JPH07302695A - Matching device - Google Patents

Matching device

Info

Publication number
JPH07302695A
JPH07302695A JP6093163A JP9316394A JPH07302695A JP H07302695 A JPH07302695 A JP H07302695A JP 6093163 A JP6093163 A JP 6093163A JP 9316394 A JP9316394 A JP 9316394A JP H07302695 A JPH07302695 A JP H07302695A
Authority
JP
Japan
Prior art keywords
variable
frequency
matching
capacitance
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6093163A
Other languages
Japanese (ja)
Inventor
Noritoshi Tomikawa
典俊 富川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP6093163A priority Critical patent/JPH07302695A/en
Publication of JPH07302695A publication Critical patent/JPH07302695A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a matching device with which matching adjustment on the load side can be performed easily in a wide frequency range solely by setting a continuous changeable range of a capacity component and an induction component in the matching device large, and setting its change ratio inconstant. CONSTITUTION:A variable capacity element comprising variable capacitors 2, 3, and an inductometer element comprising a coil 4 and a conductor 6 are provided to form a resonance circuit, and a capacity change per unit rotation quantity of the capacitors 2, 3 is set to be smaller as a frequency range is more on the high range side. Matching adjustment on the load side to a wide range of plasma excitation frequencies can thus be provided.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、高周波プラズマ発生装
置用の整合器に係り、特に広い周波数範囲の高周波の整
合を可能とする単一構造の整合器に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a matching device for a high frequency plasma generator, and more particularly to a matching device having a single structure which enables matching of high frequencies in a wide frequency range.

【0002】[0002]

【従来の技術】表面処理や成膜プロセスにおいてプラズ
マを利用するものは多い。プラズマの発生方法としては
直流,高周波,マイクロ波等があるが、特に高周波プラ
ズマの場合にはプラズマ部での電力消費を最大にするた
めと電源又は発振回路を保護するため整合器が設置され
る。整合器は高周波電源側と負荷側をマッチングさせる
ため周波数の同調とインピーダンスの調整を行うもので
ある。プラズマ発生装置において、例えば高周波電源側
の出力インピーダンスが純抵抗で50[Ω]であるとす
る。一方、プラズマ負荷は容量成分と抵抗成分および電
極等の装置形状に由来する浮遊容量成分を合わせた装置
負荷からなる。整合器は負荷側の前記装置負荷と結合
し、負荷側のインピーダンスを純抵抗50[Ω]に調整
するためのものである。
2. Description of the Related Art In many cases, plasma is used in surface treatment and film formation processes. There are direct current, high frequency, microwave, etc. as a method of generating plasma, but especially in the case of high frequency plasma, a matching device is installed to maximize power consumption in the plasma part and protect the power supply or the oscillation circuit. . The matching unit performs frequency tuning and impedance adjustment in order to match the high frequency power supply side and the load side. In the plasma generator, for example, the output impedance on the high frequency power source side is a pure resistance of 50 [Ω]. On the other hand, the plasma load is composed of a device load including a capacitance component, a resistance component, and a stray capacitance component derived from the device shape such as an electrode. The matching unit is for coupling with the device load on the load side and adjusting the impedance on the load side to a pure resistance of 50 [Ω].

【0003】整合器は、コンデンサ等の容量成分やコイ
ル等の誘導成分から構成され、回路構成してはL型,π
型,T型と各種のものがあるが一般にはL型回路が用い
られる。L型回路はプラズマに直列なリアクタンス成分
を全体として容量性となるように選びながら容量成分,
誘導成分,抵抗成分からなる並列共振回路を形成するも
のである。従来の整合器はプラズマ発生電源周波数とし
て工業的には13.56[MHz]の高周波が広く使用
され周波数は一定であった。また、従来の整合器の場合
には誘導成分を連続的に可変にすることが難しいのでコ
イル状の誘導成分をタップ切り替えで粗調整した後、バ
リアブルコンデンサで微調整して電源周波数への同調と
負荷全体のインピーダンスを調整する構造であった。
The matching unit is composed of a capacitive component such as a capacitor and an inductive component such as a coil.
There are various types such as type and T type, but an L type circuit is generally used. The L-type circuit selects the reactive component in series with the plasma so as to be capacitive as a whole,
It forms a parallel resonant circuit consisting of an inductive component and a resistive component. In the conventional matching device, a high frequency of 13.56 [MHz] is widely used industrially as a plasma generating power supply frequency and the frequency is constant. Also, in the case of a conventional matching device, it is difficult to continuously vary the inductive component, so after roughly adjusting the coiled inductive component by tap switching, fine adjustment with a variable capacitor is performed to tune to the power supply frequency. The structure was to adjust the impedance of the entire load.

【0004】前記したように、従来ではプラズマ発生電
源周波数は一定であったが、近年では、プラズマプロセ
スに与えるプラズマ励起周波数の効果が注目され、前記
の13.56[MHz]や27[MHz],40[MH
z],60[MHz]等の固定の周波数型のものだけで
なく、数[KHz]から数百[MHz]の広範囲の周波
数可変型のプラズマ発生装置が採用されている。図2,
図3は周波数可変型プラズマ発生装置に組み込まれる整
合器の具体例を示すもので、図2は電源周波数が低い場
合の整合器1aであり、図3のものは電源周波数が高い
場合の整合器1bである。
As described above, the plasma generation power supply frequency has been constant in the past, but in recent years, the effect of the plasma excitation frequency on the plasma process has been noted, and the 13.56 [MHz] and 27 [MHz] described above are noted. , 40 [MH
Not only fixed frequency type plasma generators such as z] and 60 [MHz] but also a wide frequency variable type plasma generator of several [KHz] to several hundred [MHz] is adopted. Figure 2,
FIG. 3 shows a specific example of a matching device incorporated in a frequency variable plasma generator, FIG. 2 shows a matching device 1a when the power supply frequency is low, and FIG. 3 shows a matching device when the power supply frequency is high. It is 1b.

【0005】図2において点線内で示される整合器1a
は高周波電源9(以下、電源9という)と装置負荷10
(以下、負荷10という)との間に介設される。可変容
量素子としては電源周波数同調用バリアブルコンデンサ
11およびマッチング微調整用バリアブルコンデンサ1
2(例えばエアー型バリアブルコンデンサ)が使用され
る。なお、前者のコンデンサ11の最大静電容量は例え
ば1000[pF]であり後者のコンデンサ12の最大
静電容量は例えば200[pF]である。一方、可変誘
導素子としては中空の銅パイプからなる最大誘導係数5
[μH]のタップ14付きのコイル13が用いられてい
る。
Matching device 1a shown within a dotted line in FIG.
Is a high frequency power source 9 (hereinafter referred to as power source 9) and a device load 10
(Hereinafter referred to as load 10). As the variable capacitance element, a variable capacitor 11 for power supply frequency tuning and a variable capacitor 1 for fine matching adjustment
2 (for example, an air-type variable capacitor) is used. The maximum capacitance of the former capacitor 11 is, for example, 1000 [pF], and the maximum capacitance of the latter capacitor 12 is, for example, 200 [pF]. On the other hand, the variable induction element has a maximum induction coefficient of 5 consisting of a hollow copper pipe.
A coil 13 with a [μH] tap 14 is used.

【0006】図3に示す整合器1b(点線内で示され
る)は図2と同様に電源9と負荷10間に介設され、可
変容量素子としては例えば最大静電容量250[pF]
の電源周波数同調用バリアブルコンデンサ15および最
大静電容量50[pF]のマッチング微調整用バリアブ
ルコンデンサ16が使用される。また、可変誘導素子と
してはコイル状の誘導成分は備えてなく銅板の導電体1
7が設置される。
The matching unit 1b (shown within the dotted line) shown in FIG. 3 is interposed between the power source 9 and the load 10 as in FIG. 2, and the variable capacitance element has, for example, a maximum capacitance of 250 [pF].
The variable capacitor 15 for power supply frequency tuning and the variable capacitor 16 for fine matching adjustment with the maximum capacitance of 50 [pF] are used. Further, the variable inductive element does not have a coiled inductive component, and is a conductor 1 made of a copper plate.
7 is installed.

【0007】[0007]

【発明が解決しようとする課題】図2の整合器1aを用
いて進行波出力を一定の100[W]とし反射波出力が
1[W]以下におさまるまで整合調整した場合、次の結
果が得られた。電源9からの出力周波数が10[MH
z]から58[MHz]までは図2の整合器1aで整合
調整可能であったが、58[MHz]から100[MH
z]の場合には図3の整合器1bに組み替えなければ整
合調整は出来なかった。更に、整合器1aにおいては、
10[MHz]から13[MHz]、12[MHz]か
ら18[MHz]、17[MHz]から27[MH
z]、26[MHz]から40[MHz]、39[MH
z]から58[MHz]までの5領域に対応してコイル
13のタップ14を調整した後、電源周波数同調用バリ
アブルコンデンサ11とマッチング微調整用バリアブル
コンデンサ12を調整して整合を行わなければならなか
った。しかし、どちらのコンデンサ11,12も周波数
差1[MHz]に対応するロータの回転角が最低で約3
度以下になる場合もあり、調整感度が高過ぎる問題点が
あった。
When the traveling wave output is fixed to 100 [W] and the reflected wave output is adjusted to 1 [W] or less by using the matching device 1a shown in FIG. 2, the following result is obtained. Was obtained. Output frequency from power supply 9 is 10 [MH
From [z] to 58 [MHz], matching could be adjusted by the matching device 1a of FIG. 2, but from 58 [MHz] to 100 [MH]
In the case of z], the matching adjustment could not be performed unless the matching device 1b of FIG. 3 was replaced. Furthermore, in the matching device 1a,
10 [MHz] to 13 [MHz], 12 [MHz] to 18 [MHz], 17 [MHz] to 27 [MH]
z], 26 [MHz] to 40 [MHz], 39 [MH
After adjusting the tap 14 of the coil 13 corresponding to the five regions from z] to 58 [MHz], the power source frequency tuning variable capacitor 11 and the matching fine adjustment variable capacitor 12 must be adjusted to perform matching. There wasn't. However, in both capacitors 11 and 12, the rotation angle of the rotor corresponding to the frequency difference of 1 [MHz] is about 3 at minimum.
In some cases, the adjustment sensitivity is too high, and the adjustment sensitivity is too high.

【0008】同様に図3の整合器1bを用いて進行波出
力を一定の100[W]とし反射波出力が1[W]以下
になるように整合調整した。すなわち、54[MHz]
から80[MHz]、70[MHz]から100[MH
z]の2領域に対応して整合器1bと負荷9の電極をつ
なぐ銅板の高圧導入線の長さを調整した後、電源周波数
同調用バリアブルコンデンサ15とマッチング微調整用
バリアブルコンデンサ16を調整した。この場合、どち
らのバリアブルコンデンサ15,16もロータ側の単位
回転角に対する静電容量の変化が一定のため、容量変化
に敏感な高周波領域においては相対的に変化が大きすぎ
る事があり、例えば、周波数差1[MHz]に対応する
ロータの回転角が最低で約3度以下になる場合もあり、
図2の場合と同様に敏感過ぎる問題点があった。
Similarly, the matching device 1b shown in FIG. 3 was used to adjust the traveling wave output to a constant 100 [W] so that the reflected wave output was 1 [W] or less. That is, 54 [MHz]
To 80 [MHz], 70 [MHz] to 100 [MH]
After adjusting the length of the high-voltage lead-in wire of the copper plate that connects the matching unit 1b and the electrode of the load 9 in correspondence with the two regions of z], the variable capacitor 15 for power frequency tuning and the variable capacitor 16 for fine matching adjustment were adjusted. . In this case, since the change in the electrostatic capacitance with respect to the unit rotation angle on the rotor side is constant in both variable capacitors 15 and 16, the change may be relatively large in a high frequency region sensitive to the change in capacitance. In some cases, the rotation angle of the rotor corresponding to a frequency difference of 1 [MHz] may be at most about 3 degrees or less.
As in the case of FIG. 2, there was a problem of being too sensitive.

【0009】以上のように、従来の整合器の場合、電源
の周波数に対応してそれに見合う整合器を用いる必要が
あり極めて煩雑であり、かつ調整も敏感過ぎる問題点が
あった。すなわち、整合器内の容量成分や誘導成分は周
波数に大きく依存する。まず、誘導成分においては周波
数が変わると前述のバリアブルコンデンサによる微調整
では間に合わず、コイル状の誘導成分のタップ切り替え
がその都度必要となる。また、装置や電極等の形状にも
よるが、およそ50[MHz]以上の周波数では非コイ
ル状の導電体部分の誘導成分が大きくなり、コイル状の
誘導成分が必要なくなる。この場合、例えば、整合器と
電極をつなぐ銅板等の高圧導入線の長さを調整する必要
がある。また、容量成分においては高周波数になるほど
容量変化に敏感になるため、容量調整の分解能を小さく
するためにバリアブルコンデンサの容量を小さくする必
要が生じる。そこで、例えば、1[MHz]〜200
[MHz]など広範囲の可変周波数電源においては容量
成分や誘導成分の異なる複数の整合器を使用周波数に応
じて交換し、なお、かつ前記の調整が必要であり、整合
操作は非常に煩雑であった。
As described above, in the case of the conventional matching device, it is necessary to use a matching device corresponding to the frequency of the power supply, which is extremely complicated, and the adjustment is too sensitive. That is, the capacitive component and the inductive component in the matching box largely depend on the frequency. First, when the frequency of the inductive component changes, the above-mentioned fine adjustment by the variable capacitor cannot be made in time, and tap switching of the coil-shaped inductive component is required each time. Further, although depending on the shape of the device, the electrode, etc., the inductive component of the non-coiled conductor portion becomes large at a frequency of about 50 [MHz] or higher, and the coiled inductive component becomes unnecessary. In this case, for example, it is necessary to adjust the length of the high-voltage lead-in wire such as a copper plate connecting the matching unit and the electrode. Further, in the capacitance component, the higher the frequency is, the more sensitive the capacitance change is. Therefore, it is necessary to reduce the capacitance of the variable capacitor in order to reduce the resolution of capacitance adjustment. Therefore, for example, 1 [MHz] to 200
In a wide range of variable frequency power supplies such as [MHz], it is necessary to replace a plurality of matching devices with different capacitance components and inductive components according to the frequency used, and the above adjustment is necessary, so the matching operation is very complicated. It was

【0010】本発明は、前記事情に鑑みて創案されたも
ので、整合器内の容量成分と誘導成分の連続的可変範囲
を大きくし、なおかつその変化率を一定としないこと
で、広い周波数領域で容易な整合を可能とする整合器を
提供することを目的とする。
The present invention was devised in view of the above-mentioned circumstances, and by enlarging the continuously variable range of the capacitive component and the inductive component in the matching box and not keeping the rate of change thereof constant, a wide frequency range is obtained. It is an object of the present invention to provide a matching device that enables easy matching by using.

【0011】[0011]

【課題を解決するための手段】本発明は、以上の目的を
達成するために、電極を含む負荷に対して所定の周波数
範囲内で連続的に選択可能な高周波を供給する高周波電
源を備えたプラズマ発生装置に組込まれ、前記負荷と高
周波電源との間に介在して両者のマッチングを行う整合
器であって、共振回路を形成する可変容量素子および可
変誘導素子により高周波に対する同調およびインピーダ
ンスの調整を行うと共に、前記可変容量素子の容量値お
よび前記可変誘導素子の誘導係数は連続的に設定可能で
あり、かつ前記周波数範囲の全体にわたって同調および
調整を可能とする容量レンジおよび誘導係数レンジを有
する整合器を構成するものである。また、具体的に、前
記可変容量素子は、ロータリコンデンサからなり、単位
回転量当りの容量変化分が前記高周波範囲の周波数に応
じてノンリニアに設定されることを特徴とする。更に具
体的に前記ロータリコンデンサは、単位回転量当りの容
量変化分が前記周波数範囲の高域側ほど小さくなるもの
であることを特徴とし、前記可変誘導素子は、前記周波
数範囲の低域側と高域側とで切り換え可能な,長さ可変
の導電体および巻数可変のコイルとの結合であることを
特徴とする。
In order to achieve the above object, the present invention comprises a high frequency power supply for supplying a high frequency which is continuously selectable within a predetermined frequency range to a load including electrodes. A matching device that is incorporated in a plasma generation device and intervenes between the load and a high frequency power source to perform matching between the loads and the high frequency power supply. Tuning and impedance adjustment to a high frequency by a variable capacitance element and a variable inductive element forming a resonance circuit. In addition, the capacitance value of the variable capacitance element and the induction coefficient of the variable inductive element are continuously settable, and have a capacitance range and an induction coefficient range that enable tuning and adjustment over the entire frequency range. It constitutes a matching unit. In addition, specifically, the variable capacitance element is formed of a rotary capacitor, and a capacitance change amount per unit rotation amount is set non-linearly according to a frequency in the high frequency range. More specifically, the rotary capacitor is characterized in that the amount of change in capacitance per unit amount of rotation becomes smaller on the higher side of the frequency range, and the variable inductive element is on the lower side of the frequency range. It is characterized in that it is connected to a conductor with a variable length and a coil with a variable number of turns that can be switched to the high frequency side.

【0012】[0012]

【作用】適切な容量レンジおよび誘導係数レンジを有す
る可変容量素子および可変誘導素子を用いて高周波に対
する同調およびインピーダンス調整を行うことにより、
所望のマッチングを単一の整合器で行うことが出来る。
また、ロータリコンデンサからなる可変容量素子のキャ
パシタンスは周波数に対してノンリニアに変化し、特
に、周波数範囲の高域側で単位回転量当りの容量変化を
小さくするためプラズマ励起周波数の高周波側で容量変
化の分解能が小さくなるため周波数差に対応するロータ
の回転角を大きくすることが出来、微妙な調整が大きな
ロータ回転角で実現出来る。また、可変誘導素子として
長さ可変の導電体および巻数可変のコイルが用いられ、
コイルの誘導成分が必要でなくなる高周波領域では長さ
可変の導電体を機能させればよく、整合調整が容易に行
われる。
[Function] By performing tuning and impedance adjustment to a high frequency using a variable capacitance element and a variable induction element having an appropriate capacitance range and induction coefficient range,
The desired matching can be done with a single matcher.
Also, the capacitance of the variable capacitance element consisting of a rotary capacitor changes non-linearly with respect to frequency, and in particular, in order to reduce the capacitance change per unit amount of rotation on the high frequency side of the frequency range, the capacitance change on the high frequency side of the plasma excitation frequency. Since the resolution of is decreased, the rotation angle of the rotor corresponding to the frequency difference can be increased, and delicate adjustment can be realized with a large rotor rotation angle. In addition, a variable length conductor and a variable number of coils are used as the variable induction element,
In the high frequency region where the induction component of the coil is not needed, the conductor having a variable length may be made to function, and the matching adjustment can be easily performed.

【0013】[0013]

【実施例】以下、本発明の実施例を図面に基づき説明す
る。図1は同実施例の全体構成図である。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an overall configuration diagram of the embodiment.

【0014】図1に示すように、この整合器1はL型共
振回路から構成される。図中、点線で囲まれている部分
が整合器1に相当する。整合器1は電源9と電極等を有
する負荷10間に介設される。なお、本実施例では最大
出力500[W]の高周波電源の使用を前提としてい
る。可変容量素子としては、例えば最大静電容量100
0[pF]の電源周波数同調用バリアブルロータリコン
デンサ2と最大静電容量200[pF]のマッチング微
調整用バリアブルロータリコンデンサ3を設置する。本
実施例ではどちらのコンデンサ2,3もエアー型バリア
ブルコンデンサであるが、より高出力の電源9に対応さ
せる場合には絶縁破壊電圧(耐圧)の高い真空バリアブ
ルコンデンサを用いてもよい。また、図示のように、実
際の負荷10に接続して整合調整を行う段階においては
前記バリアブルコンデンサ2,3に並列に固定コンデン
サ2a,3aを接続する場合もある。
As shown in FIG. 1, the matching device 1 is composed of an L-type resonance circuit. In the figure, the part surrounded by the dotted line corresponds to the matching box 1. The matching device 1 is provided between a power source 9 and a load 10 having electrodes and the like. The present embodiment is premised on the use of a high frequency power source with a maximum output of 500 [W]. As the variable capacitance element, for example, a maximum capacitance of 100
A variable rotary capacitor 2 for power frequency tuning of 0 [pF] and a variable rotary capacitor 3 for fine matching adjustment with a maximum capacitance of 200 [pF] are installed. In the present embodiment, both capacitors 2 and 3 are air-type variable capacitors, but a vacuum variable capacitor having a high dielectric breakdown voltage (breakdown voltage) may be used when corresponding to a higher output power source 9. Further, as shown in the figure, fixed capacitors 2a and 3a may be connected in parallel with the variable capacitors 2 and 3 at the stage of performing matching adjustment by connecting to the actual load 10.

【0015】前記バリアブルロータリコンデンサ2,3
は単位回転量当りの容量変化分が周波数範囲の高域側で
小さくなるようにしている。例えば、複数のロータ板の
うち第一板は半円状とし第二板以降は順次等間隔で中心
角度を減らした扇状とし、かつ片側の直線端面を揃えて
配置する。また、本実施例とは逆にステータ側の面積や
ギャップが変化するコンデンサを用いてもよい。
The variable rotary capacitors 2 and 3
Is designed so that the change in capacity per unit amount of rotation is reduced on the high frequency side of the frequency range. For example, among the plurality of rotor plates, the first plate has a semicircular shape, and the second and subsequent plates have a fan shape in which the central angles are sequentially reduced at equal intervals, and the linear end faces on one side are aligned. Further, a capacitor whose area and gap on the stator side may change may be used, contrary to the present embodiment.

【0016】一方、可変誘導素子としては、例えば中空
の銅パイプからなる最大誘導係数5[μH]のコイル4
と、幅30[mm],長さ500[mm],厚さ3[m
m]の銅板製の導電体6を設置した。なお、コイル4と
導電体6との切り替えはスイッチ8によって行い、どち
らか一方が負荷10側に連結される。コイル4は外周に
沿って移動する接触器5を備え、誘導係数を準連続的に
変えることが出来る。また、導電体6は接触器7を有
し、接続長さを連続的に変えることが出来る。
On the other hand, as the variable induction element, for example, a coil 4 made of a hollow copper pipe and having a maximum induction coefficient of 5 [μH] is used.
Width 30 [mm], length 500 [mm], thickness 3 [m
m] and the conductor 6 made of a copper plate. The switch between the coil 4 and the conductor 6 is performed by the switch 8, and either one of them is connected to the load 10 side. The coil 4 is provided with a contactor 5 that moves along the outer circumference, so that the induction coefficient can be changed quasi-continuously. Further, the conductor 6 has a contactor 7, and the connection length can be continuously changed.

【0017】次に、本実施例による整合作用を説明す
る。装置負荷として、Ar圧力20[mTorr]に保
たれた真空チェンバー内で直径120[mm]、電極間
距離60[mm]の平行平板型電極を用いた。また、プ
ラズマ励起用電源としては、最大出力500[W]で1
0〜100[MHz]周波数可変の高周波電源を用い
た。進行波出力を100[W]一定にして反射波出力が
1[W]以下におさまるまで整合調整したところ、出力
周波数10[MHz]から58[MHz]までは、切り
替えスイッチ8を用いてコイル4を負荷10に接続し、
コイル4の接触器5を調整した後、電源周波数同調用バ
リアブルコンデンサ2とマッチング微調整用バリアブル
コンデンサ3を調整することで容易に整合調整可能であ
った。また、54[MHz]から100[MHz]にお
いては、切り替えスイッチ8を用いて導電体6を負荷1
0に接続し、導電体6の接触器7を調整した後、電源周
波数同調用バリアブルコンデンサ2とマッチング微調整
用バリアブルコンデンサ3を調整することで容易に整合
調整可能であった。どちらのバリアブルコンデンサ2,
3もロータ単位回転量当りの容量変化分が周波数範囲の
高域側で小さくなる特性のため容量変化に敏感な整合操
作が要求される高周波領域においても分解能は高く、例
えば、周波数差1[MHz]に対応するロータの回転角
はおよそ10度以下にはならず、従来技術のように調整
が敏感過ぎることはなかった。
Next, the matching operation according to this embodiment will be described. As a device load, a parallel plate type electrode having a diameter of 120 [mm] and an inter-electrode distance of 60 [mm] was used in a vacuum chamber kept at an Ar pressure of 20 [mTorr]. As a power source for plasma excitation, the maximum output is 500 [W]
A high frequency power source with a variable frequency of 0 to 100 [MHz] was used. When the traveling wave output is kept constant at 100 [W] and the matching adjustment is performed until the reflected wave output falls below 1 [W], the changeover switch 8 is used to switch the coil 4 from the output frequency 10 [MHz] to 58 [MHz]. Connected to the load 10,
After adjusting the contactor 5 of the coil 4, the power source frequency tuning variable capacitor 2 and the matching fine adjustment variable capacitor 3 were adjusted so that matching adjustment could be easily performed. In the range of 54 [MHz] to 100 [MHz], the changeover switch 8 is used to load the conductor 6 into the load 1.
After adjusting the contactor 7 of the conductor 6 by connecting to 0, the power source frequency tuning variable capacitor 2 and the matching fine adjustment variable capacitor 3 were adjusted, so that the matching adjustment could be easily performed. Which variable capacitor 2,
3 also has a high resolution even in a high frequency region where a matching operation sensitive to the capacitance change is required because the amount of change in the capacitance per unit rotation amount of the rotor becomes small on the high frequency side of the frequency range. ] The rotation angle of the rotor corresponding to [] does not fall below about 10 degrees, and the adjustment was not too sensitive as in the prior art.

【0018】[0018]

【発明の効果】本発明によれば、次のような顕著な効果
を奏する。 1)共振回路を形成する可変容量素子と可変誘導素子は
適切な容量レンジおよび誘導係数レンジ内で電源周波数
に応じて自由に可変できるようにしたため、プラズマ励
起周波数を変えてもタップ切り替えを必要とせず、かつ
別の整合器を使用することなく単一の整合器により整合
調整を行うことが出来る。 2)単位回転量当りの容量変化分が周波数に対してノン
リニアに設定され、特に、周波数範囲の高域側ほど小さ
く設定されるため、整合調整が容易に出来る。 3)また、可変誘導素子として周波数範囲の低域側およ
び高域側での切り換え可能な構造を採用したため共通の
整合器で広範囲の周波数に対する整合調整が容易に出来
る。
According to the present invention, the following remarkable effects are obtained. 1) The variable capacitance element and the variable inductive element forming the resonance circuit can be freely varied according to the power supply frequency within an appropriate capacitance range and induction coefficient range, so tap switching is not required even if the plasma excitation frequency is changed. And matching adjustment can be performed by a single matching device without using another matching device. 2) The amount of change in capacity per unit amount of rotation is set non-linearly with respect to the frequency, and in particular, it is set smaller toward the high frequency side of the frequency range, so matching adjustment can be easily performed. 3) Further, since the variable inductive element has a structure that can be switched between the low band side and the high band side of the frequency range, a common matching box can easily perform matching adjustment for a wide range of frequencies.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の全体構成図。FIG. 1 is an overall configuration diagram of an embodiment of the present invention.

【図2】従来の低域側整合器の構成図。FIG. 2 is a configuration diagram of a conventional low-frequency side matching box.

【図3】従来の高域側整合器の構成図。FIG. 3 is a configuration diagram of a conventional high-frequency side matching box.

【符号の説明】[Explanation of symbols]

1 整合器 2 電源周波数同調用バリアブルロータリコンデンサ 2a 固定コンデンサ 3 マッチング微調整用バリアブルロータリコンデン
サ 3a 固定コンデンサ 4 コイル 5 接触器 6 導電体 7 接触器 8 切り替えスイッチ 9 高周波電源(電源) 10 装置負荷(負荷)
1 Matching Device 2 Variable Rotary Capacitor for Power Frequency Tuning 2a Fixed Capacitor 3 Variable Rotary Capacitor for Fine Tuning Matching 3a Fixed Capacitor 4 Coil 5 Contactor 6 Conductor 7 Contactor 8 Changeover Switch 9 High Frequency Power Supply 10 Device Load (Load) )

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 電極を含む負荷に対して所定の周波数範
囲内で連続的に選択可能な高周波を供給する高周波電源
を備えたプラズマ発生装置に組み込まれ、前記負荷と高
周波電源との間に介在して両者のマッチングを行う整合
器であって、共振回路を形成する可変容量素子および可
変誘導素子により高周波に対する同調およびインピーダ
ンスの調整を行うと共に、前記可変容量素子の容量値お
よび前記可変誘導素子の誘導係数は連続的に設定可能で
あり、かつ前記周波数範囲の全体にわたって同調および
調整を可能とする容量レンジおよび誘導係数レンジを有
することを特徴とする整合器。
1. A plasma generator equipped with a high-frequency power supply that supplies a high-frequency power that can be continuously selected within a predetermined frequency range to a load including electrodes, and is interposed between the load and the high-frequency power supply. A matching device for performing matching between the two, the tuning of the high frequency and the adjustment of the impedance by the variable capacitance element and the variable inductive element forming the resonance circuit, and the capacitance value of the variable capacitance element and the variable inductive element. A matcher characterized in that the induction coefficient is continuously settable and has a capacitance range and an induction coefficient range that allow tuning and adjustment over the frequency range.
【請求項2】 前記可変容量素子は、ロータリコンデン
サからなり、単位回転量当りの容量変化分が前記周波数
範囲の周波数に応じてノンリニアに設定されている請求
項1の整合器。
2. The matching device according to claim 1, wherein the variable capacitance element comprises a rotary capacitor, and a capacitance change amount per unit rotation amount is set non-linearly according to a frequency in the frequency range.
【請求項3】 前記ロータリコンデンサは、単位回転量
当りの容量変化分が前記周波数範囲の高域側ほど小さく
なるものである請求項2の整合器。
3. The matching device according to claim 2, wherein the rotary capacitor is such that the amount of change in capacitance per unit amount of rotation becomes smaller toward the higher frequency side of the frequency range.
【請求項4】 前記可変誘導素子は、前記周波数範囲の
低域側と高域側とで切り換え可能な,長さ可変の導電体
および巻数可変のコイルとの結合からなる請求項1の整
合器。
4. The matching device according to claim 1, wherein the variable inductive element is composed of a conductor having a variable length and a coil having a variable number of turns, which are switchable between a low band side and a high band side of the frequency range. .
JP6093163A 1994-05-02 1994-05-02 Matching device Pending JPH07302695A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6093163A JPH07302695A (en) 1994-05-02 1994-05-02 Matching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6093163A JPH07302695A (en) 1994-05-02 1994-05-02 Matching device

Publications (1)

Publication Number Publication Date
JPH07302695A true JPH07302695A (en) 1995-11-14

Family

ID=14074907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6093163A Pending JPH07302695A (en) 1994-05-02 1994-05-02 Matching device

Country Status (1)

Country Link
JP (1) JPH07302695A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11162697A (en) * 1997-11-28 1999-06-18 Mc Electronics Kk Spiral resonance device for plasma generation
JP2011034971A (en) * 2009-08-05 2011-02-17 Advanced Micro-Fabrication Equipment Inc (Asia) Plasma treatment chamber having switchable bias frequency, and switchable matching network

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11162697A (en) * 1997-11-28 1999-06-18 Mc Electronics Kk Spiral resonance device for plasma generation
JP2011034971A (en) * 2009-08-05 2011-02-17 Advanced Micro-Fabrication Equipment Inc (Asia) Plasma treatment chamber having switchable bias frequency, and switchable matching network

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