JPH07283503A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH07283503A JPH07283503A JP6071171A JP7117194A JPH07283503A JP H07283503 A JPH07283503 A JP H07283503A JP 6071171 A JP6071171 A JP 6071171A JP 7117194 A JP7117194 A JP 7117194A JP H07283503 A JPH07283503 A JP H07283503A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- circuit board
- wiring pattern
- terminal
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、電気接続する回路基
板の配線パターンに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring pattern of a circuit board for electrical connection.
【0002】[0002]
【従来の技術】従来、図14と15に示すように、回路
基板1には配線パターン1bが形成されている。配線パ
ターン1bは、他基板との接続端子1baaが設けられ
ており、他の回路基板と接続される部分以外はポリイミ
ド等の絶縁材1cによって被覆されている。同様に、回
路基板2には、配線パターン2bと、他基板との接続端
子2baが形成されており、他の回路基板と接続される
部分以外は絶縁材2cによって被覆されている。回路基
板1と回路基板2の接続は、接続端子1abと接続端子
2abを接続によって行われる構造が知られていた。2. Description of the Related Art Conventionally, a wiring pattern 1b is formed on a circuit board 1 as shown in FIGS. The wiring pattern 1b is provided with a connection terminal 1baa for connection to another board, and is covered with an insulating material 1c such as polyimide except for a portion connected to another circuit board. Similarly, the circuit board 2 is formed with a wiring pattern 2b and a connection terminal 2ba for connecting to another board, and is covered with an insulating material 2c except for a portion connected to the other circuit board. It has been known that the circuit board 1 and the circuit board 2 are connected by connecting the connection terminals 1ab and 2ab.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来の回路基
板では、下記の課題があった。 図13と14に示す構造では、接続端子1aaと接
続端子2aaの接続部が配線パターン1aと配線パター
ン2aとで回路を形成するので、前記接続部の接続抵抗
の測定が難しかった。 回路基板の位置合わせのずれを検査は、前記接続抵
抗値が得られない為、目視での検査が必要となり、検査
に手間がかっかた。 図13に示す構造では、回路基板が剥がれかかった
ときに、回路基板の配線パターン1bbb、2baから
接続端子の断線が発生するおそれがあった。However, the conventional circuit board has the following problems. In the structures shown in FIGS. 13 and 14, the connection portion of the connection terminal 1aa and the connection terminal 2aa forms a circuit with the wiring pattern 1a and the wiring pattern 2a, so that it is difficult to measure the connection resistance of the connection portion. The inspection of the positional deviation of the circuit board requires visual inspection because the connection resistance value cannot be obtained, and the inspection is troublesome. In the structure shown in FIG. 13, when the circuit board is about to come off, the wiring patterns 1bbb, 2ba of the circuit board may cause disconnection of the connection terminal.
【0004】そこで、この発明の目的は、従来のこのよ
うな課題を解決するため、接続部の接続抵抗の測定を可
能にすることと、回路基板接続の位置ずれ検査性の向上
と、回路接続端子の断線防止にある。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problems of the prior art, to enable the measurement of the connection resistance of the connection portion, to improve the positional deviation inspection property of the circuit board connection, and to connect the circuit connection. It is to prevent disconnection of terminals.
【0005】[0005]
【課題を解決するための手段】上記課題を解決するため
に、この発明は、回路基板において、少なくとも1つの
接続端子を経由して導通している外部から電気的接触可
能な2つ以上の端子を持つようになる配線パターンを有
する構成とした。In order to solve the above-mentioned problems, the present invention provides a circuit board having two or more terminals which are electrically connected to each other and which are electrically connected via at least one connection terminal. The wiring pattern has such a structure.
【0006】そして、外部から電気的接触可能な端子と
接続端子までの配線パターンが他の配線パターンと電気
的に独立している構成とした。そして、外部から電気的
接触可能な端子と導通している接続端子が回路基板の接
続する辺の端に位置する配線パターンを有する構成とし
た。The wiring pattern from the externally electrically contactable terminal to the connection terminal is electrically independent of other wiring patterns. The connection terminal, which is electrically connected to the terminal that can be electrically contacted from the outside, has a wiring pattern located at the end of the side to which the circuit board is connected.
【0007】そして、一方の回路基板の電気的に同一な
接続端子に2つ以上の外部から電気的接触可能な端子と
導通している他の配線パターンと電気的に独立した接続
端子を接続させる配線パターンを有する構成とした。[0007] Then, connecting terminals electrically connected to one and the same electrically connecting terminals of one circuit board are electrically independent of two or more externally electrically connectable terminals and other wiring patterns. The structure has a wiring pattern.
【0008】[0008]
【作用】上記のように構成された回路基板においては、
互いの回路基板の接続により、少なくとも1つの接続端
子を経由して導通している外部から電気的接触可能な2
つ以上の端子を持つ。前記の電気接触可能な端子を用い
ることによって、容易に接続部の抵抗値を測定できる。In the circuit board constructed as described above,
By connecting the circuit boards to each other, which can be electrically contacted from the outside by conducting at least one connecting terminal.
Has one or more terminals. The resistance value of the connection portion can be easily measured by using the above-mentioned electrically contactable terminal.
【0009】また、外部から電気的接触可能な端子と接
続端子までの配線パターンが他の配線パターンと電気的
に独立している構成とすると、前記接続端子の接続抵抗
値のみを測定することができる。また、外部から電気的
接触可能な端子と導通している接続端子が回路基板の接
続する辺の端に位置する配線パターンを有することによ
り、前記配線パターンが他の配線パターンの接続強度を
補強する。Further, if the wiring pattern from the externally electrically connectable terminal to the connection terminal is electrically independent of other wiring patterns, only the connection resistance value of the connection terminal can be measured. it can. In addition, since the connection terminal that is electrically connected to the terminal that can be electrically contacted from the outside has the wiring pattern located at the end of the side where the circuit board is connected, the wiring pattern reinforces the connection strength of other wiring patterns. .
【0010】また、一方の回路基板の電気的に同一な接
続端子に2つ以上の外部から電気的接触可能な端子と導
通している他の配線パターンと電気的に独立した接続端
子を接続させる配線パターンを有することにより、前記
接続部の接続抵抗を測定することができる。Further, the electrically identical connection terminals of one circuit board are electrically connected with the connection terminals electrically independent of the other wiring patterns which are electrically connected to the two or more externally electrically connectable terminals. By having the wiring pattern, the connection resistance of the connection portion can be measured.
【0011】[0011]
【実施例】以下に、この発明の実施例を図面に基づいて
説明する。 (実施例1)図2は、本発明による配線パターンを有す
るフレキシブル基板とプリント回路基板を接続した上面
図であり、図1は図2のA−A’間の断面図である。図
において、1はフレキシブル基板、1aはフレキシブル
基板のベース、1bはベース1aに上に形成された銅箔
配線パターン、1baは接続後に回路を形成する配線パ
ターン、1bbは配線パターンと電気的に独立した配線
パターン、1bbaは外部から電気的接触可能な測定端
子、1baaと1bbbは接続端子、1cはカバーレ
イ、2はプリント基板、2aはセラミック等のベース、
2bはベース2a上に膜付けされたアルミ配線パター
ン、2baは外部から電気的接触可能な測定端子、2b
bは回路基板の接続端子、2cは絶縁膜、3は異方性導
電膜である。Embodiments of the present invention will be described below with reference to the drawings. (Embodiment 1) FIG. 2 is a top view in which a flexible board having a wiring pattern according to the present invention and a printed circuit board are connected, and FIG. 1 is a sectional view taken along the line AA 'in FIG. In the figure, 1 is a flexible substrate, 1a is a base of the flexible substrate, 1b is a copper foil wiring pattern formed on the base 1a, 1ba is a wiring pattern for forming a circuit after connection, 1bb is electrically independent of the wiring pattern. The wiring pattern, 1bba is a measurement terminal that can be electrically contacted from the outside, 1baa and 1bbb are connection terminals, 1c is a coverlay, 2 is a printed circuit board, 2a is a base such as ceramic,
2b is an aluminum wiring pattern film-formed on the base 2a, 2ba is a measurement terminal which can be electrically contacted from the outside, 2b
Reference numeral b is a connection terminal of the circuit board, 2c is an insulating film, and 3 is an anisotropic conductive film.
【0012】フレキシブル基板1は配線パターン1ba
と配線パターン1bbを持ち、配線パターン1baと1
bbは電気的に独立し、配線パターン1baは接続端子
1baaを持ち、配線パターン1bbは測定端子1bb
aと接続端子1bbbを持っている。配線パターン2b
はプリント基板2上に形成され、測定端子2baと接続
端子2bbを持っている。プリント基板2の接続端子2
bbは、異方性導電膜3を用いて、フレキシブル基板1
の接続端子1bba及び1bbbと接続されている。The flexible substrate 1 has a wiring pattern 1ba.
And wiring pattern 1bb, and wiring patterns 1ba and 1ba
bb is electrically independent, the wiring pattern 1ba has a connection terminal 1baa, and the wiring pattern 1bb is a measurement terminal 1bb.
It has a and a connection terminal 1bbb. Wiring pattern 2b
Is formed on the printed circuit board 2 and has a measuring terminal 2ba and a connecting terminal 2bb. Connection terminal 2 of printed circuit board 2
bb is the flexible substrate 1 using the anisotropic conductive film 3.
Connected to the connection terminals 1bba and 1bbb.
【0013】この構成により、接続端子1bbbと接続
端子2bbの接続抵抗は測定端子1bbaと2baを使
って容易に求めることができる為、接続抵抗で回路基板
の接続状態を管理することができる。つぎに、この構成
による本実施例の効果を説明する。With this configuration, the connection resistance of the connection terminal 1bbb and the connection terminal 2bb can be easily obtained by using the measurement terminals 1bba and 2ba, so that the connection state of the circuit board can be managed by the connection resistance. Next, the effect of this embodiment with this configuration will be described.
【0014】図3図4図5は、接続端子の合わせ位置が
ずれた場合である。図3は接続端子の合わせ位置が横方
向にずれた場合で、図4は合わせ位置が縦方向にずれた
場合で、図5は合わせ位置が斜めにずれた場合を示して
いる。合わせ位置がずれると接続端子1bbbと2bb
の接続面積が変化するので、接続抵抗値が変化する。よ
って、測定端子1bbaと測定端子2baを用いて抵抗
値を測定することにより、フレキシブル基板1とプリン
ト基板2の合わせ位置ずれの発生を知ることができる。3 and 4 show the case where the connecting positions of the connecting terminals are displaced. FIG. 3 shows a case where the connecting position of the connection terminals is displaced in the horizontal direction, FIG. 4 shows a case where the aligning position is displaced in the vertical direction, and FIG. 5 shows a case where the aligning position is displaced obliquely. If the alignment position shifts, the connection terminals 1bbb and 2bb
The connection resistance value changes because the connection area changes. Therefore, by measuring the resistance value using the measurement terminal 1bba and the measurement terminal 2ba, it is possible to know the occurrence of misalignment between the flexible board 1 and the printed board 2.
【0015】(実施例2)図6は、他の実施例で、図7
は図6のA−A’間の断面図であり、図8は図6のB部
の拡大図である。図において、1はフレキシブル基板、
1aはフレキシブル基板のベース、1bはベース1aに
上に形成された銅箔配線パターン、1baは接続後に回
路を形成する配線パターン、1bbは配線パターンと電
気的に独立した配線パターン、1bbaは外部から電気
的接触可能な測定端子、1baaと1bbbは接続端
子、1cはカバーレイ、2はプリント基板、2aはセラ
ミック等のベース、2bはベース2a上に膜付けされた
アルミ配線パターン、2bbは接続端子、2cは絶縁
膜、3は異方性導電膜である。(Embodiment 2) FIG. 6 shows another embodiment of FIG.
6 is a cross-sectional view taken along the line AA ′ in FIG. 6, and FIG. 8 is an enlarged view of a B portion in FIG. In the figure, 1 is a flexible substrate,
1a is a base of a flexible substrate, 1b is a copper foil wiring pattern formed on the base 1a, 1ba is a wiring pattern for forming a circuit after connection, 1bb is a wiring pattern electrically independent of the wiring pattern, and 1bba is from the outside. Electrically contactable measurement terminals, 1baa and 1bbb are connection terminals, 1c is a coverlay, 2 is a printed circuit board, 2a is a base such as ceramic, 2b is an aluminum wiring pattern filmed on the base 2a, and 2bb is a connection terminal. 2c is an insulating film and 3 is an anisotropic conductive film.
【0016】本実施例では、配線パターン1baと電気
的に独立した配線パターン1bbがフレキシブル基板1
の両端にあり、接続端子1bbbと2bbの横端が一致
した状態が正常な合わせ位置となるように配置され、両
端の接続端子の合わせ位置の関係は線対称である。実施
例1にあったプリント基板の配線パターン2bに形成さ
れる測定端子2baが無くなっている。これ以外は前述
した実施例1と同じである。In this embodiment, the wiring pattern 1bb electrically independent from the wiring pattern 1ba is the flexible substrate 1
The connection terminals 1bbb and 2bb are arranged at both ends thereof so that a normal alignment position is obtained, and the connection positions of the connection terminals at both ends are line symmetrical. The measurement terminal 2ba formed on the wiring pattern 2b of the printed circuit board in the first embodiment is eliminated. The other points are the same as those in the first embodiment described above.
【0017】この構成により、フレキシブル基板1の両
端にある測定端子1bbaを用いることにより、フレキ
シブル基板1の両端部の接続抵抗の和を測定することが
できる。つぎに、この構成による本実施例の効果を説明
する。With this configuration, the sum of the connection resistances at both ends of the flexible substrate 1 can be measured by using the measuring terminals 1bba at both ends of the flexible substrate 1. Next, the effect of this embodiment with this configuration will be described.
【0018】測定される接続抵抗値は、フレキシブル基
板1の両端部の接続抵抗の和である為、熱圧着で基板を
接続する時にフレキシブル基板1が伸びた場合でも両端
の接続抵抗値で基板合わせ位置のずれを管理できる。図
8は回路基板合わせ位置が正常な状態、図9は回路基板
合わせ位置がずれた状態である。Since the measured connection resistance value is the sum of the connection resistances at both ends of the flexible substrate 1, even if the flexible substrate 1 is stretched when the substrates are connected by thermocompression bonding, the connection resistance values at both ends are used to match the substrates. It is possible to manage misalignment. FIG. 8 shows a state where the circuit board alignment position is normal, and FIG. 9 shows a state where the circuit board alignment position is displaced.
【0019】一方、フレキシブル基板1とプリント基板
2の接続部に剥がれ等の異常は両端部から発生する為、
基板両端部に配置した接続端子1bbbが隣接した接続
端子1baaと接続端子2bbの接続を補強する効果が
ある。 (実施例3)図10は、他の実施例で、図11は図10
のA−A’間の断面図であり、図12は図10のB部の
拡大図である。図において、1はフレキシブル基板、1
aはフレキシブル基板のベース、1bはベース1aに上
に形成された銅箔配線パターン、1baは接続後に回路
を形成する配線パターン、1bbと1bcは配線パター
ンと電気的に独立した配線パターン、1bbaと1bc
aは外部から電気的接触可能な測定端子、1baa、1
bbbと1bcbは接続端子、1cはカバーレイ、2は
プリント基板、2aはセラミック等のベース、2bはベ
ース2a上に膜付けされたアルミ配線パターン、2bb
は接続端子、2cは絶縁膜、3は異方性導電膜である。On the other hand, since abnormalities such as peeling at the connecting portion between the flexible substrate 1 and the printed circuit board 2 occur from both ends,
The connection terminals 1bbb arranged at both ends of the substrate have an effect of reinforcing the connection between the adjacent connection terminals 1baa and 2bb. (Embodiment 3) FIG. 10 shows another embodiment, and FIG.
12 is a cross-sectional view taken along line AA ′ in FIG. 12, and FIG. 12 is an enlarged view of portion B in FIG. 10. In the figure, 1 is a flexible substrate, 1
a is a base of a flexible substrate, 1b is a copper foil wiring pattern formed on the base 1a, 1ba is a wiring pattern for forming a circuit after connection, 1bb and 1bc are wiring patterns electrically independent of the wiring pattern, and 1bba. 1 bc
a is a measurement terminal that can be electrically contacted from the outside, 1 baa, 1
bbb and 1bcb are connection terminals, 1c is a cover lay, 2 is a printed circuit board, 2a is a base such as ceramic, 2b is an aluminum wiring pattern filmed on the base 2a, 2bb
Is a connection terminal, 2c is an insulating film, and 3 is an anisotropic conductive film.
【0020】本実施例では、配線パターン1baと電気
的に独立した配線パターン1bbと1bcが隣接してフ
レキシブル基板1の両端にあり、接続端子1bbbと2
bbの横端が一致し、且つ接続端子1bcaは接続端子
1bbbが接続される反対側に接続端子1bbbの幅以
上の距離を接続端子2bbの横端と接続端子1bcaの
横端間に有して接続端子2bbと接続する状態が正常な
合わせ位置となるように配置され、回路基板両端部の合
わせ位置の関係は線対称である。これ以外は前述した実
施例2と同じである。In the present embodiment, the wiring patterns 1bb and 1bc, which are electrically independent of the wiring pattern 1ba, are adjacent to each other at both ends of the flexible substrate 1 and have the connection terminals 1bbb and 2b.
The horizontal ends of bb are the same, and the connection terminal 1bca has a distance greater than the width of the connection terminal 1bbb between the horizontal ends of the connection terminals 2bb and 1bca on the opposite side to which the connection terminal 1bbb is connected. The connection terminals 2bb are arranged so that they are connected to each other at a normal alignment position, and the alignment positions of both ends of the circuit board are line-symmetric. The other points are the same as those in the second embodiment described above.
【0021】この構成により、フレキシブル基板1の端
部毎にある測定端子1bbaと1bcaを用いて、両端
部の接続抵抗を個別に測定することが出来る。つぎに、
この構成による本実施例の効果を説明する。測定される
接続抵抗値は、フレキシブル基板1の各端部の接続抵抗
である為、図13に示されるように、基板合わせ位置が
横方向にずれて一方の接続端子1bbbが接続端子2b
bから外れた場合においても他方の接続端子1bbbは
接続しているので、片端の接続抵抗は測定できる。この
ことから、一方の接続抵抗が測れない時には、測定でき
ない端部を知ることによって、回路基板合わせ位置のず
れ方向を容易に知ることができる。With this structure, the connection terminals at both ends can be individually measured by using the measuring terminals 1bba and 1bca provided at each end of the flexible substrate 1. Next,
The effect of this embodiment with this configuration will be described. Since the measured connection resistance value is the connection resistance at each end of the flexible board 1, as shown in FIG. 13, the board alignment position is laterally displaced and one connection terminal 1bbb is connected to the connection terminal 2b.
Since the other connection terminal 1bbb is connected even when it is deviated from b, the connection resistance at one end can be measured. From this, when one of the connection resistances cannot be measured, the shift direction of the circuit board alignment position can be easily known by knowing the unmeasurable end.
【0022】[0022]
【発明の効果】この発明は、以上説明したように、回路
基板において、少なくとも1つの接続端子を経由して導
通している外部から電気的接触可能な2つ以上の端子を
持つようになる配線パターンと、外部から電気的接触可
能な端子と接続端子までの配線パターンが他の配線パタ
ーンと電気的に独立している配線パターンと、外部から
電気的接触可能な端子と導通している接続端子が回路基
板の接続する辺の端に位置する配線パターンと、電気的
に同一な接続端子に2つ以上の外部から電気的接触可能
な端子と導通している接続端子を接続させる配線パター
ンと、を有する構成としたのでいかに記載する効果を有
する。 接続抵抗値が測定できるようになるので、接続状態
を管理すことが出来る。 接続抵抗値の大小により、接続位置のずれが分かる
ため、品質管理が容易になった。 2箇所の接続抵抗の測定結果より、接続位置のずれ
が方向か分かるため、品質管理が容易になった。 配線パターン端に接続端子があるので、回路基板剥
離による接続部断線のおそれが少ない。 外部から電気的な接触を可能とする端子が在るの
で、測定が容易になる。As described above, according to the present invention, in a circuit board, there are two or more terminals that are electrically connected to each other from the outside and are electrically connected via at least one connection terminal. The pattern, the wiring pattern from the outside to the electrically contactable terminal and the connection terminal are electrically independent from other wiring patterns, and the connection terminal that is electrically connected to the externally contactable terminal A wiring pattern located at an end of a side to which the circuit board is connected, and a wiring pattern for connecting a connection terminal electrically connected to two or more externally contactable terminals to an electrically identical connection terminal, Since it is configured to have, it has an effect to be described. Since the connection resistance value can be measured, the connection status can be managed. Since the deviation of the connection position can be known depending on the magnitude of the connection resistance value, quality control is facilitated. From the measurement results of the connection resistance at the two locations, it is possible to know whether the displacement of the connection position is in the direction, which facilitates the quality control. Since the connection terminal is provided at the end of the wiring pattern, there is little risk of disconnection of the connection portion due to peeling of the circuit board. Since there is a terminal that enables electrical contact from the outside, measurement becomes easy.
【図1】本発明の実施例1の回路基板接続部(A−A’
断面)の図である。FIG. 1 is a circuit board connection portion (AA ′) according to a first embodiment of the present invention.
FIG.
【図2】本発明の実施例1の回路基板接続状態図であ
る。FIG. 2 is a circuit board connection state diagram of the first embodiment of the present invention.
【図3】本発明の実施例1の回路基板の合わせ位置の横
ずれの図である。FIG. 3 is a diagram showing lateral displacement of the alignment position of the circuit board according to the first embodiment of the present invention.
【図4】本発明の実施例1の回路基板の合わせ位置の縦
ずれの図である。FIG. 4 is a diagram of vertical displacement of the alignment position of the circuit board according to the first embodiment of the present invention.
【図5】本発明の実施例2の回路基板の合わせ位置の斜
めずれの図である。FIG. 5 is a diagram showing an oblique displacement of the alignment position of the circuit board according to the second embodiment of the present invention.
【図6】本発明の実施例2の回路基板接続状態図であ
る。FIG. 6 is a circuit board connection state diagram of a second embodiment of the present invention.
【図7】本発明の実施例2の回路基板接続部(A−A’
断面)の図である。FIG. 7 is a circuit board connecting portion (AA ′) according to the second embodiment of the present invention.
FIG.
【図8】本発明の実施例2の接続端子拡大図(正常)で
ある。FIG. 8 is an enlarged view (normal) of the connection terminal according to the second embodiment of the present invention.
【図9】本発明の実施例2の接続端子拡大図(異常)で
ある。FIG. 9 is an enlarged view (abnormality) of the connection terminal according to the second embodiment of the present invention.
【図10】本発明の実施例3の回路基板接続状態図であ
る。FIG. 10 is a circuit board connection state diagram of a third embodiment of the present invention.
【図11】本発明の実施例3の回路基板接続部(A−
A’断面)の図である。FIG. 11 is a circuit board connection portion (A-) according to the third embodiment of the present invention.
It is a figure of A'section.
【図12】本発明の実施例3の接続端子拡大図(正常)
である。FIG. 12 is an enlarged view of a connection terminal according to a third embodiment of the present invention (normal).
Is.
【図13】本発明の実施例3の接続端子拡大図(異常)
である。FIG. 13 is an enlarged view of a connection terminal of Example 3 of the present invention (abnormal).
Is.
【図14】従来の回路基板接続状態図である。FIG. 14 is a conventional circuit board connection state diagram.
【図15】従来の回路基板接続部(A−A’断面)の図
である。FIG. 15 is a view of a conventional circuit board connecting portion (AA 'cross section).
1 フレキシブル基板 1a ベース 1b 外箔配線パターン 1ba 配線パターン 1baa 接続端子 1bb 配線パターン 1bba 測定端子 1bbb 接続端子 1bc 配線パターン 1bca 測定端子 1bcb 接続端子 1c カバーレイ 2 プリント基板 2a セラミック等のベース 2b アルミ配線パターン 2ba 測定端子 2bb 接続端子 2c 絶縁膜 3 異方性導電膜 1 flexible substrate 1a base 1b outer foil wiring pattern 1ba wiring pattern 1baa connection terminal 1bb wiring pattern 1bba measurement terminal 1bbb connection terminal 1bc wiring pattern 1bca measurement terminal 1bcb connection terminal 1c coverlay 2 printed circuit board 2a ceramic wiring base 2b aluminum wiring pattern 2a Measuring terminal 2bb Connection terminal 2c Insulating film 3 Anisotropic conductive film
フロントページの続き (72)発明者 東海林 法宜 東京都江東区亀戸6丁目31番1号 セイコ ー電子工業株式会社内 (72)発明者 佐藤 義則 東京都江東区亀戸6丁目31番1号 セイコ ー電子工業株式会社内 (72)発明者 石田 雄一 東京都江東区亀戸6丁目31番1号 セイコ ー電子工業株式会社内Front page continued (72) Inventor Tokaibayashi Hogori 63-11-1 Kameido, Koto-ku, Tokyo Seiko Electronics Inc. (72) Inventor Yoshinori Sato 6-31-1 Kameido, Koto-ku, Tokyo Seiko Electronic Industry Co., Ltd. (72) Inventor Yuichi Ishida 6-31-1, Kameido, Koto-ku, Tokyo Seiko Electronic Industry Co., Ltd.
Claims (4)
回路基板において、少なくとも1つの接続端子を経由し
て導通する外部から電気的接触可能な2つ以上の端子を
持つようになる配線パターンを有することを特徴とする
回路基板。1. A circuit board in which two or more circuit boards are electrically connected to each other, the wiring having two or more terminals which are electrically contactable from the outside and which conducts via at least one connection terminal. A circuit board having a pattern.
回路基板において、外部から電気的接触可能な端子と接
続端子までの配線パターンが他の配線パターンと電気的
に独立していることを特徴とする請求項1記載の回路基
板。2. In a circuit board in which two or more circuit boards are electrically connected, a wiring pattern from an externally electrically contactable terminal to a connection terminal is electrically independent from other wiring patterns. The circuit board according to claim 1, wherein:
回路基板において、外部から電気的接触可能な端子と導
通する接続端子が回路基板の接続する辺の端に位置する
配線パターンを有することを特徴とする請求項1記載の
回路基板。3. A circuit board in which two or more circuit boards are electrically connected has a wiring pattern in which a connection terminal electrically connected to a terminal that can be electrically contacted from the outside is located at an end of a side to which the circuit board is connected. The circuit board according to claim 1, wherein:
回路基板において、一方の回路基板の電気的に同一な接
続端子に2つ以上の外部から電気的接触可能な端子と導
通する接続端子を接続する配線パターンを有することを
特徴とする請求項2記載の回路基板。4. A circuit board in which two or more circuit boards are electrically connected to each other so that electrically connected connection terminals of one circuit board are electrically connected to two or more terminals that can be electrically contacted from the outside. The circuit board according to claim 2, further comprising a wiring pattern for connecting the terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6071171A JPH07283503A (en) | 1994-04-08 | 1994-04-08 | Circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6071171A JPH07283503A (en) | 1994-04-08 | 1994-04-08 | Circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH07283503A true JPH07283503A (en) | 1995-10-27 |
Family
ID=13452953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6071171A Pending JPH07283503A (en) | 1994-04-08 | 1994-04-08 | Circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07283503A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009271383A (en) * | 2008-05-09 | 2009-11-19 | Funai Electric Co Ltd | Liquid crystal display device, and method of manufacturing the same |
-
1994
- 1994-04-08 JP JP6071171A patent/JPH07283503A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009271383A (en) * | 2008-05-09 | 2009-11-19 | Funai Electric Co Ltd | Liquid crystal display device, and method of manufacturing the same |
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