JPH07272834A - Ceramic heater and its manufacture - Google Patents
Ceramic heater and its manufactureInfo
- Publication number
- JPH07272834A JPH07272834A JP6116794A JP6116794A JPH07272834A JP H07272834 A JPH07272834 A JP H07272834A JP 6116794 A JP6116794 A JP 6116794A JP 6116794 A JP6116794 A JP 6116794A JP H07272834 A JPH07272834 A JP H07272834A
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- heater
- ceramic
- ceramics
- fluid passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Surface Heating Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、各種のＰＶＤ、プラズ
マＣＶＤ、減圧ＣＶＤ、プラズマエッチング、光エッチ
ング装置等の半導体製造装置等に使用できるセラミック
スヒータ及びその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic heater that can be used in various types of semiconductor manufacturing equipment such as PVD, plasma CVD, low pressure CVD, plasma etching, and photoetching equipment, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来から、緻密質セラミックからなる円
盤状のセラミックスヒータ基体内に螺旋状に巻回した発
熱抵抗体を埋設し、電気発熱抵抗体の両端に電気端子を
接続したセラミックスヒータが知られており、半導体製
造装置等用の加熱装置として用いられている。2. Description of the Related Art Conventionally, there is known a ceramic heater in which a heating resistor wound in a spiral shape is embedded in a disk-shaped ceramic heater base made of a dense ceramic, and electric terminals are connected to both ends of the electric heating resistor. It is used as a heating device for semiconductor manufacturing equipment.
【０００３】セラミックスヒータを用いて、良好な特性
を有する半導体装置等を得るためには、該セラミックス
ヒータは、均一な加熱特性を備える必要がある。例え
ば、半導体製造装置用の加熱装置においては、加熱面の
設定温度は 700℃、800 ℃等の高温に設定されており、
かつ、加熱面における最低温度と平均温度との差及び最
高温度と平均温度との差を、所定の範囲以内に抑えなけ
ればならないという、極めて高い均熱性が要求される。
そのため、セラミックス基体内における巻回体の平面的
パターン形状・配置及び巻き数等を、ヒータの加熱面の
温度にムラが生じないように設定する必要がある。何故
なら、ヒータの加熱面の温度にムラが発生すると、加熱
対象全体を均一に加熱することができないし、特に半導
体製造装置用の場合には、半導体膜の膜厚が不均一とな
り、半導体不良の原因となってしまうからである。In order to obtain a semiconductor device having good characteristics by using a ceramics heater, the ceramics heater must have uniform heating characteristics. For example, in a heating device for semiconductor manufacturing equipment, the set temperature of the heating surface is set to a high temperature of 700 ° C, 800 ° C, etc.
In addition, extremely high heat uniformity is required, in which the difference between the minimum temperature and the average temperature and the difference between the maximum temperature and the average temperature on the heating surface must be suppressed within a predetermined range.
Therefore, it is necessary to set the planar pattern shape / arrangement of the wound body and the number of windings in the ceramic substrate so that the temperature of the heating surface of the heater does not become uneven. This is because if the temperature of the heating surface of the heater becomes uneven, the entire heating target cannot be heated uniformly, and especially in the case of semiconductor manufacturing equipment, the film thickness of the semiconductor film becomes non-uniform and This will cause
【０００４】上記セラミックスヒータは、一般に以下の
方法で製造される。 即ち、まず高融点金属からなる抵抗
発熱体を螺旋状に巻回して巻回体を得、この線体の両端
に端子（電極）を接着し、一方、プレス成形機内にセラ
ミックス粉体を仕込み、ある程度の硬さになるまで予備
成形する。この際、予備成形体の表面に、所定の平面的
パターンに沿って連続的な凹部ないし溝を設け、その凹
部ないし溝に巻回体を収容し、その上に更にセラミック
ス粉体を充填する。そして、セラミックス粉体を一軸加
圧成形して円盤状成形体を作製し、円盤状成形体をホッ
トプレスにより焼結させる。The above ceramic heater is generally manufactured by the following method. That is, first, a resistance heating element made of a high melting point metal is spirally wound to obtain a wound body, terminals (electrodes) are bonded to both ends of this wire body, while ceramic powder is charged in a press molding machine, Preform until it has a certain hardness. At this time, continuous recesses or grooves are provided on the surface of the preformed body along a predetermined planar pattern, the wound body is accommodated in the recesses or grooves, and ceramic powder is further filled therein. Then, the ceramic powder is uniaxially pressure-molded to produce a disk-shaped molded body, and the disk-shaped molded body is sintered by hot pressing.
【０００５】[0005]
【発明が解決しようとする課題】しかし、実際に円盤状
セラミックスヒータを製造してみると、ヒータの加熱面
の加熱ムラをなくし、温度を均一にすることは、思いの
ほかに困難であることが判明した。即ち、抵抗発熱体で
ある巻回体は、通常は、細い抵抗線を螺旋コイル形状に
巻いたものであり、非常に容易かつ自由に3次元的に変
形する。従って、巻回体をセラミックス成形体の内部に
設置するときに、巻回体の位置ズレが生じ、また、成形
体の焼成時にはセラミックス粉末が流動するので、この
流動に伴って巻回体が変形する。その結果、隣接する巻
線間距離、セラミックスヒー基体の加熱面から電気抵抗
発熱体までの距離を一定にすることは困難であり、ま
た、発熱抵抗体自体が螺旋状に捩ってあるのでヒータ基
体の加熱面から発熱抵抗体までの距離も均一とはいえな
い。その結果、ヒータ使用時において、均一な熱分布が
得られず、高度に均一な加熱特性を有するセラミックス
ヒータは得られなかった。実際のセラミックスヒータの
製造工程においては、これらの不均一性を生ずる現象お
よび同現象を生ずる諸原因についての解決手段はほとん
ど解明されていないのが現状であり、上記したような高
度の均熱性を有するセラミックスヒータを定常的に生産
することは困難であった。However, when actually manufacturing the disk-shaped ceramics heater, it was found that it is difficult to eliminate the uneven heating on the heating surface of the heater and make the temperature uniform. did. That is, the wound body, which is a resistance heating element, is usually a thin resistance wire wound in a spiral coil shape, and is very easily and freely deformed three-dimensionally. Therefore, when the wound body is installed inside the ceramic molded body, the wound body is displaced, and the ceramic powder flows during firing of the molded body. To do. As a result, it is difficult to keep the distance between adjacent windings and the distance from the heating surface of the ceramic substrate to the electrical resistance heating element constant, and the heating resistor itself is twisted in a spiral shape. The distance from the heating surface of the substrate to the heating resistor is not uniform. As a result, a uniform heat distribution was not obtained when the heater was used, and a ceramic heater having highly uniform heating characteristics could not be obtained. In the actual manufacturing process of ceramic heaters, the solution to the phenomena that cause these non-uniformities and the causes that cause the same is hardly clarified at present. It was difficult to constantly produce the ceramic heaters that it has.
【０００６】一方、従来、16DRAMの半導体の量産工場で
は、設備費が増大しつつあり、セラミックスヒータを用
いる半導体ウエハー処理装置等には、スループット（ウ
エハーの処理量）の向上と装置のメンテナンスに必要な
ダウンタイムとを減少させることが要求されている。こ
こに、装置のダウンタイムとは、該装置をメンテナンス
する際には、セラミックスヒータがハンドリング可能な
温度にまで冷えるのを待つ必要があるが、この冷却時間
と低温での作業時間並びに再度加熱に必要とされる時間
の総和時間を『装置のダウンタイム（休止時間）』とい
い、このダウンタイムをできるだけ短くすることが要求
される。On the other hand, conventionally, in a mass production factory of 16DRAM semiconductors, the equipment cost is increasing, and a semiconductor wafer processing apparatus or the like using a ceramic heater is required for improvement of throughput (wafer processing amount) and maintenance of the apparatus. There is a demand to reduce significant downtime. Here, the downtime of the device means that when the device is maintained, it is necessary to wait for the ceramics heater to cool to a temperature at which it can be handled. The total time required is called "device downtime", and it is required to minimize this downtime.
【０００７】特に、熱ＣＶＤ、エピタキシャル、スパッ
タ、エッチング装置では、容器内にヒータを設置し、こ
のヒータに半導体ウエハーを設置し、ウエハーを高温に
加熱している。しかし、例えばセラミックスヒータを10
00℃に加熱し、半導体ウエハーを処理した後、抵抗発熱
体への電力の供給を停止して基体が80℃以下の温度にま
で降温するのには、通常１時間以上の長時間を必要と
し、ダウンタイムが長くなっていた。Particularly, in a thermal CVD, epitaxial, sputtering, and etching apparatus, a heater is installed in a container, a semiconductor wafer is installed in this heater, and the wafer is heated to a high temperature. However, for example, a ceramic heater
After heating the semiconductor wafer to 00 ° C and stopping the power supply to the resistance heating element to cool the substrate to a temperature of 80 ° C or less, it usually takes a long time of 1 hour or more. , Downtime was getting longer.
【０００８】従って、特にセラミックスヒータの応答性
を高めるため、セラミックスヒータの温度を自在かつ急
速に変更できるようにし、これによって被処理物質の処
理効率を向上させることが、要求されていた。Therefore, in order to improve the responsiveness of the ceramic heater, it has been required to change the temperature of the ceramic heater freely and rapidly, thereby improving the processing efficiency of the substance to be processed.
【０００９】[0009]
【発明の解決課題】本発明の課題は、セラミックス製の
ヒータ本体と、このヒータ本体の中に埋設された巻回体
である抵抗発熱体とを備えたセラミックスヒータにおい
て、加熱面の温度を高度に制御可能なセラミックスヒー
タを提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a ceramic heater having a heater body made of ceramics and a resistance heating element which is a winding body embedded in the heater body. To provide a controllable ceramics heater.
【００１０】さらに、本発明の課題は、セラミックスヒ
ータを迅速に冷却することができるセラミックスヒータ
を提供することにある。更に、本発明の別の課題は、温
度制御性に優れたセラミックスヒータを簡単かつ容易な
方法で製造できるセラミックスヒータの製造方法を提供
することを目的とする。A further object of the present invention is to provide a ceramics heater capable of rapidly cooling the ceramics heater. Further, another object of the present invention is to provide a method of manufacturing a ceramics heater having excellent temperature controllability by a simple and easy method.
【００１１】[0011]
【課題の解決手段】本発明は、セラミックススヒータ基
体とセラミックスヒータ基体に埋設した電気発熱抵抗体
とからなるセラミックスヒータにおいて、セラミックス
ヒータ基体内部でかつセラミックスヒータ基体の加熱面
と当該発熱抵抗体との間に加熱面に沿って延びる流体通
路が設けられ、該流体通路内に流体を充填することによ
って、セラミックスヒータ本体の加熱面の温度の制御を
可能としたセラミックスヒータに関するものである。The present invention relates to a ceramics heater comprising a ceramics heater base and an electric heating resistor embedded in the ceramics heater base, wherein the heating surface of the ceramics heater base is inside the ceramics heater base and the heating resistor. The present invention relates to a ceramics heater in which a fluid passage extending along the heating surface is provided, and by filling the fluid passage with a fluid, the temperature of the heating surface of the ceramics heater body can be controlled.
【００１２】また、本発明は、セラミックススヒータ基
体とセラミックスヒータ基体に埋設した電気発熱抵抗体
とからなるセラミックスヒータにおいて、該セラミック
スヒータはさらに冷却機構を有し、該冷却機構はセラミ
ックスヒータ基体内部でかつセラミックスヒータ基体の
加熱面と当該発熱抵抗体との間に加熱面に沿って延びる
流体通路からなり、該流体通路内に流体を流すことによ
ってセラミックスヒータの冷却を促進することを可能と
した冷却機構付セラミックスヒータに関するものであ
る。Further, the present invention provides a ceramics heater comprising a ceramics heater base and an electric heating resistor embedded in the ceramics heater base, wherein the ceramics heater further has a cooling mechanism, and the cooling mechanism is inside the ceramics heater base. And a fluid passage extending along the heating surface between the heating surface of the ceramics heater base and the heating resistor, and cooling the ceramics heater can be promoted by flowing a fluid in the fluid passage. The present invention relates to a ceramic heater with a cooling mechanism.
【００１３】さらに、本発明は、発熱抵抗体が埋設され
た第１のセラミックス成形体を形成し、該第１のセラミ
ックス成形体に接合すべき第２のセラミックス成形体を
形成し、該第１の焼成セラミックス成形体及び該第２の
セラミックス成形体とを接合することによってセラミッ
クスヒータを製造する方法であって、第１と第２のセラ
ミックス成形体との接合面の少なくとも一方の接合面に
流体通路を形成する溝を設け、第１のセラミックス成形
体に同通路に連通する流体流入口及び流体流出口を形成
し、第１のセラミックス成形体と第２のセラミックス成
形体を接合することによって、該セラミックスヒータ基
体の加熱面と当該発熱抵抗体との間に該溝と他の接合面
とによって加熱面に沿って伸びる流体通路を設けるセラ
ミックスヒータの製造方法に関するものである。Further, according to the present invention, a first ceramic molded body in which a heating resistor is embedded is formed, and a second ceramic molded body to be joined to the first ceramic molded body is formed. A method for manufacturing a ceramics heater by bonding the fired ceramics compact and the second ceramics compact together, wherein a fluid is applied to at least one of the joining faces of the first and second ceramics compacts. By providing a groove that forms a passage, forming a fluid inlet and a fluid outlet that communicate with the passage in the first ceramic molded body, and joining the first ceramic molded body and the second ceramic molded body, A ceramic heater is provided with a fluid passage extending along the heating surface between the heating surface of the ceramic heater base and the heating resistor by the groove and another joint surface. It relates to production method.
【００１４】[0014]
【作用】本発明のセラミックスヒータによれば、発熱抵
抗体で発生した熱は、固体セラミックスヒータ基体中を
移動するとともに、一部ガス流路中を流れるガスに吸収
され流体中の対流によってセラミックスヒータ基体の各
場所の温度差を減少させ、それによって、セラミックス
ヒータの温度を均一に制御することを可能とする。According to the ceramics heater of the present invention, the heat generated by the heating resistor moves in the solid ceramics heater base, and is partially absorbed by the gas flowing in the gas flow path to cause convection in the fluid. The temperature difference at each location of the substrate is reduced, thereby making it possible to uniformly control the temperature of the ceramic heater.
【００１５】また、半導体等をセラミックスヒータを用
いて処理をする場合、所定の高温で処理後、所定の温度
まで冷却し、その後、再度処理をするという工程を繰り
返す必要があるが、本発明のセラミックスヒータによれ
ば、ガス通路中に所定の流体を流すことによって、セラ
ミックスヒータをより迅速に冷却することができ、従来
のセラミックスヒータに比較して、ダウンタイムを大幅
に減少することができ、半導体等の処理対象物のスルー
プット（処理量）を向上することができる。Further, when a semiconductor or the like is processed using a ceramics heater, it is necessary to repeat the steps of processing at a predetermined high temperature, cooling to a predetermined temperature, and then performing the processing again. According to the ceramics heater, by flowing a predetermined fluid in the gas passage, the ceramics heater can be cooled more quickly, and the downtime can be significantly reduced as compared with the conventional ceramics heater. Throughput (processing amount) of a processing object such as a semiconductor can be improved.
【００１６】また、本発明のセラミックスヒータの製造
方法によれば、第１あるいは第２の成形体との接合面の
少なくとも一方の接合面に流体流路を形成する溝を設
け、同流路に連通する流体流入口及び流体流出口を形成
し、第１のセラミック成形体と第２のセラミック成形体
とを接合することによって、該セラミックスヒータ基体
の加熱面と当該電気発熱抵抗体との間に加熱面に沿って
伸びるガス流路を簡便に設けることができ、極めて高度
の均熱性を有するセラミックスヒータを、定常的に高い
歩留りで量産することできる。Further, according to the method for manufacturing a ceramic heater of the present invention, a groove for forming a fluid flow path is provided on at least one of the bonding surfaces with the first or second molded body, and the same flow path is provided. A fluid inflow port and a fluid outflow port which communicate with each other are formed, and the first ceramic molded body and the second ceramic molded body are joined to each other, so that the heating surface of the ceramic heater base and the electric heating resistor are connected to each other. A gas flow path extending along the heating surface can be simply provided, and a ceramic heater having an extremely high degree of soaking can be mass-produced constantly with a high yield.
【００１７】本発明に係るセラミックスヒータの好まし
い実施態様として、以下のものが挙げられる。 (1) 前記流体通路内の流体が強制的にセラミックスヒー
タ外部から該流体通路に導入され、該流体通路からセラ
ミックスヒータ外部に導出されるようにされたセラミッ
クスヒータ。この場合には、セラミックスヒータ内の熱
分布は通路内の流体の対流及び移動によってより一層均
一化が図られる。 (2) 前記流体として、アルゴン、ヘリウム、窒素から選
ばれた不活性ガスを用いるセラミックスヒータ。この場
合には、セラミックスヒータを構成しているセラミック
ス材料及び発熱抵抗体に何ら悪影響を与える事なく所望
の均熱効果を達成できる。 (3) 前記セラミックスヒータ基体が円盤状をなし、前記
発熱抵抗体がセラミックヒータ基体内で螺旋状に巻回さ
れ埋設されているセラミックスヒータ。この場合には、
螺旋状に巻回して発熱抵抗体が円盤状のセラミックスヒ
ータ内に均一に配置されることになり、上記流体通路の
設置とあいまってより高い均熱効果が得られる。 (4) 前記流体通路がほぼ同心円状に延設された複数の環
状の通路からなり、該複数の環状の通路が流体流入口と
流体流出口との間に伸びるセラミックスヒータ。この場
合には、加熱面の個々の環状領域の加熱を独立かつ均一
に制御することが可能となり、特に上記(3) のセラミッ
クヒータの場合に有効である。また、全体の加熱面から
みても、小さな領域に分割してそれぞれを均一に制御す
ることにより、加熱面全体をより均一に温度制御でき
る。 (5) 少なくとも１組の外側流体流入口と外側流体流出口
と１組の中央流体流入口と中央流体流出口とからなり、
該１組の外側流体流入口と外側流体流出口との間及び該
１組の中央流体流入口と中央流体流出口との間にそれぞ
れ外周側流体通路と中央流体通路とが周方向に略同心円
状でかつジグザグに延びるセラミック・ヒータ。この場
合にも、加熱面の外周領域と中央領域とを独立かつ均一
に加熱することが可能となり、特に上記(3) のセラミッ
クヒータの場合に有効である。 (6) 前記セラミックスヒータ本体の加熱面部を周方向に
複数の領域に分け、各領域に対応して外周部から内周部
にかけて周方向にジグザグに延びる流路を設けたセラミ
ックスヒータ。この場合には、加熱面部を周方向に分け
た複数の領域の温度を独立かつ均一に制御できる。Preferred embodiments of the ceramic heater according to the present invention are as follows. (1) A ceramic heater in which the fluid in the fluid passage is forcibly introduced into the fluid passage from the outside of the ceramic heater and is led out from the fluid passage to the outside of the ceramic heater. In this case, the heat distribution in the ceramic heater can be made more uniform by the convection and movement of the fluid in the passage. (2) A ceramic heater using an inert gas selected from argon, helium, and nitrogen as the fluid. In this case, a desired soaking effect can be achieved without any adverse effect on the ceramic material and the heating resistor forming the ceramic heater. (3) A ceramics heater in which the ceramics heater base has a disk shape, and the heating resistor is spirally wound and embedded in the ceramics heater base. In this case,
Since the heating resistors are spirally wound and are uniformly arranged in the disk-shaped ceramics heater, a higher soaking effect can be obtained together with the installation of the fluid passage. (4) A ceramic heater in which the fluid passage comprises a plurality of annular passages extending substantially concentrically, and the plurality of annular passages extend between a fluid inlet and a fluid outlet. In this case, it becomes possible to independently and uniformly control the heating of each annular region on the heating surface, which is particularly effective in the case of the ceramic heater described in (3) above. Further, even when viewed from the entire heating surface, the temperature can be controlled more uniformly over the entire heating surface by dividing the area into smaller regions and controlling each of them uniformly. (5) At least one set of outer fluid inlet, outer fluid outlet, and one set of central fluid inlet and central fluid outlet,
An outer peripheral fluid passage and a central fluid passage are substantially concentric in the circumferential direction between the pair of outer fluid inlets and outer fluid outlets and between the pair of central fluid inlets and central fluid outlets, respectively. Shaped and zigzag extending ceramic heater. Also in this case, the outer peripheral region and the central region of the heating surface can be heated independently and uniformly, which is particularly effective in the case of the ceramic heater described in (3) above. (6) A ceramics heater in which a heating surface portion of the ceramics heater main body is divided into a plurality of regions in the circumferential direction, and channels are provided so as to extend in a zigzag direction in the circumferential direction from the outer peripheral portion to the inner peripheral portion corresponding to each region. In this case, it is possible to independently and uniformly control the temperatures of a plurality of regions obtained by dividing the heating surface portion in the circumferential direction.
【００１８】上記セラミックスヒータの製造方法の好ま
しい実施態様としては、第１と第２のセラミックス成形
体との接合面の少なくとも一方の接合面に流体通路に対
応する形状を与えるマスクを載置し、サンドブラストあ
るいはエッチング処理によって流体通路を形成する溝を
設け、第１と第２のセラミックス成形体との接合面の少
なくとも一方の接合面に対し YSiAlON系ガラス等の接着
剤を塗布後第１のセラミック本体と第２のセラミック本
体とをガラス塗布層を介して接合させ焼成する。この方
法によれば、強固に結合したセラミックスヒータを得る
ことができる。In a preferred embodiment of the above-mentioned method for manufacturing a ceramic heater, a mask for giving a shape corresponding to a fluid passage is placed on at least one of the joint surfaces of the first and second ceramic compacts. A groove for forming a fluid passage is provided by sandblasting or etching, and an adhesive such as YSiAlON-based glass is applied to at least one joint surface between the first and second ceramic compacts, and then the first ceramic body. And the second ceramic body are joined together through a glass coating layer and fired. According to this method, it is possible to obtain a ceramic heater that is firmly bonded.
【００１９】以下に、本発明を詳細に説明する。本発明
のセラミックスヒータの基材は、緻密質セラミックスに
よって形成する。好ましくは、窒化珪素、窒化アルミニ
ウム、サイアロン等の窒化物系セラミックスを用いるこ
とができる。窒化珪素を用いる場合には、耐熱衝撃性の
高いセラミックスヒータが得られる。また、窒化アルミ
ニウムを用いる場合には、ハロゲン系腐蝕性ガスに対し
て、高い耐蝕性を有するセラミックスヒータが得られ
る。特に、Y2O3と Yb2O3の少なくともどちらか一方を焼
結助材として含有する窒化ケイ素、Y2O3を焼結助材とし
て含有する窒化アルミニウムはセラミックスとして熱伝
導率が高いので、加熱面の均熱性を向上させるという観
点から、特に好ましい。The present invention will be described in detail below. The base material of the ceramic heater of the present invention is formed of dense ceramics. Preferably, nitride ceramics such as silicon nitride, aluminum nitride and sialon can be used. When silicon nitride is used, a ceramic heater having high thermal shock resistance can be obtained. Moreover, when aluminum nitride is used, a ceramic heater having high corrosion resistance to halogen-based corrosive gas can be obtained. In particular, since silicon nitride containing Y 2 O 3 and / or Yb 2 O 3 as a sintering aid and aluminum nitride containing Y 2 O 3 as a sintering aid have high thermal conductivity as ceramics, From the viewpoint of improving the soaking property of the heating surface, it is particularly preferable.
【００２０】こうした窒化珪素からホットプレス法によ
って焼結体を製造すると、加圧軸方向の熱伝導率よりも
該軸に対し垂直方向の熱伝導率が高くなる。従って、盤
状の基体をホットプレス法によって作製した場合には、
盤状基体の加熱面と水平方向の熱伝導率が盤状基体の厚
さ方向の熱伝導率よりも大きくなり、均熱性を向上させ
るという観点から好ましい。また窒化アルミニウムはホ
ットプレス法によって焼結体を製造した場合、熱伝導率
の異方性は生じないが、常圧焼結品に比べ、強度、熱伝
導率が向上するので、好ましい。When a sintered body is manufactured from such silicon nitride by the hot pressing method, the thermal conductivity in the direction perpendicular to the pressing axis is higher than the thermal conductivity in the pressing axis direction. Therefore, when a plate-shaped substrate is manufactured by the hot pressing method,
The thermal conductivity in the horizontal direction with respect to the heating surface of the disk-shaped substrate is higher than the thermal conductivity in the thickness direction of the disk-shaped substrate, which is preferable from the viewpoint of improving the thermal uniformity. When a sintered body is manufactured by a hot pressing method, aluminum nitride does not cause anisotropy in thermal conductivity, but strength and thermal conductivity are improved as compared with a pressureless sintered product, which is preferable.
【００２１】巻回体を構成する金属としては、特に高温
用のセラミックスヒータにおいては、高融点金属が好ま
しく、とりわけ、タングステン、モリブデン、白金、こ
れらの合金が更に好ましい。巻回体としては、種々の形
状を有するものが使用できるが、コイルスプリング形状
の巻回体が、入手し易く好ましい。この巻回体は、線体
が螺旋形状に巻回されたもので、、巻回体は略円筒形に
螺旋状に延びる。しかし、巻回体の螺旋形状は、円形の
他、楕円形、四辺形等の形状とすることもできる。As the metal constituting the wound body, particularly in a ceramic heater for high temperature, a refractory metal is preferable, and tungsten, molybdenum, platinum and alloys thereof are more preferable. As the wound body, those having various shapes can be used, but a coil spring-shaped wound body is preferable because it is easily available. The wound body is a wire wound in a spiral shape, and the wound body extends in a substantially cylindrical shape in a spiral shape. However, the spiral shape of the wound body can be a circular shape, an elliptical shape, a quadrilateral shape, or the like.
【００２２】流体通路は、セラミックスヒータ基体の内
部でかつ基体の加熱面と発熱抵抗体との間に設けられ
る。 セラミックスヒータの熱分布を均一にし基体加熱面
の加熱状態を均一にし、及び／またはセラミックスヒー
タを短期間に冷却を可能とする限り、ガス通路の形状・
配置等には特に限定がない。また、『流体通路が基体の
加熱面に沿って延びる』とは、必ずしも加熱面と平行に
のみ延びる場合のみならず、基体の内部でかつ基体の加
熱面と発熱抵抗体との間にあるのであれば多少上下に波
打つ場合も含む。また、『基体の加熱面と発熱抵抗体と
の間』とは、流体通路全体が基体の加熱面と発熱抵抗体
の間に位置する場合のみならず、本発明の均熱・冷却効
果が発揮出来る限り、流体通路の１部が基体の加熱面と
反対側の発熱抵抗体の下方に延在している場合も含む。
また、流体通路は連続して設けられていることが好まし
いが、『流体通路が連続して設けられ』とは流体通路中
を流体が連続的に流れることが可能となるように設けら
れていることを意味するが、部分的に不連続な場合も含
む。The fluid passage is provided inside the ceramic heater base and between the heating surface of the base and the heating resistor. As long as the heat distribution of the ceramic heater is made uniform and the heating state of the substrate heating surface is made uniform, and / or the ceramic heater can be cooled in a short time,
The arrangement and the like are not particularly limited. Further, "the fluid passage extends along the heating surface of the substrate" does not necessarily mean that the fluid passage extends only in parallel with the heating surface, but also because it is inside the substrate and between the heating surface of the substrate and the heating resistor. If there is a slight wave up and down, it is included. Further, "between the heating surface of the substrate and the heating resistor" means not only the case where the entire fluid passage is located between the heating surface of the substrate and the heating resistor, but also the soaking / cooling effect of the present invention is exerted. The case where a part of the fluid passage extends below the heating resistor on the side opposite to the heating surface of the substrate is included as much as possible.
Further, it is preferable that the fluid passages are continuously provided, but "the fluid passages are continuously provided" means that the fluid can continuously flow through the fluid passages. However, it also includes the case of partial discontinuity.
【００２３】流体を流体通路内に充填しセラミックスヒ
ータの外部から強制的に流体を流体通路内で移動させな
い場合には、適当な封止弁等の流体封止構造が採用され
る。また、単に流体通路端部を閉止してもよい。このよ
うな封止構造自体は、当業者が容易に適宜採用できるも
のであるので詳細な説明は省く。When the fluid is filled in the fluid passage and the fluid is not forcibly moved from the outside of the ceramic heater in the fluid passage, a suitable fluid sealing structure such as a sealing valve is adopted. Alternatively, the end of the fluid passage may be simply closed. Since such a sealing structure itself can be easily adopted by those skilled in the art, detailed description thereof will be omitted.
【００２４】流体を流体通路内で強制的に流す場合に
は、ポンプ、弁、流量計、流体流通路等からなる強制流
動機構を流体通路接続する。かかる強制流動機構は当業
者であれば容易に適宜採用できるものであるので詳細な
説明を省く。この場合には、流体を循環する強制循環流
動機構とすることが好ましい。When the fluid is forced to flow in the fluid passage, a forced flow mechanism including a pump, a valve, a flow meter, a fluid passage, etc. is connected to the fluid passage. Such forced flow mechanism can be easily adopted by those skilled in the art, and thus detailed description thereof will be omitted. In this case, it is preferable to use a forced circulation flow mechanism for circulating the fluid.
【００２５】流体流路に流す流体としては、アルゴン、
ヘリウム、窒素等の不活性ガスが好ましく用いられる。
流体の好ましい流量範囲は、流路の形状、配置、流体の
種類等によって適宜決定される。均熱性を高めることを
目的とする場合は、好ましくは流体を１〜30 1SCCMの範
囲内で流すことが望ましい。また冷却速度を高めること
を目的とする場合は１ SCCM 以上とすることが好まし
く、気体の流速は大きくする方が好ましい。流体流路に
流す流体は、常温で流路に導入してもよいし、加熱ある
いは冷却状態で導入しても良い。また、常圧、加圧、減
圧状態の流体も適宜用いることができる。また、かかる
流体は循環使用して流体流路に流すこともでき、この場
合には、セラミックスヒータのランニングコストを低減
できる。As the fluid flowing in the fluid flow path, argon,
An inert gas such as helium or nitrogen is preferably used.
The preferable flow rate range of the fluid is appropriately determined according to the shape and arrangement of the flow path, the type of fluid, and the like. For the purpose of enhancing the soaking property, it is desirable to flow the fluid within the range of 1 to 301 SCCM. When the purpose is to increase the cooling rate, it is preferably 1 SCCM or more, and the gas flow rate is preferably increased. The fluid flowing in the fluid channel may be introduced into the channel at room temperature, or may be introduced in a heated or cooled state. Also, a fluid under normal pressure, increased pressure, or reduced pressure can be used as appropriate. Further, such a fluid can be circulated and flown into the fluid passage, and in this case, the running cost of the ceramics heater can be reduced.
【００２６】次に、本発明に係るセラミックスヒータ及
びその製造方法を添付図面に基づいて説明する。図１
(a) 及び図１(b) は、それぞれ本発明の第１の実施例に
係るセラミックスヒータの縦断面図及び平面図である。
図中、円盤状のセラミックスヒータ基体１には、巻回状
態の発熱抵抗体２が螺旋状に埋設され、発熱抵抗体の両
端部は、基体１の下面１ａに埋設した端子３に接続され
いる。セラミックスヒータ基体内部でかつ基体１の加熱
面１ｂと発熱抵抗体２との間には、図１(b) に示される
形状・配置の流体流路４が設けられており、流体流路の
両端部には流体流入口５及び流体流出口７とがそれぞれ
流体流入路６及び流体流出路８とを介して接続されてい
る。セラミックスヒータ基体の加熱面１ｂ上には、被処
理上ウェハ９が載置される。流体流路４の形状及び配置
を更に詳しく述べると、流体流路４は全体的に基体加熱
面２ｂと略平行に延在しており、流体流路４は環状に延
びる同心円状の流路４1,４2,４3,４4,４5,４6 及び半径
方向に延びる流体流路４0 とからなり、流体流入路６及
び流体流出路８とが最外環状流体流路４1 に開口すると
ともに流体流路４0 の両端部が流体流入路６及び流体流
出路８の開口と連通している。環状流路４1,４2,４3,４
4,４5,４6 はジグザグ状に連続している。Next, a ceramic heater and a method for manufacturing the same according to the present invention will be described with reference to the accompanying drawings. Figure 1
1A and 1B are a vertical cross-sectional view and a plan view, respectively, of a ceramic heater according to a first embodiment of the present invention.
In the drawing, a heating resistor 2 in a wound state is embedded in a spiral shape in a disk-shaped ceramic heater base 1, and both ends of the heating resistor are connected to terminals 3 embedded in the lower surface 1 a of the base 1. . Inside the ceramics heater base and between the heating surface 1b of the base 1 and the heating resistor 2, a fluid flow path 4 having the shape and arrangement shown in FIG. 1 (b) is provided. A fluid inlet 5 and a fluid outlet 7 are connected to the portion via a fluid inflow passage 6 and a fluid outflow passage 8, respectively. The wafer 9 to be processed is placed on the heating surface 1b of the ceramics heater substrate. The shape and arrangement of the fluid flow path 4 will be described in more detail. The fluid flow path 4 extends substantially parallel to the substrate heating surface 2b as a whole, and the fluid flow path 4 has a concentric flow path 4 extending annularly. 1 , 4 2 , 4 3 , 4 4 , 4 5 , 4 6 and a fluid passage 4 0 extending in the radial direction, and a fluid inflow passage 6 and a fluid outflow passage 8 form an outermost annular fluid flow passage 4 1 . both end portions of the fluid flow path 4 0 is in communication with the opening of the fluid inlet channel 6 and the fluid outlet channel 8 with an opening. Annular flow path 4 1 , 4 2 , 4 3 , 4
4 , 4, 5 and 4 6 are continuous in a zigzag pattern.
【００２７】セラミックスヒータの使用の際には、発熱
抵抗体２に電流が流され、抵抗体２からヒータ基体へ熱
が発生する。一方、流体が流体流入口5、流入路６を通っ
て環状流路４1 〜４5 及び流体流路40、流出路８、流出
口７を通り所定の流量で流される。それによって、発熱
抵抗体で発生した熱は固体のセラミックスヒータ基体中
を伝達するとともに、流体流路を流動する流体によって
吸収・対流・移動され、セラミックスヒータ基体中の熱
分布が均一化され、セラミックスヒータの加熱面が均一
に加熱される。本実施例によれば、環状流路が同心円状
に設けられているのでより均一なヒータ加熱面の加熱が
可能となる。When a ceramic heater is used, an electric current is passed through the heating resistor 2 and heat is generated from the resistor 2 to the heater base. On the other hand, the fluid inlet 5 fluid through the inlet passage 6 the annular channel 41 to 5 and the fluid channel 40, outlet channel 8, flows to the outlet 7 are as given flow rate. As a result, the heat generated by the heating resistor is transmitted through the solid ceramic heater base, and is absorbed, convected, and moved by the fluid flowing in the fluid flow path, so that the heat distribution in the ceramic heater base is made uniform, and The heating surface of the heater is heated uniformly. According to the present embodiment, since the annular flow passages are provided concentrically, more uniform heating of the heater heating surface is possible.
【００２８】第１の実施例では、流体を流体通路に流す
場合について説明したが、適当な封止手段を用いること
によって流体を流体通路中に流さずに封止充填してヒー
タを使用することも可能である。この場合でも、熱の吸
収・伝達により流体が流路内を対流することによってヒ
ータ加熱面は均一に加熱される。In the first embodiment, the case where the fluid is passed through the fluid passage has been described. However, the heater is used by sealing and filling the fluid without flowing through the fluid passage by using an appropriate sealing means. Is also possible. Even in this case, the heater heating surface is uniformly heated by the convection of the fluid in the flow path due to the absorption and transmission of heat.
【００２９】図２(a) 及び図２(b) は、本発明に係る第
２の実施例のそれぞれ縦断面図及び平面図である。第１
の実施例と第２の実施例と異なる点は、第２の実施例で
は、2組の流体流路４ａ, ４ｂが設けられ、それぞれの流
体流路の両端部には流体流入口51, 52及び流体流出口７
1,７2 とがそれぞれ流体流入路61, 62及び流体流出路8
1, 82とを介して接続されている。その他の点は、実質
的に略第１の実施例と同一である。2 (a) and 2 (b) are a vertical sectional view and a plan view, respectively, of a second embodiment according to the present invention. First
The second embodiment differs from the second embodiment in that the second embodiment is provided with two sets of fluid passages 4a and 4b, and fluid inlets 51 and 52 are provided at both ends of each fluid passage. And fluid outlet 7
1 and 7 2 are fluid inflow channels 61 and 62 and fluid outflow channel 8 respectively.
1, 82 and are connected. The other points are substantially the same as those of the first embodiment.
【００３０】流体流路４ａ及び４ｂについて更に説明す
れば、流体流路４ａは半径方向外側から半径方向内側へ
と周方向でかつジグザグ状に延び、一方流体流路４ｂは
中央部に設けられ環状に延びるとともに全体としてＺ字
形状をなす。流体流路４ａと４ｂは、全体的に基体加熱
面と略平行に延在している。なお、第２の実施例では、
セラミックスヒータの加熱面で見て半径方向で中央部、
外周部の２つの区域に分けたが、３以上の環状区域に分
割しそれぞれの区域に連続する流体流路を設けることも
できる。To further explain the fluid channels 4a and 4b, the fluid channel 4a extends circumferentially in a zigzag pattern from the outer side in the radial direction to the inner side in the radial direction, while the fluid channel 4b is provided in the central portion and has an annular shape. And has a Z shape as a whole. The fluid channels 4a and 4b extend generally parallel to the substrate heating surface. In the second embodiment,
When viewed from the heating surface of the ceramics heater, the center part in the radial direction,
Although it is divided into two areas on the outer peripheral portion, it is also possible to divide the area into three or more annular areas and provide continuous fluid channels in each area.
【００３１】本発明の第２の実施例によれば、第１の実
施例と略同一の効果が得られるとともに、流体流路４ａ
と４ｂとに流す流体の流量、温度、種類等を変えること
によってセラミックスヒータの加熱面の中央部と周辺部
の温度を独立かつ均一に設定及び／または制御すること
が可能となる。According to the second embodiment of the present invention, substantially the same effect as that of the first embodiment can be obtained, and the fluid flow path 4a can be obtained.
It is possible to set and / or control the temperature of the central portion and the peripheral portion of the heating surface of the ceramics heater independently and uniformly by changing the flow rate, the temperature, the type, etc. of the fluid to be supplied to the heaters 4b.
【００３２】第２の実施例でも、流体を流体通路に流す
場合について説明したが、適当な封止手段を用いること
によって流体を流体通路中に流さずに封止充填してヒー
タを使用することも可能であることは第１の実施例と同
様である。In the second embodiment as well, the case where the fluid is made to flow in the fluid passage has been described. However, by using an appropriate sealing means, it is possible to seal and fill the fluid without flowing the fluid in the fluid passage to use the heater. The same is possible as in the first embodiment.
【００３３】図３は、本発明に係る第３の実施例の横断
面図である。図３において、陰影をつけた部分は流路の
壁部を表す。第３の実施例では、半径方向に延在する４
つの隔壁11a, 11b, 11c, 11dで基体加熱面を周方向に見
て、４つの等しい面積の扇状の区域に分けられ、それぞ
れの区域に、図３に示すように、隔壁12a1, 12a2, 12
a3, 12a4, 12a5, 12a6；隔壁12b1, 12b2, 12b3, 12b4,
12b5, 12b6；隔壁12c1, 12c2, 12c3, 12c4, 12c5, 12
c6；隔壁12d1, 12d2, 12d3, 12d4, 12d5, 12d6の隔壁群
を設け、各隔壁部は隣接する半径方向の隔壁間に延び、
周方向に延びる隔壁は、隣接する半径方向隔壁との間で
交互に二つの隔壁側に開口している。これらの隔壁によ
って、環状の流体流路が半径方向外周部から中央部に向
かってジグザグ状に連続して設けられる。第３の実施例
の他の構成については、第１の実施例と略同一である。FIG. 3 is a cross-sectional view of a third embodiment according to the present invention. In FIG. 3, the shaded portion represents the wall of the flow channel. In the third embodiment, 4 extending in the radial direction
The partition wall 11a, 11b, 11c, 11d is divided into four fan-shaped areas having the same area when the substrate heating surface is viewed in the circumferential direction, and each partition area has a partition wall 12a 1 , 12a 2 as shown in FIG. , 12
a 3 , 12a 4 , 12a 5 , 12a 6 ; partition wall 12b 1 , 12b 2 , 12b 3 , 12b 4 ,
12b 5 , 12b 6 ; partition walls 12c 1 , 12c 2 , 12c 3 , 12c 4 , 12c 5 , 12
c 6; a partition wall group of the partition wall 12d 1, 12d 2, 12d 3 , 12d 4, 12d 5, 12d 6 provided, each partition wall extending between adjacent radial dividing wall,
The partition walls extending in the circumferential direction are alternately opened to the two partition wall sides between the adjacent partition walls in the radial direction. By these partitions, an annular fluid flow path is continuously provided in a zigzag shape from the outer peripheral portion in the radial direction toward the central portion. The other structure of the third embodiment is substantially the same as that of the first embodiment.
【００３４】第３の実施例のセラミックスヒータの使用
の際には、発熱抵抗体２に電流が流される一方、流体を
流体流入口、流入路６を通って環状流路13c, 13d に分
岐し、流体は外周部から中央部と周方向ジグザグ状に流
し、中央部に達すると分岐した流体が合流し、再度流体
は流体流路13a, 13bに分岐し、中央部から外周部へと周
方向でジグザグ状に流れ、流体流出路に達する。第３の
実施例では、周方向を４つの等面積の区域に分割しそれ
ぞれの区域に連続して流体流路を形成したが、周方向を
互いに等しい面積あるいは異なる面積の３つの区域ある
いは５つ以上の区域に分け、それぞれの区域に周方向か
つジグザグ状の連続した流体流路を形成することもでき
る。 また、第3の実施例では、流体流入路及び流体流出
路をすべての流体流路に共通して設けたが、それぞれの
流路ごとに流体流入路及び流体流出路を設けることもで
きるし、いくつかの流路を組として各組ごとに流体流入
路及び流体流出路を設けることもできる。When the ceramic heater of the third embodiment is used, an electric current is passed through the heating resistor 2 while the fluid is branched into the annular flow passages 13c and 13d through the fluid inlet port and the inflow passage 6. , The fluid flows from the outer peripheral portion to the central portion in a zigzag shape in the circumferential direction, and when the fluid reaches the central portion, the branched fluid merges, and the fluid branches again into the fluid flow paths 13a and 13b, and the fluid flows in the circumferential direction from the central portion to the outer peripheral portion. Flows in a zigzag shape and reaches the fluid outflow passage. In the third embodiment, the circumferential direction is divided into four areas of equal area and the fluid channels are formed continuously in the respective areas, but the circumferential direction is divided into three areas having the same area or different areas, or five areas. It is also possible to divide into the above areas and form a continuous zigzag continuous fluid flow path in each area. Further, in the third embodiment, the fluid inflow path and the fluid outflow path are provided in common to all the fluid flow paths, but it is also possible to provide a fluid inflow path and a fluid outflow path for each flow path, It is also possible to provide a fluid inflow path and a fluid outflow path for each set with several flow paths as a set.
【００３５】第３の実施例では、第１の実施例で得られ
る効果に加えて、４つの分割区域をそれぞれ均一に加熱
できるという効果があるとともに、隔壁が半径方向に延
びているので、加熱面の補強がなされセラミックスヒー
タの機械的強度は大きくなる。In addition to the effect obtained in the first embodiment, the third embodiment has the effect that each of the four divided areas can be uniformly heated, and since the partition walls extend in the radial direction, the heating Since the surface is reinforced, the mechanical strength of the ceramic heater is increased.
【００３６】次に、本発明に係るセラミックスヒータの
製造方法を図４(a) から４(d) に示す模式的断面図であ
る製造工程図に沿って説明する。以下、工程順に説明す
る。まず、図４(a) に示す第１のセラミックスヒータ成
形体を作製する。すなわち、高融点金属の線体を巻回し
た巻回体の両端に端子（電極）を接着し、プレス成形機
内にセラミックス粉体を仕込み、予備成形体の表面に、
所定の平面的パターンに沿って連続的な凹部ないし溝を
設ける。そして、巻回体をこの凹部に収容し、その上に
更にセラミックス粉体を充填し、セラミックス粉体を一
軸加圧成形して円盤状成形体を作製し、円盤状成形体を
ホットプレスにより焼結させる。Next, a method for manufacturing a ceramics heater according to the present invention will be described with reference to manufacturing process drawings which are schematic sectional views shown in FIGS. 4 (a) to 4 (d). The steps will be described below in order. First, the first ceramic heater molded body shown in FIG. 4 (a) is manufactured. That is, terminals (electrodes) are bonded to both ends of a wound body obtained by winding a wire body of a high melting point metal, ceramic powder is charged in a press molding machine, and the surface of the preformed body is
A continuous depression or groove is provided along a predetermined planar pattern. Then, the wound body is housed in this recess, and ceramic powder is further filled on the recess, and the ceramic powder is uniaxially pressure-molded to produce a disk-shaped molded body, and the disk-shaped molded body is baked by hot pressing. Tie.
【００３７】次に、得られた第１のセラミックス成形体
に流体流入路５及び流体流出路6を形成する〔図４(b)
〕。その後、流体通路を形成するマスクを第１のセラ
ミックスヒータ基体部分の基体加熱面側の面に載置し、
サンドブラスト処理あるいはエッチング処理等を行うこ
とによって流体通路を形成する溝部を設ける〔図４(c)
〕。最後に、ガラス(例えば、YSiALON 系ガラス) 等の
接着剤を介して溝形成面に薄板状の第２のセラミックス
成形体を重ね、焼成することによって薄板状体を一体化
する〔図４(d) 〕。本製造方法では、第１のセラミック
スヒータ成形体の表面に流体通路形成溝を設けたが、薄
板状の第２の成形体に流体流路を形成する溝を設けても
よい。各セラミックス成形体は、ホットプレス法で焼結
するのが最も好ましいが、常圧焼結してもよく、あるい
は常圧で予備焼結させた後にホットアイソスタティック
プレス法で焼結させてもよい。Next, a fluid inflow path 5 and a fluid outflow path 6 are formed in the obtained first ceramic molded body [FIG. 4 (b)].
]. After that, a mask that forms a fluid passage is placed on the surface of the first ceramics heater base portion on the base heating surface side,
Providing a groove for forming a fluid passage by performing sandblasting or etching [Fig. 4 (c)]
]. Finally, a thin plate-shaped second ceramic molded body is overlaid on the groove forming surface with an adhesive such as glass (for example, YSiALON-based glass) and baked to integrate the thin plate-shaped body [Fig. 4 (d )]. In this manufacturing method, the fluid passage forming groove is provided on the surface of the first ceramics heater molded body, but a groove for forming a fluid flow path may be provided in the thin plate-shaped second molded body. It is most preferable to sinter each ceramic compact by a hot press method, but it may be sintered under normal pressure, or may be pre-sintered under normal pressure and then sintered by a hot isostatic press method. .
【００３８】[0038]
【実施例】本発明のセラミックスヒータの均熱効果を調
べるため、以下の実験をした。用いたセラミックスヒー
タは、図３に示す第３の実施例の形状のもので、各部の
寸法は以下の通りであった。なお、セラミックスヒータ
の基体は、窒化珪素を成形・焼成することにによって形
成した。 １）セラミックスヒータ基体直径: 205 mm ２）流体流路 幅：10mm、深さ: 0.3mm ３）隔壁 幅：28mm、高さ: 0.3mm ４）加熱面から流体流路上面までの距離：１mm 図５に示すように、このセラミックスヒータの流体流入
口及び流体流出口にそれぞれ流体流入管14及び流体流出
管15を活性銀ロウ16によって接合し、８インチのシリコ
ーンウェハをセラミックスヒータの加熱面上にメカニカ
ルクランプ（図示せず）、で機械的に固定した。 流路に
流す流体はＡｒ流体を予熱せずに常温で用い、所定の流
量で流路中を流しセラミックスヒータの均熱性の測定を
行った。EXAMPLE The following experiment was conducted in order to investigate the soaking effect of the ceramics heater of the present invention. The ceramic heater used had the shape of the third embodiment shown in FIG. 3, and the dimensions of each part were as follows. The base of the ceramic heater was formed by molding and firing silicon nitride. 1) Ceramic heater base diameter: 205 mm 2) Fluid channel width: 10 mm, depth: 0.3 mm 3) Partition wall width: 28 mm, height: 0.3 mm 4) Distance from heating surface to fluid channel upper surface: 1 mm Figure As shown in FIG. 5, a fluid inflow pipe 14 and a fluid outflow pipe 15 are bonded to the fluid inflow port and the fluid outflow port of the ceramics heater with activated silver braze 16, respectively, and an 8-inch silicone wafer is placed on the heating surface of the ceramics heater. It was mechanically fixed by a mechanical clamp (not shown). As the fluid flowing in the flow channel, an Ar fluid was used at room temperature without being preheated, and the ceramic heater was measured for uniform temperature by flowing in the flow channel at a predetermined flow rate.
【００３９】測定にあったては、本試験例で作成した各
例のセラミックスヒータを真空容器17に密封状態で配置
し、ウェハを基体加熱面との間に所定の間隔をあけて固
定・保持し、基体加熱面の温度の平均値が約 850℃とな
るように抵抗発熱体を発熱させ、加熱面上に保持された
ウェハの中央部（ウェハの中心から直径 190mmの円の内
部領域）の異なる30箇所における温度を赤外線放射温度
計で測定した。これらの結果を度数分布で表１に示す。
なお、均熱性は、（ばらつき温度÷平均温度×100 ）で
計算した値で表した。従来例として、流体流路を設けて
いない以外は同一のセラミックヒータを用い、また流体
流路内にガスを流さず真空引きしたものを参考例とし
た。In the measurement, the ceramic heaters of each example prepared in this test example are placed in a vacuum container 17 in a hermetically sealed state, and the wafer is fixed and held at a predetermined distance from the substrate heating surface. Then, the resistance heating element is caused to generate heat so that the average temperature of the heated surface of the substrate becomes approximately 850 ° C, and the central portion of the wafer held on the heated surface (the inner area of the circle with a diameter of 190 mm from the center of the wafer) The temperature at 30 different points was measured with an infrared radiation thermometer. The results are shown in Table 1 as a frequency distribution.
The soaking property is represented by a value calculated by (variation temperature / average temperature x 100). As a conventional example, the same ceramic heater was used except that no fluid flow passage was provided, and a vacuum was drawn without flowing gas in the fluid flow passage as a reference example.
【００４０】[0040]
【表１】 [Table 1]
【００４１】上記表から分かるように、流体流路内を真
空にした場合、均熱性は±4.3 %であったが、Ａｒガス
を充填した状態（１atm)で均熱性は±3.2 ％まで向上し
た。さらに、１SCCMの一定の流量でＡｒガスを流体流路
に流したとき、均熱性は 1.1％まで向上した。一方、Ａ
ｒガスの流量を10 SCCM に変えると均熱性0.55%まで向
上した。しかし、10 SCCM より大きい流量でＡｒガスを
流体流路に流しても均熱性はこれ以上改善しなかった。As can be seen from the above table, when the fluid passage was evacuated, the soaking property was ± 4.3%, but when so filled (1 atm) with Ar gas, the soaking property was improved to ± 3.2%. . Furthermore, when Ar gas was caused to flow through the fluid passage at a constant flow rate of 1 SCCM, the soaking property was improved to 1.1%. On the other hand, A
When the flow rate of r gas was changed to 10 SCCM, the heat uniformity improved to 0.55%. However, even if Ar gas was caused to flow through the fluid flow passage at a flow rate higher than 10 SCCM, the soaking property was not further improved.
【００４２】[0042]
【発明の効果】本発明のセラミックスヒータは、セラミ
ックスヒータ基体とセラミックスヒータ本体に埋設した
電気発熱抵抗体とからなり、セラミックスヒータ基体内
部でかつセラミックスヒータ本体の加熱面と当該電気発
熱抵抗体との間に加熱面に沿って延びる流体通路を設
け、該流体通路内に流体を充填することを可能としたの
で、セラミックスヒータの加熱面の温度を均一な制御を
可能となる。The ceramic heater of the present invention comprises a ceramic heater base and an electric heating resistor embedded in the ceramic heater body. The ceramic heater is provided inside the ceramic heater base, and the heating surface of the ceramic heater body and the electric heating resistor. Since the fluid passage extending along the heating surface is provided between the fluid passages and the fluid passage can be filled with the fluid, the temperature of the heating surface of the ceramic heater can be uniformly controlled.
【００４３】本発明のセラミックヒータは、セラミック
ススヒータ基体とセラミックスヒータ基体に埋設した発
熱抵抗体とからなる、該セラミックスヒータはさらに冷
却機構を有し、該冷却機構はセラミックスヒータ基体内
部でかつセラミックスヒータ基体の加熱面と当該発熱抵
抗体との間に加熱面に沿って延びる流体通路からなり
る。従って該流体通路内に流体を流すことによって、セ
ラミックスヒータの冷却を迅速に行うことが可能とし
た。The ceramic heater of the present invention comprises a ceramics heater base and a heating resistor embedded in the ceramics heater base. The ceramics heater further has a cooling mechanism, and the cooling mechanism is inside the ceramics heater base and ceramics. A fluid passage extends along the heating surface between the heating surface of the heater base and the heating resistor. Therefore, it is possible to quickly cool the ceramics heater by flowing the fluid in the fluid passage.
【００４４】さらに、本発明のセラミックヒータの製造
方法では、発熱抵抗体が埋設された第１のセラミックス
成形体を形成し、該第１のセラミックス成形体に接合す
べき第２のセラミックス成形体を形成し、該第１の焼成
セラミックス成形体及び該第２のセラミックス成形体と
を接合することによってセラミックスヒータを製造する
方法であって、第１と第２のセラミックス成形体との接
合面の少なくとも一方の接合面に流体通路を形成する溝
を設け、第１のセラミックス成形体に該流体通路に連通
する流体流入口及び流体流出口を形成し、第１のセラミ
ックス成形体と第２のセラミックス成形体を接合するこ
とによって、該セラミックスヒータ基体の加熱面と当該
発熱抵抗体との間に該溝と他方の接合面とによって加熱
面に沿って延びる流体通路を設けるので、均一に加熱が
可能なセラミックスヒータを容易に作製することができ
る。Further, in the method for manufacturing a ceramic heater according to the present invention, a first ceramics compact having a heating resistor embedded therein is formed, and a second ceramics compact to be bonded to the first ceramics compact is formed. A method of manufacturing a ceramics heater by forming and bonding the first fired ceramics compact and the second ceramics compact, comprising at least a joint surface between the first and second ceramics compacts. A groove for forming a fluid passage is formed on one of the joint surfaces, and a fluid inlet and a fluid outlet communicating with the fluid passage are formed in the first ceramic molded body to form a first ceramic molded body and a second ceramic molded body. By joining the bodies, the groove extends between the heating surface of the ceramic heater base and the heating resistor along the heating surface by the groove and the other joining surface. Since provision of the body passageway, it is possible to easily produce a ceramic heater capable of uniformly heating.
【図１】図１(a) 及び図１(b) は、それぞれ本発明の第
１の実施例に係るセラミックスヒータの縦断面図及び平
面図である。1 (a) and 1 (b) are a longitudinal sectional view and a plan view, respectively, of a ceramic heater according to a first embodiment of the present invention.
【図２】図２(a) 及び図２(b) は、それぞれ本発明の第
２の実施例に係るセラミックスヒータの縦断面図及び平
面図である。FIG. 2 (a) and FIG. 2 (b) are a longitudinal sectional view and a plan view of a ceramics heater according to a second embodiment of the present invention, respectively.
【図３】図３は、本発明の第３の実施例に係るセラミッ
クスヒータの横断面図である。FIG. 3 is a cross-sectional view of a ceramics heater according to a third embodiment of the present invention.
【図４】図４(a) から図４(d) は、本発明に係るセラミ
ックスヒータの製造方法を断面図で説明する工程図であ
る。FIG. 4 (a) to FIG. 4 (d) are process drawings for explaining a method for manufacturing a ceramics heater according to the present invention with sectional views.
【図５】図５はセラミックスヒータの均熱性を調べた実
験例を説明する図である。FIG. 5 is a diagram illustrating an experimental example in which the soaking property of a ceramics heater is examined.
１ セラミックスヒータ基体、１ｂ 加熱面、２ 発熱
抵抗体、３ 端子、４, 40, 41, 42, 43, 44, 45, ４
ａ, ４ｂ 流体流路、５, 51, 52流体流入口、６, 61,
62 流体流入路、７, 71, 72 流体流出口、８, 81, 82
流体流出路、９ ウェハ、11a, 11b, 11c, 11d、 12a, 1
2b, 12c, 12d 隔壁、13a, 13b, 13c, 13d 流体流路、
14 流体流入管、15 流体流出管、16 活性銀ロウ、17
真空容器1 ceramics heater base, 1b heating surface, 2 heating resistors, 3 terminals, 4, 40, 41, 42, 43, 44, 45, 4
a, 4b fluid flow path, 5, 51, 52 fluid inlet, 6, 61,
62 fluid inlet, 7, 71, 72 fluid outlet, 8, 81, 82
Fluid outflow path, 9 wafers, 11a, 11b, 11c, 11d, 12a, 1
2b, 12c, 12d bulkhead, 13a, 13b, 13c, 13d fluid flow path,
14 fluid inflow pipe, 15 fluid outflow pipe, 16 activated silver wax, 17
Vacuum container
Claims (12)
ヒータ基体に埋設した電気発熱抵抗体とからなるセラミ
ックスヒータにおいて、セラミックスヒータ基体内部で
かつセラミックスヒータ基体の加熱面と当該発熱抵抗体
との間に加熱面に沿って伸びる流体通路が設けられ、該
流体通路内に流体を充填することによって、セラミック
スヒータ本体の加熱面の温度の制御を可能としたセラミ
ックスヒータ。1. A ceramic heater comprising a ceramics heater base and an electric heating resistor embedded in the ceramics heater base, wherein a heating surface is provided inside the ceramics heater base and between the heating face of the ceramics heater base and the heating resistor. A ceramics heater provided with a fluid passage extending along the fluid passage, and by filling the fluid passage with a fluid, the temperature of the heating surface of the ceramics heater body can be controlled.
クスヒータ外部から該流体通路に導入され、セラミック
スヒータ外部に導出される請求項１記載のセラミックス
ヒータ。2. The ceramic heater according to claim 1, wherein the fluid in the fluid passage is forcibly introduced into the fluid passage from the outside of the ceramic heater and is led out to the outside of the ceramic heater.
選ばれた不活性ガスである請求項１ないし２記載のセラ
ミックスヒータ。3. The ceramic heater according to claim 1, wherein the fluid is an inert gas selected from argon, helium and nitrogen.
し、前記発熱抵抗体がセラミックヒータ基体内で螺旋状
に巻回され埋設されている請求項１乃至３のいずれかの
請求項に記載したセラミックスヒータ。4. The ceramic according to claim 1, wherein the ceramics heater base has a disk shape, and the heating resistor is spirally wound and embedded in the ceramics heater base. heater.
す請求項２乃至４のいずれかの請求項に記載したセラミ
ックスヒータ。5. The ceramic heater according to claim 2, wherein the fluid is caused to flow at a velocity in the range of 1 to 30 SCCM.
複数の環状の通路からなり、該複数の環状の通路が流体
流入口と流体流出口との間に伸びる請求項１乃至５のい
ずれかに記載したセラミックスヒータ。6. The fluid passage according to claim 1, wherein the fluid passage comprises a plurality of annular passages extending substantially concentrically, and the plurality of annular passages extend between a fluid inlet and a fluid outlet. The ceramic heater described in any one.
体流出口と１組の中央流体流入口と中央流出口とからな
り、該１組の外側流体流入口と外側流体流出口との間及
び該１組の中央流体流入口と中央流体流出口との間にそ
れぞれ外周側流体通路と中央流体通路とが周方向に略同
心円状でかつジグザグに延びる請求項１乃至５記載のセ
ラミックスヒータ。7. At least one set of an outer fluid inlet, an outer fluid outlet, a set of a central fluid inlet and a central outlet, and between the pair of outer fluid inlet and the outer fluid outlet. The ceramic heater according to any one of claims 1 to 5, wherein the outer peripheral fluid passage and the central fluid passage extend substantially concentrically and zigzag in the circumferential direction between the pair of central fluid inlet and central fluid outlet.
周方向に複数の領域に分け、各領域に対応して外周部か
ら内周部にかけて周方向にジグザグに延びる通路を設け
た請求項１乃至５に記載したセラミックスヒータ。8. The heating surface portion of the ceramics heater body is divided into a plurality of regions in the circumferential direction, and a passage extending in a zigzag pattern in the circumferential direction from the outer peripheral portion to the inner peripheral portion is provided corresponding to each region. Ceramic heater described in.
ヒータ基体に埋設した発熱抵抗体とからなるセラミック
スヒータにおいて、該セラミックスヒータはさらに冷却
機構を有し、該冷却機構はセラミックスヒータ基体内部
でかつセラミックスヒータ基体の加熱面と当該発熱抵抗
体との間に加熱面に沿って延びる流体通路からなり、該
流体通路内に流体を流すことによってセラミックスヒー
タの冷却を促進することを可能とした冷却機構付セラミ
ックスヒータ。9. A ceramics heater comprising a ceramics heater base and a heating resistor embedded in the ceramics heater base, wherein the ceramics heater further has a cooling mechanism, the cooling mechanism being inside the ceramics heater base and the ceramics heater base. A ceramic heater with a cooling mechanism comprising a fluid passage extending along the heating surface between the heating surface and the heating resistor, and allowing cooling of the ceramic heater to be accelerated by flowing a fluid in the fluid passage. .
求項９記載のセラミックスヒータ。10. The ceramic heater according to claim 9, wherein the fluid is caused to flow at a rate of 1 SCCM or more.
クス成形体を形成し、該第１のセラミックス成形体に接
合すべき第２のセラミックス成形体を形成し、該第１の
焼成セラミックス成形体及び該第２のセラミックス成形
体とを接合することによってセラミックスヒータを製造
する方法であって、第１と第２のセラミックス成形体と
の接合面の少なくとも一方の接合面に流体通路を形成す
る溝を設け、第１のセラミックス成形体に該流体通路に
連通する流体流入口及び流体流出口を形成し、第１のセ
ラミックス成形体と第２のセラミックス成形体を接合す
ることによって、該セラミックスヒータ基体の加熱面と
当該発熱抵抗体との間に該溝と他方の接合面とによって
加熱面に沿って延びる流体通路を設けるセラミックスヒ
ータの製造方法。11. A first ceramic molded body in which a heating resistor is embedded, a second ceramic molded body to be joined to the first ceramic molded body is formed, and the first fired ceramic molded body is formed. A method of manufacturing a ceramics heater by joining a body and the second ceramics compact, wherein a fluid passage is formed on at least one of the joints between the first and second ceramics compacts. The ceramic heater is provided with a groove, a fluid inlet and a fluid outlet communicating with the fluid passage are formed in the first ceramic molded body, and the first ceramic molded body and the second ceramic molded body are joined to each other. A method for manufacturing a ceramic heater, wherein a fluid passage extending along a heating surface is provided between the heating surface of a substrate and the heating resistor by the groove and the other joint surface.
合面の少なくとも一方の接合面に流体通路に対応する形
状を与えるマスクを載置し、サンドブラストあるいはエ
ッチング処理によって流体通路を形成する該溝を設け、
第１と第２のセラミックス成形体との接合面の少なくと
も一方の接合面に対し YSiAlON系ガラス等の接着剤を塗
布後第１のセラミック成形体と第２のセラミック成形体
とをガラス塗布層を介して接合させ焼成する請求項11に
記載したセラミックスヒータの製造方法。12. A mask for providing a shape corresponding to a fluid passage is placed on at least one of the joining surfaces of the first and second ceramic compacts, and the fluid passage is formed by sandblasting or etching. With a groove,
After applying an adhesive such as YSiAlON-based glass to at least one of the joint surfaces of the first and second ceramic compacts, a glass coating layer is applied to the first ceramic compact and the second ceramic compact. 12. The method for manufacturing a ceramics heater according to claim 11, wherein the ceramics heater is joined and fired.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6061167A JP2960645B2 (en) | 1994-03-30 | 1994-03-30 | Ceramic heater and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6061167A JP2960645B2 (en) | 1994-03-30 | 1994-03-30 | Ceramic heater and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07272834A true JPH07272834A (en) | 1995-10-20 |
| JP2960645B2 JP2960645B2 (en) | 1999-10-12 |
Family
ID=13163326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6061167A Expired - Lifetime JP2960645B2 (en) | 1994-03-30 | 1994-03-30 | Ceramic heater and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2960645B2 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001160479A (en) * | 1999-12-01 | 2001-06-12 | Tokyo Electron Ltd | Ceramic heating resistor and board processing device using the same |
| JP2007066542A (en) * | 2005-08-29 | 2007-03-15 | Kyocera Corp | Heater and wafer-heating device, and manufacturing method of heater |
| CN100350207C (en) * | 2002-04-10 | 2007-11-21 | 光洋热系统株式会社 | Heating apparatus |
| US7981218B2 (en) | 2006-03-24 | 2011-07-19 | Tokyo Electron Limited | Substrate supporting mechanism and substrate processing apparatus |
| US8055125B2 (en) | 2005-07-14 | 2011-11-08 | Tokyo Electron Limited | Substrate stage mechanism and substrate processing apparatus |
| JP2013161522A (en) * | 2012-02-01 | 2013-08-19 | Ngk Insulators Ltd | Ceramic heater |
| CN108493619A (en) * | 2018-03-09 | 2018-09-04 | 南京邮电大学 | A kind of multi purpose space wave beam compiler based on plasma Meta Materials |
| CN108682966A (en) * | 2018-04-16 | 2018-10-19 | 南京邮电大学 | A kind of novel super surface of plasma Meta Materials trap |
| KR20210009052A (en) * | 2019-07-16 | 2021-01-26 | 최낙운 | Drying apparatus for enhancing dry efficiency |
| US10941477B2 (en) | 2013-01-24 | 2021-03-09 | Tokyo Electron Limited | Substrate processing apparatus and susceptor |
| CN114530521A (en) * | 2020-11-05 | 2022-05-24 | 中国建材国际工程集团有限公司 | Heating device of laminator |
| CN116770273A (en) * | 2023-06-28 | 2023-09-19 | 拓荆科技(上海)有限公司 | Base plate heating system and semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04306583A (en) * | 1991-04-03 | 1992-10-29 | Seiko Epson Corp | Hot plate for ic heating |
| JPH05175139A (en) * | 1991-12-25 | 1993-07-13 | Ngk Insulators Ltd | Ceramic heater |
-
1994
- 1994-03-30 JP JP6061167A patent/JP2960645B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04306583A (en) * | 1991-04-03 | 1992-10-29 | Seiko Epson Corp | Hot plate for ic heating |
| JPH05175139A (en) * | 1991-12-25 | 1993-07-13 | Ngk Insulators Ltd | Ceramic heater |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001160479A (en) * | 1999-12-01 | 2001-06-12 | Tokyo Electron Ltd | Ceramic heating resistor and board processing device using the same |
| US6951587B1 (en) | 1999-12-01 | 2005-10-04 | Tokyo Electron Limited | Ceramic heater system and substrate processing apparatus having the same installed therein |
| CN100350207C (en) * | 2002-04-10 | 2007-11-21 | 光洋热系统株式会社 | Heating apparatus |
| US8055125B2 (en) | 2005-07-14 | 2011-11-08 | Tokyo Electron Limited | Substrate stage mechanism and substrate processing apparatus |
| JP2007066542A (en) * | 2005-08-29 | 2007-03-15 | Kyocera Corp | Heater and wafer-heating device, and manufacturing method of heater |
| US7981218B2 (en) | 2006-03-24 | 2011-07-19 | Tokyo Electron Limited | Substrate supporting mechanism and substrate processing apparatus |
| JP2013161522A (en) * | 2012-02-01 | 2013-08-19 | Ngk Insulators Ltd | Ceramic heater |
| US10941477B2 (en) | 2013-01-24 | 2021-03-09 | Tokyo Electron Limited | Substrate processing apparatus and susceptor |
| CN108493619B (en) * | 2018-03-09 | 2020-05-15 | 南京邮电大学 | Multifunctional space beam compiler based on plasma metamaterial |
| CN108493619A (en) * | 2018-03-09 | 2018-09-04 | 南京邮电大学 | A kind of multi purpose space wave beam compiler based on plasma Meta Materials |
| CN108682966A (en) * | 2018-04-16 | 2018-10-19 | 南京邮电大学 | A kind of novel super surface of plasma Meta Materials trap |
| CN108682966B (en) * | 2018-04-16 | 2020-04-24 | 南京邮电大学 | Novel trapped wave super surface of plasma metamaterial |
| KR20210009052A (en) * | 2019-07-16 | 2021-01-26 | 최낙운 | Drying apparatus for enhancing dry efficiency |
| CN114530521A (en) * | 2020-11-05 | 2022-05-24 | 中国建材国际工程集团有限公司 | Heating device of laminator |
| CN114530521B (en) * | 2020-11-05 | 2023-08-11 | 中国建材国际工程集团有限公司 | Heating device of laminating machine |
| CN116770273A (en) * | 2023-06-28 | 2023-09-19 | 拓荆科技(上海)有限公司 | Base plate heating system and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2960645B2 (en) | 1999-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106469666B (en) | Base and matrix processing equipment | |
| JP5523326B2 (en) | Electrostatic chuck assembly | |
| US6951587B1 (en) | Ceramic heater system and substrate processing apparatus having the same installed therein | |
| KR101118863B1 (en) | Substrate holder having a fluid gap and method of fabricating the substrate holder | |
| KR100452649B1 (en) | Plasma process device, electrode structure thereof, and stage structure | |
| JP2960645B2 (en) | Ceramic heater and method of manufacturing the same | |
| US11956863B2 (en) | Multi-zone heater | |
| JP2011502361A (en) | Temperature control module that uses gas pressure to control the thermal conductivity between the coolant and the component body | |
| JP7290687B2 (en) | ELECTROSTATIC CHUCK, MANUFACTURING METHOD THEREOF, AND SUBSTRATE PROCESSING APPARATUS | |
| JP2022552237A (en) | Wafer heater with backside purge and integrated ramp purge | |
| JP2005510869A (en) | Heating vacuum support device | |
| US20230079804A1 (en) | Wafer chuck with thermal tuning cavity features | |
| JP2004253789A (en) | Electrostatic chuck | |
| JP2022553302A (en) | monolithic anisotropic substrate support | |
| CN112582330A (en) | Semiconductor processing equipment and electrostatic chuck assembly thereof | |
| CN112753097A (en) | Multiplexed high TCR-based ampoule heaters | |
| TWI841636B (en) | Pedestal including vapor chamber for substrate processing systems | |
| US20230383406A1 (en) | Axially cooled metal showerheads for high temperature processes | |
| US20220002866A1 (en) | Pedestal including vapor chamber for substrate processing systems | |
| JP6789081B2 (en) | Holding device | |
| WO2023140941A1 (en) | Active temperature control of showerheads for high temperature processes | |
| CN116057684A (en) | Susceptor thermal profile adjustment using multiple heating zones and thermal apertures | |
| CN116065137A (en) | Substrate processing apparatus | |
| KR20230149836A (en) | wit squad and wit structure | |
| JP2024506289A (en) | Hybrid liquid/air cooling system for TCP windows |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990629 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080730 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090730 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100730 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100730 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110730 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120730 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120730 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130730 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term |