JPH07278898A - Method for controlling surface treating solution and device therefor - Google Patents

Abstract

PURPOSE:To automatically keep the quality of a surface treating solution optimal while operating a surface treating device and simultaneously to save the space of the surface treating device. CONSTITUTION:A supply means 21 is connected to a tank 4E storing a plating solution, a nickel carbonate powder is stored in a hopper 21c of the supply means 21 and is supplied to the tank 4E through a supply pipe 24 by operating a motor 21b. A pH sensor 30 is dipped into the tank 4E to constantly detect the pH of the plating solution, and when the pH of the plating solution which is detected by the sensor 30 becomes smaller than a prescribed proper ph value with the progress of plating, nickel carbonate in the hopper 21c is supplied to the tank 4E by working the motor 21b of the supply means 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment liquid management method and apparatus for controlling the quality of a surface treatment liquid such as a plating liquid or a pretreatment liquid for plating a work or its pretreatment. It is a thing.

[0002]

2. Description of the Related Art Conventionally, various surface treatment techniques have been known in which a surface to be treated of a workpiece is plated and a pretreatment process such as degreasing etching is performed. For example, as such a technique, it is generally known that a work is immersed in a bath in which a surface treatment liquid (hereinafter abbreviated as a treatment liquid) is stored to perform the surface treatment. Further, recently, there has been considered a technique for increasing the speed of the surface treatment work by performing the surface treatment while flowing the treatment liquid onto the surface to be treated of the work. For example, in Japanese Unexamined Patent Publication (Kokai) No. Hei 5-222589, a support for supporting a work such as an engine cylinder is equipped with a member for forming a flow path of a plating solution, an electrode, etc. There is disclosed a plating apparatus which is connected to a bath of a plating solution via the above, and which carries out plating while feeding the plating solution from the bath to the support by a pump to cause the plating solution to flow. With this device, high-speed plating can be performed, and
The bathtub can be downsized.

By the way, in order to obtain a desired treated surface in such a surface treatment, it is required that the quality of the treating liquid is kept to be suitable and constant. For example, in the case of plating the surface to be processed of the workpiece, the plating material contained in the plating solution as the processing solution decreases with the plating work, so it is necessary to replenish it, and in the case of performing the previous step In addition, since the processing liquid is deteriorated due to the inclusion of impurities in the processing liquid due to dissolution of the metal constituting the work, it is necessary to replace the processing liquid.

Therefore, conventionally, when plating the surface to be treated of a work, an operator puts a plating material into a bath of the plating solution after a considerable period of time, such as when the plating operation is stopped, or the bath. The cloth-made bag containing the plating material is dipped therein so that the plating material is melted. In addition, when performing pretreatment, after a predetermined working time has elapsed, the pretreatment device is temporarily stopped so that the treatment liquid stored in the bathtub is discharged by a pump or the like and replaced with a new treatment liquid. ing.

[0005]

By the way, it is difficult to accurately control the quality of the plating solution by the conventional method when plating the surface of the workpiece to be treated. In addition, generally, in order to prevent the change and deterioration of the liquid quality from occurring, a large amount of the processing liquid is stored in a large bath to perform the plating treatment. It is necessary to dissolve a large amount of the plating material in the plating solution at the time of replenishment, and it takes a long time to replenish the plating material, and the bath itself is large. There is also a problem that it hinders space. On the other hand, if the bath is downsized and the plating solution storage amount is reduced,
Since the quality of the plating solution is likely to change in a short period of time, it becomes more difficult to control the quality of the solution by the conventional method.

Further, in the case of performing the pretreatment, according to the conventional method, when the treatment liquid is replaced due to deterioration of the treatment liquid,
Since the pretreatment device must be stopped, there is a problem in terms of production efficiency, and it is difficult to change the treatment liquid frequently, so it is difficult to sufficiently suppress changes in liquid quality.

The present invention has been made in order to solve the above problems, and while operating the surface treatment apparatus, automatically keeps the surface treatment solution in a proper quality and saves space of the surface treatment apparatus. It is an object of the present invention to provide a surface treatment liquid management method and device that can be achieved.

[0008]

The invention according to claim 1 is
A method of managing a surface treatment liquid stored in a bath, which is an element that acts in a direction in which the function of the surface treatment liquid is restored based on information indicating the functional deterioration of the surface treatment liquid or a condition corresponding to the functional decrease. Is continuously or intermittently supplied into the bathtub during the surface treatment work.

According to a second aspect of the present invention, in the method for controlling a surface treatment liquid according to the first aspect, the surface treatment liquid is a plating liquid containing a plating substance, and is related to consumption of the plating substance by a plating operation. The plating substance is supplied into the bath according to the information.

According to a third aspect of the present invention, in the surface treatment solution management method according to the second aspect, the plating solution contains nickel as a main plating material, and the information relating to the consumption of nickel is as described above. The pH value of the plating solution is detected, and nickel carbonate is supplied into the bath according to the change.

According to a fourth aspect of the present invention, in the surface treatment liquid management method according to the third aspect, the plating solution is caused to flow between a soluble electrode and a surface to be plated, and the soluble electrode is added as plating is performed. In this case, nickel is replenished in the plating solution, and the elution amount of nickel in the soluble electrode is regulated so that the pH value of the plating solution becomes an appropriate value or less.

According to a fifth aspect of the present invention, in the surface treatment liquid management method according to the first aspect, the surface treatment liquid is a pretreatment liquid containing a treatment solute and a solvent, and the function is deteriorated due to deterioration of the pretreatment liquid. As the pretreatment liquid is used in the pretreatment work as a condition related to the above condition, the pretreatment liquid in the bath is continuously discharged in a predetermined amount at a predetermined amount, and a predetermined amount of the treatment solute corresponding to the discharged pretreatment liquid is discharged. While supplying to the bathtub,
The solvent is supplied into the bath so that the liquid level in the bath becomes a predetermined level.

According to a sixth aspect of the present invention, there is provided a management device for a plating solution stored in a bath, which comprises a supplying means for supplying the plating material of the plating solution from the storage section into the bath, and the plating material by the plating operation. And a control means for controlling the supply means so as to supply the plating material into the bath based on the information detected by the detection means.

According to a seventh aspect of the present invention, in the surface treatment solution management apparatus according to the sixth aspect, the plating solution contains nickel as a main plating material, and a pH meter is provided as the detection means. Nickel carbonate is supplied into the bath according to the pH value of the plating solution in the bath detected by the pH meter.

According to an eighth aspect of the present invention, there is provided a management device for pretreatment liquid stored in a bath, which comprises a supply source for supplying treatment solute of the pretreatment liquid and water, and a supply source for each of them in the bath. First and second supplying means for supplying, liquid level detecting means for detecting a liquid level of the pretreatment liquid in the bath,
A discharge unit for discharging the pretreatment liquid in the bathtub by a predetermined amount, and a discharge tank for storing the pretreatment liquid discharged thereby,
While discharging the pretreatment liquid in the bath during the pretreatment work, while supplying a predetermined amount of treatment solute according to the discharge pretreatment liquid amount into the bath, based on the detection result by the liquid level detecting means, It is provided with a control means for controlling the first and second supply means and the discharge means so as to supply water so that the liquid level becomes a predetermined level.

[0016]

According to the first aspect of the present invention, an element for restoring the function of the surface treatment liquid is supplied to the bath according to the deterioration of the function due to the use of the surface treatment liquid during the surface treatment work. Function deterioration is corrected.

According to the second aspect of the present invention, the amount of the plating material consumed is supplied by supplying the plating material into the bath according to the information related to the consumption of the plating material by the plating operation. Will be supplemented.

According to the third aspect of the invention, the pH value of the plating solution is detected, and nickel carbonate is supplied according to the change in the pH value.

According to the invention described in claim 4, the excessive replenishment of nickel to the plating solution is suppressed, and the process for correcting the excessive replenishment of nickel becomes unnecessary.

According to the fifth aspect of the present invention, as the pretreatment liquid is used in the pretreatment work, the pretreatment liquid in the bath is continuously discharged by a predetermined amount while the treatment solute and the solvent are supplied. By this, deterioration of the pretreatment liquid is compensated.

According to the sixth aspect of the invention, the plating material in the storage portion is supplied to the plating solution in the bath according to the information related to the consumption of the plating material detected by the detecting means.

According to the seventh aspect of the invention, nickel carbonate is supplied into the bath according to the pH value of the plating solution detected by the pH meter.

According to the invention described in claim 8, the pretreatment liquid in the bathtub is continuously discharged by a predetermined amount at the time of the pretreatment work, while a predetermined amount of the treatment solute corresponding to the discharge pretreatment liquid amount. Is supplied into the bathtub. At the same time, water is supplied into the bath to maintain the liquid level of the pretreatment liquid at a predetermined level.

[0024]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows the outline of the entire plating processing system. In this plating system, processing sections A to D for various pretreatments, a plating processing section E, and a drying section F are arranged along the plating processing line in an array corresponding to the work order. Specifically, the degreasing processing unit A,
The alkali etching processing section B, the mixed acid etching processing section C, the alumite processing section D, the high speed plating processing section E and the drying section F are arranged in this order. Furthermore, each processing unit A
To E and between the plating processing section E and the drying section F, water washing sections Ga, Gb, Gc, Gd and Ge are provided, respectively. Further, the work input part 2 is provided on the starting end side of the plating processing line, and the work unloading part 3 is provided on the end side of the plating processing line.

Outside the processing line, a degreasing liquid storage tank 4A, an alkaline liquid storage tank 4B, and a mixed acid liquid storage tank 4 are provided.
C, a mixed acid solution discharge tank 4C ', an alumite solution storage tank 4D, and a plating solution storage tank 4E are arranged. Pumps 5A, 5B, 5C, 5D, 5E for supplying the treatment liquid and pipes for supplying the treatment liquid are provided between the tanks (tubs) 4A to 4E for the treatment liquids and the corresponding processing units A to E. Equipped.

Although not shown, a work transfer means is movably arranged above the plating processing line from the work input part 2 to the work transfer part 3, and the work transfer means is provided. Thus, the work is suspended and is sequentially transported along the plating processing line.

FIG. 2 shows a piping system and a control system for high-speed plating in the plating processing section E, to which the present invention is applied.

In this figure, the plating solution supply pipe 1 is provided between the tank 4E for storing the plating solution and the pump 5E connected to the tank 4E and the processing apparatus main body 10 of the plating processing section E.
1 and a plating solution recovery pipe 12 are provided. The plating solution supply pipe 11 has an upstream end connected to the pump 5E, and a downstream end connected to a plating solution introduction passage 19 of the processing apparatus body 10 described later. Further, the plating solution supply pipe 11 is provided with a main automatic valve 14 and a main manual valve 15 for adjusting the plating solution supply amount. Further, since the surplus solution is returned to the tank 4E, it is upstream of the valves 14 and 15. A bypass pipe 13 that branches off from the plating solution supply pipe 11 to reach the tank 4E is attached to the side, and a bypass automatic valve 16 is provided in the bypass pipe 13.

The processing apparatus main body 10 supports a cylindrical work 1 such as a cylinder of a cylinder block of an automobile. In the processing apparatus main body 10, the inner peripheral surface of the work 1 is supported. It is designed to be plated. In the present embodiment, the work 1 is subjected to nickel (Ni) -phosphorus (P) composite plating. Therefore, the tank 4E stores a plating solution containing nickel and phosphorus. In addition, sodium is added to the plating solution to accelerate the precipitation of phosphorus during high speed plating.

The work 1 is supported by the holder 18 of the processing apparatus main body 10 in a state where the upper opening edge is sealed by the sealing jig 17 formed of a conductive material. A plating solution introduction passage 19 extending in the lateral direction is formed in the holder 18, and the plating solution supply pipe 11 is connected to the plating solution introduction passage 19. In addition, the holder 18 is provided with an opening communicating with the plating solution introduction passage 19 at a position corresponding to the lower opening of the work 1, and the cylindrical soluble electrode 20 ( Hereinafter, abbreviated as electrode 20) is projected upward through this opening. Then, in the illustrated state in which the work 1 is supported by the holder 18, the electrode 2
0 rushes into the hollow portion of the work 1 and reaches near the upper end of the work 1.

As shown in FIG. 3, the electrode 20 has an inner tubular portion 201 and an outer tubular portion 202, and a large number of nickel, which is a soluble anode substance, is formed between the inner and outer tubular portions 201 and 202. The pellets Pa are stored.

In the electrode 20, the inner cylindrical portion 201
Is composed of a metal pipe having a cover such as a metal net attached to the upper end. On the other hand, the outer cylinder portion 202 is a pipe member 20 including a metal pipe 202a and a porous metal plate or the like.
2b are connected to each other vertically, and the metal pipe 20
Insoluble anode part 2 made of platinum plating on the outer peripheral surface of 2a
0a is formed, and during the plating process described later, the pellet Pa is eluted into the plating solution through the pipe member 202b of the outer cylinder 202 so that nickel in the plating solution is supplemented. It has become. Moreover, in the outer cylinder portion 202, the dimensional ratio in the lengthwise direction between the insoluble anode portion 20a and the pipe member 202b is set to a predetermined dimensional ratio, whereby excessive elution of nickel can be suppressed. There is. Specifically, the above dimensional ratio is set such that the detected pH value of the plating solution does not exceed a predetermined appropriate pH value only by elution of nickel from the electrode 20 into the plating solution.

In this electrode 20, the outer cylinder portion 202
Part of is formed by the metal pipe 202a,
By forming the insoluble anode portion 20a on the surface of the metal pipe 202a as described above, this portion functions as an anode, and the plating deposition action on the surface to be plated is also excellently exhibited in this portion. ing.

From the viewpoint of plating quality and the like, it is preferable that the electrode is mainly composed of a soluble anode. Therefore, the insoluble anode portion 20a regulates the elution of nickel so as not to exceed an appropriate pH value. It is desirable to provide it in the minimum necessary range that satisfies the condition.

The hollow portion of the electrode 20 (that is, the inner side of the inner cylindrical portion 201) is connected to the plating solution recovery pipe 12 via the holder 18. That is, in the processing apparatus main body 10, the plating solution introduced into the plating solution introduction passage 19 by the plating solution supply pipe 11 and the inner peripheral surface of the work 1 and the electrode 20 are indicated by an arrow in FIG.
And flows into the plating solution recovery pipe 12 from the upper end of the electrode 20 through the hollow portion.

Further, three supply means 21 to 23 for supplying a plating material to the tank 4E are provided. Of these, the supply means 21 includes a feeder 21a for supplying nickel carbonate powder. This feeder 21
The motor a is driven by the motor 21b, and the nickel carbonate powder is delivered from the hopper 21c as a storage unit and supplied to the tank 4E via the supply pipe 24. Also,
The supply means 22 and 23 are provided with tanks 22a and 23a, respectively, and the respective solutions of hypophosphorous acid and sodium saccharin are stored in the tanks 22a and 23a, respectively.
These are supplied to the tank 4E through the supply pipe 25 by the operation of the metering pumps 22b and 23b. In addition, in the embodiment, each of the supply pipes 2
As shown in FIG. 2, the downstream end sides of the tanks 4E and 4 are arranged in parallel with the downstream end side of the bypass pipe 13.
It is arranged so as to face the mixing tank 26 formed therein.

A pH sensor 30, for example of a proportional control type, for detecting the pH value of the plating solution stored in the tank 4E is immersed in the tank 4E. The pH value is to be detected.

The plating treatment section E having the above structure
Is a controller 31 that controls the plating process operation.
Is provided and the main automatic valve 1 of the above piping system
4, bypass automatic valve 16, motor 21b of each supply means 21-23, pumps 22b, 23b and pH sensor 3
0 and the like are all connected to this controller 31.

The sealing jig 17 and the electrode 20 of the processing apparatus main body 10 are connected to a rectifier 32 connected to an AC power source (not shown), and the rectifier 32 is connected to the controller via an integrating ammeter 33. It is connected to 31. The rectifier 3 is used in the plating process.
A predetermined current corresponding to the amount of rectification at 2 is supplied through the electrode 20, and the supplied current amount is integrated by the integrating ammeter 33.

According to the above-mentioned plating processing section E configured as described above, the plating processing is performed as follows.

That is, in the state shown in FIG. 2 in which the work 1 is supported by the processing apparatus main body 10, the plating solution is supplied and circulated through the piping system, and the electrodes 20 are energized. The inner peripheral surface of the work 1 is plated. More specifically, the plating solution supplied from the plating solution supply pipe 11 to the plating solution introduction passage 19 of the holder 18 is, as indicated by an arrow in FIG. 3, an outer surface of the electrode 20 and a hollow portion of the work 1. It flows between the wall surface and the inside of the electrode 20 through the upper end portion of the work 1. And further,
It flows into the plating solution recovery pipe 12 and is returned to the tank 4E.
In this way, the plating solution is circulated, and the plating solution is caused to flow along the wall surface of the hollow portion, which is the surface to be plated of the work 1, while the current is passed between the electrode 20 and the work 1, so that the plating solution is Nickel and phosphorus therein are deposited on the surface to be plated, and the work 1 is subjected to nickel (Ni) -phosphorus (P) dispersion plating.

By the way, in the plating treatment section E, when the plating treatment progresses as described above, the plating material in the plating solution which is lost accordingly is replenished as follows.

First, nickel, which is the main plating material, is supplemented by the elution of the pellet Pa of the electrode 20 with the precipitation of nickel in the plating solution.

Further, when such elution of the pellet Pa alone is not sufficient, the supply means 21 is operated to replenish the plating solution with nickel. Specifically, p of the plating solution detected by the pH sensor 30 is
The feeder 11 is driven according to the H value, so that the nickel carbonate powder in the hopper 21c is replenished to the tank 4E. That is, as the plating process progresses, nickel is deposited, and when the nickel ions in the plating solution decrease, the acid ions remain in the plating solution, so that the pH value of the plating solution contains an appropriate amount of nickel ions. However, with respect to the appropriate pH value (pH 4 in the embodiment), the pH value gradually changes.

Therefore, the pH value of the plating solution in the tank 4E is constantly detected by the pH sensor 30, and when the value becomes lower than the proper pH value as shown in FIG. 4, the feeder 11 is operated. Nickel carbonate powder in tank 4E
It is supplied to the inside of the plating solution to keep an appropriate amount of nickel in the plating solution. At this time, the supply amount of the nickel carbonate powder may be intermittently supplied at a preset constant amount. For example, the supply amount of the nickel carbonate powder that can set the detected pH value to an appropriate pH value. May be calculated, and the amount of nickel carbonate powder corresponding to the calculated value may be supplied. In this case, the supply amount of the nickel carbonate powder can be set by the operating time or the driving speed of the motor 21b.

As described above, the pH value of the plating solution is constantly detected, and the nickel carbonate powder is supplied based on the detected value to maintain the pH value in the plating solution at a substantially proper pH value. A proper amount of nickel can be maintained.

Particularly in nickel composite plating, since the pH value of the plating solution has a great influence on the plating deposition action and the properties of the plating, nickel is replenished to keep the pH value within an appropriate range based on the detection of the pH value. It will be effective. Moreover, when necessary, that is, when the pH value is the proper pH.
Since the nickel carbonate powder is supplied at any time when the value becomes lower than the value, the amount of the nickel carbonate powder supplied at one time by the supply means 21 can be relatively small, and as a result, the plating solution of the nickel carbonate powder can be obtained. There is also an advantage that the solubility to nickel is enhanced and nickel can be quickly supplied to the plating solution. Since nickel carbonate is released as carbon dioxide gas other than nickel when dissolved in the plating solution, it is suitable for nickel replenishment without causing alteration of the plating solution.

The influence of the elution of the pellet Pa from the electrode 20 on the plating solution, that is, the variation of the pH value is carried out within the range of the appropriate pH value or less as described above, and the supply means 21 supplies nickel. Is the plating solution p
When the H value is lower than the proper pH value, it is set to the proper pH value.
It does not exceed the value, which is advantageous for controlling the plating solution.

That is, when nickel is excessively supplied and the pH value of the plating solution exceeds the appropriate range, an acid (for example, sulfamic acid) may be added to the plating solution as a means for correcting this. However, addition of a large amount of acid causes an adverse effect of altering the composition of the plating solution itself. Therefore, it is desirable to avoid such treatment for pH value correction as much as possible. On the other hand, if the pH value is lower than the proper range, nickel carbonate may be added to correct it,
It does not cause deterioration of the composition.

Therefore, according to the method for controlling the plating solution of the above-mentioned embodiment in which the pH value of the plating solution does not exceed the proper pH value, the pH value can be adjusted without causing the composition to change, and the plating solution management Is extremely advantageous in.

Further, in the plating processing section E,
Since the work 1 is subjected to nickel (Ni) -phosphorus (P) composite plating, along with the progress of the plating treatment, in addition to nickel, phosphorus in the plating solution and sodium as a deposition accelerator thereof are also added. It will be consumed as well. The amount of phosphorus or the like in the plating solution affects the properties of plating.

Therefore, in the plating treatment part E, the solutions of hypophosphorous acid and sodium saccharin are supplied to the tank 4E during the plating treatment to be dissolved, so that the phosphorus and sodium in the plating solution are maintained in appropriate amounts. I have to.
Specifically, as shown in FIG. 4, when the integrated value of the energizing current amount integrated by the integrating ammeter 33 in accordance with the plating process reaches a predetermined value, each of the metering pumps of the supplying means 22 and 23. 22b and 23b are actuated to supply the respective solutions of hypophosphorous acid and sodium saccharin to the tank 4E by a predetermined constant amount. After the supply of each solution of hypophosphorous acid and sodium saccharin, the integrated ammeter 33 is reset and the energization current amount is integrated again. Thereafter, as shown in FIG.
Each time the accumulated current value of
By operating each of the metering pumps 22b and 23b of Nos. 23 and 23 to supply the solutions of hypophosphorous acid and sodium saccharin, the phosphorus and sodium in the plating solution are maintained at appropriate amounts.

As described above, in the plating treatment section E, the feeder 11 for supplying the nickel carbonate powder, the hypophosphorous acid and the sodium saccharin solution, respectively.
13 to 13 and supply each solution of nickel carbonate powder, hypophosphorous acid and sodium saccharin to the tank 4E, the nickel, phosphorus and sodium in the plating solution which are lost as the plating process progresses automatically. Since the supply is replenished, the plating solution can be maintained at a proper quality and constant even during the plating treatment for a long time, and as a result, the plating treatment in the plating treatment section E can be favorably continued.

In the above embodiment, the supply means 21-
23 and the downstream end of each of the supply pipes 24 and 25 and the bypass pipe 13.
Of the bypass pipe 13 at the time of supplying each solution of nickel carbonate powder, hypophosphorous acid and sodium saccharin.
There is an advantage that each of these substances can be effectively dissolved in the plating liquid by the liquid flow of the plating liquid returned to the tank 4E via the.

Further, in the plating treatment part E of the above-mentioned embodiment in which nickel, phosphorus and sodium are supplied to the plating solution, the plating solution is automatically kept in a proper and constant condition. Since the quality does not change or deteriorate extremely, it is necessary to store and circulate a large amount of processing liquid in a large bath for the purpose of making it difficult to change or deteriorate the liquid quality as in the conventional example. Therefore, the plating treatment can be performed by circulating a relatively small amount of plating solution. Therefore, the tank 4E can be downsized, and as a result,
There is also an advantage that the space of the plating processing section E can be saved.

In the above embodiments, as application of the present invention, the control of the plating solution when the nickel plating of nickel (Ni) -phosphorus (P) is applied to the work 1 has been described.
The same can be applied to the case of performing nickel (Ni) -phosphorus (P) -silicon carbide (SiC) composite plating. In this case, since the silicon carbide in the plating solution is also consumed as the plating process progresses, a supply means for the same may be provided to replenish the silicon carbide. In particular, when using silicon carbide, it is desirable to add 5% or more of free carbon to the amount of silicon carbide supplied in order to promote the dispersion of silicon carbide during plating. Therefore, for example, a supply means for free carbon may be provided and the free carbon may be supplied according to the supply amount of silicon carbide.

Further, the structure of the present invention can be applied not only to the plating treatment section E but also to the pretreatment section. An example applied to the pretreatment section will be described below with reference to FIG. In addition, in the following description, the case where it is applied to the mixed acid etching processing section C will be described as an example.

In the figure, the mixed acid etching processing part C (hereinafter,
The piping system and control system in the pretreatment part C are shown. As shown in this figure, the piping system of the pretreatment section C basically has substantially the same structure as the piping system of the plating treatment section E. Specifically, the tank 4 for storing the pretreatment liquid
A pretreatment liquid supply pipe 51 and a pretreatment liquid recovery pipe 52 are arranged between C and the pump 5C connected thereto and the treatment device body 50 of the pretreatment unit C, and the pretreatment liquid supply pipe 51 A main automatic valve 53 and a main manual valve 54 are provided. A pump 66 is connected to the tank 4C,
A pretreatment liquid discharge pipe 67 is arranged between the pump 66 and the mixed acid liquid discharge tank 4C '.

The processing apparatus main body 50 is also constructed in substantially the same manner as the processing apparatus main body 10. That is, the holder 55 for supporting the work 1 and the sealing jig 56 for sealing the upper part of the supported work 1 are provided, and the holder 55
A pretreatment liquid introduction passage 57 is formed in the above, and the pretreatment liquid supply pipe 51 is connected to the pretreatment liquid introduction passage 57. Further, the holder 55 is provided with an opening communicating with the pretreatment liquid introduction passage 57, and the flow path forming member 58 disposed in the holder 55 projects upward through this opening. The flow path forming member 58 has substantially the same shape and arrangement as the electrode 20 in the plating treatment section E, and the lower end portion thereof is connected to the pretreatment liquid recovery pipe 52. Therefore, also in the processing apparatus main body 50, as in the processing apparatus main body 10, the pretreatment liquid introduction passage 5 of the processing apparatus main body 50.
As shown by the arrow in the figure, the plating solution introduced in
It flows between the hollow part of the work 1 and the outer peripheral surface of the flow path forming member 58, and flows into the pretreatment liquid recovery pipe 52 from the upper end of the flow path forming member 58 through the hollow part.

Further, three supply means 60 to 62 are connected to the tank 4C. These supply means 6
0 to 62 are provided with tanks 60a, 61a, 62a, respectively, and the stock solutions and water constituting the pretreatment liquid are stored in the tanks 60a, 61a, 62a, respectively, and connected to the tanks 60a, 61a, 62a. Each pump 60b,
The stock solutions and water are supplied to the tank 4C through the supply pipes 63 to 65 by operating the 61b and 62b. In the embodiment, nitric acid, hydrofluoric acid, and water are used as pretreatment liquids for performing the mixed acid etching treatment in predetermined ratios (in the embodiment, nitric acid: hydrofluoric acid: water = 7: 1: The pretreatment liquid mixed in 2) is stored. Therefore, nitric acid, hydrofluoric acid, and water are stored in this order in the tanks 60a, 61a, and 62a of the supply means 60 to 62, respectively. It is supposed to be done.

A level sensor 68 for detecting the liquid level (height) of the pretreatment liquid stored in the tank 4C is immersed in the tank 4C.
The liquid level of the pretreatment liquid in C is detected.

The pretreatment section C thus constructed is provided with a controller 70 for integrally controlling the pretreatment operation. The main automatic valve 53 of the piping system and the pumps of the supply means 60 to 62 are provided. 60b, 61b, 62b, the level sensor 68, etc. are all connected to this controller 70.

In the pretreatment section C configured as described above, as in the case of the plating treatment section E, the pretreatment liquid is circulated through the above piping system to perform the pretreatment on the work 1. Will be done. That is, as shown by the arrow in the figure, the pretreatment liquid in the tank 4C is supplied to the treatment device main body 50, flows between the outer surface of the flow path forming member 58 and the wall surface of the hollow portion of the work 1, and the work 1 Flows into the inside of the flow path forming member 58 through the upper end portion of the above, and is returned to the tank 4E through the pretreatment liquid recovery pipe 52.

By the way, when the pretreatment progresses as described above, accordingly, oil components, constituent metal ions of the work 1 and the like are dissolved and mixed in the pretreatment liquid, which deteriorates the pretreatment liquid. Become. Therefore, in the pretreatment section C, the deterioration of the pretreatment liquid is avoided and its quality is kept constant and constant as described below.

That is, in the pretreatment section C, at the same time when the pretreatment operation is started, the pump 66 is operated to discharge the pretreatment liquid in the tank 4C, while at the same time, the pretreatment lost thereby. In order to replenish the liquid, the supply means 60 to 62 are operated to supply nitric acid, hydrofluoric acid and water to the tank 4C.

More specifically, the pump 66 continuously discharges the pretreatment liquid in the tank 4C by a fixed amount to the mixed acid liquid discharge tank 4C 'while operating the supply means 60 and 61. , Nitric acid and hydrofluoric acid corresponding to the amount contained in the discharged pretreatment liquid are continuously supplied in a fixed ratio at a predetermined ratio, and during this, the inside of the tank 4C detected by the level sensor 68 is detected. The supply means 62 is operated to supply water so that the liquid level of the pretreatment liquid becomes a predetermined level, thereby maintaining the concentration of the treatment liquid.

By supplying nitric acid, hydrofluoric acid and water while continuously discharging the pretreatment liquid in the tank 4C as described above, the pretreatment liquid in the tank 4C is substantially always fresh. It can be replaced with a different pretreatment liquid. Therefore, in the pretreatment section C, since the pretreatment liquid can be kept in a proper quality, the function of pretreatment such as etching can be appropriately maintained, and overetching or insufficient etching can occur. There is no. Moreover, there is no need to replace the entire pretreatment liquid, which is preferable in terms of worker safety. Further, since it is not necessary to stop the pretreatment unit C when replacing the pretreatment liquid, it is extremely convenient in terms of production efficiency as compared with the conventional one in which the entire apparatus needs to be stopped when changing the pretreatment liquid. Is good.

In the above embodiments, the present invention is applied to the plating processing section E and the mixed acid etching processing section C, but the present invention can also be applied to other processing sections. Further, in each of the above embodiments, the processing unit is configured to perform plating or pretreatment at high speed while flowing the processing liquid, but for example, by storing the processing liquid in a bath and immersing the work The present invention is also applicable to a plating treatment unit of a type that performs plating or pretreatment.

Besides this, the specific structure is not limited to the above-mentioned embodiment, but can be changed appropriately. For example, in the plating processing section E and the mixed acid etching processing section C, 3
The base supply means 21 to 23 and 60 to 62 are respectively provided to supply the required substances to the tank 4E or the tank 4C individually. For example, a substance obtained by mixing the required substances at a predetermined ratio. May be generated in advance and supplied from one supply means.

[0071]

As described above, according to the present invention, based on the information indicating the functional deterioration of the surface treatment liquid or the conditions corresponding to the functional deterioration, the elements acting in the direction in which the function of the surface treatment liquid is restored are provided. Since the surface treatment liquid is continuously or intermittently supplied into the bath during the surface treatment operation, the function of the surface treatment liquid is always ensured, and thereby the surface treatment effect can be favorably maintained.

At this time, when the surface treatment solution is a plating solution, the plating solution is appropriately supplied by supplying the plating material into the bath according to the information related to the consumption of the plating material by the plating operation. It can be maintained, and the plating process can be appropriately continued. Especially when the plating solution uses nickel as the main plating material, the pH value of the plating solution is detected, and nickel carbonate is supplied according to the change in the value to keep the plating solution in an appropriate condition. You can Further, when the plating solution is made to flow between the soluble electrode and the surface to be plated and nickel of the plating solution is supplemented by elution of the soluble electrode, the soluble electrode is adjusted so that the pH value of the plating solution varies below an appropriate value. If the elution of nickel is carried out, there is almost no need to perform treatment for correcting the excessive nickel supply.

When the surface treatment liquid is a pretreatment liquid comprising a treatment solute and a solvent, the pretreatment liquid in the bath is continuously discharged while the pretreatment liquid is continuously discharged as the pretreatment liquid is used. At the same time, by supplying a predetermined amount of treated solute into the bath and supplying the solvent so that the liquid level in the bath is at a predetermined level, the quality of the pretreatment liquid can be maintained at an appropriate level. The treatment can be suitably continued.

Further, a supplying means for supplying the plating material of the plating solution from the storage portion into the bath, a detecting means for detecting information relating to the consumption of the plating material by the plating operation, and the information detected by the detecting means. Based on the provision of the control means for controlling the supply means so as to supply the plating material into the bath based on the above, if the management device for the plating solution stored in the bath is configured, the plating material in the storage part is The plating solution is supplied to the plating solution in the bath according to the information related to the consumption of the plating material detected by the detection means, so that the plating solution can be automatically maintained in a proper quality, and the plating process is suitable. Can be sustained.

At this time, if the plating solution contains nickel as the main plating material, a pH meter is applied as the above-mentioned detecting means, and the pH value in the bath is detected by the pH meter. Accordingly, by supplying nickel carbonate into the bath, the plating solution can be maintained in a proper quality.

Further, supply sources for supplying the treatment solute and water of the pretreatment liquid, the first and second supply means for respectively supplying these into the bath, and the liquid level of the pretreatment liquid in the bath. Liquid level detecting means for detecting the pretreatment liquid, a discharging means for discharging the pretreatment liquid in the bathtub by a predetermined amount, a discharge tank for storing the pretreatment liquid discharged thereby, and a pretreatment in the bathtub during the pretreatment work. While discharging the liquid, while supplying a predetermined amount of treated solute according to the amount of this pre-discharge treatment liquid into the bath,
A control means for controlling the first and second supply means and the discharge means so as to supply water so that the liquid level becomes a predetermined level based on the detection result by the liquid level detection means. By configuring a management device for the pretreatment liquid stored in the bathtub, the pretreatment liquid in the bathtub is discharged by a predetermined amount at the time of the pretreatment work, and a predetermined amount according to the amount of the pretreatment liquid discharged. The treatment solute of (1) is supplied to the bath and water is supplied to the bath to maintain the liquid level of the pretreatment liquid at a predetermined level, which allows the pretreatment liquid to be automatically maintained in a proper quality. The pretreatment can be suitably continued.

[Brief description of drawings]

FIG. 1 is a plan view showing an outline of an entire plating processing system to which the present invention is applied.

FIG. 2 is a schematic diagram showing a piping system and a control system of a plating processing section.

FIG. 3 is an enlarged view showing an electrode portion of a plating processing section.

FIG. 4 is a time chart showing an example of control in the plating processing section.

FIG. 5 is a schematic diagram showing a piping system and a control system of a mixed acid etching treatment section.

[Explanation of symbols]

 E plating processing part 4E tank 10 processing device main body 21,22,23 supply means 21a feeder 22a, 23a tank 21b motor 22b, 23b pump 21c hopper 30 pH sensor 31 controller

Claims (8)

[Claims] 1. A method of managing a surface treatment liquid stored in a bath, wherein the function of the surface treatment liquid is restored based on information indicating a decrease in the function of the surface treatment liquid or a condition corresponding to the decrease in the function. A method for managing a surface treatment liquid, which comprises continuously or intermittently supplying an element acting in a direction to a bath during the surface treatment operation. 2. The surface treatment solution is a plating solution containing a plating material, and the plating material is supplied into the bath according to information related to consumption of the plating material by the plating operation. The surface treatment liquid management method according to claim 1, which is characterized in that. 3. The plating solution is mainly composed of nickel as a plating material, and the pH value of the plating solution is detected as information relating to nickel consumption, and nickel carbonate is detected in accordance with the change. The surface treatment liquid management method according to claim 2, wherein the surface treatment liquid is supplied into the bathtub. 4. The plating solution is caused to flow between a soluble electrode and a surface to be plated, and nickel is replenished from the soluble electrode into the plating solution as plating is performed. The method for managing a surface treatment liquid according to claim 3, wherein the amount of nickel eluted from the soluble electrode is regulated so that the pH value is equal to or lower than an appropriate value. 5. The surface treatment liquid is a pretreatment liquid consisting of a treatment solute and a solvent, and is continuously used as the pretreatment liquid is used by the pretreatment work as a condition related to the functional deterioration due to deterioration of the pretreatment liquid. In addition, while discharging the pretreatment liquid in the bathtub by a predetermined amount, a predetermined amount of treatment solute corresponding to the amount of the pretreatment liquid discharged is supplied into the bathtub, and the liquid level in the bathtub becomes a predetermined level. The method for managing a surface treatment liquid according to claim 1, wherein the solvent is supplied into the bath as described above. 6. A management device for a plating solution stored in a bath, which is a supply means for supplying the plating material of the plating solution from the storage portion into the bath, and information relating to consumption of the plating material by the plating operation. A surface treatment liquid management apparatus comprising: a detection unit for detecting the above-mentioned condition; and a control unit for controlling the supply unit so as to supply the plating substance into the bath based on the information detected by the detection unit. 7. The plating solution is mainly composed of nickel as a plating material, and a pH meter is provided as the detecting means, and the pH value of the plating solution in the bath is detected by the pH meter. 7. The surface treatment liquid management apparatus according to claim 6, wherein nickel carbonate is supplied into the bath. 8. A management device for pretreatment liquid stored in a bathtub, comprising a supply source for supplying a treatment solute of the pretreatment liquid and water, and first and second supply sources for supplying these to the bathtub, respectively. 2 supply means, liquid level detecting means for detecting the liquid level of the pretreatment liquid in the bath, discharge means for discharging the pretreatment liquid in the bath by a predetermined amount, and pretreatment liquid discharged by the discharge means. And a discharge tank that stores the pretreatment liquid in the bathtub during the pretreatment work, while supplying a predetermined amount of treatment solute according to the amount of the discharge pretreatment liquid into the bathtub, and the liquid level detecting means. A surface provided with control means for controlling the first and second supply means and the discharge means so as to supply water so that the liquid level becomes a predetermined level based on the detection result by Processing liquid management device.