JPH07297504A - Aggregated flexible substrate - Google Patents

Abstract

PURPOSE:To provide an aggregated flexible substrate whose dimensional stability is improved without damaging operability. CONSTITUTION:In the title aggregated flexible substrate 10, a flexible substrate 11 is divided into a plurality of flexible substrate bodies 12, 13, 14 defined by a cutting line from a peripheral part 15 and is connected to the peripheral part by joint parts 12a, 12b, 13a, 13b wherein a reinforcement material is cut off. In the joint part region, a cut part for inducing breaking in an adhesive material is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an assembled flexible board having a plurality of flexible board bodies integrally formed.

[0002]

2. Description of the Related Art Conventionally, such an assembled flexible substrate is constructed, for example, as shown in FIG. In FIG. 10, the assembled flexible substrate 1 is configured as a flexible substrate 2 provided with electrode layers of two conductive patterns as described later. The aggregated flexible substrate 1 has a plurality of (three in the case of FIG. 3) flexible substrate bodies 3, which are cut lines from each other.
4, 5 are divided from the surrounding part 6.

In addition, each flexible substrate body 3,
The joints 4 and 5 are connected to the surrounding portion 6 by joints at a plurality of positions on the periphery thereof and are held integrally with each other. That is, in the illustrated case, the flexible substrate body 3 is connected to the peripheral portion 6 by the joint portions 3a and 3b, and the flexible substrate body 4 is connected to the peripheral portion 6 by the joint portions 4a and 4b.

Here, the joint portions 3a, 3b, 4
Since a and 4b have the same configuration, only the joint portion 3a will be described. First, in FIG. 11, the flexible substrate 2 is configured as a so-called two-layer flexible substrate, and the base film 2a and the adhesives 2b and 2c on the front surface and the back surface of the base film 2a, respectively.
And electrode layers 2d and 2e attached by
Cover 2 attached to d and 2e with adhesives 2f and 2g
h, 2i, a reinforcing material 2k attached to the back surface of the base film 2a with an adhesive 2j via an electrode layer 2e and a cover 2i, and an adhesive material 2l attached to the back surface of the reinforcing material 2k. Release paper 2m.

The electrode layers 2d and 2e are formed of, for example, copper foil so as to have a desired conductive pattern.

The covers 2h and 2i have electrode layers 2d and 2
By covering e, the electrode layers 2d and 2e are protected.

The reinforcing member 2k is composed of the base film 2a,
By lining the electrode layers 2d, 2e and the covers 2h, 2i, the strength of the whole is enhanced.

Further, the release paper 2m can be peeled off from the adhesive material 21. As a result, the flexible substrate body 3, 4 or 5 can be easily fixed and held at a desired location by the adhesive material 2l.

Further, the joint portion 3a is shown in FIG.
And as shown in FIG. That is, in the illustrated case, the joint portion 3a is composed of a portion that protrudes from the peripheral portion 6 in a substantially trapezoidal shape with respect to the cutting line A. The tip portion of the flexible substrate body 3
The reinforcing member 2k is cut out in a circular shape at a portion connected to. In the illustrated case, the electrode layers 2d and 2e, the adhesive 2g, the cover 2i, the adhesive 2j, the adhesive 2l, and the release paper 2m are also cut in a circular shape together with the reinforcing material 2k.

According to the assembled flexible substrate 1 thus constructed, the individual flexible substrates 3 and 4 are connected to the base film 2a and the adhesives 2b and 2c at the joint portions 3a, 3b, 4a and 4b. By tearing the adhesive 2f and the cover 2h, the adhesive 2f and the cover 2h can be easily removed from the surrounding portion 6. Thereafter, the individual flexible substrate bodies 3, 4, and 5 are mounted with the release paper 2m and the adhesive material 2l during mounting.
The adhesive material 2l is exposed on the back surface side by peeling off the adhesive material.

Therefore, the flexible substrate body 3,
When the flexible board bodies 3, 4, 5 are mounted on desired mounting portions, the adhesive material 2l exposed on the back surface side of the flexible substrate bodies 3, 4 adheres to the mounting portions, so It is attached to the part and fixedly held.

However, in the assembled flexible substrate 1 having such a structure, the joint portions 3a, 3
In b, 4a, 4b, etc., adhesive material 2l and release paper 2m
The rigidity of the joint is relatively low because the is cut. Therefore, when the assembled flexible substrate 1 is transported, the base film 2a, the adhesives 2b and 2c, the adhesive 2 are jointed by the joint portions 3a, 3b, 4a and 4b.
The f and the cover 2h may be torn. For this reason, there is a problem that the handling is necessary and the workability is deteriorated.

On the other hand, an assembled flexible substrate 7 having a structure as shown in FIGS. 13 and 14 is also known.
In this case, in the assembled flexible substrate 1, the reinforcing member 2k is connected to the electrode layer at the joint portions 3a, 3b, 4a, 4b, etc., which connect the individual flexible substrate bodies 3, 4, 5 to the peripheral portion 6. 2d, 2e, adhesive 2g, cover 2i, and adhesive 2j are cut into a circle,
The adhesive material 2l and the release paper 2m are not cut off (see FIG. 1).
4).

According to the assembled flexible substrate 7 having such a configuration, the individual flexible substrates 3 and 4 are connected to the base film 2a, the adhesives 2b and 2c, and the adhesives 2b and 2c at the joint portions 3a, 3b, 4a and 4b described above. Adhesive 2f, cover 2
By breaking the h, the adhesive material 21 and the release paper 2m,
It is easily removed from the surrounding part 6. After that, the individual flexible substrate bodies 3, 4, and 5 are separated from the adhesive material 2l at the time of mounting, so that the adhesive material 2l is exposed on the back surface side. Therefore, by mounting the flexible board bodies 3, 4, and 5 on desired mounting portions, the flexible board bodies 3, 4, and 5 are mounted.
The adhesive material 2l exposed on the back surface thereof is adhered to and fixedly held on the mounting portion by adhering to the mounting portion.

[0015]

However, in the assembled flexible substrate 7 having such a structure,
In order to remove the individual flexible boards 3, 4 from the surrounding part 6, the joint parts 3a, 3b, 4a,
At 4b, when the base film 2a, the adhesives 2b and 2c, the adhesive 2f, the cover 2h, the adhesive material 2l and the release paper 2m are torn off, the adhesive material 2l is cut along the cutting line A due to an abnormal crack. It may not be cut properly. As a result, the adhesive material 2l may pop out from the cutting line A as shown in FIG. 15 or the adhesive material 2l on the inner side of the cutting line A may be taken away as shown in FIG. In this case, the size of the deviation of the crack from the cutting line A to the outside or inside cannot be controlled at all.

Thus, since the tearing position of the adhesive material 2l is not stable, the dimensional stability of the flexible substrate bodies 3, 4, 5 is reduced. Therefore, there has been a problem that the yield of the flexible substrate bodies 3, 4, 5 is reduced and the product reliability is also reduced.

In view of the above points, an object of the present invention is to provide an assembled flexible substrate in which workability is not impaired and dimensional stability is improved.

[0018]

According to the present invention, the above object is to provide a base film, at least one electrode layer formed on the base film, and directly on one surface of the base film or through the electrode layer. A plurality of individual flexible substrates defined by cutting lines from a peripheral portion of the substrate body, the substrate body including a reinforcing material attached to the substrate and an adhesive material provided on the surface of the reinforcing material. The main body is divided into the main body, and the peripheral portion is connected by the joint portion in which the reinforcing material is cut off, and in the area of the joint portion, the notch portion for guiding the tearing to the adhesive material. Is formed by an assembled flexible substrate.

The assembled flexible substrate according to the present invention is
Preferably, the cut portion is formed closer to the flexible substrate main body than the cutting line of the joint portion.

The assembled flexible substrate according to the present invention is
Preferably, the notch is a hole penetrating the adhesive material.

The assembled flexible substrate according to the present invention is
Preferably, the diameter of the hole is 2 / the width of the joint portion.
It is selected to be about 3.

The assembled flexible substrate according to the present invention comprises:
Preferably, the notch is a slit that penetrates the adhesive material.

The assembled flexible substrate according to the present invention comprises:
Preferably, the length of the slit is selected to be about 2/3 of the width of the joint portion.

[0024]

According to the above construction, in the area of the joint,
A cut portion is formed in the adhesive material. Thereby, in order to remove the individual flexible substrate main body from the surrounding portion, when the adhesive material is torn along with the base film at this joint portion, cracks generated in the adhesive material are notched in the notch portion of the adhesive material. Will be guided.

Here, both ends of the cut portion are close to both ends of the joint portion. As a result, the adhesive material is not torn across the entire width of the joint portion, but is torn in the range from both ends of the joint portion to both ends of the cut portion. Therefore, even if an abnormal crack is generated in the adhesive material, this abnormal crack is also induced in the cut portion. Thus, the tearing of the adhesive material can be performed substantially along the cutting line of the flexible substrate body.

When the cut portion is formed on the flexible substrate main body side from the cutting line of the joint portion,
The tearing of the adhesive material is performed slightly inside the outer shape of the flexible substrate body. Therefore, the edge due to the tearing of the adhesive material,
It does not project outside the flexible substrate body.

When the cut portion is a hole that penetrates through the adhesive material, the cut portion is easily formed and the hole has a width in the vertical and horizontal directions with respect to the horizontal direction. The bonding error at the time of will be absorbed.

The diameter of the hole is 2 / the width of the joint.
When selected to be about 3, the distance from both ends of the joint to the edge of the hole becomes relatively short. Therefore, the adhesive material can be easily torn and the strength of the joint portion can be secured.

When the cut portion is a slit penetrating the adhesive material, the cut portion can be formed very easily.

When the length of the slit is selected to be about ⅔ of the width of the joint portion, the distance from both ends of the joint portion to both ends of the slit becomes relatively short. Therefore, the adhesive material can be easily torn and the strength of the joint portion can be secured.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to FIGS. It should be noted that the examples described below are suitable specific examples of the present invention, and therefore, various technically preferable limitations are given, but the scope of the present invention particularly limits the present invention in the following description. Unless otherwise stated, the present invention is not limited to these modes.

FIG. 1 shows a first embodiment of an assembled flexible substrate to which the present invention is applied. In FIG.
The assembled flexible substrate 10 is a flexible substrate 1 provided with electrode layers having two conductive patterns as described later.
In addition to being configured as one, a plurality (three in the illustrated case) of flexible substrate bodies 12, 13, 14 are divided from the peripheral portion 15 by cutting lines.

Then, each flexible substrate body 1
2, 13 and 14 are respectively provided at a plurality of positions on the periphery of
The joint portion connects the surrounding portions 15 and holds them together. That is, in the illustrated case,
The flexible substrate body 12 includes joint parts 12a, 1
2b, and the flexible substrate body 13 is surrounded by the joint portions 13a and 13b.
Is linked to.

In this embodiment, the flexible substrate 11
Is configured as a so-called two-layer flexible substrate as shown in FIGS. That is, the flexible substrate 1
1 is a base film 11a and this base film 1
Electrode layers 11d and 11e adhered to the front and back surfaces of 1a by adhesives 11b and 11c, respectively, and this electrode layer 1
1d and 11e, covers 11h and 11i adhered with adhesives 11f and 11g, and a reinforcing material 11k adhered to the back surface of the base film 11a with an adhesive 11j via the electrode layer 11e and the cover 11i, This reinforcement 1
Adhesive material 11l provided on the back surface of 1k and this adhesive material 1
It has a release paper 11m placed on 1l.

The electrode layers 11d and 11e are formed of, for example, copper foil so as to have a desired conductive pattern.

The covers 11h and 11i are made up of the electrode layer 11
By covering d and 11e, the electrode layers 11d and 11e
e are protected.

The reinforcing member 11k is the base film 11
By lining a, the electrode layers 11d and 11e, and the covers 11h and 11i, the strength of the whole is enhanced.

The release paper 11m is made of an adhesive material 11l.
It is designed to be peeled off from. As a result, the flexible substrate body 12, 13 or 14 can be easily fixed and held to the desired portion by the adhesive material 11l.

Further, the joint portions 12a, 12
Since b, 13a, and 13b have the same configuration, only the joint portion 12a will be described.

The joint portion 12a is shown in FIGS.
It is configured as shown in. That is, the joint portion 12
In the illustrated case, a is a peripheral portion 15 with respect to the cutting line A.
It is composed of a portion protruding from the
At the tip portion thereof, that is, the portion connected to the flexible substrate main body 12, the reinforcing member 11k is attached to one of FIGS.
As indicated by reference numeral B in FIG. still,
In the case shown in the figure, together with the reinforcing material 11k, the electrode layers 11d,
11e, adhesive 11g, cover 11i and adhesive 11j
Is also cut into a circle.

Assembled flexible substrate 1 according to this embodiment
In the joint portion 12a of 0, the through hole 1 is further formed in the adhesive material 11l in the area of the joint portion 12a.
6 is formed.

This through hole 16 is for guiding the tearing of the adhesive material 11l when it is torn, and in the illustrated case,
It is formed in a circular shape having a diameter D centered on a position displaced inward of the flexible substrate body 12 by a distance d from the cutting line A. Regarding the through hole 16, in the illustrated case, the distance d is 0.3 mm and the diameter D is ⅔ of the width L of the joint portion 12 a at the cutting line A. still,
In the case of the illustration, the release paper 11m together with the adhesive material 11l
Is also cut into a circle.

As a result, each flexible substrate 1
Reference numerals 2 and 13 denote joint portions 12a, 12b, 1 described above.
3a and 13b, base film 11a, adhesive 11
f and cover 11h, adhesive material 11l and release paper 11m
It is detached from the surrounding part 15 by tearing.

In this case, since the through hole 16 is provided in the adhesive material 11l, when the adhesive material 11l is torn at each joint portion, for example, the joint portion 12a, the adhesive material 11l is cut off.
The crack generated in 1 is guided to the through hole 16 of the adhesive material 11l. As a result, the adhesive material 11l moves from both ends of the joint portion 12a toward both ends of the through hole 16 as described above.
It will be torn in the direction shown by the arrow X in FIG.

Therefore, even if an abnormal crack is generated in the adhesive material 11l, this abnormal crack is also induced in the cut portion. Thus, the tearing of the adhesive material 11l can be performed substantially along the cutting line A of the flexible substrate body 12 and, more precisely, inside the cutting line A by the distance d.

Thereafter, each flexible substrate body 1
2, 13, 14 peel off the release paper 11m from the adhesive material 11l at the time of mounting, so that the adhesive material 11l is provided on the back surface side.
Is exposed. Therefore, this flexible substrate body 1
The flexible board bodies 12, 13, 1 are mounted on the flexible board bodies 12, 13, 14 by mounting them on desired mounting portions.
4 is affixed to the mounting portion by the adhesive material 11l exposed on the back surface thereof sticking to the mounting portion,
Holds fixed.

FIG. 6 shows a second embodiment of the assembled flexible substrate according to the present invention. In FIG. 6, the assembled flexible substrate 20 is the same as the first embodiment shown in FIGS. 1 to 5 except that the assembled flexible substrate 20 is configured as a flexible substrate 21 having an electrode layer having a single-layer conductive pattern. It has the same configuration. That is, the assembled flexible substrate 2
In 0, a plurality of flexible board bodies are divided from the peripheral portion by cutting lines, and each flexible board body is connected to the peripheral portion by joint portions 22 at a plurality of positions on the periphery thereof. , Held together with each other.

In this case, the flexible substrate 21 is the same as that shown in FIG.
As shown in, a base film 21a, an electrode layer 21c attached to the surface of the base film 21a with an adhesive 21b, a cover 21e attached to the electrode layer 21c with an adhesive 21d, and the base film 21a
21g Reinforcement material attached to the back surface of the adhesive with adhesive 21f
And an adhesive material 21h provided on the back surface of the reinforcing material 21g
And a release paper 21i placed on the adhesive material 21h. Further, the reinforcing material 21g is cut off in the region of the joint portion 22 as indicated by the symbol B together with the electrode layer 21c and the adhesive 21f, as in the case of FIG.

Further, as in the case of FIG. 3, in the area of the joint portion 22, the adhesive material 21h and the release paper 21i are used.
A through hole 23 is formed in.

This through hole 23 is for guiding the tearing of the adhesive material 21h when the adhesive 21h is torn, and as in the case of FIG. 3, is placed inside the flexible substrate main body by a distance d from the cutting line A. It is formed in a circular shape having a diameter D centered on the displaced position.

According to the assembled flexible substrate 20 having such a configuration, each flexible substrate is connected to the base film 21a and the cover 2 at the joint portion 22 described above.
1e, the adhesive material 21h, and the release paper 21i are torn off to be removed from the peripheral portion.

In this case, since the through hole 23 is provided in the adhesive material 21h, the adhesive material 2 is formed at each joint portion 22.
When tearing 1h, the cracks generated in the adhesive material 21h are
The adhesive material 21h is guided to the through hole 23. As a result, the adhesive material 21h is torn from both ends of the joint portion 22 toward both ends of the through hole 23.

Therefore, even if an abnormal crack is generated in the adhesive material 21h, the abnormal crack is also guided into the through hole 23, so that the adhesive material 21h is substantially torn. To be precise, along the cutting line of (1), it can be done inside the cutting line by a distance d.

FIG. 7 shows a third embodiment of the assembled flexible substrate according to the present invention. In FIG. 7, the assembled flexible substrate 30 is the same as the first embodiment shown in FIGS. 1 to 5, except that the assembled flexible substrate 30 is configured as a flexible substrate 31 having an electrode layer having two conductive patterns. It has the same configuration. That is, the assembled flexible substrate 3
0 means that a plurality of flexible substrate bodies are divided from each other by a cutting line from a peripheral portion, and each flexible substrate body is connected to the peripheral portion by joint portions 32 at a plurality of positions on the periphery thereof. , Held together with each other.

In this case, the flexible substrate 31 is the same as that shown in FIG.
As shown in, the base film 31a and the adhesive 31b,
Electrode layers 31d and 31e adhered by 31c, covers 31h and 31i adhered to the electrode layers 31d and 31e by adhesives 31f and 31g, and electrode layers 31e and 31i on the back surface of the base film 31a. It has a reinforcing material 31k adhered with an adhesive 31j via a release paper 31m attached to the back surface of the reinforcing material 31k via an adhesive material 31l. In addition, the reinforcing material 3
1k is similar to the case of FIG. 2 in the electrode layers 31d, 31e,
In the area of the joint portion 32, the reference sign B together with the adhesive 31j
However, the cover 31i is not cut.

Further, as in the case of FIG. 3, in the region of the joint portion 32, the adhesive material 31l and the release paper 31m are used.
A through hole 33 is formed in.

This through hole 33 is for guiding the tearing of the adhesive material 31l when it is torn, and as in FIG. 3, it is inside the flexible substrate body a distance d from the cutting line A. It is formed in a circular shape having a diameter D centered on the displaced position.

According to the assembled flexible substrate 30 having such a configuration, the individual flexible substrates are connected to the base film 31a and the cover 3 at the joint portion 32 described above.
By tearing off 1h, 31i, the adhesive material 31l and the release paper 31m, they are removed from the surrounding parts.

In this case, since the through hole 33 is provided in the adhesive material 31l, the adhesive material 3 is formed at each joint portion 32.
When tearing 1 l, the cracks generated in the adhesive material 31 l are
It is guided to the through hole 33 of the adhesive material 31l. As a result, the adhesive material 31l is torn from both ends of the joint portion 32 toward both ends of the through hole 33.

Therefore, even if an abnormal crack is generated in the adhesive material 31l, the abnormal crack is also induced in the through hole 33, so that the adhesive material 31l is substantially torn. To be precise, along the cutting line of (1), it can be done inside the cutting line by a distance d.

FIG. 8 shows a fourth embodiment of the assembled flexible substrate according to the present invention. In FIG. 8, the assembled flexible substrate 40 is the same as that of the first embodiment shown in FIGS. 1 to 5 except that the assembled flexible substrate 40 is configured as a flexible substrate 41 having an electrode layer having three conductive patterns. It has the same configuration. That is, the assembled flexible substrate 4
0 means that a plurality of flexible substrate bodies are divided from each other by a cutting line from the peripheral portion, and each flexible substrate body is connected to the peripheral portion by the joint portions 42 at a plurality of positions on the periphery thereof. , Held together with each other.

In this case, the flexible substrate 41 has the structure shown in FIG.
As shown in, a base film 41a and adhesives 41b, 41b on the front surface and the back surface of the base film 41a, respectively.
Electrode layers 41d and 41e adhered by 41c, covers 41h and 41i adhered to the electrode layers 41d and 41e by adhesives 41f and 41g, and an electrode layer adhered by adhesive 41j to the cover 41h. 41k and a cover 41 adhered to this electrode layer 41k with an adhesive 41l
m and the electrode layer 41 on the back surface of the base film 41a.
e and a cover 41i, a reinforcing material 41o adhered by an adhesive 41n, an adhesive material 41p provided on the back surface of the reinforcing material 41o, and a release paper 41q placed on the adhesive material 41p. is doing. In addition, the reinforcing material 41o
Is similar to the case of FIG. 2, the electrode layers 41d, 41e, 41
Along with h and the adhesive 41n, it is cut off in the region of the joint portion 42 as indicated by the symbol B.

Further, as in the case of FIG. 3, in the area of the joint portion 42, the adhesive material 41p and the release paper 41q.
A through hole 43 is formed in the.

This through hole 43 is for guiding the tearing of the adhesive material 41p at the time of tearing, and, as in FIG. 3, is located inside the flexible substrate main body by a distance d from the cutting line A. It is formed in a circular shape having a diameter D centered on the displaced position.

According to the assembled flexible substrate 40 having such a configuration, the individual flexible substrates are connected to the base film 41a and the cover 4 at the joint portion 42 described above.
By tearing 1 m, the adhesive material 41p, and the release paper 41q, it is removed from the surrounding portion.

In this case, since the through hole 43 is provided in the adhesive material 41p, the adhesive material 4 is formed at each joint 42.
When tearing 1p, the crack generated in the adhesive material 41p is
The adhesive material 41p is guided to the through hole 43. As a result, the adhesive material 41p is torn from both ends of the joint portion 42 toward both ends of the through hole 43.

Therefore, even if an abnormal crack is generated in the adhesive material 41p, the abnormal crack is also induced in the through hole 43, so that the adhesive material 41p is substantially torn. To be precise, along the cutting line of (1), it can be done inside the cutting line by a distance d.

FIG. 9 shows a fifth embodiment of an assembled flexible substrate according to the present invention. In FIG. 9, the assembled flexible substrate 50 is composed of a plurality of flexible substrate bodies 51 as in the first embodiment shown in FIGS. 1 to 5.
Are separated from each other by a cutting line from each other, and each flexible substrate main body 51 is divided into a plurality of peripheral portions 5 by joint portions 52 at a plurality of peripheral portions thereof.
3 and are held integrally with each other. In this case, the flexible board itself is configured similarly to the flexible board 11 in the first embodiment.

Further, in the assembled flexible substrate 50, instead of the through hole 16 of the first embodiment shown in FIG. 3, the adhesive material 54 is provided in the area of the joint portion 52.
The slit 55 is formed in the.

The slit 55 is for guiding the tearing of the adhesive material 54 at the time of tearing, and at a position displaced from the cutting line A by a distance d inside the flexible substrate main body 51, It is formed over the entire pressure of the adhesive material 54 so as to have the length L1. In this case, this slit 55
The length L1 of the joint portion 52 is preferably selected to be ⅔ of the width L of the joint portion 52 at the cutting line A. The slits 55 are also formed in the release paper placed on the adhesive material 54.

According to the assembled flexible substrate 50 having such a configuration, the individual flexible substrates 51 are cut at the joint portion 52 described above by tearing off the base film, the cover, the adhesive material 54 and the release paper. It is removed from the peripheral portion 53.

In this case, since the adhesive material 54 is provided with the slit 55, the adhesive material 5 is formed at each joint 52.
A crack generated in the adhesive material 54 at the time of tearing 4 is guided to the slit 55 of the adhesive material 54. This allows
The adhesive material 54 is torn from both ends of the joint portion 52 toward both ends of the slit 55.

Therefore, even if an abnormal crack is generated in the adhesive material 54, this abnormal crack is also guided into the slit 55, so that the adhesive material 54 is torn substantially in the flexible substrate body. Along the cutting line, to be precise, it can be done a distance d inside this cutting line.

As described above, according to the above-mentioned embodiment, since the cut portion is formed in the adhesive material in the area of the joint portion, when the adhesive material is torn, cracks generated in the adhesive material are not generated. , Is guided to the cut portion of this adhesive material. This allows
Since the adhesive material is torn in the range from both ends of the joint portion to both ends of the cut portion, the adhesive material can be torn substantially along the cutting line of the flexible substrate body. . Therefore, since the joint portion is provided with the adhesive material, the strength of the joint portion is secured.

Further, since the adhesive material is torn substantially along the cut portion, after the adhesive material is torn, the adhesive material pops out from the outer shape of the flexible substrate body or the inner adhesive The material will not be taken away by tearing. Thus, the dimensional stability of the outer shape of each flexible board body is improved, the yield of the flexible board body is improved, and high product reliability is obtained.

When the cutout is formed on the flexible substrate main body side with respect to the cutting line of the joint,
The tearing of the adhesive material is performed slightly inside the outer shape of the flexible substrate body. Therefore, the edge due to the tearing of the adhesive material,
It does not project outside the flexible substrate body. Therefore, the dimensional stability of the flexible substrate body can be further improved, and the product reliability can be enhanced.

When the cut portion is a hole that penetrates through the adhesive material, the cut portion is easily formed and the hole has a width in the vertical and horizontal directions with respect to the horizontal direction. The bonding error at the time of will be absorbed. When the cut portion is a slit penetrating the adhesive material, the cut portion can be formed very easily.

In the above-mentioned embodiment, the adhesive material 1
Through holes 1 provided in 1l, 21h, 31l, 41p
The cross sections of 6, 23, 33 and 43 are formed in a circular shape, but the shape is not limited to this, and other shapes such as an elliptical shape, a triangular shape,
It is obvious that the shape may be a quadrangle or the like. The configurations of the flexible substrates 11, 21, 31, 41, 51 are not limited to those shown in the figures, and flexible substrates having other configurations may be used.

[0079]

As described above, according to the present invention, it is possible to obtain an extremely excellent assembled flexible substrate in which workability is not impaired and dimensional stability is improved.

[Brief description of drawings]

FIG. 1 is a plan view showing a part of a first embodiment of an assembled flexible substrate according to the present invention.

FIG. 2 is a partially enlarged plan view of a joint portion of each flexible substrate body of the assembled flexible substrate of FIG.

3 is a partially enlarged bottom view of a joint portion of each flexible board body of the assembled flexible board of FIG.

4 is an enlarged cross-sectional view taken along line 4-4 of FIG.

5 is an enlarged sectional view taken along line 5-5 of FIG.

FIG. 6 is an enlarged sectional view similar to FIG. 4, showing a joint portion in a second embodiment of an assembled flexible substrate according to the present invention.

FIG. 7 is an enlarged cross-sectional view similar to FIG. 4 of a joint portion in a third embodiment of an assembled flexible substrate according to the present invention.

FIG. 8 is an enlarged cross-sectional view similar to FIG. 4 of a joint portion in a fourth embodiment of an assembled flexible substrate according to the present invention.

FIG. 9 is a partial enlarged bottom view of a joint portion in a fifth embodiment of the assembled flexible substrate according to the present invention.

FIG. 10 is a plan view showing a part of an example of a conventional assembled flexible substrate.

11 is an enlarged cross-sectional view of a joint portion of each flexible substrate body of the assembled flexible substrate of FIG.

12 is a partially enlarged plan view of the joint portion of FIG.

FIG. 13 is a partial enlarged bottom view of a joint portion in another example of the conventional assembled flexible substrate.

14 is an enlarged sectional view taken along line 13-13 of FIG.

FIG. 15 is a partially enlarged bottom view of the joint section showing a state where the adhesive material has jumped out due to tearing.

FIG. 16 is a partially enlarged bottom view of the joint section showing a state where the adhesive material is robbed inside by tearing.

[Explanation of symbols]

 10 Assembly Flexible Board 11 Flexible Board 12 Flexible Board Body 12a Joint Section 12b Joint Section 13 Flexible Board Body 13a Joint Section 13b Joint Section 14 Flexible Board Body 15 Surrounding Area 16 Through Hole 20 Assembly Flexible Board 21 Flexible Board 22 Joint Section 23 Through Hole 30 Assembly Flexible Board 31 Flexible Board 32 Joint Section 33 Through Hole 40 Assembly Flexible Board 41 Flexible Board 42 Joint Section 43 Through Hole 50 Assembly Flexible Board 51 Flexible Board Main Body 52 Joint Section 53 Peripheral Part 54 Adhesive Material 55 slits

Claims (6)

[Claims] 1. A base film, at least one electrode layer formed on the base film, a reinforcing material attached to one surface of the base film directly or through the electrode layer, and a surface of the reinforcing material. The substrate main body including the adhesive material provided in is divided into a plurality of individual flexible substrate main bodies defined by cutting lines from the peripheral portion of the substrate main body. , The reinforcing material is connected by the cut joint portion, and the adhesive material is provided with a cut portion for guiding the tearing in the region of the joint portion. substrate. 2. The assembled flexible board according to claim 1, wherein the cutout portion is formed closer to the flexible board body than the cutting line of the joint portion. 3. The aggregated flexible substrate according to claim 1, wherein the cutout portion is a hole that penetrates the adhesive material. 4. The diameter of the hole is 2 times the width of the joint portion.
The assembled flexible substrate according to claim 3, wherein the flexible substrate is selected to be about / 3. 5. The aggregated flexible substrate according to claim 1, wherein the cutout portion is a slit that penetrates the adhesive material. 6. The assembled flexible substrate according to claim 5, wherein the length of the slit is selected to be about ⅔ of the width of the joint portion.