JPH07285191A - Gas barrier packaging material - Google Patents

Abstract

PURPOSE:To obtain a gas barrier packaging material keeping high transparency and gas barrier properties even when heated by retort treatment or an electronic oven and suitable for the long-term preservation of food. CONSTITUTION:At least one surface of a base material film layer composed of polyester or the like is coated with an inorg. layer having transparency composed of silicon oxide and a barrier resin coating layer containing a vinylidene chloride type copolymer. The surface of the barrier resin coating layer or the other surface of the base material film layer is coated with a heat seal layer to obtain a gas barrier packaging material. The thickness n1 of the inorg. layer is 0.01-0.5mum and the thickness n2 of the barrier resin coating layer is 0.05-15mum and the thickness ratio n2/n1 is 0.1-1500.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas barrier packaging material which is transparent and has an excellent gas barrier property against water vapor, oxygen, etc. and which is suitable for retort treatment and microwave heating.

[0002]

2. Description of the Related Art In recent years, with the spread of microwave ovens, cooked or semi-cooked foods (hereinafter collectively referred to as cooked foods)
However, it is heated in a microwave oven as it is packaged and served before meals. Further, the cooked food is often retorted after packaging. Such packaging materials need to withstand retort processing and microwave heating. In addition, in order to prevent the deterioration of the quality of food, it is required to have a high gas barrier property against water vapor, oxygen, etc. and high transparency for visually recognizing the contents.

As the packaging material as described above, for example, a composite film obtained by laminating a vinylidene chloride polymer film having a gas barrier property or a film coated with a vinylidene chloride polymer, and an unstretched polypropylene film having a heat sealing property. Is proposed.

A packaging material using a vinylidene chloride polymer is transparent and allows the contents to be seen through, but it still has a low gas barrier property and is not suitable for long-term storage of cooked foods. Moreover, if the thickness of the vinylidene chloride-based polymer layer is increased to improve the gas barrier property, the microwave loss in the film increases when heated in a microwave oven, which not only increases the heating time but also increases the film cost. Becomes higher.
In particular, when exposed to a high temperature (for example, a temperature of 110 ° C. or higher) by retort treatment or microwave heating, the vinylidene chloride-based polymer has a low heat resistance, so that the gas barrier property against water vapor, oxygen gas, etc. is significantly lowered. Therefore, it is not suitable for retort food packaging and food packaging for microwave oven heating. Further, whitening occurs at high temperature and the transparency is lowered, so that the visibility of the contents is lowered.

On the other hand, a film in which a metal vapor-deposited layer such as tin is formed on a base material film such as polyethylene terephthalate and a packaging film in which an aluminum foil and a polypropylene film are laminated have been proposed (Japanese Patent Laid-Open No. 62-62-62). No. 152746, etc.). Although a film having a metal layer laminated thereon has excellent gas barrier properties and is used for packaging retort foods, it does not have transparency and is electrically conductive, so that it cannot be heated by a microwave oven.

Japanese Unexamined Patent Publication No. 1-220435 and Japanese Unexamined Patent Publication No.
JP-A-202436 describes a packaging material for a microwave oven or a packaging material for a retort food, in which a vapor deposition layer of silicon oxide and a heat-sealing layer or a protective layer are formed on the surface of a substrate film. The heat seal layer is composed of a laminate layer of a heat sealable resin film such as polypropylene, and the protective layer is composed of a laminate layer of a film such as ethylene-vinyl alcohol copolymer or a coating layer of a thermosetting resin. Has been done. However, the gas barrier property of the film in which the heat seal layer or the protective layer is formed on the inorganic oxide layer has an oxygen permeability of 1 cc / m ² · 24 h.
r, water vapor transmission rate is only about 1 g / m ² · 24 hr,
The gas barrier property is still insufficient when long-term storage of food is required.

In Japanese Patent Laid-Open No. 4-89236, two or more vapor-deposited layers of silicon oxide are laminated on the surface of a substrate film, and the surface is covered with a protective layer or a heat-sealing layer similar to the above-mentioned prior art. Coated packaging materials have been proposed.
However, the production of such packaging material requires two or more vapor deposition steps. Moreover, since the vapor deposition film is exposed to an atmosphere containing oxygen, it is necessary to return the apparatus to normal pressure and take out the film in each vapor deposition process, which not only complicates the manufacturing process but also increases the cost.

[0008]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a gas barrier packaging material having transparency and excellent gas barrier properties even when the coating layer is thin.

[0009] Another object of the present invention is to
It is an object of the present invention to provide a gas barrier packaging material that can suppress deterioration of transparency and gas barrier properties, and can store contents for a long period of time while suppressing deterioration and deterioration.

Still another object of the present invention is to provide a gas barrier packaging material which can suppress microwave loss during electromagnetic wave heating and is useful for packaging foods and the like which are subjected to electromagnetic wave heating and retort treatment. It is in.

[0011]

The present inventors have conducted various studies in order to achieve the above-mentioned object. As a result, the base film layer has an inorganic layer having transparency and a coating layer containing a barrier resin having a high gas barrier property. The present invention has been completed by discovering that the heat-sealing layer is formed sequentially, and high transparency and gas barrier property can be maintained even when exposed to high temperature by microwave oven heating and retort treatment.

That is, in the gas barrier packaging material of the present invention, at least one surface of the base film layer (1) is covered with the barrier resin coating layer (3) via the transparent inorganic layer (2). In addition to being covered, this barrier resin coating layer (3) is covered with a heat seal layer (4). In the gas barrier packaging material, one surface of the base film layer (1) is covered with a barrier resin coating layer (3) through an inorganic layer (2) having transparency, and the base material is also used. The other surface of the film layer (1) may be covered with the heat seal layer (4).

In the present specification, the "barrier resin coating layer" means that the thickness is 2 μm and the temperature is 25
Oxygen gas permeability of 20 cc / m ² at 24 ° C for 24 hours or less, water vapor permeability of 20 g / m ² at 40 ° C and 90% relative humidity
-It means a layer containing a barrier resin for 24 hours or less. Further, the “heat seal layer” means a layer that can be thermally bonded by a method such as impulse sealing, high frequency bonding, ultrasonic bonding, or the like, without being limited to thermal bonding by a heat sealer.

As the polymer constituting the base film layer (1), various polymers capable of forming a film, for example, polyethylene, ethylene-ethyl acrylate copolymer, ionomer, polypropylene, ethylene-propylene copolymer, poly Polyolefin such as -4-methylpentene-1; polyethylene terephthalate, polyethylene-2,
Polyesters such as 6-naphthalate and polybutylene terephthalate; nylon 6, nylon 11, nylon 1
2, nylon 66, nylon 610, nylon 6/6
6, polyamide such as nylon 66/610; aromatic polyamide; polyvinyl chloride; polyvinylidene chloride, vinylidene chloride-vinyl chloride copolymer, vinylidene chloride-acrylonitrile copolymer, vinylidene chloride- (meth) acrylic acid ester copolymer Vinylidene chloride resins such as polymer; polystyrene, styrene polymers such as styrene-acrylonitrile copolymer, styrene-acrylonitrile-butadiene copolymer; vinyl alcohol polymers such as polyvinyl alcohol, ethylene-vinyl alcohol copolymer; polyamideimide Polyimide; Polyetherimide; Polycarbonate; Polysulfone; Polyethersulfone; Polyetheretherketone; Polyarylate; Polyphenylene sulfide; Polyphenylene oxide; Poly Laxylene; Polyacrylonitrile; Fluorine resins such as polytetrafluoroethylene, polytrifluorochloroethylene, fluorinated ethylene-propylene copolymers; Cellulosic polymers such as cellophane; Hydrochloric acid rubber; Copolymers containing the components of the various polymers An example is a combination. These polymers may be used alone or in combination of two or more.

The light transmittance of the substrate film layer can be appropriately selected, but for the visibility and aesthetics of the package contents, the total light transmittance for white light rays is usually 40% or more, preferably. It is desirable that it is 60% or more, and more preferably 80% or more.

The base film layer (1) is composed of an olefin polymer (especially polypropylene), polyester (especially polyethylene terephthalate), polyamide, styrene polymer, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile, etc. Preferably.

The above-mentioned polymer can be selected according to the use of the packaging material. For the packaging material for foods for retort treatment or electromagnetic wave heating, a polymer having high transparency, mechanical strength and suitability for packaging, such as polypropylene, is used. , Polyester, nylon (polyamide), ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile and the like are preferable. Particularly preferred base film layer (1)
Examples of the polymer constituting the above include polyester and polyamide.

The substrate film layer may be a single layer film or a laminated film in which two or more kinds of polymer layers are laminated. The thickness of the base film layer is not particularly limited and is appropriately selected in consideration of packaging suitability, mechanical strength, flexibility and the like. The thickness is usually 3 to 200 μm, preferably 5 to 100 μm.

The base film layer can be formed by a conventional film forming method, for example, a melt forming method such as an inflation method or a T die method, or a casting method using a solution. Further, the base film layer may be unstretched,
It may be uniaxially or biaxially stretched. As the stretching method, for example, a conventional stretching method such as roll stretching, rolling stretching, belt stretching, tenter stretching, tube stretching, or a combination of these can be applied. The draw ratio can be appropriately set according to the desired characteristics of the film, and is, for example, 1.5 to 20 times in at least one direction, preferably 2 to
It is about 15 times.

At least one surface of the base film layer is
It may be surface-treated. Examples of the surface treatment include corona discharge treatment, plasma treatment, glow discharge treatment, reverse sputtering treatment, flame treatment, chromic acid treatment, solvent treatment and surface roughening treatment. In addition, when the inorganic layer and the barrier resin coating layer are formed on the surface-treated surface of the base film layer, the adhesion can be improved.

An undercoat layer may be formed on the surface of the base film layer instead of or together with the surface treatment. The undercoat layer can be composed of various resins such as thermoplastic resins, thermosetting resins, light curable resins (electron beam curable resins, ultraviolet curable resins, etc.) and coupling agents. Specifically, for example, acrylic resin, vinyl chloride-vinyl acetate copolymer, polyvinyl butyral, polycarbonate, cellulose-based polymer such as nitrocellulose and cellulose acetate, thermoplastic resin such as rosin-modified maleic acid resin; urethane-based resin , Urea resin, melamine resin, urea-melamine resin; thermosetting resin such as epoxy resin, alkyd resin, aminoalkyd resin; epoxy (meth) acrylate, urethane (meth) acrylate, polyester (meth) Photocurable resins such as acrylates; silane coupling agents and the like. These may be used alone or in combination of two or more.

The undercoat layer may contain a colorant such as a general-purpose dye or pigment. The content of the colorant is appropriately selected within a range that does not impair the transparency of the film, and is usually about 1 to 30% by weight based on the resin forming the undercoat layer. The thickness of the undercoat layer is not particularly limited, but is usually about 0.1 to 5 μm.

The method for forming the undercoat layer is not particularly limited, and an organic or aqueous coating agent containing the components of the undercoat layer is commonly used for coating such as roll coating method, gravure coating method, reverse coating method and spray coating method. It is carried out by applying by a method and drying or curing. When a photocurable resin is used, it may be irradiated with an actinic ray.

The main feature of the present invention is that the transparent inorganic layer (2) and the barrier resin coating layer (3) are combined to coat the surface of the base film (1) in a specific order. It is in. With this composite structure, it is possible to obtain a film having excellent gas barrier properties even when the coating layer is thin, while suppressing deterioration of transparency and gas barrier properties under the action of mechanical external force or at high temperatures. This can be considered as follows.

That is, the packaging material of the present invention comprises a transparent inorganic layer (2) and a barrier resin coating layer (3).
Has a high affinity with. Therefore, even if the inorganic layer is a single layer and the coating layer is extremely thin, a high gas barrier property is obtained, and not only the transparency is excellent, but also the flexibility is lowered and the gas barrier property is lowered by an external force. No peeling or defects are generated. In addition, the combination of the inorganic layer and the barrier resin coating layer, even when exposed to high temperatures such as retort treatment and electromagnetic wave heating, for example, oxygen permeability 0.5cc / m ² · 24hr or less, water vapor permeability 1.0g A high gas barrier property of not more than / m ² · 24 hr can be maintained. Moreover, the barrier resin coating layer can be easily formed by a simple operation of applying the coating liquid. Further, the microwave loss during electromagnetic wave heating of a microwave oven is small, and whitening does not occur even at high temperatures such as retort treatment. Therefore, the packaging material of the present invention can maintain excellent gas barrier properties for a long period of time while suppressing deterioration of transparency and gas barrier properties even at high temperatures.

The inorganic material constituting the inorganic layer (2) is not particularly limited as long as it is an inorganic material capable of forming a transparent thin film. For example, beryllium, magnesium, calcium, strontium, barium and other elements of Group 2A of the periodic table; Titanium, zirconium, ruthenium, hafnium,
Periodic table transition elements such as tantalum; Periodic table 2B such as zinc
Group elements: Periodic table 3B group elements such as aluminum, gallium, indium, and thallium; Periodic table 4B group elements such as silicon, germanium, tin; Periodic table 6B group elements such as selenium and tellurium; Inorganic compounds such as oxides, halides, carbides, nitrides and the like can be mentioned. These can be used alone or in combination of two or more.

Preferred inorganic substances include, for example, elements of Group 2A of the periodic table such as magnesium, calcium, barium; elements of the periodic table such as titanium, zirconium, tantalum, ruthenium; elements of Group 2B of the periodic table such as zinc; aluminum, indium, etc. Periodic table group 3B elements such as thallium; periodic table group 4B elements such as silicon and tin; periodic table group 6B group elements such as selenium; and oxides containing these.

Among them, oxides containing the above elements (for example,
Tin oxide, indium oxide, or their composite oxides, silicon oxides, etc.) are preferable because of their excellent transparency and gas barrier properties. In particular, silicon oxide, in addition to the above-mentioned characteristics, can form a dense thin film, has a high affinity with the polymer forming the barrier resin coating layer, and even if a mechanical external force acts, cracks or cracks are generated in the inorganic layer. No defects are generated, and high gas barrier properties can be maintained for a long period of time even at high temperatures.
The silicon oxide includes not only silicon monoxide and silicon dioxide but also silicon oxide represented by the composition formula SiOx (wherein 0 <x≤2).

Among these inorganic substances, in the electromagnetic wave heating packaging material, inorganic compounds having a low electric conductivity, for example, non-conductive inorganic substances such as oxides, halides, carbides and nitrides can be used. Preferred non-conductive inorganic materials include oxides such as silicon oxide.

The thickness of the inorganic layer is usually 100 to 500.
0 Å (0.01-0.5 μm), preferably 300-1500 Å (0.03-
0.15 μm). 100 thickness
If it is less than angstrom, sufficient gas barrier property cannot be obtained, and if it exceeds 5,000 angstrom, the barrier property is not improved so much, which is economically disadvantageous.

The barrier resin coating layer is a resin having a high gas barrier property as described above, for example, vinylidene chloride copolymer, ethylene-vinyl alcohol copolymer,
Polyamide polymer, polyvinyl alcohol polymer,
It contains polyacrylonitrile polymer, urethane polymer and the like. The barrier resin of the gas barrier resin coating layer does not include resins that do not exhibit the above gas barrier properties, such as general urethane polymers. These barrier resins can be used alone or in combination of two or more.

Preferred barrier resins include, for example, vinylidene chloride copolymers and ethylene-vinyl alcohol copolymers. The vinylidene chloride-based copolymer is a copolymer of vinylidene chloride and another polymerizable monomer, and as such a polymerizable monomer, for example,
Various acrylates such as vinyl chloride, vinyl acetate, crotonic acid, acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, butyl acrylate, isobutyl acrylate, tert-butyl acrylate, pentyl acrylate, hexyl acrylate, acrylonitrile, methacrylonitrile Examples thereof include methacrylic acid and methacrylate corresponding to the above acrylates. Among these vinylidene chloride-based copolymers, vinylidene chloride-acrylonylolyl copolymer, vinylidene chloride-methacrylic acid copolymer, vinylidene chloride-acrylate copolymer, vinylidene chloride-methacrylate copolymer, vinylidene chloride-
Vinyl acetate copolymer and the like are preferable. The vinylidene chloride content in the vinylidene chloride-based copolymer is usually 85 to
It is about 99% by weight, preferably about 90 to 97% by weight.
Since such a vinylidene chloride-based copolymer has a high vinylidene chloride content, it is possible to maintain high transparency and gas barrier properties even when heat-treated.

The ethylene-vinyl alcohol copolymer is preferably a solvent-soluble ethylene-vinyl alcohol copolymer. In such an ethylene-vinyl alcohol copolymer, the ethylene content is usually 5 to 50 mol%, preferably 10 to 45 mol%, more preferably 2%.
It is about 5 to 35 mol%, and the molecular weight is usually 10,000 to 1
0,000, preferably about 40,000 to 50,000, saponification degree 99.5%
The above is desirable. Such a solvent-soluble ethylene-vinyl alcohol copolymer is soluble in water or a mixed solvent of water and alcohol and can form a thin film by coating.

The barrier resin coating layer is formed of the above-mentioned barrier resin (preferably vinylidene chloride copolymer and ethylene-vinyl alcohol copolymer) depending on desired gas barrier properties (oxygen, water vapor, carbon dioxide, etc.). It may contain at least one resin and may contain a plurality of resins. Further, the barrier resin coating layer may be composed of a plurality of layers containing a barrier resin. For example, the barrier resin coating layer may be composed of a plurality of layers including a layer containing a vinylidene chloride copolymer and a layer containing an ethylene-vinyl alcohol copolymer. The content of the barrier resin in the barrier resin coating layer is 50% by weight or more, preferably 75 to 100% by weight, more preferably 90 to 100%.
It is about% by weight.

The thickness of the barrier resin coating layer is appropriately selected within a range that does not impair the characteristics of the film, but is usually 0.05 to 15 μm, preferably 0.1 to 10 μm.
m, more preferably about 0.25 to 5 μm. If the thickness is 0.05 μm or less, sufficient gas barrier properties cannot be obtained, and if it exceeds 15 μm, the gas barrier properties are not so improved, which is economically disadvantageous and the loss of microwaves during heating of electromagnetic waves tends to increase. .

In the present invention, the thickness ratio of the inorganic layer (2) and the barrier resin coating layer (3) can be set appropriately, but the thickness ratio affects the gas barrier property. Therefore, in order to obtain high gas barrier properties and resistance, the ratio n2 (μm) of the thickness of the barrier resin coating layer to the thickness n1 (μm) of the inorganic layer is n.
2 / n1 is usually 0.1 to 1500, preferably
It is desirable to be 0.5 to 60, more preferably about 2 to 50. When the thickness ratio is out of the above range, it becomes difficult to obtain sufficient gas barrier properties, and when the ratio is less than 0.1, defects are likely to occur in the inorganic layer, and even if it exceeds 1500, the gas barrier properties are not so improved. Not economical.

On the surface of the barrier resin coating layer,
If necessary, a conventional surface treatment as exemplified in the base film layer may be applied.

In order to form the bag easily, the barrier resin coating layer (3) is covered with a heat seal layer (4). The heat seal layer (4) may be formed on the other surface of the base film layer (1). In this case, at least one surface of the substrate film (1) is covered with at least the inorganic layer (2) and the barrier resin coating layer (3).
It may be covered with.

As the polymer constituting the heat seal layer, a heat-bonding polymer such as an olefin polymer, vinyl acetate-vinyl chloride copolymer, polyester,
Examples thereof include polyamides and rubber polymers. These heat-bondable polymers can be used alone or in combination of two or more.

Examples of the heat-bonding olefin polymer include polyethylene such as low density polyethylene and linear low density polyethylene, ethylene-butene-1 copolymer, ethylene- (4-methylpentene-1) copolymer. , Ethylene-hexene-1 copolymer, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylate copolymer, ionomer, polypropylene, propylene-butene-1 copolymer Examples thereof include polymers, ethylene-propylene copolymers, ethylene-propylene-butene-1 copolymers, ethylene-propylene-diene copolymers, and modified polyolefins such as maleic anhydride modified polyethylene and maleic anhydride polypropylene. Preferred olefin-based polymers include ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, amorphous polyolefin (for example, amorphous polypropylene). When forming the heat-sealing layer by laminating, a preferable heat-bonding film includes an unstretched polypropylene film.

The heat-bondable polyester is a polyester containing one component of an aliphatic diol or an aliphatic dicarboxylic acid as a constituent unit, particularly an aliphatic polyester containing an aliphatic diol and an aliphatic dicarboxylic acid as a constituent component. included. Preferred heat-bondable polyesters often contain units of saturated aliphatic carboxylic acids. Examples of the aliphatic diol component include ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,6. -Hexanediol, polymethylene glycol, etc. are included, and examples of the aliphatic dicarboxylic acid component include unsaturated aliphatic dicarboxylic acids such as maleic acid and fumaric acid, succinic anhydride, adipic acid, azelaic acid, sebacic acid, suberin. Examples thereof include acids and saturated aliphatic dicarboxylic acids such as dodecanoic acid.

Examples of the heat-bondable polyamide include nylon 6, nylon 11, nylon 12, nylon 1
3, nylon 610, nylon 612, nylon 616
Etc., and copolymer nylon using these nylon raw materials (for example, nylon 6/12). Preferred polyamides include nylon 11, nylon 12,
Nylon 6/12 etc. are included.

Examples of the rubber type polymer include butyl rubber, isobutylene rubber, chloroprene rubber and styrene-
Acrylonitrile copolymers, styrene-butadiene copolymers, styrene-acrylonitrile-butadiene copolymers, etc. are included.

Preferred heat seal layer polymers include olefin polymers, vinyl acetate-vinyl chloride copolymers, polyesters, polyamides and the like.

The thickness of the heat-sealing layer can be appropriately selected in the range of, for example, about 3 to 100 μm according to the use of the packaging material, and when the heat-sealing layer is formed by laminating films, the thickness is, for example, 20. ˜100 μm, preferably about 30 to 80 μm.

The heat seal layer may be formed on a predetermined portion of the surface of the barrier resin coating layer, for example, a portion to be subjected to heat sealing, but it is often formed on the entire surface of the barrier resin coating layer. . Further, the heat seal layer may be formed on the heat seal site or the whole of the other surface of the base film layer as described above.

The base film layer contains various additives,
For example, stabilizers such as antioxidants, ultraviolet absorbers and heat stabilizers; antistatic agents such as cationic, anionic, nonionic and amphoteric antistatic agents; crystal nucleus growth agents; styrene resins, terpene resins, Petroleum resins, dicyclopentadiene resins, coumarone resins such as coumarone indene resins, phenolic resins, hydrocarbon polymers such as rosin and its derivatives and hydrogenated resins thereof; plasticizers; fillers; higher fatty acid amides, higher fatty acids And its salts, higher fatty acid esters, natural waxes such as mineral-based and plant-based waxes, waxes such as synthetic waxes such as polyethylene; silica-based fine powders, inorganic lubricants such as alumina-based powders, polyethylene-based powders, acrylic-based powders Fine powdered lubricants such as organic lubricants; colorants and the like may be contained.

The barrier resin coating layer may be formed of another polymer such as ethylene-vinyl acetate copolymer,
Olefin-based polymers such as ethylene-ethyl acrylate copolymers; acrylic-based polymers; styrene-based polymers; polyesters; polyacetals; polyvinyl acetate;
Polyvinyl chloride; vinyl chloride-vinyl acetate copolymer; polyamide; urethane-based polymer; acrylonitrile-based polymer; polycarbonate; chlorinated polyolefin; cellulose-based polymer and the like may be contained.

The barrier resin coating layer and the heat-sealing layer may contain the above-mentioned additives, if necessary, and the barrier resin coating layer improves the adhesion of anti-blocking agents; polyethyleneimine, polyisocyanate and the like. The agent may be included.

The packaging material of the present invention comprises a transparent inorganic layer (2), a barrier resin coating layer (3) and a heat seal layer (4) on at least one surface of the base film layer (1). Or by sequentially coating one side of the base film layer (1) with the transparent inorganic layer (2) and the barrier resin coating layer (3). ) Can be obtained by a method of coating the other surface of (1) with the heat seal layer (4).

The inorganic layer (2) is formed by a conventional method, for example,
Vacuum deposition method, reactive deposition method, sputtering method, reactive sputtering method, ion plating method, reactive ion plating method, CVD method, plasma CVD method,
It can be formed by coating the surface of the base film layer (1) with the inorganic substance by a laser CVD method or the like.
The inorganic layer can be formed on one side or both sides of the base film layer.

The barrier resin coating layer can be formed by applying a coating liquid containing a barrier resin to the surface of the inorganic layer. The coating liquid can be prepared by selecting an appropriate solvent according to the kind of the barrier resin, and may be in the form of a solution or a dispersion liquid.

For example, the solvent of the solution coating solution containing the vinylidene chloride copolymer can be appropriately selected according to the kind of the vinylidene chloride copolymer, and examples thereof include ketones such as acetone, methyl ethyl ketone and cyclohexanone. Examples include ethers such as dioxane, diethyl ether and tetrahydrofuran; aromatic hydrocarbons such as benzene, toluene and xylene; esters such as ethyl acetate and butyl acetate; amides such as dimethylformamide and mixed solvents thereof. . Further, the dispersion liquid is usually commercially available in the form of an O / W type emulsion.

The coating liquid containing the ethylene-vinyl alcohol copolymer can be usually prepared using a mixed solvent of water and alcohol. Examples of such alcohols include methanol, ethanol, propanol, isopropanol, cyclohexanol and the like.

The above-mentioned coating liquid may contain the above-mentioned various additives, and may further contain conventional additives such as defoaming agents and viscosity modifiers in order to improve the coating property.

The coating method is not particularly limited, and a conventional method such as an air knife coating method, a roll coating method, a gravure coating method, a blade coater method, a dip coating method or a spraying method can be employed. After applying the coating solution, the barrier resin coating layer can be formed by drying at a temperature of, for example, about 50 to 150 ° C.

The heat-sealing layer can be formed by a conventional method such as a dry laminating method, an extrusion laminating method or a coating method depending on the kind of the heat-bonding polymer.

The gas barrier film of the present invention includes various coating layers and laminating layers such as a slipping layer, an antistatic layer, a decorative printing film layer, and a nylon film depending on the type and use of the film. A reinforcing layer or the like may be formed.

The gas barrier packaging material of the present invention has a feature that it exhibits a high gas barrier property as described above even when exposed to a high temperature, and has high transparency. Therefore, the packaging material is
It can be suitably used as various packaging materials such as microwave oven foods, retort foods, frozen foods, microwave sterilization, flavor barriers, pharmaceuticals, precision electronic parts, and balloon forming materials such as balloons. In addition, by packaging food or the like, the contents can be stored for a long period of time while suppressing deterioration and deterioration.

The form of the package using the packaging material of the present invention is not particularly limited, but examples thereof include solid packaging bags such as hamburgers, chouxmais, gyozas, curries, soups, and the like.
It can be used as a packaging bag for liquid materials such as coffee and tea. The packaging bag containing these foods can be subjected to retort treatment or microwave heating as it is. When used as an inner bag of a paper container such as a liquor pack, the contents can be heated by heating in a microwave oven, for example, so-called can can be performed.

As the packaging form of the packaging material of the present invention, containers such as bags, cups, tubes, standing bags, and trays, lid materials, and paper packs such as sake, soy sauce, mirin, oil, milk, juice, etc. A material or the like is exemplified.

[0062]

In the gas barrier packaging material of the present invention, the surface of the base film layer is coated with the transparent inorganic layer and the barrier resin coating layer, so that the transparency is improved even if the coating layer is thin. Also, the gas barrier property is high, and the bag can be easily formed by utilizing the heat seal layer. Moreover, even when exposed to high temperatures, the deterioration of transparency and gas barrier property can be suppressed, and the contents can be stored for a long period of time. Further, microwave loss during electromagnetic wave heating is small, and foods and the like that are subjected to electromagnetic wave heating and retort treatment can be packaged while suppressing deterioration and deterioration of quality.

[0063]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited to these examples.

Example 1 5 × 1 was formed on one surface of a biaxially stretched polyethylene terephthalate film having a thickness of 12 μm by using SiO as an evaporation source.
Under vacuum of 0 ^-5 Torr, the thickness is 100 by vacuum deposition method.
A 0 angstrom deposited layer of silicon oxide was formed.

Vinylidene chloride-based copolymer (Asahi Kasei Kogyo KK, trade name Saran Resin F216) was mixed in a mixed solvent of toluene / tetrahydrofuran = 1/2 (weight ratio) so that the resin concentration became 15% by weight. It melt | dissolved and prepared the barrier resin coating layer coating liquid. This coating liquid was applied to the vapor deposition surface so that the thickness after drying was 1 μm, and then dried to form a barrier resin coating layer.

Further, a polyester adhesive is applied to the surface of the barrier resin coating layer to a thickness of 3 μm,
After drying at 80 ° C. for 20 seconds, the pressure of ² kg / cm ² is applied to 1
An unstretched polypropylene film having a thickness of 40 μm was dry laminated under the condition of 00 ° C. for 1 second to prepare a packaging film.

Example 2 An ethylene-vinyl alcohol copolymer (manufactured by Nippon Synthetic Chemical Industry Co., Ltd., trade name: Soarnol 30L) was dissolved in a mixed solvent of water / isopropanol = 1/1 (weight ratio),
The resin concentration was adjusted to 12% by weight to prepare a coating liquid for a barrier resin coating layer. A packaging film was produced in the same manner as in Example 1 except that the above coating liquid containing an ethylene-vinyl alcohol copolymer was used instead of the coating liquid in Example 1.

Example 3 A biaxially stretched nylon film having a thickness of 20 μm was used as a base film, and one surface of this film was vacuum-deposited under a vacuum of 5 × 10 ⁻⁵ Torr using SiO as an evaporation source. A packaging film was produced in the same manner as in Example 1 except that a silicon oxide vapor deposition layer having a thickness of 600 Å was formed by.

Example 4 On the silicon oxide vapor deposition surface formed in the same manner as in Example 1,
The thickness of the barrier resin coating layer coating solution after drying is 0.
A packaging film was produced in the same manner as in Example 1 except that the coating film was applied so as to have a thickness of 5 μm.

Example 5 A two-component urethane adhesive was applied to the surface of a barrier resin coating layer formed on one surface of a substrate film in the same manner as in Example 1 to a thickness of 2 μm, and the mixture was heated at 80 ° C. After drying for 10 seconds, a packaging film was produced in the same manner as in Example 1 except that a linear low-density polyethylene film having a thickness of 50 μm was dry laminated under a pressure of 2.5 kg / cm ² .

Comparative Example 1 In the same manner as in Example 1, a polyester adhesive was used to dry-laminate an unstretched polypropylene film having a thickness of 40 μm on the surface of the inorganic layer without forming a barrier resin coating layer. A packaging film was created.

Comparative Example 2 Thickness of 12 μm without forming a silicon oxide vapor deposition layer
The coating liquid containing the vinylidene chloride-based copolymer of Example 1 was applied to the polyethylene terephthalate film of Example 1 to form a 5 μm-thick barrier resin coating layer after drying, and then the polyester was prepared in the same manner as in Example 1. An unstretched polypropylene film having a thickness of 40 μm was dry-laminated with a system adhesive to produce a packaging film.

Comparative Example 3 After a 12 μm thick aluminum foil was dry laminated on a 12 μm thick polyethylene terephthalate film, a 40 μm thick unstretched polypropylene film was formed by a polyester adhesive in the same manner as in Example 1. It was dry laminated to produce a packaging film.

Gas barrier property of the obtained packaging film,
The transparency and the suitability for the microwave oven were examined as follows.

Gas barrier property test: oxygen gas permeability is MO
Regarding the CON method and the water vapor transmission rate, the oxygen gas and water vapor transmission rates were measured according to JIS-Z-0208.

Transparency: Visually evaluated before and after retort treatment at 130 ° C. for 20 minutes.

Microwave oven suitability: The packaging films of Examples 1 and 2 and Comparative Examples 1 to 3 were made into bags, and 200 g of meat sauce for spaghetti was packed in each bag and heated in a household microwave oven. The time required for heating in the microwave oven was about 95 seconds for the film of Comparative Example 2, while Example 1,
The films of 2 and Comparative Example 1 were about 75 seconds. In the film of Comparative Example 3, the conductive aluminum foil was sparked and could not be heated by the microwave oven.

The suitability for the microwave oven was comprehensively evaluated based on these results according to the following criteria.

◯: Heating by a microwave oven is possible,
And the time is short. Δ: Heating by a microwave oven is possible, but time is long ×: Heating by a microwave oven is not possible. The obtained results are shown in the table.

[0080]

[Table 1] As is clear from the table, the films of Examples have higher transparency and gas barrier properties than the films of Comparative Examples,
Moreover, these characteristics are not significantly deteriorated by heating.
Thus, the films of the Examples have overall excellent suitability for retort processing and microwave heating.

Claims (6)

[Claims] 1. At least one surface of a base film layer (1) is covered with a barrier resin coating layer (3) through a transparent inorganic layer (2), and the barrier property is also provided. A gas barrier packaging material in which a resin coating layer (3) is covered with a heat seal layer (4). 2. A substrate film layer (1) is covered on one side with a barrier resin coating layer (3) through a transparent inorganic layer (2), and the substrate film is also formed. The other surface of the layer (1) is the heat seal layer (4)
Gas barrier packaging material coated with. 3. The barrier resin coating layer (3) comprises:
The barrier packaging material according to claim 1, which comprises a vinylidene chloride-based copolymer or an ethylene-vinyl alcohol-based copolymer. 4. The gas barrier packaging material according to claim 1, wherein the transparent inorganic layer (2) is composed of silicon oxide. 5. The gas barrier packaging material according to claim 1, wherein the barrier resin coating layer (3) has a thickness of 0.05 to 15 μm. 6. The thickness n of the transparent inorganic layer (2)
The gas barrier packaging material according to claim 1 or 2, wherein the ratio n2 / n1 of the thickness n2 (μm) of the barrier resin coating layer to 1 (μm) is 0.1 to 1500.