JPH07303962A - Automatic soldering device for ic attachment/detachment - Google Patents

Abstract

PURPOSE:To improve the productivity, to realize the operation by a non-skid worker, and to facilitate the exchange of only the soldering tip by integrating the soldering iron with a resistor to enable the rapid temperature rise and drop when the IC is attached/detached to/from a printed circuit board by soldering. CONSTITUTION:A soldering iron 3 is integrated with a resistor 4. The material of the soldering iron 3 is ceramics, glass, metal, carbon or the like, while the material of the resistor 4 is stainless steel, platinum, copper, brass, nickel or the like, or the mixture thereof. A suction nozzle 9 is provided on the inner side of the soldering iron as the vacuum attachment/detachment mechanism, and connected to a vacuum pump 7. The power source of the resistor 4 is automatically and immediately switched off after energization for the period of time required for the heating when a flat pack IC is mounted on the printed circuit board after the energizing operation. When the IC is detached, the power source is automatically turned off when the IC is detached from the printed circuit board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron for mounting a component on a board or removing a component on a board.

[0002]

2. Description of the Related Art The conventional one is a system in which a solder is melted by heating with an electrically insulated nichrome wire, so that heat conduction to the iron tip is slow and there is a problem in working efficiency and thermal efficiency.

Soldering irons for flat packages are also commercially available, but this is an extension of the conventional method, and the work of quickly soldering the four sides simultaneously requires skill and there is a problem in the defect rate.

An air heater that heats air with a heater is used as a heating means for melting the solder on the substrate, but heat may be dissipated to simultaneously heat other nearby parts.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to solve the problems of the conventional products, to shorten the working time, and to provide an apparatus which can be easily handled even by an unskilled person.

[0006]

In order to solve the above-mentioned problems, the present invention firstly integrates a soldering iron tip and a resistor.

Secondly, it has a structure in which a desorption mechanism is incorporated.

When the material of the iron tip is ceramics or glass, the resistor is formed by directly coating, spraying or adhering a conductive material on its surface.

When the material is a metal, it is formed by subjecting the conductive material to an insulation treatment by the same means as the pretreatment.

[0010]

[Operation] The integration of the iron tip and the resistor according to the present invention is
Since the iron tip itself is small and its heat capacity is also small, the electric power required to reach about 250 ° C at which the solder melts is essentially 2
About 0 watts is enough.

Further, since the resistor provided on the surface of the iron tip is closely adhered, the thermal resistance is very small. Therefore, the solder can be instantly melted by heat conduction.

Therefore, it is necessary to select a material having a high thermal conductivity for the iron tip.

On the other hand, when heat removal is considered, heat is easily removed due to the opposite effect.

Therefore, since the high-speed temperature rising / falling cycle can be performed in several tens of seconds, the production efficiency is improved.

Since the attachment / detachment mechanism is incorporated, the attachment / detachment of parts can be automated, and as a result, the work can be performed quickly and accurately.

[0016]

【Example】

The present invention will be described with reference to the illustrated embodiments.

Integrated type of iron tip and resistor

[Figure 1]

The substrate (1) is made of stainless steel, and the resistor (4) is made of aluminum nitride (ceramics) coated with a conductive material (3 mm × 10 mm × 15 mm).

The resistor is attached to the substrate with rivets (6). Pull out the lead wire (5) from the resistor.

Mounting method of flat pack IC on printed circuit board

[Fig. 2]

It is assumed that cream solder is printed at a predetermined position on the printed circuit board on which the flat pack IC is mounted.

The flat pack IC is fitted in a predetermined position of the iron tip and suction-held by the suction nozzle (9) so as not to drop.

Operate the lever (8) to lower the iron tip,
The IC sucked and held by the tip of the iron is brought to a predetermined position by bringing the IC close to the printed circuit board surface.

Next, the resistor power is turned on while pressing the lever. The resistor at the iron tip is heated in a short time, and the work of soldering the IC to the printed board is completed. The resistor power supply automatically switches to the disconnected state immediately after the power is supplied for the time required for heating.

When the soldering work is completed, the lever is raised to float the resistor from the IC soldering point, and the IC soldered to the printed circuit board is pressed against the printed circuit board surface by the suction nozzle.

After the resistor is separated from the IC soldering point,
The solder cools down, the suction nozzle separates from the IC, and the soldering work is completed.

Method of Removing Flat Pack IC Soldered on Printed Circuit Board

[Figure 3]

The IC soldered on the printed circuit board and the iron tip are aligned so that the IC fits in the heater portion of the iron tip.

After positioning, turn on the resistor power while pressing it with the tip of the iron. The resistor at the tip of the iron is heated in a short time and the IC
The solder used to solder is melted.

After the solder is melted, the iron tip, the suction nozzle and the IC are separated from the board at the same time. Vacuum suctioned IC
Also leave. The IC soldered to the printed board can be removed from the printed board.

When the IC is separated from the printed circuit board surface,
The resistor power supply is automatically turned off.

【The invention's effect】

The present invention is constructed as described above. Therefore, it has the following effects.

Since the iron tip and the resistor are integrated, the temperature control is facilitated and the productivity is improved.

Since all the work can be performed only with the start button, even an unskilled person can easily perform the work.

It is easy to replace only the iron tip corresponding to the shape of the IC.

Energy saving due to compact device.

Since heat diffusion is unlikely to occur, nearby parts will not be damaged.

[0039]

[Brief description of drawings]

FIG. 1 is a plan view showing an integrated type of a soldering iron tip and a resistor.

FIG. 2 is a plan view showing a method for mounting a flat pack IC on a printed circuit board.

FIG. 3 is a plan view showing a method for removing a flat pack IC soldered onto a printed circuit board.

[Explanation of symbols]

 (1) Substrate (2) Target IC (3) Iron tip (4) Resistor (5) Lead wire (6) Rivet (7) Vacuum pump (8) (9) Suction nozzle

Claims (4)

[Claims] 1. An IC attachment / detachment method and apparatus in which a soldering iron (3) is integrated with a resistor (4) in a soldering iron for mounting a component (2) on a substrate (1). 2. The iron tip (3) has a width of 0.1 to 3 mm, a length of 0.1 to 50 mm and a height of 50 mm or less, and the material is ceramics, glass, metal, carbon or the like. 3. The resistor (4) is provided on the surface of the above material, and the material is stainless steel, platinum, copper, brass, nickel, etc., and a mixture thereof. 4. A method for attaching / detaching an IC as claimed in claim 1, 2 or 3.
The vacuum suction mechanism is built into the inside of the.