JPH0724350B2 - Cooling system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A cooling device, in which a flexible cooling element is locked to a cooling plate, and a heat transfer plate of the cooling element is pressed against the surface of a semiconductor element for cooling, The heat transfer plate can be easily removed by sliding the cooling plate and the printed circuit board in opposite directions to each other for the purpose of achieving high density mounting of semiconductor elements. Of the heat transfer plate and the surface of the semiconductor element by interposing a liquid medium having heat conductivity between the cooling plate and the printed circuit board by widening the mutual space between the cooling plate and the printed circuit board. Is provided in such a manner that a protrusion is retained at a predetermined position of the heat transfer plate so as to separate in a predetermined direction.

[Industrial application field]

The present invention relates to a cooling device that locks a flexible cooling element on a cooling plate and presses a heat transfer plate of the cooling element against the surface of a semiconductor element for cooling.

In an electronic device such as an electronic computer formed by mounting a semiconductor element such as an LSI element on a printed circuit board, the semiconductor element is cooled by a cooling device in order to obtain stable operation.

As such a cooling device, cooling with a cooling plate that circulates cold water is generally known because it has a high cooling efficiency and is relatively economical.

Such a cooling plate is provided with cooling elements corresponding to the respective semiconductor elements mounted on the printed circuit board, and is formed so that predetermined portions of the respective cooling elements are brought into pressure contact with the surface of the semiconductor element. Each of the semiconductor elements mounted in is contacted with the cooling plate by interposing the cooling element, and cooling is performed by the cold water circulated in the cooling plate.

Therefore, in such cooling, since the cooling element is firmly adhered to the surface of the semiconductor element with the liquid medium having heat conductivity, high cooling efficiency is obtained, and therefore the cooling element is surely adhered to the surface of the semiconductor element. It is very important to.

[Conventional technology]

Conventionally, it is configured as shown in the conventional explanatory view of FIG. 6A is a side sectional view, and FIG. 6B is a plan view of the cooling element.

As shown in FIG. 6 (a), the heat transfer plate 10C of the cooling element 10 locked to the cooling plate 1 is configured to be pressed against the surface 6A of the semiconductor element 6 mounted on the printed circuit board 5. Was there.

Further, this cooling plate 1 is made of aluminum, copper, which is a good heat conductive material.
Cooling element 10 made of material such as stainless steel
The flange portion 10A is formed on one side of the bellows 10B having elastic elasticity so as to have flexibility by fixing the heat transfer plate 10C on the other side.

Further, the flange portion 10A is locked by screwing the screw 13 onto the cooling plate 1 as shown in (b), and the O-ring 12 is inserted into the locking portion between the flange portion 10A and the cooling plate 1. Therefore, the refrigerant 9 is formed so as not to flow out.

Therefore, a coolant 9 such as cold water circulated in the cooling plate 1
Is circulated to the cooling element 10 by the nozzle 1A as shown by the arrow, and the heat transfer plate 10C is pressed against the surface 6A of the semiconductor element 6 by interposing the low melting point metal having good heat conduction or the heat conductive grease 11.

Therefore, the heat generated in the semiconductor element 6 is cooled by the circulating coolant 9 flowing from the cooling plate 1 to the respective cooling elements 10 via the heat transfer plate 10C and the heat conductive grease 11.

[Problems to be Solved by the Invention]

In such a configuration, the cooling plate 1 and the printed circuit board 5
When it is desired to separate and, the cooling plate 1 and the printed circuit board 5 are slid in opposite directions, or separated so as to widen the space.

In this case, since the heat transfer plate 10C and the surface 6A of the semiconductor element 6 are brought into close contact with each other by pressure contact, an external force is applied to the cooling element 10 even if it is slid or pulled apart, and there is a risk of deforming the bellows 10B in particular. .

Therefore, there is a problem that the cooling plate 1 and the printed circuit board 5 should be carefully separated from each other.

Further, as shown in FIG. 6 (b), one cooling element 10
To lock the cooling plate 1 to the cooling plate 1, the flange 10A
Since it is formed so as to be tightened by the screws 13 at the four positions, when the plurality of semiconductor elements 6 are mounted so as to be adjacent to each other, the adjacent pitch is determined by the screws for attaching the cooling elements 10.
This is a range in which 13 mounting spaces are provided, and the mounting density of the semiconductor elements 6 is restricted.

Therefore, there is a problem in that the mounting density of the semiconductor elements 6 cannot be increased.

Therefore, it is an object of the present invention to facilitate removal of the cooling plate and to achieve high-density mounting of semiconductor elements.

[Means for Solving the Problems]

(A) and (b) of FIG. 1 are side views of the principle of the first invention.
2A and 2B are side views of the principle of the second invention.

As shown in FIGS. 1 and 2, by providing a wall surface for pressing the heat transfer plate in the sliding direction of the cooling plate by sliding the cooling plate and the printed circuit board in mutually opposite predetermined directions, In addition, a protrusion is provided at a predetermined position of the heat transfer plate so as to separate the pressure contact between the heat transfer plate and the surface of the semiconductor element in a predetermined direction by widening the gap between the cooling plate and the printed circuit board. To configure.

With this configuration, the above-mentioned object can be achieved.

[Action]

That is, by providing the wall surface that presses the heat transfer plate to slide in the predetermined direction by sliding the cooling plate and the printed circuit board in the opposite predetermined directions, external force does not particularly act on the bellows. By doing so, it is possible to reduce the contact portion between the heat transfer plate and the surface of the semiconductor element.Also, by separating the cooling plate and the printed circuit board from each other, the heat transfer plate can be moved in a predetermined direction. By providing a protrusion that is hooked so as to be peeled off, in particular, the adhesion portion between the heat transfer plate and the surface of the semiconductor element is peeled off by preventing external force from acting on the bellows. .

Further, such wall surfaces and protrusions are fixed to the cooling plate by fixing the block having the plurality of through holes into which the cooling elements are inserted to the cooling plate, thereby fixing the blocks. By this, the flange portion of the cooling element can be locked.

Therefore, the cooling plate and the printed circuit board can be easily separated from each other, and it is not necessary to screw them as in the conventional case, and the pitch between the adjacent semiconductor elements can be narrowed as much as possible. It becomes possible to implement it.

〔Example〕

The present invention will be described in detail below with reference to FIGS. 3, 4, and 5. FIG. 3 is an explanatory view of an embodiment according to the first invention, (a) is a side view, (b) is a side view of essential parts, and FIG. 4 is an illustration of an embodiment of the second invention. Where (a) is a side view, (b) is a rear view, (c) is a perspective view of a block, and FIG.
The figure is an explanatory view of another embodiment of the second aspect of the present invention, (a) is a rear view of the main part, and (b) is a sectional view taken along the line AA of (a). Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 3 (a), a block 8A is provided adjacent to a flexible cooling element 2 formed by fixing a flange portion 3 on one side of a bellows 2A and a heat transfer plate 4 on the other side. The structure is the same as that described above except that it is locked.

Further, a wall surface 20 is provided on the block 8A and is formed so as to be in contact with the side surface of the heat transfer plate 4 of the cooling element 2.

Therefore, by moving the cooling plate 1 in the direction of arrow A and the printed circuit board 5 in the direction of arrow B, the pressure contact between the heat transfer plate 4 and the surface 6A of the semiconductor element 6 is slid, and when separating the contact portion, the wall surface is used. This can be done by pressing the heat transfer plate 4 with 20.

Therefore, when the cooling plate 1 and the printed circuit board 5 are separated, it is possible to prevent an external force from being applied to the bellows 2A of the cooling element 2.

Further, in the configuration shown in (b), a protrusion 21 is provided on the block 8A, and the protrusion 21 is formed so as to be hooked at a predetermined position of the heat transfer plate 4.

In this case, the cooling plate 1 is moved in the arrow D direction and the printed circuit board 5 is moved in the arrow C direction.
The protrusion 21 can be used to separate the contact portion between the heat transfer plate 4 and the surface 6A of the semiconductor element 6 so as to widen the distance between the heat transfer plate 4 and the printed circuit board 5.

Therefore, similarly to the above, it is possible to prevent external force from being applied to the bellows 2A of the cooling element 2 when the cooling plate 1 and the printed circuit board 5 are separated.

It is also possible to form the wall surface 20 and the protrusion 21 as shown in FIGS. 4 and 5.

As shown in FIG. 4 (a), a block 8B having a plurality of through holes 22 into which the cooling element 2 is inserted and formed in a honeycomb shape is locked to the cooling plate 1 by a fixing screw 14. The other configurations are the same as those described above.

The block 8B is formed of aluminum or the like so as to have a predetermined thickness, and as shown in (c), a mounting hole 22A into which the fixing screw 14 is inserted between the through hole 22 and the through hole 22,
The cutout hole 22B is provided, and the fixing screw 14 is inserted into each of the mounting hole 22A and the cutout hole 22B, and the block 8B is locked by being screwed into the cooling plate 1, and the flange portion 3 of the cooling element 2 is It is formed so as to be sandwiched by the block 8B and fixed to a predetermined portion of the cooling plate 1.

Therefore, the heat transfer plate 4 is brought into pressure contact with the surface 6A of the semiconductor element 6 mounted on the printed circuit board 5 via the heat conductive grease 11, and the semiconductor is generated by the refrigerant 9 jetted from the nozzle 1A of the cooling plate 1 as shown by the arrow. The element 6 is cooled.

Further, due to the notch hole 22B provided on the outer periphery of the block 8B, the other block 8B-
1 can be locked adjacently.

Therefore, according to this structure, by moving the cooling plate 1 in the arrow A direction and the printed circuit board 5 in the arrow B direction, the pressure contact between the heat transfer plate 4 and the surface 6A of the semiconductor element 6 is slid, and the contact portion is moved. Can be separated by the wall surface 20 formed by the through hole 22.

Further, it is sufficient to screw the fixing screw 14 for locking the block 8B by providing one place at the center of the through holes 22 arranged in four directions, and the screw 13 for fixing the conventional flange portion 10A is provided.
It is possible to fix the through holes 22 with a smaller number than the above number, the pitch of the through holes 22 can be made smaller than in the conventional case, and the mounting density of the semiconductor elements 6 can be improved.

In the case of FIG. 5 (a), the through hole 22 of the block 8B is used.
An arcuate protrusion 21 is provided on the inner circumference of each of the.

As shown in (b), the protrusion 21 is formed so as to be hooked on a predetermined portion of the cooling element 2.

Therefore, by moving the cooling plate 1 in the arrow D direction and the printed circuit board 5 in the arrow C direction,
When the heat transfer plate 4 and the surface 6A are separated from each other so as to widen the distance between the heat transfer plate 4 and the printed circuit board 5, a force acts so that the heat transfer plate 4 is caught by the protrusion 21 and is peeled from one side. Therefore, even the heat transfer plate 4 that is in close contact with the surface 6A of the semiconductor element 6 in a vacuum state can be easily peeled off.

[Effects of the Invention] As described above, according to the present invention, it is possible to reduce the pitch of the arrangement of the cooling elements fixed to the cooling plate, and further, when removing the cooling plate, the cooling elements and the semiconductor elements are separated. The adhesion portion with the surface can be easily peeled off.

Therefore, the packaging density of the semiconductor elements can be improved as compared with the conventional case, and further, the cooling plate can be easily attached and detached, and the practical effect is great.

[Brief description of drawings]

(A) and (b) of FIG. 1 are side views of the principle of the first invention, (a) and (b) of FIG. 2 are side views of the principle of the second invention, and FIG. FIG. 3 is an explanatory view of an embodiment according to the invention,
(A) is a side view, (b) is a side view of essential parts, and FIG. 4 is an explanatory view of an embodiment according to the second invention,
(A) is a side view, (b) is a rear view, (c) is a perspective view of a block, and FIG. 5 is an explanatory view of another embodiment of the second invention, (a)
Is a back view, (b) is a sectional view taken along line AA of (a), and is a conventional explanatory view of FIG. 6, (a) is a side sectional view, (b).
Shows a plan view of the cooling element. In the figure, 1 is a cooling plate, 2 is a cooling element, 3 is a flange portion, 4 is a heat transfer plate, 5 is a printed circuit board, 6 is a semiconductor element, 21 is a protruding portion, 8A and 8B are blocks, 9 is a refrigerant, 6A. Is the surface, 22 is the through hole, and 20 is the wall surface.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Haruhiko Yamamoto Inventor Haruhiko Yamamoto 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Within Fujitsu Limited (56) Reference JP-A-1-150344 (JP, A) (JP, U)

Claims (4)

[Claims] 1. A flexible cooling element (2) provided with a cooling plate (1) in which a refrigerant (9) is circulated and a flange portion (3) on one side and a heat transfer plate (4) on the other side. And a semiconductor element (6) mounted on the printed circuit board (5),
The heat transfer plate (4) is brought into pressure contact with the surface (6A) of the semiconductor element (6) through the heat conductive liquid medium by the flange portion (3) being locked to the cooling plate (1). In the cooling device for cooling the semiconductor element (6) by circulating the coolant (9) from the cooling plate (1) to the cooling element (2), the cooling plate (1) and the printed circuit board ( A wall surface (20) is provided that presses the heat transfer plate (4) in the sliding direction (A) of the cooling plate (1) by sliding them in opposite directions (A, B) with respect to 5). A cooling device characterized by the above. 2. The surface (6A) of the heat transfer plate (4) and the semiconductor element (6) by increasing the mutual distance between the cooling plate (1) and the printed circuit board (5) according to claim 1. The heat transfer plate (4) so that the pressure contact with is separated in a predetermined direction (C, D).
A cooling device, characterized in that a protrusion (21) that is locked at a predetermined position is provided. 3. A wall (20) or a wall according to claim 1, wherein a block (8A) is locked to the cooling plate (1) by adjoining the cooling element (2), and the block (8A) is locked to the block (8A). Item 2. A cooling device having the protrusion (21) according to item 2. 4. A honeycomb block (8B) having a plurality of through holes (22) into which the cooling element (2) is inserted is locked to the cooling plate (1), and each of the through holes (22). A cooling device, characterized in that the wall surface (20) according to claim 1 or the protrusion (21) according to claim 2 is formed.