JPH07288381A - Pretreatment liquid of through-hole plating using conductive polymer - Google Patents
Pretreatment liquid of through-hole plating using conductive polymerInfo
- Publication number
- JPH07288381A JPH07288381A JP8032294A JP8032294A JPH07288381A JP H07288381 A JPH07288381 A JP H07288381A JP 8032294 A JP8032294 A JP 8032294A JP 8032294 A JP8032294 A JP 8032294A JP H07288381 A JPH07288381 A JP H07288381A
- Authority
- JP
- Japan
- Prior art keywords
- conductive polymer
- hole
- nonionic surfactant
- hole plating
- pretreatment liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、導電性ポリマーを用い
るプリント配線板のスルーホールめっきの前 処理液に関するBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is directed to through-hole plating of printed wiring boards using a conductive polymer. Regarding processing liquid
【0002】[0002]
【従来の技術】絶縁基板のスルーホール内壁に電気めっ
きを施すに際して、予めスルーホール内壁に導電性を付
与する手段として、従来の無電解銅めっきによらず、ド
イツ国特許P3806884,2−34公報に開示され
ているように、酸重合タイプの導電性ポリマーを形成す
る有機モノマーと、溶媒又は可溶化剤、例えばピロール
モノマーとN−メチル−2−ピロリドンを用い、スルー
ホール内壁に導電性ポリマーを形成する方法がある。こ
の導電性ポリマーを用いるスルーホールめっきの前処理
は、特開平4−133393号公報及び特開平4−18
8696号公報に開示されているように、ソフトエッチ
ング工程、コンディショニング工程、過マンガン酸処理
工程、有機モノマー付与工程、酸重合工程で構成され、
スルーホール内壁のガラスエポキシ樹脂上にのみ導電性
ポリマーを形成させ、後のスルーホールの電気めっきを
行うために使用される。この導電性ポリマーを用いるス
ルーホールめっきの前処理液としての、コンディショニ
ングの働きは、被めっき物表面にある加工油、手のあぶ
ら、その他の有機物等の汚れを洗浄し、また親油性であ
る被めっき物の表面を界面活性剤等により親水性とし
て、ぬれ易くし、後に行われる過マンガン酸処理工程で
の二酸化マンガンの生成を促進させることにある。2. Description of the Related Art When electroplating an inner wall of a through-hole of an insulating substrate, as a means for imparting conductivity to the inner wall of the through-hole in advance, it is not the conventional electroless copper plating, but German Patent P3806884,2-34. As disclosed in US Pat. No. 6,033,963, an organic monomer forming an electrically conductive polymer of an acid polymerization type and a solvent or a solubilizer such as a pyrrole monomer and N-methyl-2-pyrrolidone are used to form an electrically conductive polymer on the inner wall of the through hole. There is a method of forming. Pretreatment for through-hole plating using this conductive polymer is disclosed in JP-A-4-133393 and JP-A-4-18.
As disclosed in Japanese Patent No. 8696, it comprises a soft etching step, a conditioning step, a permanganate treatment step, an organic monomer applying step, and an acid polymerization step,
It is used to form a conductive polymer only on the glass epoxy resin on the inner wall of the through hole and perform electroplating of the through hole later. As a pretreatment liquid for through-hole plating using this conductive polymer, the function of conditioning is to clean dirt on the surface of the object to be processed, such as processing oil, oil on the hands, and other organic substances, and to make it lipophilic. The surface of the plated product is made hydrophilic by a surfactant or the like so that it can be easily wetted and the production of manganese dioxide in a permanganate treatment step which will be performed later is promoted.
【0003】[0003]
【発明が解決しようとする課題】特開平4−13339
3号公報及び特開平4−188696号公報に示される
従来の方法では、スルーホール内壁は導電化されるもの
の、特に板厚/穴径の比(以下、アスペクト比とい
う。)の高いスルーホールを有する基板に対しては、充
分な導電性が得られず、時として、めっき不析出やピン
ホールボイド等が発生するという課題があった。スルー
ホールに形成する導電膜の導電性を向上させるには、過
マンガン酸処理工程の処理時間、温度及び濃度を上げる
という方法が考えられるが、この方法は、ランニングコ
ストが上昇するだけでなく、作業上危険であり、又作業
効率が悪くなることからあまり好ましくない。[Patent Document 1] Japanese Patent Application Laid-Open No. 4-13339
According to the conventional methods disclosed in Japanese Patent Laid-Open No. 3 and Japanese Patent Laid-Open No. 4-188696, the inner wall of the through hole is made conductive, but a through hole having a particularly high plate thickness / hole diameter ratio (hereinafter referred to as an aspect ratio) is used. Sufficient conductivity was not obtained with respect to the substrate which it had, and there was a problem that plating non-precipitation, pinhole voids, etc. sometimes occurred. In order to improve the conductivity of the conductive film formed in the through hole, a method of increasing the treatment time, temperature and concentration of the permanganate treatment step can be considered, but this method not only increases the running cost, It is not preferable because it is dangerous in working and working efficiency is deteriorated.
【0004】本発明は、ガラス布上の二酸化マンガンの
生成の促進に優れ、スルーホールに導電性の良好なポリ
マーを形成することを可能にするめっきの前処理液を提
供することを目的とする。It is an object of the present invention to provide a pretreatment solution for plating, which is excellent in promoting the production of manganese dioxide on a glass cloth and which makes it possible to form a polymer having good conductivity in through holes. .
【0005】[0005]
【課題を解決するための手段】本発明の導電性ポリマー
を用いるスルーホールめっきの前処理液は、イミダゾリ
ニウム塩を含有する陽イオン界面活性剤又は、ポリオキ
シエチレン脂肪酸アミドを含有する非イオン界面活性剤
の混合物又は少なくとも一つと、非イオン界面活性剤を
含むアルカリ性又は酸性の水溶液から成ることを特徴と
する。A pretreatment solution for through-hole plating using a conductive polymer of the present invention is a cationic surfactant containing an imidazolinium salt or a nonionic containing a polyoxyethylene fatty acid amide. It is characterized by comprising an alkaline or acidic aqueous solution containing a mixture or at least one of surfactants and a nonionic surfactant.
【0006】イミダゾリニウム塩を含有する陽イオン界
面活性剤としては、一般式The cationic surfactant containing an imidazolinium salt is represented by the general formula
【0007】[0007]
【化4】 (但し、R:アルキル基 R1,R2:アルキル基又はア
ルコールなどX:Cl,Brから選択されるものとす
る。)で示さるものが好ましく、具体的には[Chemical 4] (However, R: alkyl group R 1 , R 2 : alkyl group or alcohol, etc. is selected from X: Cl, Br.) Is preferable.
【0008】[0008]
【化5】 が使用できる。[Chemical 5] Can be used.
【0009】また、ポリオキシエチレン脂肪酸アミドを
含有する非イオン界面活性剤の一般式がFurther, the general formula of the nonionic surfactant containing polyoxyethylene fatty acid amide is
【0010】[0010]
【化6】 (ただし、R;アルキル基,R1,:CnH2n+1NHな
ど)で示されるものが好ましく、具体的には、[Chemical 6] (However, R; alkyl group, R 1 ,: C n H 2n + 1 NH etc.) are preferable, and specifically,
【0011】[0011]
【化7】 が使用できる。[Chemical 7] Can be used.
【0012】また、非イオン界面活性剤としては、H.
L.B.(Hydrophile Lipophile Balance) が1〜16
のものが良く、これらは一般式Further, as the nonionic surfactant, H.
L. B. (Hydrophile Lipophile Balance) is 1-16
Is good, these are general formulas
【0013】[0013]
【化8】 で示されるものが好ましく、具体的には、ポリオキシエ
チレンラウリルエーテル、ポリオキシエチレンセチルエ
ーテル、ポリオキシエチレンオレイルエーテル、ポリオ
キシエチレンオクチルフェニルエーテル、ポリオキシエ
チレンノニルフェニルエーテル等が使用できる。[Chemical 8] Are preferred, and specifically, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether and the like can be used.
【0014】イミダゾリニウム塩を含有する陽イオン界
面活性剤の含有量は、0.1〜10g/l が好ましく、ポ
リオキシエチレン脂肪酸アミドを含有する非イオン界面
活性剤の含有量は、0.1〜10g/lが好ましく、非イ
オン界面活性剤の含有量は、0.1〜50g/lが好まし
く、これらをアルカリ性あるいは酸性の水溶液として使
用する。いずれもこの範囲以下になると、本発明の目的
を達成せず、この範囲を越えると効果の大きさが変わら
ず、経済的でないか、あるいは効果を減殺する場合もあ
る。The content of the cationic surfactant containing the imidazolinium salt is preferably 0.1 to 10 g / l, and the content of the nonionic surfactant containing the polyoxyethylene fatty acid amide is 0. 1 to 10 g / l is preferable, and the content of the nonionic surfactant is preferably 0.1 to 50 g / l, and these are used as an alkaline or acidic aqueous solution. If both are below this range, the object of the present invention is not achieved, and above this range, the magnitude of the effect does not change, which is not economical or the effect may be diminished.
【0015】[0015]
【作用】本発明のめっきの前処理液は、イミダゾリニウ
ム塩を含有する陽イオン界面活性剤又は、ポリオキシエ
チレン脂肪酸アミドを含有する非イオン界面活性剤の混
合物又は少なくとも一つにより、積層板の基材であるガ
ラス布表面に単分子膜を形成し、後に行われる過マンガ
ン酸工程によって酸化され易くなり、二酸化マンガンの
生成が容易となる。また、非イオン界面活性剤は、被め
っき物のぬれ性を向上させることができ、これらの相互
作用により優れた効果が生じるものと考えられる。The pretreatment liquid for plating of the present invention comprises a laminate containing a cation surfactant containing an imidazolinium salt or a nonionic surfactant containing a polyoxyethylene fatty acid amide, or at least one of them. A monomolecular film is formed on the surface of the glass cloth, which is the base material, and is easily oxidized by a permanganic acid step that is performed later, and manganese dioxide is easily generated. Further, it is considered that the nonionic surfactant can improve the wettability of the object to be plated, and an excellent effect is produced by the interaction thereof.
【0016】[0016]
実施例1 ガラス布を1−ヒドロキシ・エチル2−アルキル(硬化
牛脂)、イミダゾリン4級塩であるニッサンカチオンA
R−4(日本油脂株式会社製、商品名)2g/lと、ポリ
オキシエチレンオクチルフェニルエーテルであるHS−
210(日本油脂株式会社製、商品名)1g/lを含むp
H10のアルカリ性水溶液の前処理液で60℃、5分処
理した。次いで過マンガン酸カリウム60g/lから成る
水溶液で90℃、5分処理し、ガラス布上に生成された
二酸化マンガンを測定した。二酸化マンガンの生成量が
多いほど、導電性ポリマーの導電性が良好であることが
わかっており、効果を二酸化マンガンの生成量で判定し
た。Example 1 A glass cloth was coated with 1-hydroxyethyl 2-alkyl (hardened beef tallow), a imidazoline quaternary salt, Nissan Cation A.
R-4 (Nippon Oil & Fats Co., Ltd., trade name) 2 g / l and polyoxyethylene octyl phenyl ether HS-
210 (Nippon Yushi Co., Ltd., trade name) p containing 1 g / l
It was treated with a pretreatment solution of an alkaline aqueous solution of H10 at 60 ° C. for 5 minutes. Then, it was treated with an aqueous solution containing 60 g / l of potassium permanganate at 90 ° C. for 5 minutes, and the amount of manganese dioxide produced on the glass cloth was measured. It was found that the larger the amount of manganese dioxide produced, the better the conductivity of the conductive polymer, and the effect was judged by the amount of manganese dioxide produced.
【0017】実施例2 ガラス布をポリオキシエチレンポリアルキレンポリアミ
ン脂肪酸アミドであるラボスク9009(東邦化学工業
株式会社製、商品名)1g/lと、ポリオキシエチレンオ
クチルフェニルエーテルHS−210(日本油脂株式会
社製、商品名)10g/lを含むpH3の酸性水溶液の前
処理で60℃、5分処理した。次いで実施例1と同様の
処理を行い、ガラス布上の二酸化マンガンを測定した。Example 2 Glass cloth was polyoxyethylene polyalkylene polyamine fatty acid amide Labosk 9009 (trade name, manufactured by Toho Chemical Industry Co., Ltd.) 1 g / l, and polyoxyethylene octyl phenyl ether HS-210 (NOF CORPORATION) The product was treated at 60 ° C. for 5 minutes by pretreatment with an acidic aqueous solution of pH 3 containing 10 g / l manufactured by the company. Then, the same treatment as in Example 1 was performed to measure the manganese dioxide on the glass cloth.
【0018】実施例3 ガラス布をポリアルキレンポリアミンアルキルアミドイ
ミダゾリン酢酸塩であるソフノンGW−18(東邦化学
工業株式会社製、商品名)5g/lと、ポリオキシエチレ
ンノニルフェニルエーテルであるHS−220(日本油
脂株式会社製、商品名)5g/lを含むpH10のアルカ
リ性水溶液で60℃、5分処理した。次いで実施例1と
同様の処理を行い、ガラス布上の二酸化マンガンを測定
した。Example 3 A glass cloth of polyalkylene polyamine alkyl amide imidazoline acetate Sofnon GW-18 (manufactured by Toho Chemical Industry Co., Ltd., trade name) 5 g / l and polyoxyethylene nonyl phenyl ether HS-220 were used. (Nippon Yushi Co., Ltd., trade name) It was treated at 60 ° C. for 5 minutes with an alkaline aqueous solution containing 5 g / l at pH 10. Then, the same treatment as in Example 1 was performed to measure the manganese dioxide on the glass cloth.
【0019】比較例1 上記実施例の組成を含まない界面活性剤ブラソリットD
NS2パート1(ブラスバーグ社製、商品名)15ml/l
と、界面活性剤ブラソリットDMS2パート2(ブラス
バーグ社製、商品名)30ml/lで60℃、5分処理し
た。次いで実施例1と同様の処理を行い、ガラス布上の
二酸化マンガンを測定した。Comparative Example 1 Surfactant Brasolit D without the composition of the above example
NS2 Part 1 (Brasberg, trade name) 15 ml / l
Then, it was treated with the surfactant Brasolit DMS2 Part 2 (manufactured by Brasberg Co., trade name) 30 ml / l at 60 ° C. for 5 minutes. Then, the same treatment as in Example 1 was performed to measure the manganese dioxide on the glass cloth.
【0020】実施例1〜3と比較例1の結果を表1に示
す。The results of Examples 1 to 3 and Comparative Example 1 are shown in Table 1.
【0021】[0021]
【表1】 [Table 1]
【0022】表1に示すように、実施例1〜3の前処理
液で処理したものは、二酸化マンガンの生成量が多く、
優れた導電性を示した。As shown in Table 1, those treated with the pretreatment liquids of Examples 1 to 3 produced a large amount of manganese dioxide,
It showed excellent conductivity.
【0023】[0023]
【発明の効果】以上に説明したように、本発明によっ
て、ガラス布上の二酸化マンガンの生成量を増加させる
ことができ、スルーホール内壁に形成する導電性ポリマ
ーの導電性を向上させることができ、高アスペクト比の
基板に対しても充分な導電性が得られ、めっき不析出や
ピンホールボイドの発生を抑制できる導電性ポリマーを
用いるスルーホールめっき前処理液を提供することがで
きる。As described above, according to the present invention, the production amount of manganese dioxide on the glass cloth can be increased and the conductivity of the conductive polymer formed on the inner wall of the through hole can be improved. It is possible to provide a through-hole plating pretreatment liquid using a conductive polymer that can obtain sufficient conductivity even for a substrate having a high aspect ratio and can suppress the non-precipitation of plating and the generation of pinhole voids.
Claims (2)
面活性剤、又は、ポリオキシエチレン脂肪酸アミドを含
有する非イオン界面活性剤の混合物、又は、少なくとも
一つと、非イオン界面活性剤を含むアルカリ性又は酸性
の水溶液から成ることを特徴とする導電性ポリマーを用
いるスルーホールめっきの前処理液。1. A cationic surfactant containing an imidazolinium salt or a mixture of nonionic surfactants containing a polyoxyethylene fatty acid amide, or at least one and an alkaline containing a nonionic surfactant. Alternatively, a pretreatment solution for through-hole plating using a conductive polymer characterized by comprising an acidic aqueous solution.
面活性剤が、一般式 【化1】 (但し、R:アルキル基 H R1,R2:アルキル基又
はアルコールなどX:Cl,Brから選択されるものと
する。)で示され、ポリオキシエチレン脂肪酸アミドを
含有する非イオン界面活性剤が、一般式 【化2】(但し、R:アルキル基、R1:CnH2n+1NH
など)で示され、非イオン界面活性剤が、一般式 【化3】RO(CH3CH2O)nH (ただし、R;−CnH2n+1,CnH2n+1−)で示される
ことを特徴とする請求項1に記載の導電性ポリマーを用
いるスルーホールめっき前処理液。2. A cationic surfactant containing an imidazolinium salt is represented by the general formula: (Provided that R is an alkyl group H R 1 , R 2 : an alkyl group or alcohol such as X: Cl, Br, etc.) and contains a polyoxyethylene fatty acid amide. Is represented by the general formula: (wherein R is an alkyl group, R 1 : C n H 2n + 1 NH
Etc.) and the nonionic surfactant is represented by the general formula: RO (CH 3 CH 2 O) n H (provided that R; -C n H 2n + 1 , C n H 2n + 1- ). The pretreatment liquid for through-hole plating using the conductive polymer according to claim 1, wherein
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8032294A JPH07288381A (en) | 1994-04-19 | 1994-04-19 | Pretreatment liquid of through-hole plating using conductive polymer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8032294A JPH07288381A (en) | 1994-04-19 | 1994-04-19 | Pretreatment liquid of through-hole plating using conductive polymer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07288381A true JPH07288381A (en) | 1995-10-31 |
Family
ID=13715030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8032294A Pending JPH07288381A (en) | 1994-04-19 | 1994-04-19 | Pretreatment liquid of through-hole plating using conductive polymer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07288381A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10212593A (en) * | 1997-01-27 | 1998-08-11 | Merutetsukusu Kk | Precleaning agent for plating |
JP2014091858A (en) * | 2012-11-05 | 2014-05-19 | Hitachi Chemical Co Ltd | Pretreatment agent for electroless plating and production method thereof |
-
1994
- 1994-04-19 JP JP8032294A patent/JPH07288381A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10212593A (en) * | 1997-01-27 | 1998-08-11 | Merutetsukusu Kk | Precleaning agent for plating |
JP2014091858A (en) * | 2012-11-05 | 2014-05-19 | Hitachi Chemical Co Ltd | Pretreatment agent for electroless plating and production method thereof |
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