JPH0729629Y2 - Processing equipment by radical reaction - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION The present invention utilizes a radical (free radical) reaction to, for example, a silicon single crystal for manufacturing a semiconductor device, a germanium single crystal, a gallium-arsenic compound,
Alternatively, the present invention relates to a precision cutting device that accurately cuts a relatively thick material such as ceramics or glass that is difficult to cut by a normal mechanical method, and a processing device similar to this.

[0002]

2. Description of the Related Art Conventionally, a dicing processing method using a diamond wheel has been employed for cutting a silicon single crystal or the like. However, when cutting by this method, a plastic working layer remains on the surface and fine cracks are generated, which causes the manufacturing process. This causes a decrease in the yield of the processed wafer.

In order to solve such a problem, a precision processing method utilizing a radical reaction has been proposed (JP-A-1-125829). The precision processing method by this radical reaction is to generate a radical by activating the reaction gas by discharge or laser light excitation in the vicinity of the work piece arranged in the atmosphere of the reaction gas, and generating the radical and the constituent atom of the work piece or The object is processed by radical reaction with molecules.

In the above-mentioned publication, as an example of a processing method, a voltage is applied to a wire electrode wound on a wire supply bobbin while the wire electrode is wound on a wire take-up bobbin to apply a voltage to the wire electrode. A discharge is generated between the cut objects to activate the reaction gas, the reaction gas generates radicals to cause a radical reaction between the radicals and the constituent atoms or molecules of the cut object, and the cut object to the wire electrode. There is disclosed a precision cutting method by a radical reaction in which an object to be cut is cut by relatively moving the wire electrode in a direction traversing the wire electrode.

[0005]

However, if the above-mentioned cutting method using the wire electrode is to be carried out as it is with an ordinary apparatus, the wire electrode transfer system machinery will come into contact with the reaction gas such as chlorine or fluorine, There is a problem such as corrosion depending on the materials of the components that make up the machinery.

The present invention can prevent the corrosion of machinery by a processing gas such as a reaction gas and can reduce the amount of the processing gas used. Further, the members such as the supply nozzle can be accurately installed in a narrow room. An object of the present invention is to provide a processing device by a radical reaction or the like that can be provided well and easily.

[0007]

In order to achieve the above object, the first invention is that a machine room and a processing room are provided side by side, and the machine room is provided with a partition wall between the machine room and the processing room. Machines that move processing equipment such as wire electrodes that are put into the processing chamber from the small holes are provided. Also, in the processing chamber, a supply nozzle that supplies a processing gas such as a reaction gas into the processing chamber and a machine that works for processing. And a suction nozzle for sucking the processing gas to the outside to keep the atmospheric pressure in the processing chamber lower than the atmospheric pressure in the machine chamber, and the second invention is a reference having an external reference surface and an internal reference surface. The member is provided by inserting the internal reference surface into the chamber such as the processing chamber through the insertion hole and by bringing the external reference surface into contact with the reference outer surface of the chamber, and the member such as the supply nozzle is used as the reference of the reference member. It was configured to be supported indoors using the inner surface

[0008]

In the first invention, the suction nozzle keeps the atmospheric pressure in the processing chamber lower than that in the machine chamber.
The processing gas in the processing chamber does not leak from the small holes of the partition wall into the machine chamber, and therefore the machinery in the machine chamber is not corroded by the processing gas. Further, since the processing gas only needs to be supplied to a processing chamber that is relatively small, the amount of processing gas used can be reduced. Further, in the second invention, since the internal reference surface of the reference member is accurately positioned by the contact of the external reference surface of the reference member with the reference external surface of the processing chamber or the like, the internal reference surface is utilized. A member such as a supply nozzle can be correctly and easily provided at a predetermined position in a narrow processing chamber or the like.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The attached drawings show an embodiment of a processing apparatus for radical reaction according to the present invention. In these drawings, reference numeral 1 is a frame, which has machine rooms Ca and Cc and a processing room Cb. The two machine chambers Ca and Cc are arranged side by side on the left and right of the machining chamber Cb, and in FIG. 1 and FIG. 2, the machine chamber Ca on the left side is provided with a supply mechanism 2 of a wire electrode (machining equipment) W and a machining center. A cutting mechanism 3 is provided in the chamber Cb, and a wire electrode W take-up mechanism 4 is provided in the right machine chamber Cc.

The wire electrode W supply mechanism 2 mainly includes a wire supply bobbin 5 around which the wire electrode W is wound, a dancer roller 6, a brake drum 7, and a positioning roller 8. The wire electrode W of the wire supply bobbin 5 is wound around the dancer roller 6, the brake drum 7, the external roller 10 and the brake drum 7 in this order, and the positioning roller 8
Be drawn to. The wire supply bobbin 5 is detachably attached to the rotary shaft 12 of the anti-phase brake motor 11, and resistance is applied by the anti-phase brake motor 11 to the rotation when the wire electrode W is drawn and supplied.

The dancer roller 6 is attached to the rotary arm 14 of the encoder 13. The encoder 13
The tension of the wire electrode W between the wire supply bobbin 5 and the brake drum 7 is detected from the rotation angle of the rotation arm 14, and the detection signal is output to the antiphase brake motor 11. The antiphase brake motor 11 changes the braking force according to the detection signal of the encoder 13 to keep the tension of the wire electrode W between the wire supply bobbin 5 and the brake drum 7 constant. An electromagnetic brake 15 (FIG. 2) is attached to the brake drum 7 and applies a resistance to the rotation of the brake drum 7.

The cutting mechanism 3 includes a pair of front and rear (left and right in FIG. 1) guide rollers 16, 17, 18, 19 and a power feeding brush 21, which is disposed between the guide rollers 16, 17, 18, 19. 22 and a reaction gas (processing gas) supply nozzle 23
And a holding plate 25 that holds the object to be cut 24. In the processing chamber Cb, a base 26 is fixedly provided to a reference member 27 which is inserted into the bottom plate 1a from below. An upper and lower member 29 (FIG. 3) is attached to the vertical plate 28 of the base 26 so as to be vertically adjustable by an adjusting screw 30, and a horizontal moving member 31 is attached to the upper and lower member 29 by an adjusting screw 32. , Guide rollers 16, 17, 18,
It is attached so that it can be adjusted in the horizontal direction (direction perpendicular to the paper surface in FIG. 1) orthogonal to the arrangement direction of the nineteen. Each guide roller 16, 17, 18, 19 has a guide groove on the outer peripheral surface.
The reference member 27 will be described later.

Guide rollers 16, 17, 1 of the cutting mechanism 3
Reference numerals 8 and 19 are attached to the lateral movement member 31, and the wire electrode W fed into the processing chamber Cb from the positioning roller 8 of the supply mechanism 2 through the small holes of the seal mechanism 34 provided in the partition wall 1b is horizontally leveled. It guides and sends out to the machine room Cc through the small hole of the seal mechanism 35 provided in the other partition wall 1c. Further, each of the power feeding brushes 21 and 22 is fixed to a swing member 37 swingably attached to the vertical plate 28, and contacts the wire electrode W in the middle of the guide rollers 16 and 17 and the guide rollers 18 and 19. There is. The oscillating member 37 is moved by the brush oscillating motor 38 together with the power feeding brushes 21 and 22 in the horizontal direction intersecting the wire electrode W.
The attachment member 36 is adjustable in the length direction of the wire electrode W. The guide rollers 16 and 17 and the power feeding brush 2
The equipment structure such as 1 is the same as that of the guide rollers 18 and 19 and the power feeding brush 22 in FIG.

The reaction gas supply nozzle 23 is a guide roller 1.
It is horizontally attached to the attachment member 36 between the positions 7 and 18. The supply nozzle 23 is formed thinner than the groove width of the cutting groove formed in the object 24 by the radical reaction, and has a slit-shaped ejection port on its side edge (lower edge). The outlet of the supply nozzle 23 is parallel to the wire electrode W between the guide rollers 17 and 18. Further, the supply nozzle 23 is connected to a cylinder (not shown) of a reaction gas such as chlorine or fluorine via a pipe, and ejects the reaction gas from the ejection port to the groove bottom of the cutting groove. The supply nozzle 23 is normally configured to eject the reaction gas uniformly from the ejection port over its entire length, but its specific structure is arbitrary.

Further, the holding plate 25 of the object to be cut 24 is moved up and down by a vertical servomotor 40 and a rod 41.
Supported by. The up / down servo motor 40 moves the object to be cut 24 to the rod 41 and the holding plate 25 as the cutting progresses.
To rise through. Bottom plate 1a with rod 41 penetrated
A bellows 42 is provided in the portion of, and the portion is made airtight.

The wire electrode W take-up mechanism 4 includes guide rollers 43, 44, 45 and 46, a take-up roller 47,
A take-up motor 48 and a pinch roller 49 are main components. The take-up motor 48 rotates the take-up roller 47. The pinch roller 49 is attached to the tip of a lever 51 that is rotatable up and down, and is pressed against the take-up roller 47 by a spring (not shown).

The central wire electrode W is a guide roller 43,
45 and the wire electrodes w on both sides are guide rollers 43,
They are guided by 44 and 46, respectively, and are respectively sandwiched between the take-up roller 47 and the pinch roller 49, and the take-up motor 47 rotates to take up from the wire supply bobbin 5 to the take-up roller 47. To be
A roll cutter 53 is provided below the take-up roller 47. The roll cutter 53 cuts the used wire electrode W drawn by the take-up roller 47 into a predetermined length.

Reference numeral 55 is a suction nozzle. The suction nozzle 55 is provided through the partition walls 1b and 1c with the tip of the suction nozzle 55 disposed below the wire electrode W between the guide rollers 17 and 18, and is attached to a support member 57 that is moved by a horizontal movement stepping motor 56. Has been. The horizontal movement stepping motor 56 operates in synchronization with the up / down servo motor 40, and the suction nozzle 5 is provided at the end of the cutting groove of the object 24 to be lifted by the up / down servo motor 40.
Always make the tips of 5 coincide or approach. Each partition wall 1b, 1c
A bellows 58 is provided between the suction nozzle 55 and the suction nozzle 55.
That part is made airtight.

A vacuum pump (not shown) is connected to the suction nozzle 55. The vacuum pump sucks the reaction products (SiF ₄ , S, C, etc.) generated by the radical reaction and the surplus reaction gas from the groove bottom of the cutting groove via the suction nozzle 55. The suction by the vacuum pump is such that the atmospheric pressure in the central processing chamber Cb is slightly lower than the atmospheric pressures in the left and right machine chambers Ca and Cc, and the reaction gas does not leak outside from the processing chamber Cb. An inspection window 59 is appropriately provided on the outer wall of each chamber Ca, Cb, Cc.

The reference member 27 will be described. As shown in FIG. 4, the reference member 27 has a fixed flange 27a.
And the shaft portion 27b, the external reference surface 27c and the internal reference surface 27d
And are individually formed. The outer reference surface 27c and the inner reference surface 27d are finished and parallel to each other. An insertion hole 1d is formed in the bottom plate 1a of the processing chamber Cb.
The peripheral portion of the insertion hole 1d on the lower surface of the is finished by horizontal processing to form a reference outer surface 1e. The reference member 27 has its shaft portion 27b inserted into the insertion hole 1d from below, and the external reference surface 2
7c is fixed to the bottom plate 1a with bolts 60 in a state of being brought into contact with the reference outer surface 1e of the bottom plate 1a.

As described above, since the reference outer surface 1e is finished horizontally and the outer reference surface 27c and the inner reference surface 27d are parallel to each other, the inner reference surface 27d is machined when the reference member 27 is fixed as described above. It becomes horizontal in the chamber Cb. The base 26 is an internal reference surface 27d of the plurality of reference members 27.
It is placed horizontally on top and fixed to the reference member 27 with bolts or the like. A sealing material 61 such as an O-ring is fitted into the insertion hole 1d to hermetically seal that portion.

In the illustrated embodiment, the supply mechanism 2, the cutting mechanism 3, the take-up mechanism 4 and the like are provided for each of the three sets, and the object 24 to be cut is cut at three points at the same time. The number of sets can be increased or decreased. In addition, the wire feeding bobbin 5, the dancer roller 6, the brake drum 7,
It goes without saying that all the transfer systems of the wire electrodes W such as the seal mechanisms 34 and 35 are insulated. Wire electrode W
Insulation of the transfer system reduces the capacitance as much as possible.
Further, since electromagnetic waves generated in the chamber may cause malfunctions and burnouts of the motors, the motors and the wiring are shielded to prevent electromagnetic waves.

Next, the operation of the processing apparatus having the above-described structure according to the present invention, such as the radical reaction, will be described. The take-up motor 48 is driven to rotate to take the wire electrode W wound around the wire supply bobbin 5 to the take-up roller 47, while supplying the reaction gas from the supply nozzle 23 and feeding brush 21. , 22 to apply a voltage to the wire electrode W and the wire electrode W and the object to be cut 2
A discharge is generated between this and the No. The discharge activates the reaction gas to generate radicals, which radically react with the constituent atoms or molecules of the object to be cut. As a result, a groove is formed in the object to be cut 24, and the object to be cut 24 is cut. At the time of power feeding, the brush swinging motor 38 swings the power feeding brushes 21 and 22 in the horizontal direction intersecting the wire electrode W to prevent local abrasion of the power feeding brushes 21 and 22.

As the cutting of the object to be cut 24 progresses, the up-and-down servo motor 40 is operated to raise the object to be cut 24. Further, the suction nozzle 55 sucks the excess reaction gas at the groove bottom and the reaction product discharged by the gas, and the atmospheric pressure of the central processing chamber Cb is made slightly lower than that of the adjacent machine chambers Ca and Cc. Therefore, the discharge is not stopped by the reaction product, the radical reaction, that is, the cutting is smoothly performed, and the leakage of the reaction gas to the outside is prevented. On this occasion,
The suction nozzle 55 is horizontally moved by the stepping motor 56 in synchronization with the rise of the object to be cut 24 so as to relatively move along the outer peripheral surface of the object to be cut 24.

The supply nozzle 23 is formed thinner than the cutting groove formed by the radical reaction, and the object to be cut 2
As the wire 4 rises, it enters the cutting groove together with the wire electrode W. Therefore, the thickness of the object to be cut 24 is large, and no matter how deep the cutting groove is, the reaction gas can be sufficiently supplied to the groove bottom to continue the cutting process.

By the way, the diameter of a silicon block for semiconductor device manufacture, which is currently cut by dicing with a diamond wheel, is generally 6 to 8 inches, and this size is the limit of application of the conventional method. However, in the above embodiment, because of the wire electrode W,
It is also possible to cut a silicon block having a diameter of 10 inches or more. In addition, when the electrode is fixed with a plate-shaped blade type, there is a risk of heating and melting of the electrode due to the heat of plasma reaction, and the electrode is damaged by the reaction with radicals, and there is a problem with durability. Although the equipment structure is complicated and it is not easy to replace it, the wire electrode W is used in the embodiment shown in the figure, and the wire electrode W is constantly renewed so that the above problem does not occur.

When the wire electrode W is pulled out from the wire supply bobbin 5 and supplied to the cutting mechanism 3, the reverse-phase brake motor 11 and the electrode brake 15 work to operate the wire electrode W.
However, since the encoder 13 controls the anti-phase brake motor 11 by the encoder 13,
Even if the winding diameter of the wire electrode W of the wire supplying bobbin 5 is gradually reduced by the supply of the wire electrode W, the tension does not change.

Note that the wire electrode W is usually 0.05
Wires of various materials with diameters of up to 0.3 mm are used. The supply transfer speed of the wire electrode W is determined in consideration of the strength of the wire electrode W and the like. In order to correspond to various wire electrodes W, the rotation speed of the take-up motor 48, the reverse phase brake motor 11
The braking force of the electrode brake 15 is adjustable. The thickness of the reaction gas supply nozzle 23 is usually 0.1.
It is about 5 to 0.3 mm.

When assembling the supply nozzle 23 and the like in the processing chamber Cb, the lower surface of the bottom plate 1a is finished horizontally after the processing chamber Cb is assembled to form the reference outer surface 1e, and the outer reference surface 27c and the inner reference surface 27d which are parallel to each other. The reference member 2 in which the fixing flange 27a and the shaft portion 27b are individually finished
Produce 7. Then, the shaft portion 27b of the reference member 27 is inserted into the insertion hole 1d from below so as to project into the processing chamber Cb, and the external reference surface 27c of the fixed flange 27a is brought into contact with the reference outer surface 1e of the bottom plate 1a. 27 is fixed to the bottom plate 1a with bolts 60. After that, the base 26 is placed on the internal reference surface 27d of the shaft portion 27b of the reference member 27, the base 26 is fixed to the reference member 27 with bolts, and the supply nozzle 23 and the like are mounted on the base 26.

In this structure, the working chamber Cb is formed narrow in order to reduce the amount of the reaction gas used, and the working chamber Cb is welded or the like at the time of assembling.
Even when it is difficult to remove the strain generated on the inner wall surface of the machine by machining, the members such as the supply nozzle 23 can be accurately and easily provided in the machining chamber Cb. The central processing room C
It can also be applied to the attachment of various members in the outer machine chambers Ca and Cc other than b.

[0031]

As described above, according to the first invention, the machine room and the processing room are arranged side by side, and the machine room is provided with a small hole provided in the partition wall of the machine room and the processing room into the processing room. Machines for moving the processing equipment such as the inserted wire electrode are provided, and in the above processing chamber, a supply nozzle for supplying a processing gas such as a reaction gas into the processing chamber and the processing gas etc. that worked for the processing are externally provided. Since the suction nozzle that sucks out and keeps the atmospheric pressure in the processing chamber lower than the atmospheric pressure in the machine chamber is provided, the processing gas in the processing chamber does not leak into the machine chamber,
It is possible to prevent corrosion of machines such as brake motors, encoders, electromagnetic brakes, and take-up motors provided in the machine room due to processing gas. Further, since the processing gas is supplied only to the processing chamber, the amount of the processing gas used can be suppressed as small as possible.

According to a second aspect of the present invention, a reference member having an external reference surface and an internal reference surface inserts the internal reference surface into a chamber such as a processing chamber through an insertion hole and sets the external reference surface to the reference outer surface of the chamber. Since the member such as the supply nozzle is supported inside the chamber by utilizing the reference inner surface of the reference member, the inner wall surface of the reference member is distorted when the processing chamber is assembled. Even if such a problem occurs, the member such as the supply nozzle can be accurately and easily provided in the room.

[Brief description of drawings]

FIG. 1 is a front sectional view of a processing apparatus for radical reaction or the like according to the present invention.

FIG. 2 is a plan sectional view of the same.

FIG. 3 is an external view showing a relationship between a guide roller and a power supply brush.

FIG. 4 is a cross-sectional view showing how the reference member is attached to the bottom plate of the processing chamber.

[Explanation of symbols]

 1a Bottom plate 1b, 1c Partition wall 1d Insertion hole 1e Reference outer surface 23 Supply nozzle 27 Reference member 27a Fixed flange 27b Shaft part 27c External reference surface 27d Internal reference surface 55 Suction nozzle Ca, Cc Machine room Cb Machining room W Wire electrode

Claims (2)

[Scope of utility model registration request] 1. A machine room and a machining room are installed side by side, and in the machine room, a machine for moving a machining equipment such as a wire electrode inserted into the machining room from a small hole provided in a partition of the machine room and the machining room. Are provided in the processing chamber, and a supply nozzle that supplies a processing gas such as a reaction gas into the processing chamber, and the processing gas that has worked for the processing is sucked out to make the pressure in the processing chamber lower than the pressure in the machine chamber. A processing device by a radical reaction or the like, which is provided with a suction nozzle for keeping the temperature low. 2. A reference member having an external reference surface and an internal reference surface is provided such that the internal reference surface is inserted into a chamber such as a processing chamber through an insertion hole and the external reference surface is brought into contact with a reference external surface of the chamber. And a member such as a supply nozzle for the reference member is supported indoors by utilizing the reference inner surface of the reference member.