JPH07302874A - Lead frame where outer leads are fixed, and semiconductor device making use of it, and its manufacture - Google Patents

Abstract

PURPOSE:To prevent the transformation of a lead, and improve the flatness of mounting contact face, and make possible easy mounting, and conduct the operation test easily after mounting by providing a lead frame, which cope with the narrowing of the pitch of leads, a semiconductor device, and its manufacture. CONSTITUTION:These are a lead frame, which has outer leads 33b, 33c, 33d, and 33e, a semiconductor device using this, and its manufacture. This lead frame has insulating coupling members 201, 202, 203, and 204 which are arranged in the directions crossing the directions of extension of outer leads and besides fix the outer leads with each other. Hereby, the shape preservation capacity of the outer lead can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device,
In particular, the present invention relates to a surface mount semiconductor device in which external leads derived from a package that embeds a semiconductor chip or an integrated circuit are brought into contact with and bonded to the surface of a mounting substrate. The present invention also relates to a lead frame having film-shaped or planar outer leads. Furthermore, the present invention relates to a method for manufacturing these semiconductors and lead frames.

[0002]

2. Description of the Related Art For example, in order to mount a semiconductor device (so-called LSI or the like) made of a plastic-encapsulated package on a printed circuit board (PCB: Printed Circuit Board or printed wiring board), external leads led out from the package are mounted. Various shapes are used. As a recent tendency, a surface mount type lead shape in which the external leads are brought into contact with and fixed to the surface of the printed circuit board (for example, as shown in FIG. The gull wing shape as shown in A) is becoming mainstream.

As shown in FIG.
External lead 2 issued₁ , 2₂ , 2 ₃ 、… Print
Mounting on the mounting surface side of the board 3 and mounting the lead
Footprint (pad) whose contact surface is a printed circuit board 4
₁ , 4₂ , 4₃ , Bend it so that it touches it tightly
Formed. External of such a typical gull wing shape
The lead has a complicated shape and may retain the shape.
Since it is not taken into consideration, it easily deforms when external force is applied.
I will end up. Therefore, as shown in FIG.
As shown in (B), the flatness of the lead (
(Variation) is bad and leads are properly on the footprint
Not on (external lead 2₁ And the lead mounting surface
Tprint 4₁ A gap g is created between
Two₃ Footprint 4 like₃ Small contact area with)
This allows for soldering of leads and footprint during mounting.
Possibility of open defects at joints
There is. In particular, the narrower the lead pitch, the more this question
The subject becomes bigger.

As a countermeasure against such a problem, the following three methods have been conventionally performed. (1) MCR (Molded Carrier Ring or GQFP
(Guard ring Quad Flat Package) method (Fig. 2
This method uses a ring 5 that surrounds and fixes all of the tips of the leads that are linearly drawn from the package (that is, substantially parallel to the top surface or bottom surface if the package body is a parallel plate). The ring is reinforced to prevent the lead from being deformed by an external force. In a semiconductor device having such a ring, the lead is protected from external force by the ring from completion of the device to mounting on a printed circuit board (thus preventing deformation of the lead during transportation of the device). Need to be processed into a predetermined lead shape as shown in FIG. Therefore, as the ring is set, the outer shape of the semiconductor device to be handled becomes large, which is disadvantageous in terms of cost. Further, even if the lead shape is protected until just before mounting, there is a possibility that the lead may be deformed depending on the lead processing method at the time of mounting.
This determines the mounting state where the final device quality is finalized by finishing the manufacturing process of the device with a semi-finished product when viewed from the mounting state and processing the leads when mounting the device. Therefore, more strictness is required in the mounting process.

(2) BQFP (Bumper Quad Flat Packa)
ge) method (see FIG. 3) In this method, protrusions (bumpers) 6 for protecting the leads are provided at four corners of the package to prevent deformation. However, the lead near the center between the bumpers, which is difficult to be protected by the bumpers, is likely to receive an external force. (3) Method using QFP with test pad (see FIG. 4) This method includes the case where the method of (1) or (2) above is applied, and the tester pin contacts each lead during the operation test after mounting. This is to cope with the deformation of the lead when pressed. The pad portion 7 for test is formed in the lead protruding from the edge of the package. Such a test pad is used for the X and Y cavities of the upper and lower cavities of the package forming mold in the packaging process.
The tester pin is provided in a portion having such a size difference by changing the (vertical and horizontal) dimensions, and the tester pin is brought into contact with the vicinity of the center point p of the operation test. As a result, the strength of the tester pin abutting portion is increased and the tester pin is applied only to the strengthened portion, so that the lead can be prevented from being deformed due to the pressing of the tester pin. However, the typical test method needs to be changed, and the fabrication of a lead frame for a package having such a pad portion requires fine processing technology, and the pad portion may be buried in the resin of the package. There is
It has the drawback.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object of the present invention is to provide a lead frame and a semiconductor device which can cope with a narrow lead pitch, and a manufacturing method thereof. To provide. Another object of the present invention is to prevent deformation of the leads to improve the flatness of the mounting contact surface of the leads, and to easily mount the leads without burdening the mounting process. Another object of the present invention is to easily perform an operation test after mounting without changing a typical test method.

[0007]

A semiconductor device according to the present invention has a semiconductor element, a package for encapsulating the semiconductor element, and a plurality of external leads connected to the semiconductor element and extending from the package. The semiconductor device is characterized in that it has an insulating connecting member that is arranged in a direction intersecting the extending direction of the external leads and that fixes the external leads to each other.

A method of manufacturing a semiconductor device according to the present invention comprises a semiconductor element, a package for sealing the semiconductor element,
A method of manufacturing a semiconductor device having a plurality of external leads connected to the semiconductor element and extending from the package, comprising a mounting and fixing step of mounting and fixing the semiconductor element on an island portion of a lead frame, A mold preparation step of forming a mold cavity surrounding at least the island portion and the semiconductor element by sandwiching the island portion and the semiconductor element with a pair of molding mold halves, and injecting a melted plastic material into the mold cavity. Each of the molding mold halves has a main cavity forming concave portion surrounding the island portion and the semiconductor element in a central portion thereof, and at least one of the molding mold halves has the main cavity. Forming the main cavity by communicating with a part of the forming cavity Is characterized by having a sub-cavity forming recesses for the connecting member formed extending spaced and along which the peripheral edge parts.

The lead frame according to the present invention is a lead frame having external leads, and has two patterns for connecting each of the external leads in a direction intersecting the extending direction of the external leads. I am trying. A method of manufacturing a lead frame according to the present invention is a method of manufacturing a lead frame having external leads, wherein each of the external leads is extended in the etching step of forming the external leads on a lead frame substrate. It is characterized by forming two patterns that are connected in a direction intersecting the outgoing direction.

A method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device using the above lead frame, which comprises a mounting step of mounting a semiconductor element on the lead frame, and a mounting step of mounting the semiconductor element. And a shaping step of cutting two patterns for connecting each of the external leads in a direction intersecting the extending direction of the external leads after the sealing step. It is characterized by that.

Another lead frame according to the present invention is a lead frame having external leads, the insulating being arranged in a direction intersecting with the extending direction of the external leads, and fixing the external leads to each other. It is characterized by having a connecting member. A method of manufacturing a lead frame according to the present invention is a method of manufacturing a lead frame having external leads, the method including an etching step of forming the external leads on a lead frame substrate, and an extension of the external leads after the etching step. And a connecting member forming step of forming an insulating connecting member arranged in a direction intersecting the direction and fixing each of the external leads to each other.

[0012]

According to the lead frame, the semiconductor device, and the method of manufacturing the same of the present invention, the insulation is arranged in a direction intersecting with the extending direction of the plurality of outer leads extending from the package, and the outer leads are fixed to each other. The body connecting member
Improves the shape retention ability of external leads.

[0013]

The present invention will be described in detail below with reference to the drawings. FIG. 5 is a partial external view of a QFP semiconductor device according to an embodiment of the present invention. In FIG. 5, external leads 12 ₁₁ , 12 ₁₂ , 12 ₁₃ , ..., 12 _4n-1 , which extend from a substantially parallel flat plate-shaped plastic package body 11 for embedding and sealing a semiconductor element or an integrated circuit chip,
Each of the 12 _4n has a gull wing shape. Between the first bending point (first bending point) and the second bending point (second bending point) of the external lead 12 from the side surface of the package, a plastic equivalent to the body 11 is used as a lead hold portion. Rod-shaped electrically insulating connecting members 20 ₁ , 20 ₂ , 20 ₃ , 20 made of resin such as
₄ are arranged on each side surface of the package, and this insulating connecting member connects adjacent ones of the external leads to each other to prevent deformation of the leads due to external force.

As a result, the shape of the external lead is strengthened, the external lead is less likely to be deformed, and the flatness of the mounting contact surface can be improved. When mounted on a printed circuit board with the insulating connecting member attached, the mounting contact surface formed by the contact surface of the external lead coincides with the printed wiring surface on the printed circuit board. Since the strength of the external lead is maintained by the insulating connecting member even after mounting, the external lead is less likely to be deformed by the pressing of the tester pin even in the operation test performed by applying the tester pin. It also has the advantage that the typical test methods of the past are not changed. Further, even when compared with the above-mentioned method by MCR, an advantageous result in terms of cost is obtained. Further, the package body 11 and the connecting members 20 ₁ , 20 ₂ ,
If 20 ₃ and 20 ₄ are made of the same material,
These can be formed by molding once, which is advantageous in terms of cost.

Next, a method of manufacturing the semiconductor device of the present invention including the read hold section 20 will be described. Figure 6
FIG. 3 is a schematic cross-sectional view showing a structure of a transfer mold for molding the semiconductor device by a so-called low-voltage transfer molding method, that is, a structure of a molding mold and a form of a lead frame on which a semiconductor chip is mounted.

In FIG. 6, the molding method is one in which the lead frame 33 and the semiconductor chip 34 to be sealed are fixed at predetermined positions by a mold (upper mold 31, lower mold 32) which is heated to a constant temperature in advance. High-frequency heating, etc., of the resin 35 that has been molded into a tablet shape in advance by sandwiching it in between is filled in the cull hole 36, and the transfer plunger 37 is operated to pass the resin through the runner 38 and the gate 39 to the upper mold cavity 40 and the lower mold cavity. It is to be melt-pressurized and injected into 41.

In order to describe the method of manufacturing the present semiconductor device in detail, reference is made to FIGS. FIG. 7 is the same as FIG.
FIG. 6 is a diagram showing the structure of a cavity 41 and the arrangement of the lead frame 33 with respect to the lower mold 32. The cavity communicates with the portion 41a that seals the package bottom surface side of the lead frame (thus forming the bottom surface side body of the finished package) and the body forming portion 41a and the gate 39, and the first and second body forming portions 41a. 41b and 41c that are formed along the side surface (edge) of the body and are separated by a predetermined distance, and communicate with the body forming portion 41a and the vent 42, and along the third and fourth side surfaces (edge) of the body forming portion 41a. In addition, the groove portions 41d and 41e are formed so as to be separated by a predetermined distance. At the time of sealing by the upper and lower molds, the body forming portion 41a serves as a main cavity forming concave portion, and the groove portions 41b, 41c, 41d, 41e serve as sub cavity forming concave portions. Further, the semiconductor chip (not shown) has an island portion 33 in the lead frame 33.
It is mounted on a and subjected to a predetermined process (fixing, wire bonding, etc.).

At the time of melt pressure injection of the resin, the resin injected from the runner 38 is injected through the gate 39 into each of the cavities 41a, 41b, 41c, 41d and 41e. The resin injected into the groove portions 41d and 41e is the body forming portion 4
It is supplied via 1a. The lead frame 33 is sealed on one side with a resin that fills the cavity at the position where the alternate long and short dash line in the figure leads. Therefore, the lead frame 33
Externally extending leads (that is, external leads) 33b, 3
3c, 33d, and 33e cross each other in the extending direction and hit each groove portion, as shown by the hatching in a band shape.

Therefore, as shown in FIG. 8, in the middle of the external lead, they are connected to each other by a rod-shaped resin body, that is, a connecting member formed in each groove by the resin sealing. At this stage, unnecessary patterns on the lead frame are cut. Similarly, when the package top surface side of the lead frame is also resin-sealed with respect to the package body, unnecessary portions (dotted line portions in FIG. 8) of the rod-shaped resin body are further cut as shown in FIG. Is divided into Thus, the rod-shaped resin body serves as the lead hold portions 20 ₁ , 20 ₂ , 20 ₃ , 20 ₄ . 8 and 9 are views seen from the top surface to the bottom surface of the package.

Finally, the external lead is shaped into the gull wing shape like the external lead 12 in FIG. 5, and the manufacturing process of the semiconductor device having the read hold portion is completed. In order to efficiently manufacture the semiconductor device of the present invention, the lead frame may be manufactured and then packaged as follows.

FIG. 10 shows an example of a manufacturing process of the lead frame according to the present invention. In such a process,
First, for example, a pattern diagram of a lead frame to be manufactured on a paper surface is created as an original drawing (step S10). Then, based on this pattern diagram, CAD (Computer Aid
ed Design) data is input to the system to create data on the CAD (step S11). Then, based on the data created here, a pattern mask is produced (step S11A) and a plating mask is produced (step S11A).
11B), a taping die is manufactured (step S11)
C).

CAD data is created in step S11.
And after the pattern mask is produced in step S11A
Moves to the etching step S12. In this process,
Shown in FIG. 11 by a so-called etching process
Such a lead frame is formed. Note that FIG. 11 shows the inside.
And the number of lead frames including the shape and number of external leads
It is a simplified representation of each pattern. In Figure 11
The same parts as those in FIG. 7 are designated by the same reference numerals,
The part defined by the one-dot chain line is the shape of the package body
It corresponds to the position. In this lead frame
Is a molding formed along the edge of the body forming region.
Dam bar (tie bar) 33B, 33 for stopping resin flow
In addition to C, 33D, 33E, external leads 33b, 33
External lead extension in the middle of c, 33d, 33e
The external leads are double connected along the crossing direction.
Be done. These two rod-shaped connection parts (pattern) 33B1
And 33B2, 33C1 and 33C2, 33D1 and 3
3D2, 33E1 and 33E2 are respectively the first and second
Width of each guide bar w₁ , W
₂ Facilitates work in the lead shaping process described below
It is preferable to make it as small as possible. Also, guidance
Read hold between the bars in the sealing process described later.
Since the resin as a part is formed, the gap g₀ Will be adopted
It is preferably set appropriately according to the strength of the resin and the like.

When the lead frame 33 'as shown in FIG. 11 is formed in step S12, for example, the inner leads (the pattern connecting the dam bar and the periphery of the island) are plated using the plating mask prepared in step S11B ( Step S13), and then, using the taping die manufactured in step S11C, down-setting is performed to provide a recess for mounting a semiconductor chip on the island 33a of the lead frame (step S14). After this,
After inspection (step S15) and packing (step S16), shipment (step S17) is carried.

The steps S11A, S11B and S11
C is drawn as an indirect process, and other processes are
It is depicted as a direct process. The lead frame 33 'manufactured in this way is delivered to the assembly process as shown in FIG. Of course, this delivery may be performed immediately after the inspection step S15 in FIG.

In this assembly process, first, die bonding (step S20) for fixing the semiconductor chip to the lead frame is performed, and the input / output pad of the fixed chip and the corresponding internal lead end are connected. Wire bonding (step S21) is performed. When the bonding is completed, the process proceeds to the sealing step S22. In this step, the lead frame to which the semiconductor chip is attached is sealed by the method as described in FIGS. 6 and 7 above. At this time, the band-shaped hatched portion in FIG. 7 corresponds to the guide bar interval (g ₀ ) in FIG. 11. Therefore, as shown in FIG. 13, the guide bar 3
Between 3B1 and 33B2, guide bars 33C1 and 33C2
, The guide bars 33D1 and 33D2, and the guide bars 33E1 and 33E2 are covered with the resin 20.
As a result, the external leads are fixed to each other.

When the sealing step S22 is completed, the external leads are plated (step S23), and the lead shaping step S24.
Move to. This step includes a step of cutting the guide bar so that the outer lead portion is left, and unnecessary parts around the outer lead are removed. That is, as shown in FIG. 13, not only is the unnecessary portion of the connecting resin body 20 cut,
From the lead exposed from the package body 11, the guide bar in the shaded portion in the enlarged view is removed. As a result, the finish is as shown in FIG. Further, in this shaping step, the outer lead from which the guide bar has been removed is shaped into a gull wing and finished.

When the external lead is shaped in step S24, it is shipped (step S27) through inspection (step S25), packing (step S26). On the other hand, even if the connecting resin body is not formed at the same time as the packaging, that is, the resin sealing of the lead frame on which the semiconductor chip is placed as described above, It may be formed.

FIG. 14 shows a lead frame manufacturing process for realizing such a mode, and the parts equivalent to those in FIG. 10 are designated by the same reference numerals. According to this, after the plating process S13, the resin applying process S30 as the connecting member forming process is performed, and then the downsetting process S14 is performed. Further, the above-described guide bar is not provided on the lead frame manufactured up to the plating step S13. In the resin coating step S30, the connecting resins 20 ₁ , 20 ₂ , 20 ₃ , 20 ₄ are directly formed on the lead frame plated as shown in FIG. More specifically, the external leads 33b, 33c, 33
The resin is applied along the directions intersecting the extending directions of d and 33e to form the connecting resin.

By doing so, the completed connecting resin body is formed on the ordinary lead frame itself, regardless of the packaging, so that as described with reference to FIGS. 8 and 9 and FIG. This eliminates the need for lead shaping processing. Moreover, it is convenient because a normal assembly process can be performed without using a mold or a method for forming the connecting resin body as shown in FIGS. 6 and 7. It should be noted that, in FIG. 15, each connection resin is applied and formed on the surface of the lead frame (the surface on which the semiconductor chip is fixed), so that the finished product after packaging is as shown in FIG. . Although this form is different from that of FIG. 5, it is clear that substantially the same effect can be obtained. Therefore, each connecting resin may be applied and formed on the back surface of the lead frame to finish as shown in FIG. 5, or further modified so that each connecting resin may be applied and formed on both the front and back surfaces of the lead frame. . The mode of such modification is not limited to the application step S30 as shown in FIG. 14, and a mold for resin formation at the same time as the packaging as shown in FIGS. It can be realized by devising a technique.

Although the lead hold portion in each of the above embodiments is made of the same resin as that of the package, the present invention is not limited to this, and any electrical insulator having strength enough to prevent deformation of the lead can be used. Of course good things. Further, the present invention can be applied not only to the QFP type but also to various types such as the DIP type, and the extension direction of the external lead is not limited. The present invention is not limited to plastic encapsulation, but can be applied to various encapsulation methods. Further, the present invention is not limited to the method of fixing the rod-shaped insulator to the external lead by the mold shape as shown in FIG. 7, and the fixing form itself of the rod-shaped insulator is, for example, resin-sealed in the above-mentioned embodiment. At the time of stopping, the outer lead is fixed from the package bottom surface side of the lead frame, but the outer lead may be fixed from the top surface side.

[0031]

As described above in detail, according to the external lead fixed lead frame, the semiconductor device, and the method of manufacturing the same of the present invention, the external lead extending from the package is extended in the direction crossing the extending direction. Since the insulating connecting member that is arranged and fixes each of the external leads to each other improves the shape retaining ability of the external leads, the deformation of the leads is prevented and the flatness of the mounting contact surface of the leads is improved. It can be easily implemented without burdening the user.
Further, it is possible to easily execute the operation test after mounting without changing the typical test method. Thus, the present invention provides a lead frame, a semiconductor device and a method of manufacturing the same which can cope with a narrow lead pitch.

[Brief description of drawings]

FIG. 1 is a partial perspective external view (A) and a partial sectional view (B) showing a conventional semiconductor device having a gull wing shape external lead.

FIG. 2 is a perspective external view showing a semiconductor device to which a method by MCR is applied.

FIG. 3 is a partial perspective external view showing a semiconductor device to which a method based on BQFP is applied.

FIG. 4 is a partial perspective external view showing a semiconductor device to which a method using a QFP with a test pad is applied.

FIG. 5 is a partial perspective external view of a QFP semiconductor device according to an embodiment of the present invention.

FIG. 6 is a cross-sectional view showing the structure of a die conforming to the low-voltage transfer molding method for realizing an example of the method for manufacturing a semiconductor device of the present invention, and the form of a lead frame having a semiconductor chip set therein.

7 is an exploded perspective view showing the structure of the lower mold cavity in FIG. 6 and how the lead frame is arranged with respect to the lower mold.

FIG. 8 is a plan view seen from the top surface of the package of the semiconductor device after resin sealing.

FIG. 9 is a plan view of the semiconductor device after the cutting step, viewed from the top surface of the package.

FIG. 10 is a flowchart showing an embodiment of a lead frame manufacturing process according to the present invention.

11 is a diagram showing a schematic conductor pattern of a lead frame formed by an etching process in the lead frame manufacturing process of FIG.

FIG. 12 is a flowchart showing an embodiment of an assembly process according to the present invention.

13 is a diagram showing a state of a cutting process performed in a lead shaping process in the assembly process of FIG.

FIG. 14 is a flowchart showing another embodiment of the lead frame manufacturing process according to the present invention.

15 is a diagram showing a schematic conductor pattern of a lead frame together with a connecting resin formed by a resin applying step in the lead frame manufacturing step of FIG.

16 is a schematic external view showing a semiconductor device manufactured using the lead frame manufactured by the lead frame manufacturing process of FIG.

[Explanation of symbols]

11 package _{12 11, 12 12, 12 13} , ..., 12 4n-1, 12 4n external leads 20 and 20 _1, 20 _2, 20 _3, 20 ₄ rod-like insulator (read hold section) 31 upper die 32 lower die 33 , 33 ', 33 "Lead frame 33b, 33c, 33d, 33e External lead 33B, 33C, 33D, 33E Dam bar 33B1, 33C1, 33D1, 33E1 First guide bar 33B2, 33C2, 33D2, 33E2 Second guide bar 34 semiconductor chip 35 resin tablet 36 cull part 37 plunger 38 runner 39 gate 40 upper mold cavity 41 lower mold cavity 41a package bottom body forming part 41b, 41c, 41d, 41e hold part forming groove part 42 vent

Claims (14)

[Claims] 1. A semiconductor device having a semiconductor element, a package for encapsulating the semiconductor element, and a plurality of external leads connected to the semiconductor element and extending from the package, wherein the extension of the external lead is provided. An external lead fixed type semiconductor device, comprising an insulating connecting member which is arranged in a direction intersecting the outgoing direction and which fixes each of the external leads to each other. 2. The outer lead has a first bending point and a second bending point.
The semiconductor device according to claim 1, wherein the semiconductor device has a gull wing shape having a bending point, and the insulating connecting member is arranged between the first bending point and the second bending point. 3. The package has a substantially parallel plate shape, a plurality of the outer leads extend from four side surfaces of the package, and the insulating connecting member is provided between the outer leads on each side surface. 3. The semiconductor device according to claim 1, wherein the semiconductor devices are fixed to each other. 4. The semiconductor device according to claim 1, wherein the package and the insulating connecting member are made of the same material. 5. A method of manufacturing a semiconductor device having a semiconductor element, a package for encapsulating the semiconductor element, and a plurality of external leads connected to the semiconductor element and extending from the package, the lead frame comprising: A mounting and fixing step of mounting and fixing the semiconductor element on the island portion, and a mold cavity surrounding the island portion and the semiconductor element with at least the island portion and the semiconductor element sandwiched by a pair of molding mold halves. And a molding step of injecting a melted plastic material into the mold cavity, each of the molding mold halves has a main cavity forming concave portion surrounding the island portion and the semiconductor element. At the center, at least one of the mold halves has a front Manufacturing method characterized by having a portion communicating with the sub-cavity forming recesses for spaced and connecting member formed extending therealong from the periphery of the main cavity forming recess of the main cavity forming recesses. 6. The molding step further comprises a cutting step of cutting a part of the longitudinal plastic material formed by the sub-cavity and connecting the leads of the external lead forming portion of the lead frame to each other. The manufacturing method according to claim 5. 7. The manufacturing method according to claim 5, further comprising a shaping step of shaping the outer lead into a gull wing shape. 8. A lead frame having external leads, wherein the lead frame has two patterns for connecting each of the external leads in a direction intersecting the extending direction of the external leads. 9. A method of manufacturing a lead frame having external leads, wherein in the etching step of forming the external leads on a lead frame substrate, each of the external leads is in a direction intersecting an extending direction of the external leads. A method of manufacturing a lead frame, which comprises forming two patterns for connection. 10. A method of manufacturing a semiconductor device using the lead frame according to claim 8, wherein a mounting step of mounting a semiconductor element on the lead frame, and a lead frame on which the semiconductor element is mounted. And a shaping step of cutting two patterns that connect each of the external leads in a direction intersecting the extending direction of the external leads after the sealing step. Manufacturing method. 11. The mold preparation for forming a mold cavity by sandwiching at least the island portion of the lead frame and the semiconductor element with a pair of molding mold halves to surround the island portion and the semiconductor element in the sealing step. And a molding step of injecting a molten plastic material into the mold cavity, wherein each of the molding mold halves has a main cavity forming concave portion surrounding the island portion and the semiconductor element in a central portion thereof. At least one of the molding mold halves communicates with a part of the main cavity forming recess, is spaced apart from the peripheral edge of the main cavity forming recess, and extends along the sub cavity forming a connecting member. The sub-cavity forming recess has a recess and the lead frame The method according to claim 10 wherein, characterized in that positioned between the formed the two patterns. 12. A lead frame having external leads, comprising: an insulating connecting member arranged in a direction intersecting with an extending direction of the external leads and fixing each of the external leads to each other. And lead frame. 13. A method of manufacturing a lead frame having external leads, comprising: an etching step of forming the external leads on a lead frame substrate; and a step of arranging the external leads in a direction crossing the extending direction of the external leads after the etching step. And a connecting member forming step of forming an insulating connecting member for fixing each of the external leads to each other. 14. The insulating connecting member is formed by applying a resin in the middle of the external lead in a direction intersecting the extending direction of the external lead in the connecting member forming step. Item 14. The lead frame manufacturing method according to Item 13.