JPH07300978A - Free access floor - Google Patents

Free access floor

Info

Publication number
JPH07300978A
JPH07300978A JP15783394A JP15783394A JPH07300978A JP H07300978 A JPH07300978 A JP H07300978A JP 15783394 A JP15783394 A JP 15783394A JP 15783394 A JP15783394 A JP 15783394A JP H07300978 A JPH07300978 A JP H07300978A
Authority
JP
Japan
Prior art keywords
floor
metal wire
pad
shock absorbing
conductive metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15783394A
Other languages
Japanese (ja)
Other versions
JP2778470B2 (en
Inventor
Atsuhiko Kobayashi
淳彦 小林
Akiyuki Okamoto
晶志 岡本
Tsutomu Sato
努 佐藤
Minoru Kaneko
実 金子
Kazunobu Morikawa
一信 森川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Electronics Services Co Ltd
Hitachi Kizai Inc
Original Assignee
Hitachi Electronics Services Co Ltd
Hitachi Kizai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Services Co Ltd, Hitachi Kizai Inc filed Critical Hitachi Electronics Services Co Ltd
Priority to JP15783394A priority Critical patent/JP2778470B2/en
Publication of JPH07300978A publication Critical patent/JPH07300978A/en
Application granted granted Critical
Publication of JP2778470B2 publication Critical patent/JP2778470B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Floor Finish (AREA)

Abstract

PURPOSE:To provide a pad with long service life which sufficiently prevent floor panels from being charged and does not deteriorate charging prevention function even by cleaning by burying a shock absorbing pad in a shock absorbing material with a part of a conductive metal wire braided in mesh exposed. CONSTITUTION:A shock absorbing pad 3 is positioned between a floor plate 1 and a support leg 2. In this case, the shock absorbing pad 3 is formed into disk shape, and a hole 3a through the projection 2a of the support leg 2 is formed at four locations. Next the lower half part of a conductive metal wire 3c braided in mesh is buried in the shock absorbing material 3b, and the upper half that is made in contact with the floor plate 1 is exposed. Also a conduction between the adjacent floor plates 1 is made with the conductive metal wire 3c so as to completely prevent the floor plates 1 from being charged. Thus instability of the floor plates 1 can be absorbed and also charging on them can be prevented for long time.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、床板とこれを支持す
る支持脚とを有し、床スラブ上に載置されて床スラブと
床板との間に間隙を設けるようにして敷き詰めるフリー
アクセスフロアに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a floor board and support legs for supporting the floor board, and is placed on a floor slab and laid so that a space is provided between the floor slab and the floor board. Regarding

【0002】[0002]

【従来の技術】近代的なオフィスでは、床スラブ上にフ
リーアクセスフロアを敷き詰めて2重床構造としてい
る。その際、床板に存在しうる僅かな不安定性を吸収す
るために、ゴム製の緩衝パッドを床板と支持脚との間に
介在させているが、電子計算機室やクリーンルームなど
に使用するフリーアクセスフロアでは、床板の不安定性
の吸収のほか、床板の帯電防止のために、導電性の緩衝
パッドを使用している。すなわち隣接する床板とこれを
支持する支持脚との間に導電性の緩衝パッドを介在させ
ることにより、一部の床板が摩擦などによって帯電した
としても、緩衝パッドを通じて次々に隣接する床板に放
電し、また支持脚を通じて床スラブ内に放電して、床板
の帯電を防止している。この導電性緩衝パッドとして従
来は、ゴムに導電性材料を混入した導電性ゴムを使用し
ていた。
2. Description of the Related Art In a modern office, a free access floor is spread over a floor slab to form a double floor structure. At that time, in order to absorb the slight instability that may exist in the floorboard, a rubber cushion pad is interposed between the floorboard and the supporting legs, but it is a free access floor used in computer rooms and clean rooms. Uses a conductive buffer pad to absorb the instability of the floorboard and to prevent the floorboard from being charged. That is, by interposing a conductive buffer pad between the adjacent floor plate and the supporting leg that supports the floor plate, even if some of the floor plates are charged due to friction or the like, they are discharged to the adjacent floor plates one after another through the buffer pad. Moreover, it discharges into the floor slab through the support legs to prevent the floor board from being charged. Conventionally, conductive rubber in which a conductive material is mixed has been used as the conductive buffer pad.

【0003】[0003]

【発明が解決しようとする課題】上記従来の導電性緩衝
パッドは導電性ゴムによって形成されていたから、床板
の不安定性の吸収のためには十分ではあっても、少なか
らざる電気抵抗があるから、床板の帯電の防止のために
は必ずしも十分とはいえなかった。また導電性ゴムの表
面は平滑に形成されているから、ワックスがけなどの清
掃作業や補修作業によって洗剤やゴミなどが侵入する
と、導電性ゴムと床板との間の導通が維持できなくなる
という問題点もあった。更に床板は人の歩行などによっ
て繰り返して押圧され、この結果導電性ゴムの摩耗が激
しく、耐用寿命の点でも問題があった。したがって本発
明は、床板の帯電防止を十分に図ることができ、清掃作
業などによっても帯電防止機能が劣化するおそれがな
く、且つ耐用寿命の長い床板と支持脚との間の導電性緩
衝パッドを提供することを目的とする。
Since the above-mentioned conventional conductive buffer pad is formed of conductive rubber, it has a sufficient electric resistance for absorbing the instability of the floor plate, but has a considerable electric resistance. However, it was not always sufficient to prevent the electrostatic charge. In addition, since the surface of the conductive rubber is formed smooth, if detergent or dust enters during cleaning or repair work such as waxing, the continuity between the conductive rubber and the floor plate cannot be maintained. There was also. Further, the floor plate is repeatedly pressed by the walking of a person, and as a result, the conductive rubber is heavily worn and there is a problem in terms of service life. Therefore, the present invention can sufficiently prevent the floor plate from being charged with static electricity, and there is no fear that the antistatic function is deteriorated even by a cleaning operation or the like, and a conductive buffer pad between the floor plate and the supporting leg having a long service life is provided. The purpose is to provide.

【0004】[0004]

【課題を解決するための手段】本発明は上記目的を達成
するためになされたものであり、すなわち、複数枚の床
板と、それぞれ隣接する床板を支持する複数個の支持脚
とを有し、床板と支持脚との間に緩衝パッドを介在させ
たフリーアクセスフロアにおいて、緩衝パッドを、床板
に当接する上面側において導電性金属線の一部が露出す
るように、メッシュ状に編組した導電性金属線を緩衝材
に埋設して形成したことを特徴とするフリーアクセスフ
ロアである。その際、緩衝材として導電性ゴムを用いる
ことができる。
The present invention has been made to achieve the above object, that is, it has a plurality of floor plates and a plurality of support legs for supporting adjacent floor plates, respectively. In a free access floor with a cushion pad interposed between the floor plate and the support leg, the cushion pad is made of a conductive mesh that is braided in a mesh shape so that a part of the conductive metal wire is exposed on the upper surface side that contacts the floor plate. The free access floor is characterized by being formed by embedding a metal wire in a cushioning material. At that time, conductive rubber can be used as the cushioning material.

【0005】[0005]

【作用】導電性金属線の一部は露出しており、隣接する
床板どうしはこの金属線によって互いに導通するから、
導電性ゴムによる導通の場合と比較して床板の帯電防止
機能がより十分に図られる。また導電性金属線はメッシ
ュ状に編組されていて凹凸があるから、洗剤やゴミなど
が侵入しても凹部にのみ侵入し、したがって帯電防止機
能が劣化するおそれがない。更に金属線の残部は緩衝材
に埋設されているから、緩衝材の形状を維持して変形を
防止する機能をも果たし、したがって耐用寿命が長くな
る。又、緩衝材に導電性ゴムを使用することによりさら
に導電性能を上げることもできる。
[Function] Since a part of the conductive metal wire is exposed and adjacent floor boards are electrically connected to each other by this metal wire,
The antistatic function of the floor plate can be more sufficiently achieved as compared with the case of conduction by the conductive rubber. In addition, since the conductive metal wire is braided in a mesh shape and has irregularities, even if detergent or dust enters, the conductive metal wires enter only the recesses, and therefore the antistatic function does not deteriorate. Further, since the remaining portion of the metal wire is embedded in the cushioning material, it also has a function of maintaining the shape of the cushioning material and preventing deformation, thus prolonging the service life. Further, the conductive performance can be further improved by using a conductive rubber as the cushioning material.

【0006】[0006]

【実施例】本発明を図面によって説明する。図面は本発
明の一実施例を示し、このフリーアクセスフロアは複数
枚の床板1と複数個の支持脚2とを有し、各支持脚2は
隣接する4枚の床板1の各1つの隅を支持している。各
床板1の位置ずれを防止するために、支持脚2の上面に
は4本の位置決め突起2aが突設されており、これに対
応して各床板1の四隅の下面には、位置決め突起2aが
嵌入する凹部1aが形成されている。床板1と支持脚2
との間には、本発明による緩衝パッド3が介在してい
る。緩衝パッド3は、図3に示すように円盤状に形成さ
れ、支持脚2の位置決め突起2aが貫通する孔3aが4
カ所に形成されており、こうして緩衝パッド3の脱落が
防止されている。緩衝パッド3は図4に示すように、緩
衝材3bと導電性金属線3cとからなり、本実施例の導
電性金属線3cはステンレス鋼によって形成されてい
る。導電性金属線3cはメッシュ状に編組されており、
下半部分は緩衝材3b内に埋設されているが、床板1に
当接する上面側の導電性金属線3cは露出している。
The present invention will be described with reference to the drawings. The drawings show an embodiment of the present invention, in which the free access floor has a plurality of floor boards 1 and a plurality of support legs 2, and each support leg 2 has one corner of each of four adjacent floor boards 1. I support you. In order to prevent displacement of each floor plate 1, four positioning protrusions 2a are provided on the upper surface of the support leg 2, and correspondingly, the positioning protrusions 2a are formed on the lower surfaces of the four corners of each floor plate 1. A concave portion 1a into which is inserted is formed. Floor board 1 and supporting legs 2
The buffer pad 3 according to the present invention is interposed between and. The cushioning pad 3 is formed in a disk shape as shown in FIG. 3, and has four holes 3a through which the positioning protrusions 2a of the support legs 2 pass.
The buffer pad 3 is formed at one place, and thus the buffer pad 3 is prevented from falling off. As shown in FIG. 4, the cushioning pad 3 is composed of a cushioning material 3b and a conductive metal wire 3c, and the conductive metal wire 3c of this embodiment is made of stainless steel. The conductive metal wire 3c is braided in a mesh shape,
The lower half part is embedded in the cushioning material 3b, but the conductive metal wire 3c on the upper surface side that abuts on the floor plate 1 is exposed.

【0007】本実施例は以上のように形成されており、
導電性金属線3cの床板1に当接する上面側は露出して
おり、隣接する床板1どうしの導通はこの金属線3cに
よってなされるから、床板1の帯電は確実に防止され
る。また金属線3cはメッシュ状に編組されていて凹凸
があるから、洗剤やゴミなどが侵入しても凹部にのみ侵
入し、帯電防止機能が劣化するおそれがない。更に金属
線3cの下半部分は緩衝材3bに埋設されているから、
緩衝材3bの変形が防止されて耐用寿命が長くなる。な
お緩衝材3bとしては、非導電性のゴムシートを用いる
ことができるほか、導電性ゴムを用いることによって、
導電性能の一層の向上を図ることもできる。
This embodiment is formed as described above,
The upper surface side of the conductive metal wire 3c abutting on the floor plate 1 is exposed, and conduction between the adjacent floor plates 1 is performed by the metal wire 3c, so that the floor plate 1 is reliably prevented from being charged. Further, since the metal wire 3c is braided in a mesh shape and has irregularities, even if detergent, dust, or the like enters, it does not enter the recesses only, and the antistatic function does not deteriorate. Furthermore, since the lower half part of the metal wire 3c is embedded in the cushioning material 3b,
The cushioning material 3b is prevented from being deformed and the service life is extended. As the cushioning material 3b, a non-conductive rubber sheet can be used, and by using conductive rubber,
It is possible to further improve the conductive performance.

【0008】次に図5は別の実施例を示す。上記実施例
の緩衝パッドは外面形状円形に形成されていたが、この
実施例の緩衝パッド3は、支持脚2の位置決め突起2a
が通過する部分を切欠いた十字形に形成されており、し
たがって上記実施例の孔3aは設けられていない。その
他の構成は上記実施例と同様であり、したがって上記実
施例と同様の効果を得ることができる。
Next, FIG. 5 shows another embodiment. Although the cushioning pad of the above-mentioned embodiment is formed to have a circular outer surface shape, the cushioning pad 3 of this embodiment has the positioning protrusion 2a of the support leg 2.
Is formed in a cruciform shape in which a portion passing through is cut out, and therefore the hole 3a in the above-described embodiment is not provided. Other configurations are similar to those of the above-described embodiment, and therefore, the same effect as that of the above-described embodiment can be obtained.

【0009】[0009]

【発明の効果】本発明による緩衝パッドは、メッシュ状
に編組した導電性金属線をその一部が露出するようにし
て緩衝材に埋設しているから、この緩衝パッドを用いた
フリーアクセスフロアによれば、床板の不安定性の吸収
が図られるほか、長期にわたり確実に床板の帯電を防止
することができる。
In the buffer pad according to the present invention, the conductive metal wire braided in a mesh shape is embedded in the buffer material so that a part of the metal wire is exposed, so that a free access floor using the buffer pad can be used. According to this, instability of the floor board can be absorbed, and the floor board can be reliably prevented from being charged for a long period of time.

【図面の簡単な説明】[Brief description of drawings]

【図1】床板と緩衝パッドとを仮想線で示した支持脚の
平面図
FIG. 1 is a plan view of a support leg showing a floor plate and a cushioning pad in phantom lines.

【図2】図1中A−A断面図FIG. 2 is a sectional view taken along line AA in FIG.

【図3】緩衝パッドを示す平面図FIG. 3 is a plan view showing a buffer pad.

【図4】緩衝パッドを示す縦断面図FIG. 4 is a vertical sectional view showing a buffer pad.

【図5】支持脚を仮想線で示した緩衝パッドの別の実施
例の平面図
FIG. 5 is a plan view of another embodiment of the cushioning pad with the support leg shown in phantom.

【符号の説明】[Explanation of symbols]

1…床板 1a…凹部 2
…支持脚 2a…位置決め突起 3…緩衝パッド 3
a…孔 3b…緩衝材 3c…導電性金属線
1 ... Floor board 1a ... Recessed portion 2
... Support legs 2a ... Positioning protrusions 3 ... Buffer pads 3
a ... hole 3b ... buffer material 3c ... conductive metal wire

───────────────────────────────────────────────────── フロントページの続き (72)発明者 佐藤 努 東京都千代田区内神田二丁目14番6号 日 立電子サービス株式会社内 (72)発明者 金子 実 東京都千代田区内神田二丁目14番6号 日 立電子サービス株式会社内 (72)発明者 森川 一信 東京都千代田区内神田二丁目14番6号 日 立電子サービス株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tsutomu Sato 2-14-6, Kanda, Uchikanda, Chiyoda-ku, Tokyo Inside Ritsuden Electronic Service Co., Ltd. (72) Minoru Kaneko, 2--14, Uchikanda, Chiyoda-ku, Tokyo No. 6 Nitrate Electronic Service Co., Ltd. (72) Inventor Kazunobu Morikawa 2-14-6 Kanda, Uchida, Chiyoda-ku, Tokyo

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】複数枚の床板と、それぞれ隣接する前記床
板を支持する複数個の支持脚とを有し、前記床板と支持
脚との間に緩衝パッドを介在させたフリーアクセスフロ
アにおいて、 前記緩衝パッドを、前記床板に当接する上面側において
導電性金属線の一部が露出するように、メッシュ状に編
組した前記導電性金属線を緩衝材に埋設して形成したこ
とを特徴とするフリーアクセスフロア。
1. A free access floor having a plurality of floorboards and a plurality of support legs for supporting the floorboards adjacent to each other, wherein a cushioning pad is interposed between the floorboards and the support legs. The buffer pad is formed by embedding the conductive metal wire braided in a mesh shape in a buffer material so that a part of the conductive metal wire is exposed on the upper surface side in contact with the floor plate. Access floor.
【請求項2】前記緩衝材として導電性ゴムを用いた請求
項1記載のフリーアクセスフロア。
2. The free access floor according to claim 1, wherein a conductive rubber is used as the cushioning material.
JP15783394A 1994-05-02 1994-05-02 Free access floor Expired - Lifetime JP2778470B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15783394A JP2778470B2 (en) 1994-05-02 1994-05-02 Free access floor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15783394A JP2778470B2 (en) 1994-05-02 1994-05-02 Free access floor

Publications (2)

Publication Number Publication Date
JPH07300978A true JPH07300978A (en) 1995-11-14
JP2778470B2 JP2778470B2 (en) 1998-07-23

Family

ID=15658333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15783394A Expired - Lifetime JP2778470B2 (en) 1994-05-02 1994-05-02 Free access floor

Country Status (1)

Country Link
JP (1) JP2778470B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2582998A (en) * 2019-08-26 2020-10-14 Sig Trading Ltd Improved flooring component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2582998A (en) * 2019-08-26 2020-10-14 Sig Trading Ltd Improved flooring component
GB2582998B (en) * 2019-08-26 2021-12-08 Sig Trading Ltd Improved flooring component

Also Published As

Publication number Publication date
JP2778470B2 (en) 1998-07-23

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