JPH07304930A - Phenolic resin composition and phenolic resin laminated sheet - Google Patents

Phenolic resin composition and phenolic resin laminated sheet

Info

Publication number
JPH07304930A
JPH07304930A JP9828794A JP9828794A JPH07304930A JP H07304930 A JPH07304930 A JP H07304930A JP 9828794 A JP9828794 A JP 9828794A JP 9828794 A JP9828794 A JP 9828794A JP H07304930 A JPH07304930 A JP H07304930A
Authority
JP
Japan
Prior art keywords
phenolic resin
acid
phenol resin
polyester resin
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9828794A
Other languages
Japanese (ja)
Inventor
Kazunaga Sakai
和永 坂井
Yoshihiro Nakamura
吉宏 中村
Kenichi Ikeda
謙一 池田
Masabumi Yano
正文 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP9828794A priority Critical patent/JPH07304930A/en
Publication of JPH07304930A publication Critical patent/JPH07304930A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

PURPOSE:To provide a phenolic resin laminated sheet, using paper as a substrate, having high heat resistance and tracking resistance and, at the same time, high stampability at room temp. and a phenolic resin compsn. for constituting the phenolic resin laminate sheet. CONSTITUTION:An unsatd. polyester resin, particularly an unsatd. polyester resin wherein the glycol component is a glycerol having the beta-hydroxyl group bonded to a higher fatty acid having 6 to 30 carbon atoms through an ester bond and the dibasic acid bonded to the alpha- and gamma-hydroxyl groups of the glycerol is an unsatd. dibasic acid is compounded with a flexibilizer-modified phenolic resin. The phenolic resin is impregnated into a paper substrate, and the impregnated paper substrate is dried to prepare a prepreg, which is then heated under pressure to prepare a laminated sheet.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、プリント配線板の絶縁
基板として用いられるフェノール樹脂積層板及びこのフ
ェノール樹脂積層板の構成材料であるフェノール樹脂組
成物に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin laminate used as an insulating substrate of a printed wiring board and a phenol resin composition which is a constituent material of the phenol resin laminate.

【0002】[0002]

【従来の技術】紙基材フェノール樹脂積層板は、加工性
がよいため、打ち抜き加工が多用されている。フェノー
ル類とホルムアルデヒドだけで合成されたフェノール樹
脂は、硬く、可塑性がなく、現在の積層板に要求されて
いる打ち抜き加工性が得られない。そのために、低弾性
率の紙基材を使用する。このほか、フェノール樹脂自体
に可撓性を付与するようにしている。フェノール樹脂に
可撓性を付与する手段としては、乾性油でフェノール樹
脂を変性する手法がひろく採用されている。
2. Description of the Related Art Since a paper-based phenolic resin laminate has good workability, punching is often used. Phenolic resin synthesized only with phenols and formaldehyde is hard and has no plasticity, and the punching workability required for the current laminated board cannot be obtained. For that purpose, a paper substrate having a low elastic modulus is used. In addition, the phenol resin itself is given flexibility. As a means for imparting flexibility to a phenol resin, a method of modifying the phenol resin with a drying oil is widely adopted.

【0003】[0003]

【発明が解決しようとする課題】最近、電子機器が高性
能化し、プリント配線板も苛酷な条件で使用されるよう
になり、耐熱性及び耐トラッキング性のさらなる改善が
要求されるようになっている。また、打ち抜き加工にお
いても、穴間が1.78mmという狭い間隔で、しかも
室温で打ち抜けることが要求されている。本発明は、耐
熱性及び耐トラッキング性がよく、かつ、室温での打ち
抜き加工性のよい紙基材フェノール樹脂積層板及びこの
フェノール樹脂積層板の構成材料であるフェノール樹脂
組成物を提供することを目的とするものである。
Recently, the performance of electronic equipment has increased, and printed wiring boards have come to be used under severe conditions. Therefore, further improvement in heat resistance and tracking resistance is required. There is. Also, in punching, it is required that the holes be punched at a narrow interval of 1.78 mm and at room temperature. The present invention provides a paper-based phenol resin laminate having good heat resistance and tracking resistance and good punching property at room temperature, and a phenol resin composition which is a constituent material of the phenol resin laminate. It is intended.

【0004】[0004]

【課題を解決するための手段】本発明者らは、フェノー
ル樹脂の耐熱性を損なうことなく可撓性をよくする手段
について種々検討し、脂肪族不飽和ポリエステル樹脂、
特に、β水酸基と炭素数6〜30の高級脂肪酸とがエス
テル結合したグリセリンをグリコール成分とし、前記グ
リセリンのα及びγ水酸基と結合する二塩基酸が、飽和
又は不飽和脂肪酸である脂肪族不飽和ポリエステル樹脂
を配合することにより前記課題を解決できることを見出
した。
Means for Solving the Problems The present inventors have variously studied means for improving flexibility without impairing the heat resistance of the phenolic resin, and have confirmed that the aliphatic unsaturated polyester resin,
In particular, an aliphatic unsaturation in which a glycerin in which a β-hydroxyl group and a higher fatty acid having 6 to 30 carbon atoms are ester-bonded is used as a glycol component, and a dibasic acid bonded to the α- and γ-hydroxyl groups of the glycerin is a saturated or unsaturated fatty acid. It has been found that the above problem can be solved by blending a polyester resin.

【0005】すなわち、本発明は、可撓剤変性フェノー
ル樹脂に、不飽和ポリエステル樹脂、特に、β水酸基と
炭素数6〜30の高級脂肪酸とがエステル結合したグリ
セリンをグリコール成分とし、前記グリセリンのα及び
γ水酸基と結合する二塩基酸が、不飽和脂肪酸である不
飽和ポリエステル樹脂を配合してなるフェノール樹脂組
成物である。
That is, in the present invention, an unsaturated polyester resin, in particular, glycerin in which a β hydroxyl group and a higher fatty acid having 6 to 30 carbon atoms are ester-bonded to a flexibilizer-modified phenolic resin is used as a glycol component, and α of the glycerin is used. And a dibasic acid that binds to the γ-hydroxyl group is a phenol resin composition prepared by blending an unsaturated polyester resin which is an unsaturated fatty acid.

【0006】グリセリンのβ水酸基とエステル結合する
炭素数6〜30の高級脂肪酸としては、カプリル酸、カ
プリン酸、ラウリル酸、ミリスチン酸、パルミチン酸、
ステアリン酸、オレイン酸、リノール酸、リノレン酸な
どが挙げられ、炭素数6未満では本発明所期の目的を達
成できない。また、炭素数が30を超える高級脂肪酸は
入手が困難で、実用的でない。
Examples of higher fatty acids having 6 to 30 carbon atoms which form an ester bond with β-hydroxyl group of glycerin include caprylic acid, capric acid, lauric acid, myristic acid, palmitic acid,
Examples thereof include stearic acid, oleic acid, linoleic acid, and linolenic acid. When the carbon number is less than 6, the intended purpose of the present invention cannot be achieved. Further, higher fatty acids having more than 30 carbon atoms are difficult to obtain and are not practical.

【0007】グリセリンのα及びγ水酸基と結合する二
塩基酸としては、通常不飽和ポリエステル樹脂の酸成分
として用いられている二塩基酸が使用できる。このよう
な二塩基酸としては、フマル酸、マレイン酸、無水マレ
イン酸、イタコン酸などが挙げられる。マロン酸、コハ
ク酸、フタル酸、イソフタル酸、テレフタル酸、グルタ
ル酸、アジピン酸のような飽和酸を必要に応じて併用し
てもよい。
As the dibasic acid that binds to the α and γ hydroxyl groups of glycerin, the dibasic acid usually used as the acid component of unsaturated polyester resins can be used. Examples of such dibasic acid include fumaric acid, maleic acid, maleic anhydride, and itaconic acid. Saturated acids such as malonic acid, succinic acid, phthalic acid, isophthalic acid, terephthalic acid, glutaric acid, and adipic acid may be used together if necessary.

【0008】β水酸基と炭素数6〜30の高級脂肪酸と
がエステル結合したグリセリンをグリコール成分とし、
前記グリセリンのα及びγ水酸基と結合する二塩基酸
が、不飽和脂肪酸である不飽和ポリエステル樹脂は、グ
リセリンと炭素数6〜30の高級脂肪酸とを反応させ、
次いで不飽和二塩基酸とを反応させることによって得ら
れる。
Glycerin in which β-hydroxyl group and higher fatty acid having 6 to 30 carbon atoms are ester-bonded as a glycol component,
The unsaturated polyester resin in which the dibasic acid bonded to the α and γ hydroxyl groups of glycerin is an unsaturated fatty acid is reacted with glycerin and a higher fatty acid having 6 to 30 carbon atoms,
It is then obtained by reacting with an unsaturated dibasic acid.

【0009】β水酸基と炭素数6〜30の高級脂肪酸と
がエステル結合したグリセリンをグリコール成分とし、
前記グリセリンのα及びγ水酸基と結合する二塩基酸
が、不飽和脂肪酸である不飽和ポリエステル樹脂を、公
知の方法で合成された乾性油変性フェノール樹脂に配合
したワニスを紙基材に含浸乾燥してプリプレグとし、所
要枚数重ね、加熱加圧して積層板とする。銅張積層板
は、銅はく(通常は接着剤付き銅はくを用いる)とプリ
プレグを同時に重ねて加熱加圧することによって得られ
る。
Glycerin in which β-hydroxyl group and higher fatty acid having 6 to 30 carbon atoms are ester-bonded as a glycol component,
The dibasic acid that binds to the α and γ hydroxyl groups of glycerin is an unsaturated polyester resin that is an unsaturated fatty acid, and a paper base is impregnated with a varnish mixed with a drying oil-modified phenol resin synthesized by a known method and dried. To prepare a prepreg, stack the required number of sheets, heat and pressurize to form a laminated plate. The copper-clad laminate is obtained by simultaneously stacking a copper foil (usually using a copper foil with an adhesive) and a prepreg and heating and pressing.

【0010】フェノール樹脂は、レゾール型のフェノー
ル樹脂が用いられ、この樹脂は、フェノール類とホルム
アルデヒドとを、アルカリ触媒の存在下に反応させて得
られる。フェノール類としては、フェノール、メタクレ
ゾール、パラクレゾール、オルソクレゾール、パラター
シャリーブチルフェノール、パライソプロピルフェノー
ル、パライソプロペニルフェノールオリゴマーノニルフ
ェノール、ビスフェノールAなどが使用される。
As the phenol resin, a resol type phenol resin is used, and this resin is obtained by reacting phenols and formaldehyde in the presence of an alkali catalyst. As the phenols, phenol, meta-cresol, para-cresol, ortho-cresol, para-tert-butylphenol, para-isopropylphenol, para-isopropenylphenol oligomer nonylphenol, bisphenol A and the like are used.

【0011】乾性油は、フェノール樹脂に可撓性を付与
するための変性剤であり、桐油、脱水ヒマシ油、アマニ
油、オイチシカ油などの使用が従来から提案されている
が、実用されている変性剤は、桐油である。
Drying oil is a modifier for imparting flexibility to the phenol resin, and it has been proposed to use tung oil, dehydrated castor oil, linseed oil, deer oil, etc., but it has been put to practical use. The modifier is tung oil.

【0012】ポリエステル樹脂の配合量は、可撓性フェ
ノール樹脂固形分100重量部に対して、2〜20重量
部である。2重量部より少ないと、効果がなく、20重
量部を超えると耐熱性が低くなる。
The blending amount of the polyester resin is 2 to 20 parts by weight based on 100 parts by weight of the flexible phenol resin solid content. If it is less than 2 parts by weight, no effect is obtained, and if it exceeds 20 parts by weight, the heat resistance becomes low.

【0013】可撓性フェノール樹脂とポリエステル樹脂
とを、溶剤に溶解したワニスを紙基材に含浸乾燥してプ
リプレグとする。使用される溶剤は、トルエン、メタノ
ール、メチルエチルケトン、アセトン、ジメチルホルム
アミド、スチレン等である。
A varnish obtained by dissolving a flexible phenol resin and a polyester resin in a solvent is impregnated into a paper base material and dried to obtain a prepreg. The solvent used is toluene, methanol, methyl ethyl ketone, acetone, dimethylformamide, styrene or the like.

【0014】なお、打ち抜き加工性や耐トラッキング性
は主に積層板表面が関係することが知られている。した
がって、プリプレグを複数使用するとき、表面層に本発
明のフェノール樹脂組成物を含浸した、プリプレグを用
い、中心層には、乾性油変性フェノール樹脂を含浸した
プリプレグを用いるようにしてもよい。
It is known that punching workability and tracking resistance are mainly related to the surface of the laminated plate. Therefore, when a plurality of prepregs are used, the prepreg in which the surface layer is impregnated with the phenol resin composition of the present invention may be used, and the center layer may be used in which the drying oil-modified phenol resin is impregnated.

【0015】[0015]

【作用】本発明の作用は詳らかでない。グリセリンのβ
水酸基と結合しいている脂肪酸がフェノール樹脂の硬化
物と適宜に絡み合い、それによって、可撓性を与え、か
つ耐熱性を向上させるものと思われる。
The function of the present invention is not clear. Β of glycerin
It is considered that the fatty acid bonded to the hydroxyl group is appropriately entangled with the cured product of the phenol resin, thereby giving flexibility and improving heat resistance.

【0016】[0016]

【実施例】【Example】

実施例1 桐油変性率35%のアンモニアレゾールフェノール樹脂
100重量部、β水酸基とステアリン酸とがエステル結
合したグリセリンをグリコール成分とし、前記グリセリ
ンのα及びγ水酸基と結合する二塩基酸がマレイン酸で
ある不飽和ポリエステル樹脂10重量部をメタノールに
溶解してワニスとした。あらかじめ、水溶性フェノール
樹脂を12重量%付着させたクラフト紙に、前記ワニス
を含浸乾燥してプリプレグとした。このプリプレグ8枚
と厚さ35μmで接着剤付きの銅はくを重ね、加熱加圧
して厚さ1.6mmの片面銅張積層板を得た。
Example 1 100 parts by weight of ammonia resol phenol resin having a tung oil modification rate of 35%, glycerin in which β-hydroxyl group and stearic acid are ester-bonded as a glycol component, and the dibasic acid bonded to α- and γ-hydroxyl groups of glycerin is maleic acid. 10 parts by weight of a certain unsaturated polyester resin was dissolved in methanol to obtain a varnish. Kraft paper to which 12% by weight of water-soluble phenolic resin had been attached was impregnated with the varnish and dried to obtain a prepreg. Eight pieces of this prepreg were overlaid with a copper foil having a thickness of 35 μm and having an adhesive, and heated and pressed to obtain a single-sided copper-clad laminate having a thickness of 1.6 mm.

【0017】実施例2 桐油変性率35%のアンモニアレゾールフェノール樹脂
をメタノールに溶解してワニスとし、あらかじめ、水溶
性フェノール樹脂を12重量%付着させたクラフト紙
に、前記ワニスを含浸乾燥してプリプレグとした。この
プリプレグ7枚と厚さ35μmで接着剤付きの銅はくと
を、実施例1のプリプレグ1枚を間に置いて重ね、加熱
加圧して厚さ1.6mmの片面銅張積層板を得た。
Example 2 A varnish was prepared by dissolving an ammonia-resole phenolic resin having a tung oil modification rate of 35% in methanol to form a varnish. The varnish was impregnated and dried on a kraft paper to which 12% by weight of a water-soluble phenolic resin had been attached in advance. And Seven pieces of this prepreg and a copper foil having a thickness of 35 μm and having an adhesive are stacked with one piece of the prepreg of Example 1 interposed therebetween, and heated and pressed to obtain a single-sided copper-clad laminate having a thickness of 1.6 mm. It was

【0018】比較例 実施例2で得られたプリプレグ8枚と厚さ35μmで接
着剤付きの銅はくとを重ね、加熱加圧して厚さ1.6m
mの片面銅張積層板を得た。得られた片面銅張積層板に
ついて、打ち抜き加工性、耐トラッキング性及びはんだ
耐熱性を調べた。その結果を表1に示す。
Comparative Example Eight prepregs obtained in Example 2 and copper foil with a thickness of 35 μm and having an adhesive were stacked and heated and pressed to a thickness of 1.6 m.
A single-sided copper clad laminate of m was obtained. The obtained single-sided copper-clad laminate was examined for punching workability, tracking resistance and solder heat resistance. The results are shown in Table 1.

【0019】[0019]

【表1】 [Table 1]

【0020】打ち抜き加工性は、穴間ピッチ1.78m
mの穴を、80トンプレスを用い、温度20℃で打ち抜
いたときのはくりおよび目白の有無を調べたものであ
る。耐トラッキング性は、全面エッチングにより銅はく
を除いた試験片に、4mm間隔で電極を接触させ、電極
間に塩化アンモニウム0.1%水溶液を滴下し、試験面
がトラッキング破壊するまでの滴下数を求め、電圧を変
えて電圧と滴下数との関係曲線を作り、50滴に対応す
る電圧を求めたものである。はんだ耐熱性は、試験片を
260℃のはんだ槽に浮かべ、ふくれまたははがれを生
ずるまでの時間を調べたものである。
The punching workability is such that the hole pitch is 1.78 m.
The hole of m was punched at a temperature of 20 ° C. using an 80-ton press, and the presence or absence of peeling and the white of the eye was examined. Tracking resistance is measured by contacting electrodes at 4 mm intervals to a test piece from which copper foil has been removed by etching the entire surface, dropping a 0.1% aqueous solution of ammonium chloride between the electrodes, and dropping until the test surface is broken by tracking. Then, the voltage was changed, a relationship curve between the voltage and the number of drops was created, and the voltage corresponding to 50 drops was found. The solder heat resistance is obtained by floating the test piece in a solder bath at 260 ° C. and examining the time until blistering or peeling occurs.

【0021】[0021]

【発明の効果】本発明によれば、可撓剤変性フェノール
樹脂に、不飽和ポリエステル樹脂、特に、β水酸基と炭
素数6〜30の高級脂肪酸とがエステル結合したグリセ
リンをグリコール成分とし、前記グリセリンのα及びγ
水酸基と結合する二塩基酸が、不飽和二塩基酸である不
飽和ポリエステル樹脂を配合してなるフェノール樹脂組
成物をマトリックスとしたので、桐油変性フェノール樹
脂積層板よりも、耐トラッキング性、打ち抜き加工性及
びはんだ耐熱性に優れた紙基材フェノール樹脂積層板を
得ることができる。
INDUSTRIAL APPLICABILITY According to the present invention, an unsaturated polyester resin, in particular, glycerin in which a β-hydroxyl group and a higher fatty acid having 6 to 30 carbon atoms are ester-bonded to a flexibilizer-modified phenolic resin is used as a glycol component. Α and γ of
The dibasic acid that binds to the hydroxyl group uses a phenol resin composition that is a mixture of unsaturated polyester resin, which is an unsaturated dibasic acid, as the matrix, so it has better tracking resistance and punching than the tung oil-modified phenol resin laminate. It is possible to obtain a paper-based phenol resin laminate having excellent heat resistance and solder heat resistance.

フロントページの続き (72)発明者 矢野 正文 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館工場内Front page continuation (72) Inventor Masafumi Yano 1500 Ogawa, Shimodate City, Ibaraki Prefecture Hitachi Chemical Co., Ltd. Shimodate Factory

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 可撓剤変性フェノール樹脂に、不飽和ポ
リエステル樹脂を配合してなるフェノール樹脂組成物。
1. A phenol resin composition obtained by blending a flexible agent-modified phenol resin with an unsaturated polyester resin.
【請求項2】 不飽和ポリエステル樹脂が、β水酸基と
炭素数6〜30の高級脂肪酸とがエステル結合したグリ
セリンをグリコール成分とし、前記グリセリンのα及び
γ水酸基と結合する二塩基酸が、不飽和脂肪酸であるこ
とを特徴とするするポリエステル樹脂である請求項1記
載のフェノール樹脂組成物。
2. The unsaturated polyester resin comprises glycerin, in which β-hydroxyl group and higher fatty acid having 6 to 30 carbon atoms are ester-bonded, as a glycol component, and dibasic acid bonded to α- and γ-hydroxyl groups of glycerin is unsaturated. The phenol resin composition according to claim 1, which is a polyester resin characterized by being a fatty acid.
【請求項3】 紙基材に請求項1又は2記載のフェノー
ル樹脂組成物を含浸乾燥したプリプレグを、積層してな
るフェノール樹脂積層板。
3. A phenol resin laminated plate obtained by laminating a prepreg obtained by impregnating and drying a paper substrate with the phenol resin composition according to claim 1 or 2.
JP9828794A 1994-05-12 1994-05-12 Phenolic resin composition and phenolic resin laminated sheet Pending JPH07304930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9828794A JPH07304930A (en) 1994-05-12 1994-05-12 Phenolic resin composition and phenolic resin laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9828794A JPH07304930A (en) 1994-05-12 1994-05-12 Phenolic resin composition and phenolic resin laminated sheet

Publications (1)

Publication Number Publication Date
JPH07304930A true JPH07304930A (en) 1995-11-21

Family

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Family Applications (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009292858A (en) * 2008-06-02 2009-12-17 Showa Highpolymer Co Ltd Method for producing unsaturated polyester, unsaturated polyester resin composition and unsaturated polyester resin cured molded article
CN102888077A (en) * 2011-07-18 2013-01-23 北京建筑材料科学研究总院有限公司 Method for preparing toughened phenolic foam board for exterior insulation of exterior building walls

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009292858A (en) * 2008-06-02 2009-12-17 Showa Highpolymer Co Ltd Method for producing unsaturated polyester, unsaturated polyester resin composition and unsaturated polyester resin cured molded article
CN102888077A (en) * 2011-07-18 2013-01-23 北京建筑材料科学研究总院有限公司 Method for preparing toughened phenolic foam board for exterior insulation of exterior building walls

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