JPH07254777A - Solder ball feeding jig - Google Patents

Abstract

PURPOSE:To increase the efficiency in the solder ball feeding work in relation to the title solder ball feeding jig used for the spare soldering step on a pad of a chip part such as LSI etc. CONSTITUTION:The title solder ball feeding jig is provided with a ball containing frame 1 encircled by a sidewall 1a, a mask 3 with a ball leading-in hole 3 insertion engaging ball 50 one by one contained in the solder ball containing frame 1 in backlash. state and a frame induction mechanism 2 slidably, holding the frame 1 so that the solder ball containing frame 1 may be shifted along the mask 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball supplying jig used for preliminarily soldering pads of chip parts.

[0002]

2. Description of the Related Art FIGS. 4 (a) and 4 (b) are perspective views showing an example of the structure of a conventional solder ball supply jig, and FIGS. 5 (a) and 5 (b) show the use of a conventional solder ball supply jig. It is a typical principal part side cross-sectional view for explaining a method.

As shown in FIGS. 4 (a) and 4 (b), the conventional solder ball supplying jig is a mask in which solder ball introducing holes 3a are formed corresponding to the pads 81 provided on the chip component 80. 3, the chip mounting table 16 having the chip positioning hole 17 into which the chip component 80 is fitted, and the solder ball introducing hole 3a on the pad 81 of the chip component 80 fitted in the chip positioning hole 17. A pair of mask positioning pins 7 for controlling the relative positions of the mask 3 and the chip mounting table 16 so as to be accurately positioned, and positioning pin insertion holes 3b into which the mask positioning pins 7 are respectively inserted in a loosely fitted state.
And, Note that Fig. 4 (a) shows a state in which these constituent members are separated so that the shapes of the constituent members can be clearly seen, and Fig. 4 (b) shows that the solder ball supply jig is put in a standby state by combining them. It shows the time.

This solder ball supply jig is constructed such that "first, the chip component 10 is fitted into the chip positioning hole 17 of the chip mounting table 16 and then the mask positioning pins 7 provided on the chip mounting table 16 are masked. The solder ball introducing hole 3a on the mask 3 side is positioned on the pad 81 on the chip component 80 side by engaging the positioning pin fitting hole 3b provided on the 3 side.

A method of using a conventional solder ball supply jig will be described below with reference to FIGS. 5 (a) and 5 (b). In this explanation, the solder ball supply jig is in the standby state [Fig.
Start from the time when the condition shown in (b)] is reached.

(1) First, an appropriate amount of solder balls 50 are supplied onto the mask 3 as shown in FIG. 5 (a). (2) When the solder ball 50 is supplied onto the mask 3, this time, the brush 70 or the like is used to move the solder ball 50 to the arrow A direction.
Move in the direction.

(3) The solder ball 50 moved in the direction of the arrow A by being swept by the brush 70 falls into the solder ball introducing hole 3a as shown in FIG. 4 (b) during the movement process. (4) When it is confirmed that the solder balls 50 are engaged in all the solder ball introducing holes 3a by repeating this operation,
Next, the solder balls 50 remaining on the mask 3 are removed. It should be noted that the removal of the excess solder balls 50 can be performed by, for example, disposing a dust remover (not shown) on the outside of the mask 3 and sweeping the excess solder balls 50 into the dust removal object. To be

[0008]

As is clear from the above description, when the conventional solder ball supplying jig is used, it takes a long time to remove the surplus solder balls 50, resulting in extremely poor work efficiency.

It is an object of the present invention to provide a solder ball supplying jig which does not leave the solder balls on the mask when supplying the solder balls.

[0010]

A solder ball supply jig according to the present invention is, as shown in FIG. 1, a solder ball storage frame 1 surrounded by a side wall 1a, and a solder ball storage frame 1 stored in the solder ball storage frame 1. A mask 3 having a solder ball introduction hole 3a into which each solder ball 50 is loosely fitted,
A slide groove 2a for slidably holding the solder ball storage frame 1 so that the solder ball storage frame 1 can move along the mask 3.
The frame guiding mechanism 2 having the above is provided.

[0011]

The solder ball storage frame 1 is surrounded by only the side wall 1a, and the ceiling portion and the floor portion are open. Therefore, when the solder balls 50 are moved along the mask 3 in a state where the solder balls 50 are stored in the solder storage portion 1c surrounded by the side wall 1a, the solder balls 50
Is dropped into the solder ball introduction hole 3a provided on the mask 3 side in such a manner that the side wall 1a and the side wall 1a on the rear side form a shape. At this time, if the gap between the side wall 1a and the mask 3 is made smaller than the diameter of the solder ball 50, the solder ball 50 will not spill out of the solder ball storage frame 1.

On the other hand, the frame guiding mechanism 2 has a slide groove 2a.
By moving the solder ball storage frame 1 arranged in such a manner that the handle 1b is engaged with the solder ball 50 along the mask 3, the solder balls 50 stored in the solder storage portion 1c of the solder ball storage frame 1 are removed. Guide to the solder ball introduction hole 3a.

[0013]

The present invention will be described in detail below with reference to the drawings of the embodiments. 1 (a) and 1 (b) are perspective views showing an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are schematic diagrams for explaining a method of using a solder ball supply jig according to the present invention. 3A and 3B are a perspective view and a sectional view taken along the line XX of FIG. 3A and FIG. 3B. The code is attached.

As shown in FIGS. 1 (a) and 1 (b), the solder ball supply jig according to the present invention comprises a solder ball storage frame 1 having a solder storage portion 1c surrounded by a side wall 1a.
The solder ball storage frame 1 and the mask 3 provided with the solder ball introduction holes 3a into which the solder balls 50 stored in the solder storage portion 1c are fitted one by one in a loosely fitted state so as to correspond to the pads 81 of the chip component 80. A frame guiding mechanism 2 having a slide groove 2a for slidably holding the mask 3 so as to be movable along the mask 3, and a mask holder 4 for integrally holding the frame guiding mechanism 2 and the mask 3. , A chip mounting table 6 having a chip positioning member 5 for positioning the chip component 80 at a predetermined position, a mask positioning pin 7 for controlling a relative position between the chip component 80 and the mask 3, and the mask positioning The pin 7 has a positioning pin insertion hole 13 into which the pin 7 is inserted in a fitted state.

The solder ball storage frame 1 is surrounded by only the side wall 1a, and the ceiling portion and the floor portion are open. Therefore, the side wall 1a
When the solder balls 50 are moved along the surface of the mask 3 while the solder balls 50 are stored in the solder storage portion 1c surrounded by, the solder balls 50 are shaped so that they can be squeezed by the lateral and rear side walls 1a. And is dropped into the solder ball introduction hole 3a provided on the mask 3 side. At this time, the side wall 1a
If the gap between the mask 3 and the mask 3 is made smaller than the diameter of the solder ball 50, the solder ball 50 will not spill out of the solder ball storage frame 1. In FIGS. 1A and 1B, 10 is a fixing member for fixing the frame guiding mechanism 2 and the mask 3 to the mask holder 4.

On the other hand, the frame guiding mechanism 2 has a slide groove 2a.
By moving the solder ball storage frame 1 arranged in such a manner that the handle 1b is engaged with the solder ball 50 along the mask 3, the solder balls 50 stored in the solder storage portion 1c of the solder ball storage frame 1 are removed. It is guided onto the solder ball introducing hole 3a provided on the mask 3 side.

In this solder ball supplying jig, a chip component 80 is arranged in a chip positioning member 5 arranged on a chip mounting table 6, and a mask 3 and a frame guiding mechanism 2 are arranged thereon.
By positioning the mask holder 4 that integrally holds the mask, a standby state is set. In FIG. 1A, 8 is a spacer, and the gap between the chip component 80 and the mask 3 is adjusted by adjusting the height (height) of the spacer 8.

A method of using the solder ball supply jig according to the present invention will be described below with reference to FIGS. 2 (a) and 2 (b). The description starts from "when the solder ball supply jig is in the standby state".

(1) First, an appropriate amount of solder balls 50 are supplied into the solder accommodating portion 1c of the solder ball accommodating frame 1 [FIG.
(See (a)]. (2) When the solder balls 50 are supplied into the solder accommodating portion 1c, this solder ball accommodating frame 1 is moved in the arrow A direction. Since the solder ball storage frame 1 is moved through the slide groove 2a of the frame guiding mechanism 2 described in FIG. 1, the gap formed between the solder ball storage frame 1 and the mask 3 does not change from beginning to end. .

(3) The solder ball storage frame 1 is moved in the direction of arrow A along the mask 3 so that the solder balls 50 stored in the solder storage portion 1c can be picked up by the side wall 1a. Drop into the solder ball introduction holes 3a provided on the mask 3 side one by one [Fig. 2
(b)].

FIGS. 3 (a) and 3 (b) are a perspective view and a sectional view taken along the line X--X showing one structural example of the solder ball storage frame.
As shown in FIGS. 3 (a) and 3 (b), the solder ball storage frame 1 has a solder storage portion 1c surrounded by side walls 1a and having no bottom and ceiling, and the solder storage portion 1c is moved. This member is composed of a pair of handles 1b that are sometimes used. The side wall 1a is extremely effective in moving the solder ball 50 (not shown) housed in the solder housing portion 1c as described above so that the solder ball 50 can be moved. Further, since the solder storage portion 1c has no ceiling, the solder balls 50 can be supplied very easily.

This solder ball supply jig has a side wall around the periphery.
By moving the solder accommodating portion 1c surrounded by 1a along the mask 3, the solder balls 50 accommodated in the solder accommodating portion 1c are automatically supplied into the solder ball introducing holes 3a. Therefore, the solder ball 50
The supply work of is significantly improved.

[0023]

As is apparent from the above description, in the solder ball supply jig according to the present invention, the solder balls are automatically soldered by moving the solder ball storage frame storing the solder balls along the mask. Since the solder balls are supplied into the ball introducing holes, when the solder balls are supplied by using this solder ball supplying jig, the solder ball supplying work is remarkably efficient.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention,

FIG. 2 is a schematic side sectional view for explaining a method of using the solder ball supply jig according to the present invention,

FIG. 3 is a perspective view showing a structure example of a solder ball storage frame and a cross-sectional view taken along line XX thereof,

FIG. 4 is a perspective view showing a structural example of a conventional solder ball supply jig,

FIG. 5 is a schematic side sectional view of an essential part for explaining a method of using a conventional solder ball supply jig.

[Explanation of symbols]

 1 Solder ball storage frame 1a Side wall 1b Handle 1c Solder storage part 2 Frame guiding mechanism 2a Slide groove 3 Mask 3a Solder ball introduction hole 3b, 13 Positioning pin fitting hole 4 Mask holder 5 Chip positioning member 6 Chip mounting table 7 Mask positioning pin 8 Spacer 10 Fixing member 16 Chip mounting table 17 Chip positioning hole 50 Solder ball 70 Brush 80 Chip component 81 Pad

Claims (1)

[Claims] 1. A solder ball supply jig for supplying a solder ball (50) onto a pad (81) of a chip component (80), the solder ball storage frame being surrounded by a side wall (1a).
(1) and solder balls stored in the solder ball storage frame (1)
Solder ball introduction holes into which (50) each fits loosely
A mask (3) provided with (3a), and a slide groove for slidably holding the solder ball storage frame 1 so that the solder ball storage frame 1 can move along the mask (3).
A solder ball supply jig comprising: a frame guiding mechanism (2) including (2a);