JPH07297235A - Tape carrier for tab and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve folding endurance of a conductor pattern on the slits formed in an insulation film, without the increase of the complicated manufacturing process and the increase of the complex manufacturing work and further the decrease of its quality. CONSTITUTION:In a tape carrier for TAB and the manufacturing method thereof, a plurality of slits 6A, 6B, 6C for bending an insulation film 1 along them are formed in the film 1, and protection resins 7A, 7B, 7C having respectively the film thicknesses adapted to the bent angles of the respective slits 6A, 6B, 6C are applied respectively to the inner parts of the slits. Thereafter, the etching, etc., of a metallic layer formed on the insulation film 1 are performed, and a conductor pattern 2 is formed on the top surface of the insulation film 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape carrier and a method for manufacturing the same, and more particularly, to a conductor pattern existing on a slit without complicating the manufacturing process, complicating the work, and lowering the quality. TAB with improved folding endurance
The present invention relates to a tape carrier and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, as a mounting method for semiconductor elements such as IC and LSI, TAB (Tape Tape) has been used in which semiconductor elements are incorporated into a long tape carrier by wireless bonding.
The Automated Bonding method is attracting attention as it is advantageous for bending and mounting in addition to automating and speeding up mounting.

FIG. 7 and FIG. 8 show the structure of a TAB tape carrier for mounting a bending board mounted on an LCD panel. This tape carrier for TAB is formed on the upper surface of the insulating film tape 1 by etching an insulating film tape 1 made of polyimide, polyester or the like and a metal layer such as copper foil adhered to the upper surface with an adhesive. The conductor pattern 2 is formed. Further, the conductor pattern 2 includes inner leads 2A connected to the electrodes of the semiconductor element, outer input leads 2B connected to the printed circuit board for driving the semiconductor element, and outer output terminals connected to the LCD panel described later. It is composed of leads 2C.

The insulating film tape 1 has a sprocket hole 3 for carrying and positioning in a later process, a device hole 4 for accommodating a semiconductor chip and connecting its electrode to the inner lead 2A, and an outer for input. It has an outer hole 5 for connecting the lead 2B to the printed board and a slit 6 for improving the bendability in the bent portion.

The slit 6 has therein a protective resin 7 for covering the back surface of the conductor pattern 2 on the slit 6, and the protective resin 7 supports the conductor pattern 2 at the time of bending and shorts or breaks each lead. Is designed to prevent

That is, the TAB tape carrier is shown in FIG.
As shown in FIG. 3, the semiconductor element 9 is arranged in the device hole 4, the inner leads 2A and the electrodes of the semiconductor element 9 are wirelessly bonded through the Au bumps 10, and further, the periphery of the semiconductor element 9 is potted with the resin 1.
A semiconductor device is obtained by sealing with 1 and is bent at three slits 6 as shown in FIG.
Output outer lead 2C and LCD in the state of being bent at 0 degree
The wiring portion of the panel 13 is connected by the anisotropic conductive film 14, and the input outer lead 2B and the printed board 12 are connected by a predetermined method. At this time, the conductor pattern 2 on the slit 6 has a thickness of 35 μm and a lead width of 0.05 to
It is as fine as 0.2 mm and has very low mechanical strength, and deformation and disconnection easily occur at the time of bending, but since the conductor pattern 2 is reinforced with the protective resin 7, it can be prevented.

As described above, the TA for applying the protective resin to the bending slit and reinforcing the conductor pattern in this portion
As the tape carrier for B, for example, JP-A-4-307
There is one disclosed in Japanese Patent No. 41. In this TAB tape carrier, after the insulating film tape is bent, the protective resin is applied to the conductor pattern of the slit, and it is difficult to apply the protective resin without deforming or breaking the fine conductor pattern. There was a drawback.

Therefore, in order to improve such a defect, there is a method of applying a protective resin to the conductor pattern of the slit before the film tape is bent, that is, after the conductor pattern is formed, as disclosed in JP-A-2-132418. , JP-A-4-162542 and JP-A-5-3288.

In all of these methods, a protective resin is applied to the back surface of the copper foil of the slit by screen printing, and the control range of printing conditions and the viscosity of the ink-like resist is narrow,
The film thickness of the protective resin in each slit is constant within the range of variation.

[0010]

However, the conventional TAB
According to the tape carrier for use, since the film thickness of the protective resin in the plurality of slits is constant, there is a disadvantage that the bending stress is concentrated on a specific slit depending on the bent shape. In other words, when the bent shape of the insulating film tape is, for example, when mounted on a liquid crystal panel as shown in FIG. There is an inconvenience that the folding endurance is deteriorated due to deformation or breakage.

Further, since the protective resin is formed in each slit by one-time printing by screen printing, in order to change the film thickness of the protective resin, the printing conditions are changed or the viscosity of the ink to be printed is changed. It is necessary to devise such as. Therefore, printing is inevitably performed a plurality of times, which increases the number of manufacturing steps, complicates the work, and lowers the positional accuracy, resulting in the inferior quality.

Therefore, an object of the present invention is to improve the folding endurance of the conductor pattern existing on the slit without complicating the manufacturing process, complicating the work, and further, without lowering the quality. To provide a carrier.

[0013]

In view of the above problems, the present invention provides a protective resin for covering the back surface of the conductor pattern inside the plurality of slits in order to improve the folding endurance of the conductor pattern existing on the slits. Provided is a TAB tape carrier having a film thickness according to the bending angle of each slit.

Further, the manufacturing process is complicated and the work is complicated.
Further, in order to improve the folding endurance of the conductor pattern without degrading the quality, a plurality of slits for bending are formed in the insulating film, and a metal layer such as a copper foil is formed on the insulating film in which the plurality of slits are formed. A protective resin that covers the metal layer on the slit is applied to the inside of the slit in a film thickness according to the bending angle of each slit, and the metal layer is etched to form a conductor pattern on the upper surface of the insulating film. The present invention provides a method of manufacturing a TAB tape carrier.

The above-mentioned protective resin is preferably applied to each slit by a dispenser.

Further, in the above manufacturing method, after forming the conductor pattern, a protective resin for covering the surface of the conductor pattern may be applied from the upper surface side at the position where the slit is formed. By doing so, the reinforcement of the conductor pattern existing on the slit can be increased more than when the protective resin is formed on only one surface, and the folding endurance can be further improved.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The TAB tape carrier of the present invention and its manufacturing method will be described in detail below with reference to the accompanying drawings.

FIG. 1 shows a sectional structure of a semiconductor device using a TAB tape carrier according to an embodiment of the present invention. In this figure, the same parts as those in FIG. 9 are designated by the same reference numerals and symbols, and a duplicate description will be omitted.

The TAB tape carrier used in the above-mentioned semiconductor device has a protective resin 7 for covering the back surface of the conductor pattern 2 inside the three slits 6A, 6B, 6C.
Each of A, 7B, and 7C has a structure with a film thickness corresponding to a bending angle.

That is, as shown in FIG. 2, when the LCD panel 13 and the printed board 12 are mounted by bending,
The slits 6A and 6C of the TAB tape carrier are coated with the protective resins 7A and 7C having a small film thickness, and the slit 6B is coated with the protective resin 7B having a large film thickness.

In the above structure, when the TAB tape carrier is mounted on the LCD panel 13 and the print substrate 12 and bent as shown in FIG. 2, the protective resin 7A, 7C for the slits 6A, 6C having the highest bending rate is formed. Since the film thickness of is smaller than the film thickness of the protective resin 7B of the slit 6B, the bending stress can be prevented from concentrating on the specific slits 6A and 6C, and as a result, the insulating film tape 1 is maintained in a predetermined shape. It will be easier. That is, the bending stress can be dispersed, and the folding resistance of the conductor pattern 2 existing on the slit 6 can be improved.

In order to confirm the above effect, a bending test of the insulating film tape was conducted and the number of times until the copper lead was broken was measured. As a result, the TAB tape carrier in which the film thickness of the protective resin in each slit is uniform is 90 to 18
While the copper lead was ruptured 5 times, the TAB tape carrier of the present invention in which the film thickness of the protective resin in each slit was different did not cause the copper lead rupture from 120 to 285 times.

The method of manufacturing the TAB tape carrier of the present invention will be described below. First, in FIG. 3, a sprocket hole 3, a device hole 4, an outer hole 5, and an insulating film tape 1 having a thickness of about 50 to 125 μm are formed.
And the three slits 6 are formed by pressing.

Next, in FIG. 4, an adhesive is applied to the upper surface of the insulating film tape 1, and a copper foil 15 having a thickness of about 35 μm is heat-bonded thereon.

Then, in FIG. 5, three slits 6 are formed.
The protective resin 7 that covers the back surface of the conductor pattern 2 inside the
A, 7B, and 7C are applied by a dispenser to an arbitrary film thickness, and protective resin 7A and 7C having a film thickness of 30 μm and a film thickness of 40
A protective resin 7B having a thickness of μm is formed.

Further, in FIG. 6, after the photosensitive organic resist is applied to the surface of the copper foil 15, the wiring pattern is printed.
After development, etching is performed along the resist pattern to form a conductor pattern 2 of a predetermined shape having inner leads 2A and input / output outer leads 2B, 2C on the upper surface of the insulating film tape 1.

If necessary, a solder resist 8 for pattern protection is applied on the conductor pattern 2, and finally surface treatment such as tin plating, gold plating, solder plating is applied to complete the whole process.

In the manufacturing method described above, the protective resin 7 is provided inside the plurality of slits 6A, 6B, 6C by the dispenser.
Since A, 7B, and 7C are formed, the film thickness of each protective resin can be formed to an arbitrary thickness without complicating the manufacturing process, complicating the work, and lowering the quality.

Further, in the above-mentioned manufacturing, after the copper foil 15 is etched to form the conductor pattern 2, before the solder resist 8 is applied, the protection for covering the surface of the conductor pattern 2 from the upper surface side at the position of the slit 6. You may apply resin. In this case, the reinforcement of the conductor pattern 2 can be increased more than when the protective resin is formed only on the back surface, and the folding endurance can be further improved.

[0030]

As described above, according to the TAB tape carrier and the method of manufacturing the same of the present invention, a plurality of bending slits are formed in the insulating film, and the slit is formed on the insulating film. A metal layer such as a copper foil is attached, and a protective resin that covers the metal layer on the slit is applied to the inside of the slit at a film thickness according to the bending angle of each slit, and the metal layer is etched to form an insulating film. Since the conductor pattern is formed on the upper surface, the fold resistance of the conductor pattern existing on the slit can be improved without complicating the manufacturing process and complicating the work.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor device using a TAB tape carrier according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing a state in which a semiconductor device using the TAB tape carrier of one embodiment is mounted on an LCD panel.

FIG. 3 is a plan view showing a manufacturing process according to an embodiment.

FIG. 4 is a plan view showing a manufacturing process according to an embodiment.

FIG. 5 is a cross-sectional view showing a manufacturing process according to an embodiment.

FIG. 6 is a plan view showing a manufacturing process according to an embodiment.

FIG. 7 is a plan view showing a conventional TAB tape carrier.

FIG. 8 is a cross-sectional view showing a conventional TAB tape carrier.

FIG. 9 is a sectional view showing a semiconductor device using a conventional TAB tape carrier.

FIG. 10 is a partial cross-sectional view showing a mounting state of a semiconductor device using a conventional TAB tape carrier on an LCD panel.

[Explanation of symbols]

 1 Insulating film tape 2 Conductor pattern 2A Inner lead 2B Outer lead for input 2C Outer lead for output 3 Sprocket hole 4 Device hole 5 Outer hole 6, 6A, 6B, 6C Slit 7, 7A, 7B, 7C Protective resin 8 Solder resist 9 Semiconductor element 10 Au bump 11 Potting resin 12 Printed substrate 13 LCD panel 14 Anisotropic conductive film

Front page continuation (72) Inventor Masaomi Kondo 3-1-1 Sukegawa-cho, Hitachi-shi, Ibaraki Hitachi Cable Co., Ltd.

Claims (5)

[Claims] 1. An insulating film having a plurality of slits formed thereon has a conductor pattern formed in a predetermined shape so as to pass over the slits, and at a predetermined angle at the positions of the plurality of slits. In a TAB tape carrier that is used by being folded, a protective resin that covers the back surface of the conductor pattern is provided inside the plurality of slits with a film thickness according to the predetermined angle. Tape carrier. 2. A plurality of slits for bending are formed on an insulating film, a metal layer such as a copper foil is attached on the insulating film having the plurality of slits, and a metal on the slit is provided inside the slit. A protective resin for coating a layer is applied in a film thickness according to a bending angle of each slit, and the metal layer is etched to form a conductor pattern on the upper surface of the insulating film.
Manufacturing method of B tape carrier. 3. The method for manufacturing a TAB tape carrier according to claim 2, wherein the protective resin is applied by a dispenser. 4. The protective resin for coating the surface of the conductor pattern is applied from the upper surface side at the position where the slit is formed after forming the conductor pattern.
TAB tape carrier manufacturing method. 5. The method for manufacturing a TAB tape carrier according to claim 4, wherein the protective resin coating the surface of the conductor pattern has a film thickness according to the bending angle of each slit.