low cleaning power is adopted.

The recording head E ₃ of this embodiment is manufactured as follows.

As shown in FIG. 5, an electrothermal conversion element 50a, which is a discharge energy generating means composed of a plurality of HfB _2.
And an electric wire 50b of each electrothermal converting element 50a and a pad 5 made of Au which is a metal pad arranged at the tip of the electric wire 50b.
A silicon substrate 60 which is a substrate obtained by patterning 0c is manufactured (first step), and each pad 5 of the silicon substrate 60 is manufactured.
0c and a part of the electric wiring 50b that follows this, except for the electric connection portion 60a which is a contact means, as shown in FIG. 6, a positive resist 61 having a thickness of 25 μm is applied and then the liquid flow path is formed. Patterning is performed in the shape of a certain ink flow path and an ink buffer which is a common liquid chamber (second step), and subsequently, as shown in FIG. 7, a photocurable resin 62 having a thickness of 150 μm is applied, and the photocurable resin 62 is applied thereon. Then, a quartz top plate 63 having an opening 63a overlapping the ink buffer portion of the positive resist 61 is attached (third step). Note that the silicon substrate 60 is shown in a state in which it is separated from the beginning for each recording head in order to simplify the description.
It is usual to manufacture a plurality of recording heads on an inch wafer and separate the recording heads with a dicing saw during the cleaning process of the photocurable resin described later.

Then, as shown in FIG. 8, proximity exposure is performed using a mask 64 having light-shielding portions 64a and 64b for covering the electrical connection portion 60a of the silicon substrate 60 and the ink buffer portion of the positive resist 61. All the photocurable resin except for the portions covered with the light shielding portions 64a and 64b is exposed and cured (fourth step). The mask 64 is formed by depositing an aluminum film on an optical grade synthetic quartz substrate, and patterning the aluminum film to shield the light shielding portions 64a, 64a.
b) was formed, the gap between the silicon substrate 60 and the mask 64 was set to 100 μm, and a low-pressure mercury lamp was used as the light source of the exposure light. Then, the photocurable resin in the uncured portion was washed and removed using the distillation mixture of the alkylbenzene derivative as described above (fifth step).

At this time, as shown in FIG. 9, a large amount of stains 60b, which are residues of the uncured photo-curable resin, remain on the electrical connection portion 60a due to insufficient cleaning power of the cleaning liquid.

As described above, after separating the recording heads with the dicing saw, the positive type resist 61 is removed with an aqueous sodium hydroxide solution to obtain a recording head E ₃ having an orifice 62a and an ink buffer 62b shown in FIG. 6th step). At this time, the stain 60b, which is the residue of the photocurable resin, is not dissolved in the sodium hydroxide solution and remains in the electrical connection portion 60a. Therefore,
The electric connection portion 60a is cleaned by using a XeCl excimer laser in the laser oscillation device of the apparatus of FIG. 1 to complete the recording head E ₃ shown in FIG. 11 (seventh step).

The surface condition of the electrical connection portion 60a after cleaning was carried out by changing the irradiation conditions of the XeCl excimer laser such that the laser power density was 100 mJ / puls · cm ² , the repetition frequency was 1 Hz, and the irradiation pulse number was changed within the range of 6 to 10 pulses. As a result, it was found that the stain 60b of the electrical connection portion 60a disappeared completely when the number of irradiation pulses was 2 or 3 or more.

When each pad 50c of the recording head E ₃ thus obtained was electrically connected to an external electronic component, which is an external component, by an Au ball bonder, the miswire rate was about 10 ppm. For comparison, the miswire rate is 1460 ppm when connected to an external electronic component by the same method without cleaning by the apparatus of FIG. 1, and when the electrical connection portion 60a is cleaned by plasma treatment. Caused a fatal failure in each part of the recording head E ₃ , and when the UV / O ₃ cleaning was used, the miswire rate was hardly improved.

According to the present embodiment, the use of the solvent containing no organic chlorine compound in the manufacturing process of the recording head greatly contributes to the environment maintenance, while the stains due to the residue of the solvent are completely removed, and the external electronic component is removed. It is possible to obtain a recording head having high connection reliability with. The other points are similar to those of the first embodiment.

Fourth Embodiment When the recording head E ₄ is manufactured by using the negative type resist by the method shown in FIGS. 12 to 14, it is more soluble in the developing solution of the negative type resist or the negative type dry film than the chlorine-containing organic solvent. The distillate mixture of the alkylbenzene derivative, which is a small liquid, is used, and the stains remaining on the electrical connection portion in this developing step are removed using the apparatus of FIG. The reason why the distillation mixture of the alkylbenzene derivative is used is the same as in the third embodiment.

The recording head E ₄ of this embodiment is manufactured as follows.

An electrical connecting portion 70a which is a contact means of a silicon substrate 70 which is a substrate similar to the silicon substrate 60 of FIG.
As shown in FIG. 12, a negative resist 71 having a thickness of 25 μm is applied to the surface except for the area where the ink buffer 71a and the ink flow path 71b are patterned (first step). In this step, a distillate mixture of the alkylbenzene derivative is used as the developing solution, and as a result, the stain 70b which is the residue of the negative resist remains on the electrical connection portion 70a. continue,
As shown in FIG. 13, a negative type dry film 72 is roll-coated on the surface of a negative type resist 71, and a quartz top plate glass 73 having an opening 73a overlapping with the ink buffer 71a is attached onto the negative dry film 72. Only the negative dry film 72 in the exposed portion is patterned (second step). At this time, a distillate mixture of alkylbenzene derivatives is also used as the developing solution, and the electric connection portion 70a is used.
The stain 70b remains. Similar to the third embodiment, the steps up to this point are to simultaneously manufacture a plurality of recording heads on an 8-inch wafer, and finally, the electrical connection portion 70a.
Before cleaning the above, the recording head E ₄ is separated by using a dicing saw. Electrical connection 70 of recording head E ₄
The cleaning of a is performed by using a XeCl excimer laser in the laser oscillator of the apparatus shown in FIG.
Obtain ₄ (3rd step). The irradiation conditions of the XeCl excimer laser are laser power density 100 mJ / puls · cm.
^{2. When} the surface condition of the electrical connection portion 70a after cleaning was examined by changing the irradiation frequency at 1 Hz and the irradiation pulse number in the range of 4 to 10 pulses, the stain 70b was found to be found if the irradiation pulse number was 4 or 5 or more. It turned out to disappear completely.

When the recording head E ₄ thus obtained was connected to an external electronic component by an Au ball bonder, the miswire rate was about 10 ppm. For comparison, the miswire rate is 15 when connected to an external electronic component by the same method without cleaning by the apparatus of FIG.
It was 00 ppm. The other points are similar to those of the first embodiment.

According to the experiment, the laser oscillator of the device of FIG. 1 is not limited to the KrF excimer laser, the Q-switch ruby laser, the XeCl laser, etc., but the Q switch YA.
It has been found that good results can be obtained even by using a third harmonic wave, a fourth harmonic wave of a G laser, an N ₂ laser, or the like.

Next, a liquid jet recording apparatus equipped with any one of the recording heads according to the first to fourth embodiments will be described with reference to FIG.

The carriage 101 having the recording head unit in which the recording head 103 and the ink container are joined is guided by the lead screw 105 having the guide shaft 104 and the spiral groove 105a, and the ink container is mounted on the carriage 101. It is possible to mount the ink container cassette 102.

The lead screw 105 has a gear train 106a, 106b, 1 driven by a drive motor 106 that rotates in the forward and reverse directions.
Rotated forward and backward through 06c and 106d, and its spiral groove 1
The carriage 101 is reciprocally moved in the arrow direction and the counter arrow direction via a pin (not shown) provided on the carriage 101 having a tip end engaged with the reference numeral 05a. The forward / reverse rotation of the drive motor 106 is switched by detecting that the carriage 101 is at the home position by the lever 115 and the photocoupler 116 provided on the carriage 101.

On the other hand, the recording paper 109 which is the recording medium is
The platen 107 is pressed by a pressing plate 108, and is conveyed so as to face the recording head 103 by a paper feed roller (not shown) driven by a paper feed motor 110.

The recovery unit 111 includes the recording head 103.
It is provided in order to remove the foreign matter adhering to the ejection port and the ink of high viscosity to maintain the ejection characteristic in a normal state.

The recovery unit 111 has a cap member 113 communicating with a suction means (not shown), and by capping and sucking the discharge port of the recording head 103, foreign matter and viscosity attached to the discharge port. Remove the elevated ink. Also, the recovery unit 111 and the platen 1
Between 07, a cleaning blade 114 which is guided by the guide member 112 and moves forward and backward toward the traveling path of the ejection port surface of the recording head 103 is disposed. It is configured to be able to clean foreign matter and ink droplets attached to the outlet surface.

The present invention brings excellent effects particularly in a recording head and a recording apparatus of an ink jet recording system for forming recording by forming flying droplets by utilizing thermal energy in the liquid jet recording system. Is.

Regarding the typical structure and principle thereof, see, for example, US Pat. Nos. 4,723,129 and 4740.
No. 796, the present invention is preferably carried out using these basic principles. This recording method is applicable to both the so-called on-demand type and the continuous type.

To briefly explain this recording method, recording information is recorded on an electrothermal converter which is a discharge energy generating means arranged corresponding to a sheet or a liquid passage holding a recording liquid (ink). Correspondingly, thermal energy is generated by applying at least one drive signal to the recording liquid (ink) in order to overcome the nucleate boiling phenomenon and to provide a rapid temperature rise that causes the film boiling phenomenon. Film boiling occurs on the heat-acting surface. In this way, bubbles can be formed in a one-to-one correspondence with the drive signal applied from the recording liquid (ink) to the electrothermal converter, which is particularly effective for the on-demand recording method. The growth and contraction of the bubbles cause the recording liquid (ink) to be ejected through the ejection port to form at least one droplet. It is more preferable to make this drive signal into a pulse shape, because the bubble growth and contraction are immediately and appropriately performed, so that the ejection of the recording liquid (ink) with particularly excellent responsiveness can be achieved. As the pulse-shaped drive signal, those described in US Pat. Nos. 4,463,359 and 4,345,262 are suitable. If the conditions described in US Pat. No. 4,313,124, which is an invention relating to the rate of temperature rise on the heat acting surface, are adopted, more excellent recording can be performed.

The structure of the recording head is a combination of a discharge port, a liquid flow path, and an electrothermal converter as disclosed in the above-mentioned specifications (straight liquid flow path or right-angled liquid flow path).
In addition to the above, the present invention is also effective for those having a configuration in which the heat acting portion is arranged in the bending region as disclosed in US Pat. No. 4,558,333 and US Pat. No. 4,459,600. .

In addition, Japanese Laid-Open Patent Publication No. 123670/1984, which discloses a structure in which a common slit is used as a discharge port for a plurality of electrothermal converters, and a pressure wave of thermal energy is absorbed. The present invention is also effective in a structure having a structure based on Japanese Patent Application Laid-Open No. 138461/1984, which discloses a structure in which the corresponding opening corresponds to the discharge portion.

Further, as a recording head in which the present invention is effectively used, there is a full line type recording head having a length corresponding to the maximum width of the recording medium which can be recorded by the recording apparatus. The full line head may be a full line configuration formed by combining a plurality of print heads as disclosed in the above specification, or may be a single full line print head integrally formed.

In addition, by being attached to the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective when a cartridge-type recording head that is specially provided is used.

Further, it is preferable to add recovery means for the recording head or preliminary auxiliary means to the liquid jet recording apparatus of the present invention because the recording apparatus can be made more stable. Specifically, the recording head is preheated by a capping means, a cleaning means, a pressure or suction means, an electrothermal converter or a heating element other than this, or a combination thereof. It is also effective to perform stable recording by adding a preliminary discharge mode means for performing discharge different from the means and recording.

Further, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, and either the recording head may be integrally formed or a plurality of combinations may be used. However, the present invention is also extremely effective for an apparatus provided with at least one of a multicolor of different colors or a full color by color mixing.

In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

In addition, the liquid jet recording apparatus of the present invention may be used as an image output terminal of an information processing apparatus such as a computer, a copying apparatus combined with a reader or the like, and a facsimile having a transmitting / receiving function. It may take the form of a device.

[0058]

Since the present invention is configured as described above, it has the following effects.

By cleaning the electrical connection portion of the electronic component with laser light, high connection reliability with the external electronic component can be obtained. Further, cleaning with laser light is easy to incorporate into an in-line process, and is therefore suitable for mass production, and there is no risk of impairing the performance of electronic components. As a result, it is possible to realize a high-performance electronic component that is inexpensive and easy to connect to an external electronic component. If the electronic component is a recording head, a high performance and inexpensive liquid jet recording apparatus can be realized.

[Brief description of drawings]

FIG. 1 is an explanatory diagram illustrating an apparatus used for cleaning an electrical connection portion of an electronic component.

FIG. 2 is a perspective view showing an electronic component according to the first embodiment.

FIG. 3 is a perspective view showing an electronic component according to a second embodiment.

FIG. 4 is a partial perspective view showing a main part of a liquid ejecting element according to a second embodiment.

FIG. 5 is a perspective view showing a first step of manufacturing steps of the recording head according to the third embodiment.

FIG. 6 is a perspective view showing a second step of the manufacturing steps of the recording head according to the third embodiment.

FIG. 7 is a perspective view showing a third step of the manufacturing steps of the recording head according to the third embodiment.

FIG. 8 is a perspective view showing a fourth step of the manufacturing steps of the recording head according to the third embodiment.

FIG. 9 is a perspective view showing a state after a fifth step of the recording head manufacturing steps according to the third example.

FIG. 10 is a perspective view showing a sixth step of the manufacturing steps of the recording head according to the third embodiment.

FIG. 11 is a perspective view showing a seventh step of the manufacturing steps of the recording head according to the third embodiment.

FIG. 12 is a perspective view showing a first step of manufacturing steps of the recording head according to the fourth example.

FIG. 13 is a perspective view showing a second step of the manufacturing steps of the recording head according to the fourth embodiment.

FIG. 14 is a perspective view showing a third step of manufacturing steps of the recording head according to the fourth example.

FIG. 15 is a perspective view showing the entire liquid jet recording apparatus.

[Explanation of symbols]

10, 20, 60, 70 Silicon substrate 10a, 20a, 30a, 60a, 70a Electric connection part 10b, 20b, 50b Electric wiring 10c, 20c, 30c, 50c Pad 11 Resin layer 11a, 62a Orifice 11c, 62b, 71a Ink buffer 40 Al substrate 60b, 70b Stain 61 Positive resist 62 Photocurable resin 63, 73 Top plate glass 64 Mask 71 Negative resist 71b Ink flow channel 72 Negative dry film

Claims (11)

[Claims] 1. An electronic component electrically connected to an external component by a contact means provided on a surface of a substrate, wherein the contact means has a surface cleaned by laser light. 2. The electronic component according to claim 1, wherein the contact means has a metal pad. 3. The electronic component according to claim 2, wherein the metal pad is electrically connected to an external component by wire bonding, flip chip bonding or TAB bonding. 4. The electronic component according to claim 1, wherein the laser light is an ultraviolet laser beam. 5. The electronic component according to claim 1, further comprising a resin layer or a metal layer that forms a plurality of liquid flow paths and a common liquid chamber communicating with each liquid flow path on a substrate. A recording head characterized in that 6. A method of manufacturing an electronic component, comprising: a step of bringing a surface of a substrate having contact means into contact with a liquid; and a step of cleaning the surface of the contact means of the substrate in contact with the liquid with a laser beam. 7. The method of manufacturing an electronic component according to claim 6, wherein the liquid is a developing solution or a cleaning solution for patterning the resin layer deposited on the surface of the substrate. 8. The method of manufacturing an electronic component according to claim 7, wherein the resin layer is made of a photocurable resin. 9. The method of manufacturing an electronic component according to claim 6, wherein the liquid is a solvent containing no organic chlorine compound. 10. A step of contacting a surface of a substrate having a resin layer and a contact means with a developing solution to form a plurality of liquid flow paths and a common liquid chamber communicating with each liquid flow path in the resin layer, and a developing solution. A method of manufacturing a recording head, comprising the step of cleaning the surface of the contact means of the substrate in contact with the substrate with a laser beam. 11. A carriage on which the recording head according to claim 5 is mounted, a means for supplying an electric signal to an ejection energy generating means provided in the recording head, and a recording medium facing the recording head. A liquid jet recording apparatus including a transport device for transporting.