JPH07258837A - Ceramic target with sensor - Google Patents

Abstract

PURPOSE:To make it possible to know the life of a ceramic target without cracking during production stage and sputtering by embedding heat sensitive elements into a solder layer at the time of joining a ceramic target body to a cooling plate via this solder layer. CONSTITUTION:The ceramic target 1 is formed by joining the ceramic target body 2 via the solder layer 5 to the cooling plate 3. The heat sensitive elements A, B, C are embedded into this solder layer 5 and wirings (a), (b), (c) are connected through a groove 4 formed in the cooling plate 3 to an external CPU, etc. The tap. differences between the heat sensitive elements A, B, C are so previously set that the life is known when the preset temp. differences are attained. Since there is no need for boring the target body 2, the target body 2 is kept crack-free.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic target with a sensor, which is hard to break during bonding with a cooling plate and during sputtering, and whose life can be known.

[0002]

2. Description of the Related Art Generally, a target used for sputtering has a structure in which a target material is joined to a cooling plate by soldering.

When sputtering is performed using the above-mentioned ordinary target, the consumption of the target body is non-uniform, and the life due to the consumption of the target cannot be known. Therefore, in order to know the proper replacement time,
A target has been developed in which a sensor is embedded in the target body or the target body and a cooling plate, and the sensor detects the consumption amount and the proper service life of the target body (for example, see JP-A-63-169377).

[0004]

In the above-mentioned conventional target with a sensor, since the tip of the sensor attached to the cooling plate is projected into the target body, a hole must be formed in the target body, and the target body is made of ceramics. With such a structure, cracks are generated from the holes as starting points during processing, joining with a cooling plate, and during sputtering. This is because the ceramic target body that is generally used for sputtering is required to have a higher purity than that used for ordinary structural materials, so it is difficult to mix sintering aids etc. to improve mechanical properties. This is because many of them are brittle, and cracks due to processing and cracks due to thermal stress during joining with a cooling plate or during sputtering are likely to occur.

Therefore, it has been attempted to embed the sensor only in the cooling plate, but a target in which the sensor is embedded only in the cooling plate is not effective because of its low sensitivity.

[0006]

Therefore, the present inventor has conducted research to obtain a ceramic target with a sensor having good sensitivity without cracking in the ceramic target body. As a result, the ceramic target body and the cooling plate are bonded to each other. By embedding the heat sensing element in the solder layer,
Since no holes are made in the ceramic target body, cracks do not occur in the ceramic target body, and the sensitivity is very good because the thermal sensing element is embedded in the solder layer that adheres to the ceramic target body. I got the knowledge that.

The present invention has been made on the basis of such findings, and in a ceramics target formed by bonding a ceramics target body to a cooling plate via a solder layer, a thermal sensing element is embedded in the solder layer. The present invention is characterized by a ceramics target with a sensor, which is characterized in that

A ceramic target with a sensor according to the present invention will be specifically described with reference to the drawings.

FIG. 1 is a plan view of a ceramics target with a sensor according to the present invention, and FIG. 2 is a sectional view taken along the line II of FIG.

1 and 2, 1 is a ceramics target with a sensor of the present invention, 2 is a ceramics target body, 3 is a cooling plate, 4 is a groove, A, B and C are heat sensing elements, and a and b are a and b. , C are wirings, and 5 is a solder layer. The thermal sensing elements A, B, C are all embedded in the solder layer 5, but the wirings a, b, c are connected to an external CPU (not shown) or the like through a groove provided in the cooling plate 3.

As the heat sensing elements A, B and C, any element such as a thermocouple or a thermoelectric element which senses heat can be used. The life of the ceramic target body can be known by setting the temperature difference between the heat sensing elements A, B, and C so that the life is notified when the temperature difference reaches a preset temperature difference.

[0012]

Example A circular ceramic target body having a diameter of 4 inches and a thickness of 10 mm was prepared.

Further, a Cu cooling disk having a diameter of 4 inches was prepared, and a groove (width: 2) extending from the center of the Cu cooling disk to a location 2 inches and a location 3.5 inches from the center in the radial direction.
mm, depth: 2 mm).

On the other hand, a thermocouple coated with a heat-resistant insulating layer made of an extremely thin polyimide resin is prepared, the thermocouple is embedded in the groove, and only the tip of the thermocouple is projected and installed at a predetermined position to be a solder layer. deep. Then, a solder was applied on a Cu cooling disk, a cylindrical ceramics target body was placed on it, and the ceramics target with a sensor of the present invention was manufactured by heating in a stacked state and soldering.

On the other hand, a conventional ceramic target with a sensor was produced in exactly the same manner except that a hole having a diameter of 2 mm and a depth of 2 mm was made in the circular ceramic target and the thermocouple was inserted into this hole. In some cases, cracking occurred during drilling and joining with the cooling plate.

The ceramic target with a sensor of the present invention and the ceramic target with a conventional sensor were placed in a DC magnetron sputtering apparatus, and sputtering was carried out for 0.5 hour under the conditions of atmospheric gas: Ar + 10% O ₂ total pressure: 10 Pa output: 200 W. However, although the conventional ceramic target with a sensor was cracked, the ceramic target with a sensor of the present invention was not cracked.

[0017]

As described above, since the ceramic target with a sensor of the present invention does not crack during the manufacturing process and sputtering, it can be manufactured with a higher yield than in the past, and moreover, stable sputtering is performed. Therefore, it has an excellent effect on the electronic industry.

[Brief description of drawings]

FIG. 1 is a plan view of a ceramic target with a sensor according to the present invention.

2 is a cross-sectional view taken along the line II of FIG.

[Explanation of symbols]

 1 Ceramic Target with Sensor 2 Ceramic Target Body 3 Cooling Plate 4 Groove 5 Solder Layer A, B, C Thermocouple a, b, c Wiring

Claims (1)

[Claims] 1. A ceramic target comprising a ceramic target body bonded to a cooling plate via a solder layer, wherein a thermal sensing element is embedded in the solder layer.