JPH07276198A - Grinding machine - Google Patents

Grinding machine

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Publication number
JPH07276198A
JPH07276198A JP6481494A JP6481494A JPH07276198A JP H07276198 A JPH07276198 A JP H07276198A JP 6481494 A JP6481494 A JP 6481494A JP 6481494 A JP6481494 A JP 6481494A JP H07276198 A JPH07276198 A JP H07276198A
Authority
JP
Japan
Prior art keywords
grinding
polishing
reciprocating
adjusted
polishing disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6481494A
Other languages
Japanese (ja)
Inventor
Joichi Takada
穣一 高田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP6481494A priority Critical patent/JPH07276198A/en
Publication of JPH07276198A publication Critical patent/JPH07276198A/en
Pending legal-status Critical Current

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  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

PURPOSE:To provide a grinding machine with good grinding efficiency by which the uniformity of grinding in relation to grinding workpiece can be adjusted. CONSTITUTION:A table 10 as well as grinding workpiece 70 are rotated forcely and a grinding disc 38 is rotated forcely in the same direction. A grinding head 30 as well as a movable body 20 are reciprocated by a reciprocating device 60 and the position of the rotary axial center 35 of the grinding disc 38 is displaced. By pressurizing by approaching motion, the grinding by the grinding disc 38 is carried out uniformly across the entire area in relation to the grinding surface of grinding workpiece 70 by the compound movement of force rotation with reciprocating motion. The grinding head 30 is moved longitudinally by the operation of a position adjusting device 50 and the grinding position by the grinding disc 38 is adjusted. The pitch of the reciprocating motion is adjusted by the operation of the reciprocating device and the reciprocating range and the reciprocating position of the grinding disc 38 are adjusted.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、たとえばディスク、ガ
ラス板、金属板など板状物の平面を研磨するのに使用さ
れる研磨装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus used for polishing a flat surface of a plate-like object such as a disk, a glass plate, a metal plate or the like.

【0002】[0002]

【従来の技術】従来、この種の研磨装置は、図4に示す
ように、機枠と、この機枠に上下で相対向させて配置し
た研磨ディスク80ならびにテーブル81と、前記研磨ディ
スク80に自在継手(ボールベアリングなど)82を介して
連結された昇降杆83と、前記テーブル81に連動する回転
駆動装置などにより構成されていた。そしてテーブル81
に被研磨物84をセットしたのち、回転駆動装置によりテ
ーブル81を強制回転Xさせた状態で、昇降杆83の下降動
により研磨ディスク80を被研磨物84に接近動させ、当接
させることで、研磨ディスク80を、そのフリクションに
よる連れ回り回転Yさせながら、所期の平面研磨を行っ
ていた。
2. Description of the Related Art Conventionally, as shown in FIG. 4, a polishing apparatus of this type has a machine frame, a polishing disk 80 and a table 81 which are arranged on the machine frame so as to face each other in the vertical direction, and the polishing disk 80. It was composed of a lifting rod 83 connected via a universal joint (ball bearing or the like) 82, a rotary drive device interlocking with the table 81, and the like. And table 81
After setting the object 84 to be polished, the table 81 is forcibly rotated X by the rotation drive device, and the lowering and lowering rod 83 moves the polishing disk 80 closer to and abuts the object 84. The desired flat surface polishing was performed while the polishing disk 80 was rotated Y by the friction.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記した従来
の構成によると、研磨ディスク80は、そのフリクション
による連れ回り回転Yであるため、研磨効率が悪く、ま
た被研磨物84に対する研磨の均一性を調整することがで
きなかった。
However, according to the above-mentioned conventional structure, since the polishing disk 80 is rotated by rotation Y due to the friction, the polishing efficiency is poor and the polishing uniformity with respect to the object 84 to be polished is uniform. Could not be adjusted.

【0004】本発明の目的とするところは、研磨効率が
良く、しかも被研磨物に対する研磨の均一性を調整し得
る研磨装置を提供する点にある。
An object of the present invention is to provide a polishing apparatus which has a high polishing efficiency and can adjust the uniformity of polishing with respect to an object to be polished.

【0005】[0005]

【課題を解決するための手段】上記目的を達成すべく本
発明の研磨装置は、機枠と、この機枠に上下で相対向さ
せて配置されかつ相対的に接近離間自在な研磨ディスク
ならびにテーブルと、これら研磨ディスクやテーブルに
連動するそれぞれの回転駆動装置と、前記研磨ディスク
と回転駆動装置とからなる研磨ヘッドを装備した可動体
とを有し、前記機枠に、可動体を往復動させる往復動装
置を設けるとともに、その往復動ピッチを調整自在に構
成し、前記可動体に、前記研磨ヘッドをテーブル回転軸
心に対して接近離間動させる位置調整装置を設けてい
る。
In order to achieve the above object, a polishing apparatus of the present invention comprises a machine frame, a polishing disk and a table which are vertically opposed to the machine frame and which can be relatively moved toward and away from each other. And a respective rotary drive device that interlocks with these polishing discs and tables, and a movable body equipped with a polishing head composed of the polishing disc and the rotary drive device, and reciprocates the movable body in the machine frame. A reciprocating device is provided, and a reciprocating pitch thereof is adjustable, and a position adjusting device for moving the polishing head toward and away from the table rotation axis is provided on the movable body.

【0006】[0006]

【作用】かかる本発明の構成によると、テーブルと研磨
ディスクとを相対的に離間させたのち、テーブル上に被
研磨物をセットした状態で、両者を相対的に接近させる
ことにより、被研磨物の研磨面に対して研磨ディスクを
当接させ得る。このような当接の前において両回転駆動
装置や往復動装置を稼働し、各部を回転動や移動させる
ことで所期の研磨を行える。
According to the structure of the present invention, after the table and the polishing disk are relatively separated from each other, the objects to be polished are set relatively close to each other while the objects to be polished are set on the table. The polishing disc may be brought into contact with the polishing surface of the. Before such contact, both rotary drive devices and reciprocating devices are operated to rotate and move the respective parts, whereby desired polishing can be performed.

【0007】すなわち、回転駆動装置によりテーブルと
ともに被研磨物を強制回転させ得、また回転駆動装置に
より研磨ディスクを同方向に強制回転させ得る。そして
往復動装置により可動体とともに研磨ヘッドを往復動さ
せることで、研磨ディスクの回転軸心の位置を変位させ
得る。したがって接近動により加圧することによって、
被研磨物と研磨ディスクとの強制回転と、研磨ディスク
の往復動との複合移動で、研磨ディスクによる研磨を、
被研磨物の研磨面に対して全域で均一状に行える。
That is, the object to be polished can be forcibly rotated together with the table by the rotary drive device, and the polishing disk can be forcibly rotated in the same direction by the rotary drive device. Then, the position of the rotation axis of the polishing disk can be displaced by reciprocating the polishing head together with the movable body by the reciprocating device. Therefore, by applying pressure by the approaching movement,
By the combined movement of the forced rotation of the object to be polished and the polishing disc and the reciprocating movement of the polishing disc, the polishing by the polishing disc
It can be performed uniformly over the entire polishing surface of the object to be polished.

【0008】そして被研磨物の形状に応じて調整を行え
る。すなわち、位置調整装置の操作で研磨ヘッドを前進
移動または後退移動させることにより、研磨ディスクの
回転軸心をテーブルの回転軸心に対して接近または離間
動させ得、以て研磨ディスクによる研磨位置を調整し得
る。また往復動装置の操作で往復動ピッチを調整するこ
とで、研磨ディスクの往復動の範囲(長さ)や往復動を
行う位置を調整し得る。これにより研磨ディスクを、変
位した研磨位置で、異なる往復動の範囲で、かつ変位し
た往復動位置で強制回転させて、被研磨物の研磨面に対
して研磨を全域で均一に行え得る。
The adjustment can be made according to the shape of the object to be polished. That is, by moving the polishing head forward or backward by operating the position adjusting device, the rotation axis of the polishing disk can be moved toward or away from the rotation axis of the table. Can be adjusted. Further, by adjusting the reciprocating pitch by operating the reciprocating device, it is possible to adjust the reciprocating range (length) of the polishing disk and the reciprocating position. As a result, the polishing disk can be forcibly rotated at different displaced reciprocating positions and at different displaced reciprocating positions, so that the polishing surface of the object to be polished can be uniformly polished over the entire area.

【0009】[0009]

【実施例】以下に本発明の一実施例を図1〜図3に基づ
いて説明する。図1、図2において1は機枠で、空間2
を形成する箱枠状の下部機枠3と、この下部機枠3の一
側上面から立設された上部機枠4とから構成される。前
記下部機枠3側には、テーブル10が縦方向の回転軸心11
の回りで回転自在に設けられるとともに、テーブル10に
連動する回転駆動装置12が設けられる。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 1 and 2, 1 is a machine frame, and space 2
And a lower machine casing 3 having a box-like shape, and an upper machine casing 4 erected from the upper surface of one side of the lower machine casing 3. On the lower machine casing 3 side, a table 10 has a vertical rotation axis 11
A rotary drive device 12 is provided that is rotatable around the table 10 and is interlocked with the table 10.

【0010】すなわち、下部機枠3の上板の中央部に開
口5が形成されるとともに、この開口5を通して減速機
13が配置され、この減速機13は、フランジ部14を介して
上板に載置され固定されている。そして減速機13から上
方へと回転軸15が取り出され、この回転軸15の上端に前
記テーブル10が固定されている。前記空間2内にはモー
タ16が配置され、その駆動軸17と前記減速機13の受動軸
18とが無端伝動装置19を介して連動連結されている。以
上の13〜19によりテーブル10の回転駆動装置12が構成さ
れる。
That is, an opening 5 is formed in the central portion of the upper plate of the lower machine frame 3, and the reduction gear is passed through this opening 5.
13 is arranged, and the reduction gear 13 is mounted and fixed on the upper plate via a flange portion 14. Then, the rotary shaft 15 is taken out upward from the speed reducer 13, and the table 10 is fixed to the upper end of the rotary shaft 15. A motor 16 is arranged in the space 2 and has a drive shaft 17 and a passive shaft of the speed reducer 13.
18 and 18 are interlockingly connected via an endless transmission device 19. The rotation drive device 12 for the table 10 is constituted by the above 13 to 19.

【0011】前記上部機枠4の上端には可動体20が設け
られる。すなわち上部機枠4の上面には水平方向のガイ
ドレール21が、回転軸心11に対して接近離間方向で一対
に配設され、これらガイドレール21に摺動体22を介して
前記可動体20が支持案内されるべく構成されている。
A movable body 20 is provided on the upper end of the upper machine casing 4. That is, a pair of horizontal guide rails 21 are arranged on the upper surface of the upper machine frame 4 in the direction of approaching and separating from the rotating shaft center 11, and the movable body 20 is mounted on these guide rails 21 via a sliding body 22. It is configured to be supported and guided.

【0012】この可動体20には、研磨ディスク(砥石や
研磨布など)38と回転駆動装置40とからなる研磨ヘッド
30が装備され、そして研磨ヘッド30をテーブル10の回転
軸心11に対して接近離間動させる位置調整装置50が設け
られる。すなわち長方形で箱枠状のヘッド本体31が設け
られ、このヘッド本体31は基部が可動体20上に載置され
るとともに、適宜のガイド機構(図示せず。)の案内に
より回転軸心11に対して接近離間動すべく構成されてい
る。
The movable body 20 has a polishing head composed of a polishing disk (grinding stone, polishing cloth, etc.) 38 and a rotary drive unit 40.
A position adjusting device 50 for moving the polishing head 30 toward and away from the rotation axis 11 of the table 10 is provided. That is, a rectangular box-shaped head main body 31 is provided, the base of the head main body 31 is placed on the movable body 20, and the rotary shaft center 11 is guided by an appropriate guide mechanism (not shown). It is configured to move toward and away from each other.

【0013】前記ヘッド本体31の遊端には、軸受41を介
して筒軸42が、縦軸心35の回りに回転自在に配設され、
この筒軸42にスプライン嵌合43した縦軸44の下端に、自
在継手45を介して研磨ディスク38が取り付けられてい
る。そしてヘッド本体31から一対の側板32が立設される
とともに、両側板32の上部間に渡した支持板33が設けら
れ、この支持板33に支持させた下向きのシリンダー装置
34の作動杆が前記縦軸44の上端に回転継手49を介して連
結されている。したがってシリンダー装置34の作動で縦
軸44を昇降動させることで、テーブル10に対して研磨デ
ィスク38が上方から相対的に接近離間自在となる。
At the free end of the head body 31, a cylindrical shaft 42 is disposed via a bearing 41 so as to be rotatable around a vertical axis 35,
A polishing disc 38 is attached to the lower end of a vertical axis 44, which is spline-fitted 43 on the cylindrical shaft 42, via a universal joint 45. A pair of side plates 32 are erected from the head body 31, and a support plate 33 is provided between the upper portions of the side plates 32. The downward cylinder device supported by the support plates 33 is provided.
34 operating rods are connected to the upper end of the vertical axis 44 via a rotary joint 49. Therefore, by moving the vertical axis 44 up and down by the operation of the cylinder device 34, the polishing disk 38 can be relatively moved toward and away from the table 10 from above.

【0014】前記ヘッド本体31の基端には、下向きのギ
ヤードモータ46が配設され、その出力軸47と前記筒軸42
の上端とが、タイミングベルト形式の無端伝動装置48を
介して連動連結されている。以上の41〜48により、前記
研磨ディスク38に連動した回転駆動装置40が構成され
る。
A downward geared motor 46 is arranged at the base end of the head body 31, and its output shaft 47 and the cylinder shaft 42 are arranged.
The upper end of the gear is linked by an endless transmission device 48 in the form of a timing belt. The above-mentioned 41 to 48 constitute a rotary drive device 40 linked with the polishing disk 38.

【0015】前記位置調整装置50は、前記可動体20側か
らのブラケット51に回転のみ自在に取り付けられた前後
方向の螺子軸52と、この螺子軸52が螺合すべく可動体20
に取り付けられたナット体53とから構成され、螺子軸52
の外端には、角棒状の被操作部54が形成されている。し
たがって操作具を被操作部54にセットして螺子軸52を正
逆に回転させることで、ナット体53を介して可動体20を
移動させ得る。
The position adjusting device 50 includes a screw shaft 52 in the front-rear direction, which is rotatably attached to a bracket 51 from the movable member 20, and the movable member 20 so that the screw shaft 52 can be screwed.
And the nut body 53 attached to the screw shaft 52.
A rectangular rod-shaped operated portion 54 is formed at the outer end of the. Therefore, the movable body 20 can be moved through the nut body 53 by setting the operating tool on the operated portion 54 and rotating the screw shaft 52 in the forward and reverse directions.

【0016】前記機枠1には、可動体20を往復動させる
往復動装置60が、その往復動ピッチを調整自在として設
けられる。すなわち上部機枠4の一側部には上向きのギ
ヤードモータ61が配設され、その出力軸62に円板体63が
取り付けられている。この円板体63には、出力軸62から
の距離が異なる複数の連結孔64が形成され、これら連結
孔64の一つを使用して、クランクロッド65の一端が縦ピ
ン66を介して連結され、またクランクロッド65の他端
は、可動体20からのブラケット67に縦ピン68を介して連
結されている。
A reciprocating device 60 for reciprocating the movable body 20 is provided on the machine frame 1 so that the reciprocating pitch thereof can be adjusted. That is, an upward geared motor 61 is disposed on one side of the upper machine casing 4, and a disc 63 is attached to the output shaft 62 thereof. A plurality of connecting holes 64 having different distances from the output shaft 62 are formed in the disc body 63, and one end of the crank rod 65 is connected via a vertical pin 66 using one of the connecting holes 64. The other end of the crank rod 65 is connected to a bracket 67 from the movable body 20 via a vertical pin 68.

【0017】ここで縦ピン66,68間の長さは、クランク
ロッド65をターンバックル形式にすることにより、また
は縦ピン66に対するクランクロッド65の連結位置を変更
自在に構成することにより、調整自在に構成されてい
る。なおギヤードモータ61や円板体63などはカバー69に
より覆われている。またテーブル10の周辺と下部も、カ
バーを兼ねる排液ダクト25で囲まれている。
Here, the length between the vertical pins 66 and 68 can be adjusted by making the crank rod 65 a turnbuckle type or by changing the connecting position of the crank rod 65 to the vertical pin 66. Is configured. The geared motor 61 and the disc body 63 are covered with a cover 69. Further, the periphery and the lower part of the table 10 are also surrounded by a drainage duct 25 which also serves as a cover.

【0018】以下に上記実施例における作用を説明す
る。シリンダー装置34の収縮動で縦軸44を上昇させ、図
1に示すようにテーブル10に対して研磨ディスク38を離
間させた状態で、テーブル10上に矩形板状物(被研磨
物)70がセットされる。この状態でシリンダー装置34を
伸展動させ、縦軸44を介して研磨ディスク38側を下降さ
せることにより、矩形板状物70の上面に対して研磨ディ
スク38を軽く当接し得る。このような当接の前において
各モータ16,46,61が稼働され、各部を回転動や移動さ
せて所期の研磨を行う。
The operation of the above embodiment will be described below. When the vertical axis 44 is raised by the contracting movement of the cylinder device 34 and the polishing disk 38 is separated from the table 10 as shown in FIG. 1, a rectangular plate-shaped object (object to be polished) 70 is placed on the table 10. Set. In this state, the cylinder device 34 is extended and the polishing disk 38 side is lowered via the vertical axis 44, whereby the polishing disk 38 can be lightly contacted with the upper surface of the rectangular plate-shaped object 70. Before such contact, the motors 16, 46, 61 are operated to rotate or move the respective parts to perform desired polishing.

【0019】すなわち回転駆動装置12におけるモータ16
の回転は、無端伝動装置19や減速機13を介して回転軸15
に伝達され、この回転軸15に固定しているテーブル10、
すなわち矩形板状物70を回転軸心11の周りに低速回転A
させる。また研磨ディスク38側の回転駆動装置40におけ
るギヤードモータ46の回転は、無端伝動装置48から筒軸
42、スプライン嵌合43、縦軸44、自在継手45を介して研
磨ディスク38に伝達され、この研磨ディスク38を、前述
した下部側と同方向で縦軸心35の周りに高速回転Bさせ
る。
That is, the motor 16 in the rotary drive device 12
Rotation of the rotary shaft 15 via the endless transmission 19 and the speed reducer 13.
The table 10, which is transmitted to and fixed to this rotating shaft 15,
That is, the rectangular plate 70 is rotated at low speed around the rotation axis 11.
Let Further, the rotation of the geared motor 46 in the rotary drive device 40 on the polishing disk 38 side is controlled by the endless transmission device 48 from the cylindrical shaft.
42, the spline fitting 43, the vertical axis 44, and the universal joint 45 are transmitted to the polishing disk 38, and the polishing disk 38 is rotated at a high speed B about the vertical axis 35 in the same direction as the lower side.

【0020】そして往復動装置60のギヤードモータ61の
回転により、円板体63を介して偏心位置の縦ピン66を回
転させ、これによりクランクロッド65を、揺動させなが
ら押し引き動させる。これによりクランクロッド65に縦
ピン68とブラケット67とを介して連結されている可動体
20がガイドレール21に支持案内されて往復動され、以て
可動体20で支持している研磨ヘッド30を高速で往復動C
させる。
The rotation of the geared motor 61 of the reciprocating device 60 causes the vertical pin 66 in the eccentric position to rotate via the disc body 63, whereby the crank rod 65 is pushed and pulled while swinging. As a result, a movable body connected to the crank rod 65 through the vertical pin 68 and the bracket 67.
20 is supported and guided by the guide rail 21 and is reciprocated, whereby the polishing head 30 supported by the movable body 20 is reciprocated at high speed.
Let

【0021】上述したような各部の動作に基づいて、矩
形板状物70の上面が研磨される。すなわち矩形板状物70
ならびに研磨ディスク38とは、同方向に強制的に低速回
転Aならびに高速回転Bされることになり、さらに研磨
ディスク38を有する研磨ヘッド30が横に往復動Cされ
て、研磨ディスク38の回転軸心である縦軸心35の位置を
変位させることになる。
The upper surface of the rectangular plate-like object 70 is polished based on the operation of each part as described above. That is, a rectangular plate 70
In addition, the polishing disk 38 is forcibly rotated in the same direction at a low speed A and at a high speed B, and the polishing head 30 having the polishing disk 38 is reciprocated laterally C to rotate the rotation axis of the polishing disk 38. The position of the vertical axis 35, which is the heart, is displaced.

【0022】したがってこの状態でシリンダー装置34の
伸展により荷重を掛けることによって、矩形板状物70と
研磨ディスク38との強制の回転A,Bと、研磨ディスク
38の往復動Cとの複合移動によって、矩形板状物70の上
面に対する研磨ディスク38の当接は上面全域で均一に行
え、以て研磨残りの生じない研磨を行える。なお研磨
は、水や油や研磨液を供給しながら(かけながら)行わ
れ、その際に水などは排液ダクト25を介して回収され、
また飛散して往復動装置60に付着することはカバー69に
より防止し得る。
Therefore, in this state, by applying a load by the extension of the cylinder device 34, the forced rotation A and B between the rectangular plate 70 and the polishing disk 38 and the polishing disk
By the combined movement of the reciprocating motion C of 38, the polishing disk 38 can be brought into contact with the upper surface of the rectangular plate-like object 70 uniformly over the entire upper surface, and thus polishing can be performed without causing polishing residue. The polishing is performed while supplying (spraying) water, oil, or a polishing liquid, at which time water or the like is collected through the drainage duct 25,
The cover 69 can prevent the particles from scattering and adhering to the reciprocating device 60.

【0023】たとえば被研磨物が図3に示すように長方
形板状物71の場合、その形状(長さ)に応じて調整が行
われる。すなわち、位置調整装置50の被操作部54に操作
具をセットして螺子軸52を正逆に回転させ、ナット体53
を介して可動体20を前進移動または後退移動させる。こ
れにより研磨ディスク38の縦軸心35をテーブル10の回転
軸心11に対して接近または離間動させ得、以て研磨ディ
スク38による研磨位置を調整し得る。
For example, when the object to be polished is a rectangular plate 71 as shown in FIG. 3, the adjustment is performed according to the shape (length). That is, the operation tool is set on the operated portion 54 of the position adjusting device 50, the screw shaft 52 is rotated in the forward and reverse directions, and the nut body 53 is rotated.
The movable body 20 is moved forward or backward via the. As a result, the vertical axis 35 of the polishing disk 38 can be moved toward or away from the rotational axis 11 of the table 10, and the polishing position of the polishing disk 38 can be adjusted accordingly.

【0024】また往復動装置60においては、縦ピン66に
よる連結が外され、そして目的とする連結孔64を使用し
て、クランクロッド65の一端が縦ピン66を介して連結さ
れる。さらに、ターンバックル操作や、縦ピン66に対す
るクランクロッド65の連結位置の変更などにより、縦ピ
ン66,68間の長さが調整される。これらの操作により、
可動体20、すなわち研磨ディスク38の往復動の範囲(長
さ)、ならびに往復動Cを行う位置を調整し得る。
Further, in the reciprocating device 60, the connection by the vertical pin 66 is disconnected, and one end of the crank rod 65 is connected through the vertical pin 66 by using the target connecting hole 64. Further, the length between the vertical pins 66 and 68 is adjusted by a turnbuckle operation or a change in the connecting position of the crank rod 65 to the vertical pin 66. By these operations,
The movable body 20, that is, the range (length) of the reciprocating motion of the polishing disk 38, and the position where the reciprocating motion C is performed can be adjusted.

【0025】このような調整により研磨ディスク38を、
変位した研磨位置で、かつ異なる往復動の範囲で、さら
に変位した往復動位置で強制回転させて、長方形板状物
71の上面に対する当接を上面全域で均一状に行え、以て
研磨残りの生じない研磨を行える。その際に、長方形板
状物71の長辺側と短辺側で、研磨ディスク38の往復動C
を同期させ得るように構成されている。これにより、短
辺側で研磨ディスク38が長方形板状物71の外辺に寄り過
ぎて、長方形板状物71の平面性が損なわれるのを防ぐこ
とができる。
By such adjustment, the polishing disk 38 is
A rectangular plate-shaped object is forcibly rotated at the displaced polishing position and within the range of different reciprocating motion, and further at the displaced reciprocating position.
The contact of 71 with the upper surface can be performed uniformly over the entire upper surface, and therefore polishing can be performed without causing polishing residue. At that time, the reciprocating movement C of the polishing disk 38 is performed on the long side and the short side of the rectangular plate 71.
Are configured to be synchronized. Accordingly, it is possible to prevent the polishing disk 38 from being too close to the outer side of the rectangular plate-like object 71 on the short side and impairing the flatness of the rectangular plate-like object 71.

【0026】なお、位置調整装置50と往復動装置60との
調整は、必ずしも同時に行う必要はなく、被研磨物の形
状や大きさにより、いずれか一方のみ行ってもよい。上
述のような研磨作業において、各モータ16,46,61側の
回転速度、すなわちテーブル10や研磨ディスク38などの
回転数は、たとえば操作盤の操作により任意に調整し
得、これにより、被研磨物に対する出来るだけ均一な滑
り速度を得られる。
The position adjusting device 50 and the reciprocating device 60 need not be adjusted at the same time, and only one of them may be adjusted depending on the shape and size of the object to be polished. In the polishing work as described above, the rotation speed of each motor 16, 46, 61 side, that is, the number of rotations of the table 10, the polishing disk 38, etc., can be arbitrarily adjusted by, for example, operating the operation panel. It is possible to obtain a sliding speed that is as uniform as possible with respect to the object.

【0027】上記実施例では往復動装置60による可動体
20の往復動Cを直線状に行っているが、これは揺動形式
により往復動Cさせてもよい。また被研磨物は矩形板状
物70や長方形板状物71のほか、丸形など種々な形状のも
のを取り扱える。
In the above embodiment, the movable body by the reciprocating device 60
Although the reciprocating motion C of 20 is performed linearly, the reciprocating motion C may be performed in a swinging manner. In addition to the rectangular plate-like object 70 and the rectangular plate-like object 71, various shapes such as a round shape can be handled.

【0028】上記実施例では、研磨ディスクを昇降させ
ることで、研磨ディスクとテーブルとを相対的に接近離
間自在としているが、これはテーブルを昇降させる形式
であってもよい。
In the above-mentioned embodiment, the polishing disc and the table can be relatively moved closer to and away from each other by raising and lowering the polishing disc, but this may be a type of raising and lowering the table.

【0029】[0029]

【発明の効果】上記構成の本発明によると、被研磨物な
らびに研磨ディスクの強制回転と、研磨ディスクの往復
動との複合移動により、被研磨物の研磨面に対する研磨
ディスクの研磨を、研磨面の全域で均一に行うことがで
き、以て研磨残りが生ぜずかつ方向性の無い研磨面を得
ることができる。しかも被研磨物の形状に応じて、研磨
ディスクによる研磨位置の調整、ならびに研磨ディスク
の往復動の範囲や往復動を行う位置の調整を容易に行う
ことができる。
According to the present invention having the above structure, the polishing disk is polished with respect to the polishing surface of the object to be polished by the combined movement of the forced rotation of the object to be polished and the polishing disk and the reciprocating motion of the polishing disk. Can be uniformly performed over the entire area, and thus a polishing surface with no polishing residue and no directionality can be obtained. Moreover, it is possible to easily adjust the polishing position by the polishing disk and the range of the reciprocating motion of the polishing disk and the position of the reciprocating motion according to the shape of the object to be polished.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示し、研磨装置の一部切り
欠き側面図である。
FIG. 1 is a partially cutaway side view of a polishing apparatus according to an embodiment of the present invention.

【図2】同研磨装置の一部切欠き平面図である。FIG. 2 is a partially cutaway plan view of the polishing apparatus.

【図3】同研磨装置の別な研磨状態を示す概略平面図で
ある。
FIG. 3 is a schematic plan view showing another polishing state of the polishing apparatus.

【図4】従来例を示し、研磨装置の要部の概略斜視図で
ある。
FIG. 4 is a schematic perspective view of a main part of a polishing apparatus showing a conventional example.

【符号の説明】[Explanation of symbols]

1 機枠 10 テーブル 11 回転軸心 12 回転駆動装置 15 回転軸 16 モータ 20 可動体 30 研磨ヘッド 31 ヘッド本体 34 シリンダー装置 35 縦軸心 38 研磨ディスク 40 回転駆動装置 44 縦軸 45 自在継手 46 ギヤードモータ 50 位置調整装置 52 螺子軸 53 ナット体 60 往復動装置 61 ギヤードモータ 63 円板体 64 連結孔 65 クランクロッド 70 矩形板状物(被研磨物) 71 長方形板状物(被研磨物) A 低速回転 B 高速回転 C 往復動 1 machine frame 10 table 11 rotary shaft center 12 rotary drive device 15 rotary shaft 16 motor 20 movable body 30 polishing head 31 head body 34 cylinder device 35 vertical axis 38 polishing disk 40 rotary drive device 44 vertical axis 45 universal joint 46 geared motor 50 Position adjusting device 52 Screw shaft 53 Nut body 60 Reciprocating device 61 Geared motor 63 Disc body 64 Connection hole 65 Crank rod 70 Rectangular plate-shaped object (object to be polished) 71 Rectangular plate-shaped object (object to be polished) A Low speed rotation B High-speed rotation C Reciprocating motion

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 機枠と、この機枠に上下で相対向させて
配置されかつ相対的に接近離間自在な研磨ディスクなら
びにテーブルと、これら研磨ディスクやテーブルに連動
するそれぞれの回転駆動装置と、前記研磨ディスクと回
転駆動装置とからなる研磨ヘッドを装備した可動体とを
有し、前記機枠に、可動体を往復動させる往復動装置を
設けるとともに、その往復動ピッチを調整自在に構成
し、前記可動体に、前記研磨ヘッドをテーブル回転軸心
に対して接近離間動させる位置調整装置を設けたことを
特徴とする研磨装置。
1. A machine frame, a polishing disk and a table which are vertically opposed to each other in the machine frame, and which can be relatively moved toward and away from each other, and respective rotary drive devices which interlock with the polishing disk and the table. A movable body equipped with a polishing head composed of the polishing disk and a rotary drive device is provided, and a reciprocating device for reciprocating the movable body is provided in the machine frame, and the reciprocating pitch thereof is adjustable. A polishing apparatus, wherein the movable body is provided with a position adjusting device for moving the polishing head toward and away from the rotation axis of the table.
JP6481494A 1994-04-01 1994-04-01 Grinding machine Pending JPH07276198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6481494A JPH07276198A (en) 1994-04-01 1994-04-01 Grinding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6481494A JPH07276198A (en) 1994-04-01 1994-04-01 Grinding machine

Publications (1)

Publication Number Publication Date
JPH07276198A true JPH07276198A (en) 1995-10-24

Family

ID=13269097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6481494A Pending JPH07276198A (en) 1994-04-01 1994-04-01 Grinding machine

Country Status (1)

Country Link
JP (1) JPH07276198A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102922410A (en) * 2011-08-10 2013-02-13 劲耘科技股份有限公司 Method for treating surface of glass substrate
CN113814885A (en) * 2021-10-14 2021-12-21 安徽尼睿光电科技有限公司 Grinding device for photoelectric glass

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414357A (en) * 1977-07-05 1979-02-02 Toshiba Corp Controlling method for sheet gauge
JPS6334840U (en) * 1986-08-26 1988-03-05
JPH0451971U (en) * 1990-09-07 1992-05-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414357A (en) * 1977-07-05 1979-02-02 Toshiba Corp Controlling method for sheet gauge
JPS6334840U (en) * 1986-08-26 1988-03-05
JPH0451971U (en) * 1990-09-07 1992-05-01

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102922410A (en) * 2011-08-10 2013-02-13 劲耘科技股份有限公司 Method for treating surface of glass substrate
CN102922410B (en) * 2011-08-10 2015-02-11 劲耘科技股份有限公司 Method for treating surface of glass substrate
CN113814885A (en) * 2021-10-14 2021-12-21 安徽尼睿光电科技有限公司 Grinding device for photoelectric glass

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