JPH07260533A - Air flow measuring device - Google Patents
Air flow measuring deviceInfo
- Publication number
- JPH07260533A JPH07260533A JP6046770A JP4677094A JPH07260533A JP H07260533 A JPH07260533 A JP H07260533A JP 6046770 A JP6046770 A JP 6046770A JP 4677094 A JP4677094 A JP 4677094A JP H07260533 A JPH07260533 A JP H07260533A
- Authority
- JP
- Japan
- Prior art keywords
- conductive plug
- conductive
- base
- air flow
- measuring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、内燃機関の吸入空気流
量を計測する空気流量測定装置の対ＥＭＩ性ノイズ除去
に関する構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for removing EMI noise of an air flow measuring device for measuring an intake air flow of an internal combustion engine.
【０００２】[0002]
【従来の技術】従来の技術は、例えば特開平4−261067
号公報に記載されているように、ベースと導電性プラグ
を同一部材のプレスによって形成する構造となってい
る。2. Description of the Related Art A conventional technique is disclosed in, for example, Japanese Patent Laid-Open No. 261067/1992.
As described in the publication, the structure is such that the base and the conductive plug are formed by pressing the same member.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術は、ベー
スと導電性プラグをプレスによりを同一部材で形成され
ていた。よって熱膨張係数により、圧入した導電性プラ
グとベースの間に隙間が出来ることはなかった。In the above prior art, the base and the conductive plug are formed by the same member by pressing. Therefore, due to the coefficient of thermal expansion, no gap was created between the press-fitted conductive plug and the base.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
に、ベースと導電性プラグの膨張係数を同等にし、か
つ、ベースより導電性プラグのほうがヤング率が同等か
又は、小さい材料で構成する構造とした。In order to achieve the above object, the base and the conductive plug are made to have the same expansion coefficient, and the conductive plug is made of a material whose Young's modulus is equal to or smaller than that of the base. With the structure.
【０００５】[0005]
【作用】ベースと導電性プラグの膨張係数を同等にする
ことにより、振動，冷熱サイクルによる抜け、電気的接
触抵抗の増加を防ぐことが出来、ＥＭＣレベルの低下を
防ぐことが出来る。また、導電性プラグに超音波ボンデ
ィングしたときの、振動の逃げをも防ぐことが出来る。By making the expansion coefficient of the base equal to that of the conductive plug, it is possible to prevent vibration, removal due to cooling and heating cycles, and increase in electrical contact resistance, and it is possible to prevent lowering of the EMC level. Further, it is possible to prevent escape of vibration when ultrasonically bonding the conductive plug.
【０００６】[0006]
【実施例】以下、本発明の実施例を図１，図２，図３，
図４，図５により説明する。図１は発熱抵抗体式空気流
量計を示し、回路モジュール１とボディ２より構成され
ている。この回路モジュール１の回路は、図２に示すよ
うに制御回路基板４上に構成し、フィルター回路５も同
一基板上に構成する。外部ラインより入ってきたノイズ
はフィルター５を通り、導電性ワイヤー７を通り、導電
性プラグ６を通り、導電性ベース８に落ちる構造となっ
ている。発熱抵抗体式空気流量計はエンジンルーム内に
あり、苛酷な温度，振動条件下にある。この構造におい
て、ＥＭＣの低下不良を出さないためには、制御回路基
板４と導電性ベース８間の抵抗を小さくする必要が有
り、導電性ベース８と塑性加工（メタルフロー）された
導電性プラグ６の接触抵抗を小さくし、冷熱サイクルに
よる導電性ベース８と導電性プラグ６の隙間を小さくさ
せなければならない。このためには、導電性プラグ８と
導電性ベース６の熱膨張係数差を、１０×１０Ｅ−６以
下にする必要が有る。また、この熱膨張係数差を小さく
することで、振動による導電性プラグ６の抜けを防ぐと
共に、超音波ワイヤーボンディング時に超音波の振動が
逃げない構造となり、モジュール外部からの、水分の浸
入をも防ぐことが出来る。よって本構造においては、導
電性ベース８と導電性プラグ６の材質をアルミニウムに
して、熱膨張係数差を小さくした。このことにより、ア
ルミワイヤ超音波ワイヤーボンディングで、制御回路基
板４と導電性プラグ６を接続することが出来る。この時
の、導電性プラグ６の材料としては、アルミニウム，ニ
ッケル，銅，シリコン，金，スズ，ステンレス，鉄、等
が挙げられる。Embodiments of the present invention will be described below with reference to FIGS.
This will be described with reference to FIGS. FIG. 1 shows a heating resistor type air flow meter, which is composed of a circuit module 1 and a body 2. The circuit of the circuit module 1 is formed on the control circuit board 4 as shown in FIG. 2, and the filter circuit 5 is also formed on the same board. The noise that has entered from the external line passes through the filter 5, the conductive wire 7, the conductive plug 6, and falls to the conductive base 8. The heating resistor type air flow meter is located in the engine room and is under severe temperature and vibration conditions. In this structure, it is necessary to reduce the resistance between the control circuit board 4 and the conductive base 8 in order to prevent the deterioration of EMC from occurring, and the conductive base 8 and the conductive plug that has been plastically processed (metal flow). It is necessary to reduce the contact resistance of 6 and the gap between the conductive base 8 and the conductive plug 6 due to the cooling / heating cycle. For this purpose, the difference in thermal expansion coefficient between the conductive plug 8 and the conductive base 6 needs to be 10 × 10E-6 or less. Further, by reducing the difference in the coefficient of thermal expansion, it is possible to prevent the conductive plug 6 from coming off due to vibration, and to prevent the vibration of ultrasonic waves from escaping during ultrasonic wire bonding, so that the intrusion of water from the outside of the module is prevented. Can be prevented. Therefore, in this structure, the conductive base 8 and the conductive plug 6 are made of aluminum to reduce the difference in thermal expansion coefficient. As a result, the control circuit board 4 and the conductive plug 6 can be connected by aluminum wire ultrasonic wire bonding. At this time, examples of the material of the conductive plug 6 include aluminum, nickel, copper, silicon, gold, tin, stainless steel, iron and the like.
【０００７】[0007]
【発明の効果】本発明によれば、導電性ベース８と導電
性プラグ６の膨張係数を同等にすることにより、振動，
冷熱サイクルによる抜け、電気的接触抵抗の増加を防ぐ
ことが出来、ＥＭＣレベル低下を防ぐことが出来る。ま
た、導電性プラグ６にアルミワイヤー等を超音波ボンデ
ィングしたときの、振動の逃げを防ぐことが出来、ボン
ディング接続不良防止を図ることが出来る。According to the present invention, by making the expansion coefficients of the conductive base 8 and the conductive plug 6 equal, vibration,
It is possible to prevent disconnection and increase in electrical contact resistance due to the cooling / heating cycle, and it is possible to prevent lowering of the EMC level. Further, it is possible to prevent escape of vibration when ultrasonically bonding an aluminum wire or the like to the conductive plug 6, and to prevent defective bonding connection.
【図１】本発明のノイズ除去構造を組み込んだ発熱抵抗
体式空気流量計を示す図である。FIG. 1 is a view showing a heating resistor type air flow meter incorporating a noise removing structure of the present invention.
【図２】本発明のノイズ除去構造の一実施例を示す図で
ある。FIG. 2 is a diagram showing an embodiment of a noise removal structure of the present invention.
【図３】図２のグランド構造の断面図である。3 is a cross-sectional view of the ground structure of FIG.
【図４】フィルター回路の一実施例を示す図である。FIG. 4 is a diagram showing an embodiment of a filter circuit.
１…回路モジュール、２…ボディ、３…発熱抵抗体、４
…制御回路基板、５…フィルター回路、６…導電性プラ
グ、７…導電性ワイヤー、８…導電性ベース、９…導電
性パット、１０…チップインダクタ、１１…３端子コン
デンサ、１２…制御回路。1 ... Circuit module, 2 ... Body, 3 ... Heating resistor, 4
... control circuit board, 5 ... filter circuit, 6 ... conductive plug, 7 ... conductive wire, 8 ... conductive base, 9 ... conductive pad, 10 ... chip inductor, 11 ... 3-terminal capacitor, 12 ... control circuit.
Claims (4)
しめる構造において、前記導電性プラグとベースの熱膨
張係数を同等とする構造を有することを特徴とする空気
流量測定装置。1. An air flow measuring device, characterized in that a conductive plug, which is a separate member, is press-fitted and caulked into a base, and the structure has a structure in which the coefficient of thermal expansion of the conductive plug is equal to that of the base.
を同一材料で形成することを特徴とする空気流量測定装
置。2. The air flow rate measuring device according to claim 1, wherein the conductive plug and the base are made of the same material.
の熱膨張係数差を、１０×１０Ｅ−６以下にすることを
特徴とする空気流量測定装置。3. The air flow measuring device according to claim 1, wherein the difference in coefficient of thermal expansion between the conductive plug and the base is 10 × 10E-6 or less.
の熱膨張係数が、同等であり且つ、ベースより導電性プ
ラグのほうがヤング率が同等か又は、小さい材料で構成
されたことを特徴とする空気流量測定装置。4. The conductive plug according to claim 1, wherein the conductive plug and the base have the same coefficient of thermal expansion, and the conductive plug is made of a material having a Young's modulus which is equal to or smaller than that of the base. Air flow rate measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6046770A JPH07260533A (en) | 1994-03-17 | 1994-03-17 | Air flow measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6046770A JPH07260533A (en) | 1994-03-17 | 1994-03-17 | Air flow measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07260533A true JPH07260533A (en) | 1995-10-13 |
Family
ID=12756572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6046770A Pending JPH07260533A (en) | 1994-03-17 | 1994-03-17 | Air flow measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07260533A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009036639A (en) * | 2007-08-01 | 2009-02-19 | Denso Corp | Sensor device |
-
1994
- 1994-03-17 JP JP6046770A patent/JPH07260533A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009036639A (en) * | 2007-08-01 | 2009-02-19 | Denso Corp | Sensor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06209054A (en) | Semiconductor device | |
| JPH0197817A (en) | Thermal aerometer | |
| RU96107793A (en) | DEVICE FOR MEASURING PURPOSE OF THE FLUID | |
| JP2001015682A (en) | Resin sealed electronic device | |
| US7721599B2 (en) | Reduced resistance thermal flow measurement device | |
| JPH07260533A (en) | Air flow measuring device | |
| JP3140081B2 (en) | Electronic circuit noise elimination device, method of manufacturing the same, metal case, electronic device, and engine control system | |
| JP3562411B2 (en) | Heat resistance type air flow measuring device | |
| JPH0869926A (en) | Ignition device for internal combustion engine | |
| US6664630B2 (en) | Semiconductor device | |
| KR100861509B1 (en) | Semiconductor package having electrically and thermally improved characteristics | |
| JP2970346B2 (en) | Air flow measurement device | |
| JP3457410B2 (en) | Full-wave rectifier | |
| JPH0666351B2 (en) | Semiconductor integrated circuit | |
| JPS63249357A (en) | Semiconductor device | |
| JPH0348705Y2 (en) | ||
| JPS6234452Y2 (en) | ||
| JP2734688B2 (en) | Hybrid integrated circuit | |
| JPH07231055A (en) | Modular structure | |
| JPS5855673Y2 (en) | Electronic component mounting equipment | |
| JPH0380599A (en) | Electronic circuit module | |
| JPH04214658A (en) | Semiconductor device | |
| JP2001133529A (en) | Supporting structure of magnetism-sensitive amorphous member for magnetic inpedance sensor | |
| JP3168830B2 (en) | Semiconductor type pressure sensor | |
| JPH06265387A (en) | Exothermic resistor type air flow rate measuring instrument |