JPH0726887Y2 - Adhesive sheet for Mitsuba sowing seedlings - Google Patents

Description

[Detailed description of the device]

[0001]

[Industrial application] The present invention is for sowing vegetables, flowers, etc.
The present invention relates to a pressure-sensitive adhesive sheet for seeding and raising seedlings used for raising seedlings, and particularly to a pressure-sensitive adhesive sheet for seeding and raising seedlings suitable for efficiently seeding mitsuba seeds at a desired site at a desired density.

[0002]

2. Description of the Related Art At present, in the hydroponic cultivation of mitsuba, it is common to sow seeds into seedling raising boxes by spreading seeds by hand or using an automatic seeder. Of these, in the case of manual sowing, the seeding density tends to be uneven, and each section (planting unit) used when tearing the mat small pieces along the perforations provided between the planting units of the nursery mat during planting Since the number of seeds of varieties varied, it was necessary to reduce the number of seeds after germination in order to equalize the crop density at harvest. In addition, in the case of sowing work with an automatic seeder, seeding density is relatively uniform, but seedlings grown from seeds sown near the perforations of the seedling mat may have root damage during planting. After that, growth was hindered by such factors, so again thinning work was required. Further, in both cases of manual sowing and automatic sowing, since the growth bodies are dense, it is difficult to perform the lower leaf removal work or the like performed after harvesting, especially for the growth bodies in the central part of the dense growth.

In order to solve the above problems,
The inventors of the present invention first provided a plurality of planting units on a water-soluble or water-dispersible support, and applied a point-like adhesive to each planting unit so that the mitsuba seeds were We have proposed an adhesive sheet for mitsuba sowing seedlings that can be evenly mounted in each planting unit (Jpn. Pat. Appln. No. 1-084552).

[0004]

However, in the pressure-sensitive adhesive sheet, if the mutual intervals of the plurality of dot-shaped pressure-sensitive adhesives coated for each planting unit are too wide, when the sheet is placed on the seedling-growing mat, The distance between the point-shaped adhesive at the end of each planting unit and the perforation of the mat becomes closer, and the root extending from the mitsuba seed mounted on the point-shaped adhesive passes through the perforations of the nursery mat and is adjacent to the planting unit. May extend to. Such roots are damaged when the seedling mats are torn along the perforations during planting, which prevents normal growth.

[0005] Further, if a plurality of dot-like adhesives coated for each planting unit are placed too close to each other, the seed density will be high, which will hinder each other's growth, resulting in uneven growth, and There is a problem that the efficiency of various work such as the lower leaf removal work later is lowered.

An object of the present invention is to solve the problems of the above-mentioned prior art and efficiently sow mitsuba seeds at a desired site at a desired density to improve the efficiency of various cultivation work. Another object of the present invention is to provide an adhesive sheet for sowing and raising seedlings suitable for improving the quality of harvested crops.

[0007]

The above object is to provide a plurality of plant-forming units at desired positions on a water-soluble or water-dispersible sheet-like support, and to provide a plurality of point-like pressure-sensitive adhesives for each plant-forming unit. In the pressure-sensitive adhesive sheet for sowing and raising seedlings, the number of the pressure-sensitive adhesive coated area per one point-shaped pressure-sensitive adhesive is 2.5 to ⁴ mm ² , and the number of dot-shaped pressure-sensitive adhesive coated per planting unit is 8, The space between adjacent point adhesives of the matching planting unit is 8
It can be achieved by using a pressure-sensitive adhesive sheet for seeding and raising seedlings, which is in the range of ~ 12 mm, and in which the plurality of dot-shaped pressure-sensitive adhesives in the planting unit are arranged so as to provide a void in the center. it can.

[0008]

[Function] Seeds of honey are 5 to 6 mm long and have a maximum width of 1 mm.
The seeds are flat with a spindle-shaped cross section with a thickness of 0.2 to 0.3 mm. The cultivation method is a dense cultivation method in which 20 to 25 seeds are sown per one planting unit, and the size of one planting unit of a commonly used seedling raising mat is about 23 mm square. Based on these factors, the specifications of the pressure-sensitive adhesive sheet for optimum seeding and raising seedlings for mitsuba were experimentally examined, and as a result, the above specifications were found.

That is, assuming that the adhesive coating area per point adhesive is 2.5 to 4 mm ² , the average number of seeds loaded per dot of the spit seeds of the above size is about 3 seeds, and the point per planting unit. 1 by changing the number of coated adhesives to 8
The average number of seeds loaded per unit planting can be set to about 24 seeds. Further, it was found that an appropriate gap can be provided in the central portion by setting the interval between the point adhesives adjacent to each other in adjacent planting units to be 8 to 12 mm, and the product has a good volume feeling. . Furthermore, as a result of the actual cultivation experiment, in the case of such an adhesive coated area and number, not only the growth rate of the mitsuba seedlings and the seedling alignment but also the thickness of the stems after harvest, the leaf color and the stem length are uniform. It was also found to be excellent in sex and the like.

Here, the reason why the void is provided in the central portion in the dot-like pressure-sensitive adhesive coating arrangement is as follows. That is, when the dot-shaped adhesive is arranged in a grid of 3 rows and 3 columns, the dot-shaped adhesive placed in the center is surrounded by other dot-shaped adhesives, and therefore the seedlings germinated here During growth, not only are the surrounding seedlings placed in a disadvantageous condition with respect to environmental conditions such as light and temperature, but their presence also adversely affects the growth of the surrounding seedlings. Growth will be delayed as a whole compared to the case without seedlings. In addition, it is difficult to perform the lower leaf removal work after harvesting the mitsuba grown from the seed mounted on the adhesive in the central part.

As described above, in the arrangement of the point adhesive, by providing a void in the central portion, it is possible to improve the quality of the crop to be harvested and the working efficiency in cultivation.

[0012]

EXAMPLES Hereinafter, the construction of the adhesive sheet for sowing and raising seedlings according to the present invention will be specifically described with reference to Examples.

[0013]

Embodiment 1 FIGS. 1 and 2 are partially enlarged views showing the construction of an embodiment of an adhesive sheet for sowing and raising seedlings according to the present invention. FIG. 1 is a perspective view and FIG. 2 is a top view. Body 1 and dot-shaped adhesive 2 coated with eight pieces for each planting unit of the support
Indicates that it consists of. Here, the diameter d of the dot adhesive 2 is about 1.8 mm (area about 2.5 mm ² ), and 8 dot adhesives are 3
The coating was performed so as to be located at the peripheral points on the grid points of row 3 column. In addition, the distance L ₁ between adjacent adhesives in one planting unit
Is 7 mm, the distance L between adjacent adhesives between adjacent planting units
₂ was 9 mm.

As a result of carrying out seedling raising and hydroponic cultivation of the mitsuba using the above-mentioned adhesive sheet for seeding and raising seedlings, thinning in the middle of cultivation and lower leaf removal after harvesting were carried out as compared with the case where the mitsuba seeds were sowed by hand. It was possible to reduce the amount of work such as about 1/3. Regarding the harvested mitsuba, the average leaf area, stem diameter, etc. were also increased by about 20%, and there was relatively little variation in individual growth, and high quality was able to be harvested.

[0015]

[Advantage of the Invention] As described above, by using the adhesive sheet for sowing and raising seedlings of mitsuba as the adhesive sheet of the present invention, the problems of the prior art can be solved and the mitsuba seeds can be applied to desired parts. It was possible to provide a pressure-sensitive adhesive sheet for sowing and raising seedlings suitable for efficient sowing at a desired density, improving the efficiency of various operations for cultivation, and improving the quality of crops to be harvested.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic structure of an embodiment of an adhesive sheet for seeding and raising seedlings of the present invention.

FIG. 2 is a top view showing a schematic configuration of an embodiment of an adhesive sheet for seeding and raising seedlings of the present invention.

[Explanation of symbols]

 1 ... Water-absorbent sheet-like support, 2 ... Dot-shaped adhesive.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Norimasa Kamezawa, Inventor No. 3819 Noborito, Tama-ku, Kawasaki City, Kanagawa Prefecture Sliontech Co., Ltd. M-type Hydroponics Research Institute (72) Shinji Murai 1-37 Sakaanakachi, 14 Yamamura, Kaifu-gun, Aichi Prefecture M-type Hydroponics Research Institute

Claims (1)

[Scope of utility model registration request] 1. Adhesion for seeding and raising seedlings, which comprises a plurality of planting units provided at desired positions on a water-soluble or water-dispersible sheet-like support, and a plurality of point-like adhesives per planting unit. In the sheet, the adhesive coating area per one point of the above point adhesive is in the range of ^2.5 to 4 mm ² , the number of pressure sensitive adhesive coating per fixed plant unit is 8, and the adjacent dotted adhesive of adjacent fixed plant units. Adhesion for sowing and raising seedlings for mitsuba, characterized in that the distance between them is in the range of 8 to 12 mm, and that a plurality of point adhesives in the planting unit are arranged so as to form a void in the center. Sheet.