JPH07276535A - Plastic molded product - Google Patents

Abstract

PURPOSE:To obtain a plastic molded product on which electronic parts can be mounted easily by hand operation, by a method wherein a protrusion prepared in accordance with a form and size of the electronic parts is provided on a part where the electronic parts of the plastic molded product are to mount. CONSTITUTION:Two sets of protrusions 4a, 4b comprised of an easily platable material 4 are formed respectively on positions 1a, 1b corresponding to connecting terminals 3a, 3b in a position where electronic parts 2 of an insulator 1 is mounted so that the connecting terminals 3a, 3b are placed among the two sets of protrusions 4a, 4b. The protrusions 4a, 4b are formed in accordance with a form and size of the electronic parts. Namely, a gap S where the protrusions 4a, 4b of the sets each pinch the connecting terminals 3a, 3b is arranged at an interval into which the connecting terminals 3a, 3b are apt to insert and a distance L mutually between the protrusions 4a, 4b of the two sets each is arranged at a distance longer than a length of a main body of the electronic parts 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plastic molded product such as a housing, a circuit board, a circuit component, a connector and an electromagnetic shield component, the surface of which is partially metallized by plating, etc. Regarding molded products.

[0002]

2. Description of the Related Art Conventionally, a printed wiring board has been used as a wiring board on which electronic parts are mounted, which has greatly contributed to the recent reduction in size and weight of electronic and electrical equipment and enhancement of functionality. Fine patterns and high-density packaging are being promoted to reduce size and weight.

On the other hand, a plastic molded article provided with a conductor pattern on its three-dimensional surface has been attracting attention for its reduction in size and weight, but conventionally, it was merely used as a wiring. However, in recent years, mounting of electronic parts has been required, and further, high-density mounting has been desired similarly to a printed wiring board.

A method for producing a composite molded article having a patterned metal layer of this kind is disclosed in, for example, JP-A-63-50482, JP-A-1-207989, and the like, electroless plating. After forming a primary molded body of a portion corresponding to the skeleton with a plastic material that can be easily applied (hereinafter referred to as "easy-to-stick material"), electroless plating is applied to an unnecessary plating portion on the outer surface of the primary molded body. Difficult-to-use plastic materials (hereinafter referred to as "hard plating materials")
There is a two-color molding method in which a metal layer is formed by electroless plating on the exposed portion of the molded body of the easily-platable material after injecting and integrally molding these. As another manufacturing method,
Molding is performed using only the easy-plating material, and after applying a permanent resist on the surface of the easy-plating material, a metal layer is formed on the exposed portion of the easy-plating material by electroless plating. A transfer method or the like is known in which a circuit is transferred to the surface after molding inside.

[0005]

By the way, there is surface mounting as a method of high-density mounting, and when mounting on a printed wiring board, electronic components are mounted at predetermined mounting positions by an automatic component mounting machine.

However, this method is easy when the printed wiring board is a flat plate, but in the case of a plastic molded product, there are many three-dimensional shapes, and even if the mounting surface is a flat plate, there are steps or vertical surfaces. In some cases, it is practically difficult to mount electronic components by an automatic component mounting machine, and manual mounting is the mainstream. Further, in surface mounting, it is almost impossible to manually position the components, which has not been practically performed.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide a plastic molded product on which electronic parts can be easily mounted by hand.

[0008]

In order to achieve the above object, the present invention adjusts the shape and size of an electronic component in a place where the electronic component of a plastic molded product having a patterned metal layer is to be mounted. It is provided with a protruding portion.

In the present invention, in addition to the above structure, the protrusion may be formed on the surface of the patterned metal layer at the place where the electronic component is to be mounted.

In the present invention, in addition to the above structure, the protrusion may be formed in the insulating portion at the place where the electronic component is to be mounted.

According to the present invention, in addition to the above-mentioned constitution, a plastic molded article, in which a catalyst for electroless plating is mixed and primary injection-molded, and a part of the primary molded body of the easy-platable material are exposed. And a hard-to-plate material that is secondarily injection-molded so that the exposed surface becomes a predetermined patterned metal layer, and a protrusion is formed at the time of injection molding of either the easily-platable material or the hard-to-plate material. May be.

[0012]

According to the above construction, since the projections are provided at the positions where the electronic parts of the plastic molded products are to be mounted, the projections corresponding to the shape and size of the electronic parts are provided. Even when the electronic component is vertical, the electronic component can be easily and reliably positioned manually. Further, since the connection terminal of the electronic component is fixed to the plastic molded product by the protrusion, the electronic component is prevented from being detached during the transportation and work before soldering, and the reliability after soldering is improved. .

[0013]

An embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

1A and 1B are views showing an embodiment in which an electronic component is mounted on a plastic molded product of the present invention. FIG. 1A is a front sectional view and FIG. 1B is a side sectional view. ing.

In FIGS. 1A and 1B, reference numeral 1 is an insulator made of a material that is difficult to plate. Electronic component 2 of insulator 1
At the positions 1a and 1b corresponding to the connection terminals 3a and 3b where the is mounted, two sets of protrusions 4a and 4b made of the easy-plating material 4 are formed so as to sandwich the connection terminals 3a and 3b, respectively. There is. The protrusions 4 a and 4 b are formed according to the shape and size of the electronic component 2. That is,
The interval S between the protrusions 4a and 4b of each set sandwiching the connection terminals 3a and 3b is arranged such that the connection terminals 3a and 3b are easily inserted, and the distance L between the two sets of protrusions 4a and 4b is an electron. It is arranged at a distance longer than the length of the body of the component 2. It is desirable that the gaps d ₁ and d ₂ between the electronic components 2 and the protrusions 2a and 2b after mounting the electronic components are small from the viewpoint of alignment. This is also advantageous because it improves the reliability of the solder joints that follow. However, depending on the soldering method, some gap may be required, and in that case, it is better to partially form the gap. The cross sections of the protrusions 4a and 4b are formed in a substantially concave shape, and the patterned metal layers 5a and 5b made of copper plating are applied to the surfaces of the protrusions 4a and 4b. The connection terminals 3a and 3b of the electronic component 2 are solder 6
The protrusions 4a and 4b are connected by a and 6b. A plastic molded product 7 is formed of the insulator 1, the protrusions 4a and 4b, and the patterned metal layer. As a molding material of the plastic molded product 7, it is desirable to use so-called engineer plastic in consideration of rigidity, dimensional stability, heat resistance and the like.

The electronic component 2 is preferably a surface-mounting device in which the connection terminals have been processed into a substantially L-shape in advance, but the connection terminals of an ordinary electronic component are preliminarily manually bent and cut into a substantially L-shape. You may use what was processed.

A method for producing such a plastic molded product is formed by a two-color molding method. That is, the easily-platable material 4 is used to form the protrusions 4a and 4b and the patterned metal layers 5a and 5b.
After forming a primary molded body by injection molding a portion corresponding to b, the non-plating material 1 is injected into the plating-free portion of the outer surface of the primary molded body, and these are integrally molded as a secondary molding by injection molding, The patterned metal layer 5 is formed on the exposed portion of the molded body made of the easily-platable material 4 by electroless plating.
A plastic molded product 7 is formed by forming a and 5b.

Next, the operation of the embodiment will be described.

Since the projections 4a and 4b corresponding to the shape and size of the electronic component 2 are provided at the place where the electronic component 2 of the plastic molded product 7 is to be mounted, there is a step at the place where the electronic component 2 is to be mounted. Also, the positioning of the electronic component 2 can be performed easily and reliably by hand even if it is vertical. Moreover, since the connection terminals 3a and 3b of the electronic component 2 are fixed to the plastic molded product 7 by the protrusions 4a and 4b, the electronic component 2 is prevented from being detached during the transportation and the work before soldering, and The reliability after soldering is improved.

As described above, according to the present embodiment, since the protrusions corresponding to the shape and size of the electronic component are provided at the place where the electronic component of the plastic molded product having the patterned metal layer on the surface is to be mounted, Electronic parts can be easily mounted by work.

FIG. 2 is a view showing another embodiment in which electronic parts are mounted on the plastic molded product of the present invention, and FIG.
Shows a front sectional view, and FIG. 2B shows a side sectional view.

The difference from the embodiment shown in FIGS. 1 (a) and 1 (b) is that the protrusions are formed of a difficult-to-plate material during the secondary molding.

In FIG. 2, reference numeral 10 is an insulator made of a hard-to-plate material, and two sets of protrusions 11a are provided at positions corresponding to the connection terminals 3a and 3b of the electronic component 2 so as to sandwich the connection terminals 3a and 3b. , 11b are formed respectively. Between the protrusions 11a and 11b of each set, the easily-platable material 12 is provided.
Is formed, and patterned metal layers 13a and 13b made of copper plating are formed on the formed body. A plastic molded product 14 is formed by a molded body made of the hard-to-plate material 10 and the easily-platable material 12 and the patterned metal layers 13a and 13b. The connection terminals 3a, 3b of the electronic component 2 are connected to the patterned metal layers 13a, 13b with solders 15a, 15b.

Such a plastic molded product is formed by the two-color molding method as in the plastic molded product shown in FIG.

In this embodiment, the protrusion is formed at the position corresponding to the connection terminal, but the present invention is not limited to this, and it goes without saying that it may be formed at the position corresponding to the electronic component body. Absent. Further, in the present embodiment, the case where the number of the protruding portions is two has been described, but it may be one, and one for each connecting terminal.
You may form one by one.

[0026]

In summary, according to the present invention, the following excellent effects are exhibited.

Since the protrusions corresponding to the shape and size of the electronic component are provided at the places where the electronic component of the plastic molded product having the patterned metal layer is to be mounted, the electronic component can be easily mounted by hand. it can.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment in which an electronic component is mounted on a plastic molded product of the present invention.

FIG. 2 is a diagram showing another embodiment in which an electronic component is mounted on the plastic molded product of the present invention.

[Explanation of symbols]

 2 Electronic components 4a, 4b Protrusions 5a, 5b Patterned metal layer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hideki Asano Inventor Hideki Asano 5-1-1 Hidakacho, Hitachi City, Ibaraki Hitachi Power Systems Laboratory

Claims (4)

[Claims] 1. A plastic molded article, characterized in that a protrusion corresponding to the shape and size of the electronic component is provided at a place where the electronic component of the plastic molded article having a patterned metal layer on the surface is to be mounted. 2. The plastic molded article according to claim 1, wherein the protrusion is formed on the surface of the patterned metal layer at a place where the electronic component is to be mounted. 3. The plastic molded article according to claim 1, wherein the protrusion is formed in an insulating portion at a place where the electronic component is to be mounted. 4. A plastic-molded article, wherein an electroless plating catalyst is mixed and primary injection molding is performed, and a part of a primary molding of the easy-plating material is exposed and the exposed surface is A difficult-plating material that is subjected to secondary injection molding so as to form a predetermined patterned metal layer, wherein the protrusion is formed at the time of injection molding of either the easy-plating material or the hard-plating material. 1. The plastic molded product according to 1.