JPH07307222A - Laminated inductance component and manufacturing method - Google Patents

Abstract

PURPOSE:To provide a thin laminated inductance component with good characteristics in inductance. CONSTITUTION:An insulating layer 4 is formed all over a ceramic board 1, and a base insulating layer 12 is deposited on the insulating layer 4. A lower- layer conductive layer 8 including a lower coil part 2 and a lower terminal part 3 is deposited on the base insulating layer 12. An intercoil insulating layer 6 having an opening part 5 is formed on the lower conductive layer 8. An upper- layer conductive layer 10 including an upper-layer coil part 7 and an upper-layer terminal part 9 is deposited on the intercoil insulating layer 6. A surface insulating layer 11 having an opening part 5 is deposited on the upper-layer conductive layer 10. The opening parts 5 in the intercoil insulating layer 6 and the surface insulating layer 11 are formed zigzag respectively. At the same time, the lower- layer terminal part 3 is connected to the upper-layer terminal part 3 through the opening part 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin laminated inductance component having a ceramic substrate and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional laminated inductance component will be described below.

As described in Japanese Patent Laid-Open No. 55-91103, a conventional laminated inductance component is formed by forming an electrically insulating layer on the surface of a magnetic thin plate and then forming a conductive pattern to make it magnetic. Allows the use of any calcined ferrite as a body, puts a support such as Mylar on a flat surface of aluminum, etc., prints a magnetic substance composed of ferrite powder on it, and glass powder on the entire surface of this magnetic substance This is a structure in which an insulating material composed of is printed and a conductive pattern is printed on the surface of a magnetic material having this insulating layer, and an inductor is directly formed on a circuit board.

[0004]

However, in the above-mentioned conventional structure, since the magnetic material and the conductor layer are simultaneously fired, it is necessary to use a magnetic material having a very high resistance in order to secure sufficient magnetic characteristics. Further, when the inductor is directly formed on the circuit board, there is a problem that the connection between the circuit board and the inductor is insufficient or the characteristics of the inductor are deteriorated.

The present invention solves the above problems, and an object of the present invention is to provide a thin laminated inductance component having excellent inductor characteristics.

[0006]

In order to achieve the above object, the present invention provides a conductor layer having at least one turn of a coil portion and a terminal portion, and an insulating layer made of crystallized glass and low melting point glass. Are laminated on a ceramic substrate, and the terminal portions of the conductor layer are connected to the upper and lower insulating layers through openings formed in a zigzag pattern.

[0007]

With the above structure, since the insulating layer is made of crystallized glass and low melting point glass, it is very stable thermally, has excellent thermal compatibility with the ceramic substrate, and is resistant to temperature changes. The difference in thermal expansion of the conductor can be buffered. Further, since the conductor layer is composed of the coil portion and the terminal portion, the inductance is obtained in the coil portion, magnetic mutual interference is small, and excellent characteristics can be obtained. Furthermore, because the openings of the insulating layer are staggered at the top and bottom,
The volume of the conductor can be minimized, the use of the conductor material can be reduced as much as possible, and the difference in thermal expansion between the insulating layer and the conductor layer near the terminal of the conductor layer can be absorbed to prevent the occurrence of microcracks. it can.

[0008]

【Example】

(Embodiment 1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 3, in the laminated inductance component of this embodiment, the whole surface insulating layer 4 is laminated on the ceramic substrate 1, and the board insulating layer 12 is laminated on the whole surface insulating layer 4. The lower coil portion 2 is formed on the substrate insulating layer 12.
And a lower-layer terminal portion 3 are laminated on the lower-layer conductor layer 8, an inter-coil insulating layer 6 having an opening 5 is laminated on the lower-layer conductor layer 8, and an upper-layer coil portion is formed on the inter-coil insulating layer 6. 7 and the upper conductor layer 10 including the upper terminal portion 9 are laminated, and the surface insulating layer 11 including the opening 5 is laminated on the upper conductor layer 10, and the inter-coil insulating layer 6 and the surface insulating layer are laminated. 11, the upper and lower openings 5 are arranged in a staggered manner, and the lower layer terminal portion 3 and the upper layer terminal portion 9 are drawn out from the opening 5.

The method of forming the same will be described below. 80 g of magnesium oxide-boron oxide-silicon oxide type crystallized glass and 2 g of low melting point glass (lead borosilicate type glass)
0 g was mixed to prepare an insulating material. To 100 g of this insulating material, 26 g of a mixture of α-terpineol and ethyl cellulose at a mass ratio of 100: 6 (hereinafter abbreviated as vehicle) was added and mixed, and then kneaded with a three-roll to produce an insulating paste. Was produced. The crystallization temperature of the crystallized glass is 780 ° C., and the softening point of the low melting point glass is 600 ° C. Furthermore, a silver paste was similarly prepared using 30 g of silver powder and 8 g of vehicle. Using these pastes, the whole surface insulating layer 4 shown in FIG. 3 (a) was formed on the ceramic substrate 1 made of nickel-zinc ferrite having a length and width of 100 mm and a thickness of 1 mm by screen printing. Printed. The substrate insulating layer 12 shown in FIG. 3B was printed on the entire surface insulating layer 4 using an insulating paste. Next, the lower coil portion 2 of the lower conductor layer 8 shown in FIG.
The inter-coil insulating layer 6 having the openings 5 shown in (d) was printed using an insulating paste. Further, the upper coil portion 7 of the upper conductor layer 10 shown in FIG. 3E is printed with silver paste, and the surface insulating layer 11 having the openings 5 shown in FIG. 3F is printed with insulating paste. To form a coil.
The drying temperature after printing is 150 ° C. Each insulating layer was formed by printing three times, and each conductor layer was formed by printing once. The plate used for printing is made of stainless steel and has 200 mesh. The ceramic substrate 1 made of this ferrite was held in the atmosphere at 850 ° C. for 10 minutes and then fired under the cooling condition. The above operation was repeated 5 times to laminate the coil layers.

Although not shown, two conductor wiring layers were formed on the coil layer and on the ceramic substrate 1 made of ferrite on the back surface. First, the conductor layer is printed, and then the insulating layer is printed.
It was fired under the condition of holding for 0 minutes. Next, a conductor layer was printed thereon and fired under the condition of holding at 850 ° C. for 10 minutes in the atmosphere. Finally, an insulating layer was printed using an insulating paste baked at 550 ° C.
Firing was performed under the condition of holding for a minute. Wiring layers were formed on the front and back surfaces by the above operation.

Finally, a wiring layer consisting of 12 conductor layers on the front surface and 2 conductor layers on the back surface was formed, and the thickness of the coil layer and the wiring layer was 0.9 mm.

As described above, according to the first embodiment, since the insulating layer 6 is made of crystallized glass and low melting point glass, it is very stable thermally and has a very good thermal matching with the ceramic substrate 1. In addition to being excellent, it is possible to buffer the difference in thermal expansion of the conductor even when the temperature changes. In addition, the conductor layers 8 and 10
Is composed of the coil portions 2 and 7 and the terminal portions 3 and 9, the inductance can be obtained in the coil portion, the magnetic mutual interference is small, and excellent characteristics can be obtained. Furthermore, since the openings 5 of the insulating layer are staggered above and below, the volume of the conductor can be minimized, the use of the conductor material can be reduced as much as possible, and the terminal portions 3 of the conductor layers 8 and 10 can be reduced. Absorbing the difference in thermal expansion between the insulating layer 6 and the conductor layers 8 and 10 in the vicinity of 9,
It is possible to prevent the generation of microcracks.

By using ferrite as the material of the ceramic substrate 1, the substrate forms a part of the magnetic circuit, so that the magnetic shield can be formed and the inductance component can be made thinner.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.

As shown in FIGS. 2 and 4, the laminated inductance component in this embodiment has substantially the same structure as that of the first embodiment, and includes the inter-coil insulating layer 6, the surface insulating layer 11, and the substrate insulating layer 12. The lower conductor layer 8 and the upper conductor layer 10 are provided with an opening 13 at the same position, and an opening window 13 for exposing the ceramic substrate 1 is provided.
A mold core can be inserted.

The method for forming the same will be described below. 80 g of magnesium oxide-boron oxide-silicon oxide based crystallized glass, 10 g of zircon powder and 1 low melting point glass.
0 g was mixed to prepare an insulating material. This insulating material was made into an insulating paste in the same manner as in Example 1. The crystallization temperature of the crystallized glass is 750 ° C, and the softening point of the low melting point glass is 530 ° C. Using this insulating paste and the silver paste produced in Example 1, a coil layer was formed on the ceramic substrate 1 made of ferrite by screen printing in the same manner as in Example 1 using the various patterns shown in FIG. The ceramic substrate 1 made of this ferrite was held in the atmosphere at 850 ° C. for 10 minutes and then fired under the cooling condition. The above operation was repeated 5 times to laminate the coil layers.

Further, as in Example 1, two wiring layers of conductors were formed on the coil layer and the ferrite substrate on the back surface.

Finally, the conductor 1 is formed on the surface in the same manner as in the first embodiment.
Two conductor layers were formed on the back and two conductor layers, and the coil layer and the wiring layer had a thickness of 0.9 mm. Further, the window in which no wiring layer is printed at all maintained the shape at the time of printing, and the wiring layer could be formed in a shape in which part of the ceramic substrate 1 made of ferrite was exposed.

As described above, according to the second embodiment, in addition to the effect of the first embodiment, by inserting the E-shaped core of the ferrite sintered body into the opening window 13 of the insulating layer, the inductance component can be further improved. It can be thin and have excellent characteristics.

(Embodiment 3) A third embodiment of the present invention will be described below.

The laminated inductance component in this embodiment is almost the same as the constitution of the embodiment 2 and has a constitution in which an E type core is inserted into an opening window 13 exposing the ceramic substrate 1 and an I type core is bonded. .

The method for forming the same will be described below. Magnesium oxide-boron oxide-silicon oxide based crystallized glass 30 g, alumina powder 30 g, and silicate glass 10 g
An insulating paste was prepared in the same manner as in Example 1 by using an insulating material in which a low melting point glass was mixed with 30 g, and a coil layer was formed on the ceramic substrate 1 made of alumina by screen printing using the pattern shown in FIG. Was formed.

This alumina substrate was exposed to 85% air.
After holding at 0 ° C. for 10 minutes, firing was performed under cooling conditions.
This operation was repeated 5 times to laminate the coil layers.

Further, similarly to the second embodiment, the conductor 2 is formed on the ceramic substrate 1 made of an alumina substrate on the coil layer and the back surface.
The wiring layer of the layer was formed. The crystallization temperature of the crystallized glass used in this example is 750 ° C., and the softening point of the low melting point glass is 530 ° C. The same coil layer and wiring layer as in Example 1 or Example 2 could be formed on the ceramic substrate 1 made of alumina.

As described above, according to the third embodiment, the first,
In addition to the effects of the second embodiment, an opening window 13 is provided in the exposed portion of the ceramic substrate 1 made of alumina, where the coil layer and the insulating layer are not formed, and the E-shaped core of the ferrite sintered body is inserted. In addition, since the I-shaped core is attached, the electrical characteristics can be improved.

[0027]

As described above, according to the present invention, it is possible to provide a laminated inductance component having the following effects.

That is, since the insulating layer is made of crystallized glass and low-melting glass, it is very stable thermally, has excellent thermal compatibility with the ceramic substrate, and has a conductor that is resistant to temperature changes. The difference in thermal expansion can be buffered.

Further, since the conductor layer is composed of the coil portion and the terminal portion, the inductance can be obtained in the coil portion, the magnetic mutual interference is small, and excellent characteristics can be obtained.

Furthermore, since the openings of the insulating layer are staggered above and below, the volume of the conductor can be minimized, the use of the conductor material can be reduced as much as possible, and the insulation near the terminals of the conductor layer can be achieved. Absorbs the difference in thermal expansion between layers and conductor layers,
It is possible to prevent the generation of microcracks.

By using ferrite as the material of the ceramic substrate, the substrate forms a part of the magnetic circuit, so that the magnetic shield can be formed and the inductance component can be made thinner.

Further, by inserting the E-shaped core of the ferrite sintered body into the opening of the insulating layer and adhering the I-shaped core together, the inductance component can be made thinner and have excellent characteristics.

[Brief description of drawings]

1A is a perspective view of a laminated inductance component according to a first embodiment of the present invention, and FIG. 1B is a sectional view thereof.

2A is a perspective view of a laminated inductance component according to a second embodiment of the present invention, and FIG. 2B is a sectional view thereof.

FIG. 3 is an exploded plan view of the laminated inductance component according to the first embodiment of the present invention.

FIG. 4 is an exploded plan view of a laminated inductance component according to a second embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceramic substrate 2 Lower layer coil part 3 Lower layer terminal part 4 Whole surface insulating layer 5 Opening part 6 Inter-coil insulating layer 7 Upper layer coil part 8 Lower layer conductor layer 9 Upper layer terminal part 10 Upper layer conductor layer 11 Surface insulating layer 12 Substrate insulating layer

Front page continuation (72) Inventor Keigo Kodaira 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (4)

[Claims] 1. A conductor layer having at least one turn of a coil portion and a terminal portion, and an insulating layer made of crystallized glass and low-melting glass are alternately laminated and located above and below the conductor layer. A laminated inductance component in which openings are formed in a zigzag pattern in the insulating layer, and the terminals of upper and lower conductor layers are electrically connected through the openings. 2. The laminated inductance component according to claim 1, wherein a laminated body of a conductor layer and an insulating layer is provided on a ceramic substrate, and the laminated body is provided with an opening window for exposing a lower ceramic substrate. 3. A conductor layer having a coil portion having at least one turn or more and a terminal portion, and an insulating layer made of crystallized glass and low melting point glass and having an opening portion at a portion corresponding to the terminal portion. Are alternately provided on the ceramic substrate, and the terminal portions of the conductor layers are connected by the constituent elements of the terminal portions which flow into the openings formed in the upper and lower insulating layers in a staggered manner. 4. The method for manufacturing a laminated inductance component according to claim 3, wherein a conductor layer having an opening at the same location and an insulating layer are laminated on a ceramic substrate.