JPH07299719A - Holding bowl for polishing optical parts - Google Patents

Abstract

PURPOSE:To stably chuck a holding bowl for polishing regardless of thermal influence by forming a contact support face in a receipt part of optical parts into a prescribed shape and also forming a column part fitted in a holding hole of a curve generator so as to incline the circumference of the end part. CONSTITUTION:A column part 7 which is fitted in the holding hole of a curve generator is integrally formed on the bottom part of a holding bowl 1 for polishing. The end of the column part 7 is chamfered by a prescribed inclination angle alpha in the range of a prescribed size A and the diameter of the end is downsized by a prescribed size (l) (l-1nm approximately). The prescribed inclination angle alpha is set to in a range 30 deg.-45 deg. to vertical circumference. A plurality of receipt parts 2 of circular groove lines are formed on the top of the holding bowl 1 for polishing. Respective receipt parts 2 from narrow contact support faces 4 from the inside circumferential edge via the groove lines of the prescribed width and deep hollow groove holes 5 are formed in their inside. Then, the width of the contact support faces 4 is set to approximately 1/5-10/1 of the width of the contact support face of ordinary blane contact.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a polishing plate for polishing an optical component such as a spherical lens, an aspherical lens or the like.

[0002]

2. Description of the Related Art Conventionally, a holding plate for polishing such optical parts (usually referred to as a pasting plate or a spot facing plate)
As shown in FIG. 4, a plurality of circular groove-shaped receiving portions are formed on a hemispherical holding portion 101, and a contact supporting surface 102 having a required width is formed on the inner peripheral edge of the receiving portion. Further, a deep hollow slot 103 is formed inside thereof. Then, when the optical component 104 such as an aspherical lens is loaded in the receiving portion, an adhesive such as a pitch for sticking is applied onto the contact support surface 102,
The lower surface of the optical member 104 is placed on it.

In this way, the optical component 104 held by the contact supporting surface 102 is polished after the pitch is solidified, and during this polishing, the polishing holding dish obtains a proper polishing surface. Therefore, it is accurately chucked by a curve generator (not shown). As a chucking structure in this case, as shown in FIG. 2, the polishing holding plate is fitted into the holding hole of the curve generator with high accuracy (so-called,
It is provided with a pillar portion 105 for “quiet mating”. Further, during this polishing, processing distortion occurs mainly with respect to the size of the contact supporting surface. This is an optical component 1 as a workpiece.
Depending on the diameter of 04 (lens aperture) and wall thickness, for example,
In the conventional lens receiving portion having a diameter of 35 mmφ, the width of the contact supporting surface in the inside and outside of the receiving portion is about 3 mm to 10 mm, which exceeds the allowable value of the polishing accuracy.

[0004]

The following matters are confirmed as the causes of such processing strain. That is, it can be estimated that when the adhesive such as the pitch on the contact support surface is solidified, the stress due to the contraction of the pitch causes the optical component to bend and the polishing surface to be distorted. Then, when the surface of the optical component on the contact surface side is polished and finished, an unexpected appearance may occur.
Further, when the optical component is placed on the contact support surface, the excess adhesive is not sufficiently discharged to the gap between the inner circumference of the receiving portion and the outer circumference of the optical component and the hollow groove hole, and remains on the contact support surface to bond. Since the thickness of the agent layer becomes non-uniform and the setting accuracy of the optical component cannot be ensured, an error may occur in the subsequent polishing process.

When the optical parts are attached to the polishing holding dish, the polishing holding dish is heated to 80 to 1 by high frequency heating.
The temperature may rise to 20 ° C, but due to the thermal expansion at this time,
The pillar portion 105 cannot be fitted into the holding hole of the curve generator quickly and well, which adversely affects the processing accuracy of the optical component.

Generally, the processing distortion of the optical component occurs when the optical component is placed on the contact support surface, but the fitting accuracy of the column portion 105 of the polishing holding tray depends on the processing of the optical component. Since it adversely affects the accuracy, they try to solve both problems at the same time, not individually.

Therefore, as a result of various studies and experiments, the present inventor has devised an ideal polishing holding plate for optical parts as described below.

[0008]

SUMMARY OF THE INVENTION The present invention has been made based on the above circumstances, and easily and accurately realizes the fitting of the column portion of the polishing holding tray with the holding hole of the curve generator regardless of thermal influence. The purpose is to provide a structure devised so that the polishing holding plate can be chucked stably.

Further, according to the present invention, in addition to securing a supporting area necessary for supporting the optical component, and further, it is possible to surely remove the surplus adhesive on the contact supporting surface, the contact supporting surface is formed. It is an object of the present invention to provide a holding tray for polishing an optical component, which has a devised size and width.

[0010]

To this end, an adhesive for attachment is provided on the contact support surface of each receiving part that has a plurality of receiving parts for receiving an optical component and supports the peripheral part of the optical component during polishing. In the holding tray for polishing the optical component, which is configured to adhesively hold the optical component, the contact support surface in the receiving portion is formed inside from the inner peripheral edge of the receiving portion through the groove of the required width, and The width of the receiving portion in the inner and outer directions is set to be narrow so that the supporting area required for polishing is as small as possible. In this case, the width of the contact supporting surface is 1/5 to 10 times that of a normal contact supporting surface.
It is good to set it as narrow as about one-tenth. Further, the contact supporting surface may be formed by being divided into a plurality of lines in the inner and outer directions of the receiving portion.

Further, according to the present invention, a plurality of receiving portions for receiving the optical component are provided, and the optical component is attached to the contact supporting surface of each receiving portion for supporting the peripheral portion of the optical component at the time of polishing with an adhesive for attachment. In a polishing holding dish of an optical component configured to be adhesively held, the polishing holding dish is provided with a column portion that fits into a holding hole of a curve generator at the bottom thereof, and the end peripheral surface of the column portion is , Is inclined with respect to the contact peripheral surface of the holding hole of the curve generator.

In this case, the column portion of the polishing holding dish has, for example, a notch portion at the end thereof at the inner side of the outer diameter of the column portion by about 1 mm, and further, in the normal direction from 15 to 15 mm.
The chamfering may be performed at an inclination angle of 60 degrees, preferably 30 to 45 degrees. Further, the structure of the polishing holding plate applied here is mainly that the diameter of the column portion is 1
Suitable for 0 to 40 mmφ.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described below with reference to FIG. FIG. 1 shows a polishing holding plate 1 according to the present invention, and the bottom of the polishing holding plate 1 is
A pillar portion 7 (chuck contact fitting portion) that fits into a holding hole of a curve generator (not shown) is integrally configured. Then, the end portion of the column portion 7 is chamfered with an inclination angle α within the range of the dimension A, and the diameter of the end portion is made smaller by about 1 mm than the outer diameter of the column portion.

For example, when the outer diameter of the column portion 7 of the polishing holding dish 1 is 25 mmφ and the length is 40 mm, it is at a position 1 mm inward with respect to the outer diameter, and the inclination angle α = 45 degrees from that position, That is, an oblique cutout is formed. The processing accuracy at this time is 1/50 to 1/200. Even if the polishing holding plate configured in this way is actually chucked to the curve generator, the deformation that occurred in the conventional example does not occur at all due to the formation of the inclined portion, and the thermal expansion does not occur. It was found that it completely absorbs the deformation and distortion caused by. As a result, the deformed portion is corrected to a flat surface by using a sanding means such as sandpaper, and it is not necessary to finish, and not only the processing accuracy of the optical component is improved, but also the processing of the polishing holding plate and the assembly man-hour are significantly reduced. It enabled a significant cost reduction as a whole.

Further, FIG. 1 shows a polishing holding plate 1 of the present invention.
Is shown, which includes a plurality of circular groove receivers 2
Are formed. As shown in detail in FIG. 2, this receiving portion 2 forms a narrow contact support surface 4 from its inner peripheral edge through a groove 3 having a required width a, and further has a deep hollow groove hole inside thereof. 5 is formed. In this case, the width b of the contact support surface 4 is about 1/5 to 1/10 of the width of the contact support surface by normal surface contact. For example, in the receiving portion for an aspherical lens having a diameter of 35 mmφ, the groove 3
Has a width a of about 2 mm to 3 mm, and the contact support surface 4 has a width b.
Is set to about 0.5 mm to 1.0 mm. Usually, the polishing time is about 20 minutes, and the polishing accuracy is ±
It became 0.01 to 0.02, and there was no variation. This is effective for a lens with a diameter of up to about 55 mmφ.

As shown in FIG. 3, the polishing holding plate 1 of the present invention has a plurality of contact support surfaces 4 in the inner and outer directions of the receiving portion, that is, in this embodiment,
A narrow contact support surface (thread-shaped contact surface) via the groove 6
4'and 4 "(0.5 mm to 1.0 mm, respectively)
It may be formed into concentric circles by separating into and. This is the size of the contact holding area required for polishing, large aperture lens,
It is also suitable for receiving parts of heavy optical parts such as lenses for astronomical telescopes.

With such a configuration, surface distortion is reduced, variation in the thickness of the optical component is reduced, and peeling of the optical component from the contact supporting surface during processing is reduced as compared with the conventional case. Particularly noteworthy is that the thread-like contact support surface of the present invention has an increased pitch adhesive force per contact area compared to the conventional surface contact support surface. It is expected that the particles are sufficiently discharged from above, the pitch layer thickness becomes thin and uniform, and the intermolecular bonding force in the direction perpendicular to the contact supporting surface is increased. Further, in practice, it is also an advantage of the present invention that cleaning of the holding dish becomes easier.

As another embodiment, for example, in the case where the diameter of the column portion of the polishing holding dish 1 is 35 mmφ and the length is 60 mm, the diameter difference l due to the notch at the end is the same as that of the above embodiment.
Even in the case of mm and the inclination angle α of 30 degrees, the same good result as described above could be obtained. Incidentally, in the past, when the outer diameter of the column portion of the polishing holding dish 1 was small, cracks were often generated at the end portion (in the region A), but according to the present invention, the cracks are completely generated. lost.

The outer diameter of the peripheral surface of the column portion of the polishing holding plate,
Since the size of the notch width of the end portion is appropriately determined depending on the size of the polishing holding dish, it is not always necessary to specify l = 1 mmφ as shown in the above embodiment.
Similarly, the inclination angle α is also 3 in the above embodiment.
It is set to 0 to 45 degrees, but this is also a design condition,
The optimum angle that can be appropriately determined and is expected or experimentally confirmed may be set. As a result, the thermal deformation of the column for holding the polishing tray is completely eliminated, and the conventional "cracking" or "crevice" that often appears in those with a relatively small outer diameter of the column. It was possible to eliminate the occurrence of. Furthermore, adjustments for smoothing do not require processing such as polishing, and a significant cost reduction can be achieved.

[0020]

As described above, according to the present invention, when the polishing holding plate for receiving the optical component is chucked to the curve generator, the column portion of the polishing holding plate for holding is held by thermal expansion. Distortion and cracks can be avoided, and high precision and high efficiency optical component processing can be realized.

Further, the optical parts are provided with a plurality of receiving parts for receiving the optical parts, and when polishing, the optical parts are attached to the contact supporting surfaces of the respective receiving parts which support the peripheral part of the optical parts via an adhesive for attachment. In a polishing holding tray for optical components that is configured to be adhesively held, a contact support surface of the receiving portion is formed inward from an inner peripheral edge of the receiving portion through a groove having a required width, and a width of the receiving portion in the inward and outward directions. Is set narrow so that the supporting area required for polishing is as small as possible, so that the supporting area required to support the optical components must be ensured, and moreover, on the contact supporting surface. Since it is possible to reliably remove the excess adhesive, the appearance of the polished finish of the surface of the optical component on the receiving portion side of the optical component is good. Then, this is less than 1% Next, polishing excellent without surface distortion can be realized. And, for example, even with respect to peeling which has conventionally occurred about 20%, in the present invention, this is 1%.
The product yield can be improved as follows.

By thus improving the receiving portion for the optical component while avoiding the distortion and breakage of the column portion of the polishing holding dish, it is possible to realize the processing of the optical component with high precision and high yield. I was able to.

[Brief description of drawings]

FIG. 1 is a partial vertical cross-sectional side view of a polishing holding dish according to an embodiment of the present invention.

FIG. 2 is an enlarged vertical sectional view of the main part.

FIG. 3 is an enlarged vertical side view showing another embodiment of the present invention.

FIG. 4 is a vertical sectional side view of a conventional polishing holding dish.

[Explanation of symbols]

 1 Polishing holding plate 2 Optical component 3 Groove 4 Contact support surface 5 Hollow groove hole 6 Groove 7 Column

Claims (4)

[Claims] 1. An optical component is provided with a plurality of receiving portions for receiving the optical component, and at the time of polishing, a contact supporting surface of each receiving portion that supports a peripheral portion of the optical component is bonded to the contact supporting surface of the optical component via a bonding adhesive. In a polishing holding tray for optical components that is configured to be adhesively held, a contact support surface of the receiving portion is formed inward from an inner peripheral edge of the receiving portion through a groove having a required width, and a width of the receiving portion in the inward and outward directions. Is set narrow so that the supporting area required for polishing is as small as possible,
Furthermore, a column portion that fits into the holding hole of the curve generator is provided at the bottom of the polishing holding plate, and the end peripheral surface of the column portion is inclined with respect to the contact peripheral surface of the holding hole of the curve generator. A holding tray for polishing optical parts, which is characterized in that 2. The polishing of an optical component according to claim 1, wherein the width of the contact supporting surface is set to be about 1/5 to 1/10 of that of a normal contact supporting surface. Holding dish. 3. The holding plate for polishing an optical component according to claim 1, wherein the contact support surface is divided into a plurality of lines in the inward and outward directions of the receiving portion. 4. The tilt angle of the end peripheral surface of the column portion of the polishing holding dish is set within the range of 30 degrees to 45 degrees with respect to the vertical peripheral surface. A holding tray for polishing optical parts.