JPH07240603A - Dielectric resonator device and characteristic adjustment method therefor - Google Patents

Abstract

PURPOSE:To set or adjust a coupling between adjacent resonators by forming an external conductor part elimination part at a part of the periphery of a conductor for coupling in all or prescribed dielectric resonators among the plural dielectric resonators. CONSTITUTION:The dielectric resonators Ra-Rc for which internal conductors 3a-3c are formed inside dielectric blocks and the conductors for the coupling for forming capacitance among the internal conductors are formed along with external conductors 6a-6c on side faces are integrated by jointing the side faces and the adjacent dielectric resonators are connected. In this case, by forming the external conductor part elimination part 31ab on the side face of the dielectric resonator, the capacitance between the internal conductors 3a and 3b and the external conductors 6a and 6b is reduced, the apparent capacitance between the internal conductors through the conductor for the coupling is increased and an electric field coupling between the internal conductors 3a and 3b is increased. Also, by forming the external conductor part elimination part 32c, the capacitance between the internal conductors 3b and 3c and the external conductors 6b and 6c is reduced and the electric field coupling between the internal conductors 3b and 3c is increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric resonator device formed by integrating a plurality of dielectric resonators and a characteristic adjusting method thereof.

[0002]

2. Description of the Related Art As a conventional example of this kind, a dielectric resonator comprising a plurality of resonators in which a plurality of inner conductors are provided inside a rectangular parallelepiped dielectric block and outer conductors are formed on the outer surface. There is a device configured. Such an integrated dielectric resonator device does not require a mounting bracket for mounting on a shield case or a circuit board, and thus surface mounting is easy.

[0003]

However, in the dielectric resonator device in which a plurality of resonators are provided in one dielectric block in this way, if ones having different numbers of resonators are to be manufactured, the dielectric resonator devices are different from each other. It was necessary to prepare a mold. Therefore, a large number of molds are required to manufacture various types of dielectric resonator devices having different characteristics, which increases the manufacturing cost. Further, since the distance between the resonators is determined by the size and shape of each mold, there is a problem that it is not easy to set the degree of coupling between the resonators. That is, for example, in a conventional dielectric resonator device having a combline structure, the setting or adjustment of the degree of coupling between the resonators and the setting or adjustment of the resonance frequency of each resonator are related to each other due to their structure. However, when one changed, the other changed, and it was not easy to set or adjust both independently.

An object of the present invention is to provide a dielectric resonator device which solves various problems that occur when a plurality of inner conductors are arranged in parallel in a dielectric block.

Another object of the present invention is that the conventional shield case and mounting bracket are not required, and the manufacturing cost is low.
It is possible to easily manufacture a small-sized dielectric resonator device having resonators of various numbers of stages without requiring a dedicated mold for each number of stages of resonators. Another object of the present invention is to provide a dielectric resonator device capable of setting or adjusting the degree of coupling between resonators and the like independently of each other, and a characteristic adjusting method thereof.

[0006]

A dielectric resonator device according to a first aspect of the present invention has a side surface extending between a first surface and a second surface facing each other, and the first surface and the second surface. A dielectric block having an air gap extending inside is formed, an inner conductor is formed inside the dielectric block, and a coupling conductor that forms a capacitance with the inner conductor is formed on at least a side surface together with the outer conductor. A dielectric resonator device in which a plurality of dielectric resonators formed by joining side-to-side are integrated and adjacent dielectric resonators are coupled to each other, and all the dielectric resonances of the plurality of dielectric resonators are provided. In the container or a predetermined dielectric resonator, an outer conductor portion deleted portion is formed in a part of the periphery of the coupling conductor.

A dielectric resonator device according to a second aspect of the present invention is the dielectric resonator device according to the first aspect, wherein the outer conductor portion deleted portion is provided on the first surface or the second surface of the dielectric resonator.

A dielectric resonator device according to a third aspect of the present invention is the dielectric resonator device according to the first aspect, characterized in that the outer conductor portion deleted portion is provided on a side surface of the dielectric resonator.

A dielectric resonator device according to a fourth aspect of the present invention is the dielectric resonator device according to the first aspect, wherein the outer conductor portion deletion portion is provided on the first surface or the second surface together with the side surface of the dielectric resonator. .

According to a fifth aspect of the present invention, there is provided a method for adjusting a characteristic of a dielectric resonator device, wherein a side surface extends between a first surface and a second surface facing each other, and an air gap is provided inside the first surface and the second surface. A plurality of dielectric conductor blocks, in which inner conductors are formed inside the dielectric blocks, and coupling conductors that form capacitance with the inner conductors are formed on at least side surfaces together with the outer conductors. A method for adjusting the characteristics of a dielectric resonator device in which side surfaces of a dielectric resonator are joined and integrated so that adjacent dielectric resonators are coupled to each other, wherein all the dielectric resonators among a plurality of dielectric resonators are provided. Alternatively, in a predetermined dielectric resonator, an outer conductor part deletion portion is formed in a part of the periphery of the coupling conductor, and the capacitance between the inner conductors of the adjacent dielectric resonators via the coupling conductor is increased. Adjust the characteristics of the dielectric resonator device by adjusting the The features.

A characteristic adjusting method for a dielectric resonator device according to a sixth aspect is the method according to the fifth aspect, in which the outer conductor part-removed portion is formed in a state where a plurality of dielectric resonators are joined and integrated. Characterize.

A characteristic adjusting method for a dielectric resonator device according to a seventh aspect is the method according to the fifth aspect, wherein the outer conductor part-removed portion is formed before a plurality of dielectric resonators are joined and integrated. It is characterized by

A characteristic adjusting method for a dielectric resonator device according to an eighth aspect is the method according to the fifth, sixth or seventh aspect, wherein:
The capacitance is adjusted according to the shape, size, or formation position of the outer conductor portion deleted portion.

In a dielectric resonator device according to a ninth aspect, a side surface extends between a first surface and a second surface facing each other, and a void extends inside the first surface and the second surface. A plurality of dielectric resonators each including a block, an inner conductor is formed inside the dielectric block, and a coupling conductor that forms a capacitance with the inner conductor is formed on at least a side surface together with the outer conductor. A dielectric resonator device in which adjacent side surfaces of the inner conductor are joined and integrated with each other, and adjacent dielectric resonators are coupled to each other, wherein an inner conductor part-removed portion is formed in a portion of the inner conductor adjacent to the coupling conductor. Is characterized by.

A dielectric resonator device according to a tenth aspect of the present invention is the dielectric resonator device according to the ninth aspect, characterized in that an inner conductor portion deleted portion extending in the axial direction of the inner conductor by a predetermined length is formed.

The dielectric resonator device according to an eleventh aspect is characterized in that, in the ninth aspect, the inner conductor portion deleted portion is formed so as to extend in the axial direction of the inner conductor by a predetermined amount.

According to a twelfth aspect of the present invention, there is provided a method for adjusting a characteristic of a dielectric resonator device, wherein a side surface extends between a first surface and a second surface facing each other, and a space is provided inside the first surface and the second surface. A plurality of dielectric conductor blocks, in which inner conductors are formed inside the dielectric blocks, and coupling conductors that form capacitance with the inner conductors are formed on at least side surfaces together with the outer conductors. A method for adjusting the characteristics of a dielectric resonator device in which side surfaces of a dielectric resonator are joined and integrated so that adjacent dielectric resonators are coupled to each other, wherein the inner conductor is provided at a position close to the coupling conductor. It is characterized in that a conductor portion deleted portion is formed to adjust the capacitance between the inner conductors of the dielectric resonators adjacent to each other via the coupling conductor.

According to a thirteenth aspect of the method for adjusting a characteristic of a dielectric resonator device, a side surface extends between a first surface and a second surface facing each other, and a space is provided inside the first surface and the second surface. A plurality of dielectric conductor blocks, in which inner conductors are formed inside the dielectric blocks, and coupling conductors that form capacitance with the inner conductors are formed on at least side surfaces together with the outer conductors. A method for adjusting the characteristics of a dielectric resonator device in which side surfaces of a dielectric resonator are joined and integrated so that adjacent dielectric resonators are coupled to each other, wherein the inner conductor is provided at a position close to the coupling conductor. A conductor portion deletion portion is formed to adjust the capacitance between the inner conductor of an adjacent dielectric resonator via the coupling conductor and adjust the equivalent axial length of the inner conductor. And

A characteristic adjusting method for a dielectric resonator device according to a fourteenth aspect is the method according to the twelfth aspect or the thirteenth aspect, wherein the inner conductor part deleted portion is formed in a state where a plurality of dielectric resonators are joined and integrated. It is characterized by

A characteristic adjusting method for a dielectric resonator device according to a fifteenth aspect is the method according to the twelfth aspect or the thirteenth aspect, wherein the inner conductor part-removed portion is provided in a state before a plurality of dielectric resonators are joined and integrated. It is characterized by forming.

A dielectric resonator device characteristic adjusting method according to a sixteenth aspect is the method according to the twelfth aspect, the thirteenth, fourteenth or fifteenth aspect, wherein the electrostatic capacitance is adjusted according to a shape, a size or a forming position of the inner conductor portion deleted portion. It is characterized in that the capacitance or the equivalent axial length of the inner conductor is adjusted.

In a dielectric resonator device according to a seventeenth aspect, a side surface extends between a first surface and a second surface facing each other, and a void extends inside the first surface and the second surface. A plurality of dielectric resonators each including a block, an inner conductor is formed inside the dielectric block, and a coupling conductor that forms a capacitance with the inner conductor is formed on at least a side surface together with the outer conductor. A dielectric resonator device in which adjacent dielectric resonators are coupled together by integrating side surfaces thereof, and all of the dielectric resonators or a predetermined dielectric resonator among a plurality of dielectric resonators are provided. An outer conductor portion deleted portion is formed on a part of the periphery of the coupling conductor, and an inner conductor portion deleted portion is formed on a portion of the inner conductor which is close to the coupling conductor.

According to a eighteenth aspect of the present invention, there is provided a method for adjusting a characteristic of a dielectric resonator device, wherein a side surface extends between a first surface and a second surface facing each other, and a space is provided inside the first surface and the second surface. A plurality of dielectric conductor blocks, in which inner conductors are formed inside the dielectric blocks, and coupling conductors that form capacitance with the inner conductors are formed on at least side surfaces together with the outer conductors. A method for adjusting the characteristics of a dielectric resonator device in which side surfaces of a dielectric resonator are joined and integrated so that adjacent dielectric resonators are coupled to each other, wherein all the dielectric resonators among a plurality of dielectric resonators are provided. Alternatively, in a predetermined dielectric resonator, an outer conductor portion deleted portion is formed in a part of the periphery of the coupling conductor, and an inner conductor portion deleted portion is formed in a portion of the inner conductor adjacent to the coupling conductor, Inner conduction of dielectric resonators adjacent to each other through the coupling conductor And adjusting the equivalent axial length of the capacitance or the inner conductor between.

[0024]

In the dielectric resonator device according to the first aspect of the present invention, the dielectric blocks to be used are the first facing each other.
A side surface extends between the surface and the second surface, and a void extends inside the first surface and the second surface. The inner conductor formed in the void of the dielectric block acts as a resonance conductor, and is coupled to the inner conductor of another dielectric resonator through the coupling conductor formed on at least the side surface of the dielectric block. . And
Since the outer conductor part deletion portion is formed in a part of the periphery of the coupling conductor in the joint portion of the two predetermined dielectric resonators, the inner portions of the dielectric resonators adjacent to each other through the coupling conductor are formed. The capacitance between the conductors changes. That is, the capacitance between the outer conductor and the inner conductor existing around the coupling conductor is reduced, and the apparent capacitance between the inner conductors via the coupling conductor is increased. As a result, the degree of electric field coupling between the inner conductors via the coupling conductor is increased. In this way, the degree of coupling between the adjacent resonators can be set and adjusted by forming the outer conductor portion deleted portion.

In the dielectric resonator device according to the second aspect, the outer conductor portion-removed portion is the first surface or the second surface of the dielectric resonator.
It is provided on the surface. As described above, even on the first surface or the second surface of the dielectric resonator, the inner conductor of the dielectric resonator adjacent to the coupling conductor by the outer conductor part deletion portion of the portion close to the coupling conductor. The capacitance between them is set and adjusted.

In the dielectric resonator device according to a third aspect of the present invention, the outer conductor portion deleted portion is provided on the side surface of the dielectric resonator. As described above, even on the side surface of the dielectric resonator, the capacitance between the inner conductors of the dielectric resonators adjacent to each other through the coupling conductor is increased by the outer conductor portion deletion portion in the portion close to the coupling conductor. Settings are adjusted.

In the dielectric resonator device according to the fourth aspect, the outer conductor part-removed portion is formed together with the side surface of the dielectric resonator to form the first resonator.
It is provided on the surface or the second surface. As described above, since the outer conductor part deletion portion is formed on the side surface of the dielectric resonator and on the first surface or the second surface in a portion close to the coupling conductor, the dielectric resonance adjacent to the coupling resonator via the coupling conductor is formed. The capacitance between the inner conductors of the container is set and adjusted over a wide range.

In the characteristic adjusting method of the dielectric resonator device according to the fifth aspect, the side surface extends between the first surface and the second surface facing each other of each dielectric block forming each dielectric resonator, A void extends inside the first surface and the second surface. The inner conductor formed in the void of the dielectric block acts as a resonance conductor, and a coupling conductor is formed on at least a side surface of the dielectric block, and two dielectrics adjacent to each other via the coupling conductor. Capacitance is formed between the inner conductors of the resonator. Then, an outer conductor portion deleted portion is formed in a part of the periphery of the coupling conductor in the joint portion of the two predetermined dielectric resonators. By thus forming the outer conductor part-removed portion in a part of the periphery of the coupling conductor, the capacitance between the inner conductors of the dielectric resonators adjacent to each other through the coupling conductor is adjusted. Thus, the degree of electric field coupling between the dielectric resonators is adjusted, and the characteristics of the entire dielectric resonator device are adjusted.

In the characteristic adjusting method of the dielectric resonator device according to the sixth aspect, since the outer conductor part deletion portion is formed in a state where a plurality of dielectric resonators are joined and integrated, one dielectric resonance device is formed. The final characteristic adjustment can be easily performed with the device once configured.

In the characteristic adjusting method for a dielectric resonator device according to a seventh aspect, since the outer conductor part-removed portion is formed in a state before a plurality of dielectric resonators are joined and integrated, each dielectric resonator device is formed. The characteristic can be adjusted in advance in the state of the body resonator.

In the characteristic adjusting method of the dielectric resonator device according to the eighth aspect, depending on the shape, size and formation position of the outer conductor portion deleted portion, the inner conductor of the adjacent dielectric resonator via the coupling conductor. The capacitance between them is adjusted. That is, even if the formation position of the outer conductor portion deleted portion is the same, the capacitance between the outer conductor and the inner conductor around the coupling conductor changes depending on the shape or size of the outer conductor portion deleted portion, and Even if the outer conductor part has the same shape and size, the capacitance between the outer conductor and the inner conductor around the coupling conductor changes depending on the formation position. Alternatively, the coupling degree of the adjacent dielectric resonators can be adjusted depending on the formation position, and thus the characteristics of the dielectric resonator device can be adjusted.

In a dielectric resonator device according to a ninth aspect, as a dielectric block to be used, a side surface extends between a first surface and a second surface facing each other, and a gap is provided inside the first surface and the second surface. Is extended. The inner conductor formed in the void of the dielectric block acts as a resonance conductor, and is coupled to the inner conductor of another dielectric resonator through the coupling conductor formed on at least the side surface of the dielectric block. . Since the inner conductor portion-removed portion is formed at a portion of the inner conductor which is close to the coupling conductor, the presence of the inner conductor portion-removed portion causes electrostatic discharge between the coupling conductor and the inner conductor adjacent thereto. The capacity changes. By forming the inner conductor part deletion portion in this way, the capacitance between the inner conductors of the adjacent dielectric resonators is set and adjusted via the coupling conductor, and the degree of coupling between the adjacent resonators is set and adjusted. You can

In the dielectric resonator device according to the tenth aspect,
The inner conductor portion deleted portion extends for a predetermined length in the axial direction of the inner conductor. By extending the inner conductor part deletion portion in the axial direction of the inner conductor in this way, the equivalent axial length of the inner conductor changes as well as the capacitance between the inner conductors of the dielectric resonators adjacent to each other via the coupling conductor. Then, the degree of coupling between the adjacent dielectric resonators and the setting of the resonance frequency of the dielectric resonators can be adjusted.

In the dielectric resonator device according to claim 11,
The inner conductor portion deleted portion extends by a predetermined amount in the axial direction of the inner conductor. In this way, the inner conductor part removed portion is expanded by a predetermined amount in the axial direction of the inner conductor, so that the equivalent axial length of the inner conductor that acts as a resonance conductor is hardly changed, and the inner conductor is removed through the coupling conductor. The capacitance between the inner conductors of the dielectric resonator can be adjusted independently.

According to the twelfth aspect of the method of adjusting the characteristics of the dielectric resonator device, the side surface extends between the first surface and the second surface of each dielectric block forming each dielectric resonator, which face each other. A void extends inside the first surface and the second surface. The inner conductor formed in the void of the dielectric block acts as a resonance conductor, and a coupling conductor is formed on at least a side surface of the dielectric block, and two dielectrics adjacent to each other via the coupling conductor. Capacitance is formed between the inner conductors of the resonator. Then, an inner conductor part deletion portion is formed in a portion of the inner conductor adjacent to the coupling conductor, and the capacitance between the inner conductors of the dielectric resonators adjacent to each other via the coupling conductor is adjusted. By thus forming the inner conductor part-removed portion, the capacitance between the inner conductors of the adjacent dielectric resonators is adjusted via the coupling conductor, and the degree of coupling between the dielectric resonators allows the dielectric resonator device. Is adjusted.

In the characteristic adjusting method for a dielectric resonator device according to a thirteenth aspect, a side surface extends between the first surface and the second surface of each dielectric block forming each dielectric resonator, which face each other. A void extends inside the first surface and the second surface. The inner conductor formed in the void of the dielectric block acts as a resonance conductor, and a coupling conductor is formed on at least a side surface of the dielectric block, and two dielectrics adjacent to each other via the coupling conductor. Capacitance is formed between the inner conductors of the resonator. Then, an inner conductor part deletion portion is formed at a position close to the coupling conductor of the inner conductor, and the capacitance between the inner conductor of an adjacent dielectric resonator via the coupling conductor is adjusted. At the same time, the equivalent axial length of the inner conductor is adjusted. In this way, the degree of coupling between adjacent dielectric resonators and the resonance frequency of the dielectric resonator are adjusted.

In the characteristic adjusting method of the dielectric resonator device according to the fourteenth aspect, the inner conductor portion deleted portion is formed in a state where a plurality of dielectric resonators are joined and integrated. According to this method, a plurality of dielectric resonators are joined and integrated to operate as one dielectric resonator device, and the inner conductor part deleted portion is formed while measuring the characteristics thereof, thereby having desired characteristics. A dielectric resonator device is obtained.

In the characteristic adjusting method of the dielectric resonator device according to the fifteenth aspect, the inner conductor portion deleted portion is formed in a state before the plurality of dielectric resonators are joined and integrated. In this method, each dielectric resonator is operated as a single body to form a dielectric resonator having a desired characteristic, and by joining and integrating them, a dielectric resonator device having a desired characteristic is obtained. .

In the characteristic adjusting method of the dielectric resonator device according to the sixteenth aspect, between the inner conductors of the adjacent dielectric resonators via the coupling conductor depending on the shape, size or forming position of the inner conductor part deleted portion. Or the equivalent axial length of the inner conductor is adjusted. That is, the shape of the inner conductor portion deleted portion,
It is desirable to use the fact that the capacitance between the inner conductors of adjacent dielectric resonators changes via the coupling conductors depending on the size or formation position, or the equivalent axial length of the inner conductors changes accordingly. A dielectric resonator device having the following characteristics is obtained.

In the dielectric resonator device according to claim 17,
As a dielectric block to be used, a side surface extends between a first surface and a second surface facing each other, and a void extends inside the first surface and the second surface. The inner conductor formed in the void of the dielectric block acts as a resonance conductor, and is coupled to the inner conductor of another dielectric resonator through the coupling conductor formed on at least the side surface of the dielectric block. . Then, in all of the dielectric resonators or a predetermined dielectric resonator among the plurality of dielectric resonators, an outer conductor part deletion portion is formed in a part of the periphery of the coupling conductor, and the outer conductor part deletion portion is formed close to the coupling conductor of the inner conductor. An inner conductor portion deleted portion is formed at a portion to be formed. Even when both the outer conductor portion-removed portion and the inner conductor portion-removed portion are formed in this way, the capacitance between the inner conductors of the dielectric resonators adjacent to each other via the coupling conductor or the equivalent of the inner conductor The axial length is changed, and the dielectric resonator device having desired characteristics is obtained.

In the characteristic adjusting method of the dielectric resonator device according to the eighteenth aspect, the side surface extends between the first surface and the second surface of each dielectric block forming each dielectric resonator, which face each other. A void extends inside the first surface and the second surface. The inner conductor formed in the void of the dielectric block acts as a resonance conductor, and a coupling conductor is formed on at least a side surface of the dielectric block, and two dielectrics adjacent to each other via the coupling conductor. Capacitance is formed between the inner conductors of the resonator. Then, in all of the plurality of dielectric resonators or in a predetermined dielectric resonator, an outer conductor part deleted portion is formed in a part of the periphery of the coupling conductor, and in the coupling conductor of the inner conductor, An inner conductor part deletion portion is formed at a position close to each other, and the capacitance between the inner conductors of the dielectric resonators adjacent to each other via the coupling conductor or the equivalent axial length of the inner conductor is adjusted. For example, by forming the outer conductor part deleted portion, the apparent capacitance between the inner conductors of adjacent dielectric resonators via the coupling conductor is increased, and by forming the inner conductor portion deleted part, the electrostatic capacitance is increased. It is also possible to shorten the equivalent axial length of the inner conductor without changing the capacitance between the inner conductors by reducing the equivalent axial length of the inner conductor while reducing

[0042]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, FIGS. 1 to 3 show the structure of a dielectric resonator device according to an embodiment of the present invention before characteristic adjustment.

FIG. 1 is an external perspective view of the entire dielectric resonator device. FIG. 1A is a perspective view seen from diagonally above in a state of being mounted on a circuit board or the like, and FIG. Shows the state. In FIG. 1, Ra, Rb, and Rc are dielectric resonators in which various conductors are formed in a prismatic dielectric block having through holes 2a, 2b, and 2c therein. As will be described later, these three dielectric resonators are formed by coupling adjacent dielectric resonators to each other to form a dielectric resonator device that can be used as a bandpass filter or the like. As shown in FIG. 7B, the dielectric resonators Ra and Rc have signal input / output conductors 7a and 7a, respectively.
7c is formed.

FIG. 2 is an exploded perspective view of the dielectric resonator device shown in FIG. Each of the dielectric resonators Ra, Rb, Rc includes a dielectric block in which the through holes 2a, 2b, 2c extend between the opposing first surface S1 and second surface S2, and the through holes 2a, 2b, 2c are provided. An inner conductor is formed inside, and outer conductors 6a, 6b and 6c are formed on the first surface S1, the second surface S2 and the four side surfaces of the dielectric block, respectively. Further, the coupling conductor 8a is provided on the surface of the dielectric resonator Ra facing Rb, and the coupling conductors 9b, 8b are provided on the surfaces of the dielectric resonator Rb facing Ra and Rc, respectively. The coupling conductor 9c is provided on the surface of the dielectric resonator Rc facing Rb.
Is formed.

FIG. 3 is a sectional view showing a state in which the dielectric resonator device is mounted on a circuit board. FIG. 3A is a sectional view taken along the line Y1-Y1 in FIG. 1A, and FIG. Figure 1
It is sectional drawing of the Y2-Y2 part in (A).

As shown in FIG. 3A, the dielectric resonator R
Reference character a denotes inner conductors 3a and 4a separated by a gap 5a on the inner surface of the through hole 2a provided in the dielectric block 1a. Of these, the inner conductor 3a has an axial length of 1/4 at the resonance frequency. Acts as a resonant conductor approximately equal to the wavelength.
The inner conductor 4a is connected to the outer conductor 6 via the first surface of the dielectric block.
It continues to a. The signal input / output conductor 7a is provided near the open end of the inner conductor 3a. With such a structure, a stray capacitance is generated in the gap 5a, and an electrostatic capacitance Ce as an external coupling capacitance is generated between the vicinity of the open end of the inner conductor 3a and the coupling conductor 7a. Surface mounting is performed by connecting the outer conductor of such a dielectric resonator to the ground conductor 21 on the circuit board 20 and connecting the signal input / output conductor 7a to the transmission line 22 on the circuit board.

Further, as shown in FIG. 3B, a capacitance Cab is generated between the inner conductor 3a of the dielectric resonator Ra and the coupling conductor 8a, and the capacitance Cab is coupled to the inner conductor 3b of the dielectric resonator Rb. Capacitances Cba and Cbc are generated between the conductors 9b and 8b, respectively. Further, a capacitance Ccb is generated between the inner conductor 3c of the dielectric resonator Rc and the coupling conductor 9c. The inner conductor 3c
An electrostatic capacitance Ce as an external coupling capacitance is generated between and the signal input / output conductor 7c. These three dielectric resonators Ra and R
b and Rc are formed by joining and integrating the opposite side surfaces so that the coupling conductor 8 is provided between the inner conductors 3a-3b of the dielectric resonator.
Electric field coupling is performed via a and 9b, and electric field coupling is performed between the inner conductors 3b and 3c through coupling conductors 8b and 9c. On the other hand, the ground conductor 21 and the transmission lines 22 and 23 are formed on the circuit board 20, and the outer conductor of the dielectric resonator device integrally joined is connected to the ground conductor 21 on the circuit board for signal input / output. Surface mounting is performed by connecting the conductors 7a and 7c to the transmission lines 22 and 23 on the circuit board.

Next, FIGS. 4 and 5 show examples in which the characteristics of the dielectric resonator device shown in FIGS. 1 to 3 are adjusted.

FIG. 4 is a view corresponding to the state shown in FIG. 1A. In FIG. 4, 31ab and 32bc are outer conductor part deletion portions according to the present invention. As apparent from the exploded perspective view shown in FIG.
Ab is located in a part of the periphery of the coupling conductors 8a and 9b, and the outer conductor part deletion part 32bc is located in a part of the periphery of the coupling conductors 8b and 9c.

FIG. 5 is a sectional view showing a state in which the dielectric resonator device is mounted on a circuit board. FIG. 5A is a sectional view taken along the line Y2-Y2 in FIG. 4, and FIG. 4 is a cross-sectional view taken along line XX in FIG.

As shown in FIG. 5 (A), by forming the outer conductor part deletion portion 31ab on the side surface of the dielectric resonator and partially deleting the outer conductor around the coupling conductors 8a and 9b, The capacitance between the inner conductors 3a and 3b and the outer conductors 6a and 6b decreases, and the capacitance Cab between the inner conductor 3a and the coupling conductor 8a and the capacitance between the inner conductor 3b and the coupling conductor 9b. Cba apparently increases, and the degree of electric field coupling between the inner conductors 3a and 3b increases.

As shown in FIG. 5B, the inner conductor 3
b, 3c and the coupling conductors 8b, 9c have a capacitance Cbc,
Although Ccb is generated respectively, the outer conductor portion deleted portion 32bc is formed on the first surface of the dielectric resonator to form the coupling conductor 8
By partially removing the outer conductors around b and 9c, the capacitance between the inner conductors 3b and 3c and the outer conductors 6b and 6c is reduced, and the static electricity between the inner conductor 3b and the coupling conductor 8b is reduced. The apparent capacitance of the capacitance Cbc and the capacitance Ccb between the inner conductor 3c and the coupling conductor 9c increases, and the inner conductor 3b,
The electric field coupling between 3c increases.

In the example shown in FIGS. 4 and 5, the degree of coupling between the adjacent dielectric resonators can be adjusted by the width, length and formation position of the outer conductor portion deleted portion.

FIG. 6 is a diagram showing another example of the dielectric resonator device whose characteristics have been adjusted. In the example of FIG. 6A, the outer conductor portion deletion portion 3 is provided on the side surface of the dielectric block corresponding to the periphery of the internal coupling conductor between the dielectric resonators Ra and Rb.
1ab is provided, and the outer conductor portion deleted portion 32ab is also formed on the first surface (end surface) of the dielectric block. By thus providing the outer conductor portion-removed portion on both the side surface and the first surface of the dielectric block, the adjustment range of the degree of coupling between the resonators by forming the outer conductor portion-removed portion is increased. still,
Further, the outer conductor portion-removed portion may be formed on the other side surface (bottom surface in the drawing) facing the outer conductor portion-removed portion 31ab before mounting on the circuit board.

In the example shown in FIG. 6B, a plurality of outer conductor part deleted portions are formed in an array as shown by 34ab.
In this case, the degree of coupling between the resonators can be adjusted depending on the size, the number, and the formation position of the outer conductor portion deleted portion.

In the example shown in FIGS. 4 to 6, the outer conductor part deletion portion is formed in a state where a plurality of dielectric resonators are joined and integrated, but the dielectric resonators are joined and integrated. The outer conductor portion deleted portion may be formed in a single state of the dielectric resonator before the step. FIG. 7 is a perspective view showing the example. In this example, the outer conductor 6a is partially deleted around the coupling conductor 8a, and the outer conductor part deleted portions 11a, 12a, 13a,
14a is formed. It is not necessary to form all of them at the same time, and it suffices to form a predetermined outer conductor part deleted portion at a predetermined position according to the adjustment amount. At that time, in FIG.
As shown in a, it may be formed by expanding the outer conductor non-forming portion around the coupling conductor 8a.

Next, another configuration example of the dielectric resonator device after the characteristic adjustment is shown in FIG. The appearance of the dielectric resonator device in this example is the same as that shown in FIG.
8 is a sectional view of a Y2-Y2 portion in FIG. 4, and FIG. 8B is a sectional view of a Y1-Y1 portion in FIG. In FIG. 8, reference numeral 10b is an inner conductor portion deleted portion of the dielectric resonator Rb. In this example, the inner conductor at a position near the coupling conductor 9b from the open end of the inner conductor 3b toward the short-circuit end is deleted by a certain length. As a result, the electrostatic capacitance Cba between the vicinity of the open end of the inner conductor 3b and the coupling conductor 9b is reduced as compared with the case where there is no inner conductor portion deleted portion.
In addition, by increasing the length of the inner conductor portion deleted portion 10b, the equivalent axial length of the inner conductor 3b is shortened and the resonance frequency is increased. In this way, the inner conductor portion deleted portion 10b
By changing the electrostatic capacitance between the inner conductor and the coupling conductor to adjust the degree of coupling between adjacent resonators, and by actively adjusting the equivalent axial length of the inner conductor, resonance can be achieved. The resonant frequency of the vessel can be adjusted.

FIG. 9 shows another example of forming the inner conductor portion deleted portion. FIG. 9 is a sectional view of the same portion corresponding to FIG. 8 (B). In this example, the inner conductor part deletion portion 10b is formed so as to be separated from the open end of the inner conductor 3b and on the side surface in a position close to the coupling conductor. In this case, the stray capacitance between the inner conductors 3b-4b is hardly changed, and the inner conductor 3b is not changed.
It is possible to adjust the electrostatic capacitance between the vicinity of the open end of the inner conductor 3b and the coupling conductor without substantially changing the equivalent axial length of. This capacitance can be adjusted by the shape, size, and formation position of the inner conductor portion deleted portion 10b.

FIG. 10 is an equivalent circuit diagram of the dielectric resonator device shown in FIGS. In FIG. 10, Cs is a stray capacitance generated at the open end of the inner conductor of each dielectric resonator. In this way, a dielectric resonator device which is composed of three stages of dielectric resonators and acts as, for example, a bandpass filter is obtained.

In the embodiments described above, the dielectric resonator device in which the axial length of the inner conductor of each dielectric resonator is ¼ wavelength at the resonance frequency is shown. Next, the axial length of the inner conductor is An example of a dielectric resonator device having a half wavelength is shown in FIGS.

FIG. 11 is a perspective view of the appearance of the entire dielectric resonator device. FIG. 11A is a perspective view seen from diagonally above in a state of being mounted on a circuit board or the like, and FIG. Shows the state. In FIG. 11, Ra, Rb, R
Reference numeral c is a dielectric resonator formed by forming various conductors on a prismatic dielectric block having through holes 2a, 2b and 2c therein. As shown in FIG. 3B, the dielectric resonators Ra and Rc have signal input / output conductors 7a and 7c, respectively.
forming c. In this example, the outer conductor portion deleted portion 31ab is formed on the side surface of the dielectric resonator, and the outer conductor portion deleted portion 32bc is formed on the first surface.

FIG. 12 is an exploded perspective view of the dielectric resonator device shown in FIG. Each of the dielectric resonators Ra, Rb, Rc includes a dielectric block in which the through holes 2a, 2b, 2c extend between the opposing first surface S1 and second surface S2,
An inner conductor is formed in each through hole 2a, 2b, 2c,
Outer conductors 6a, 6b and 6c are formed on the first surface S1, the second surface S2 and the four side surfaces of the dielectric block, respectively.
Further, the coupling conductor 8a is provided on the surface of the dielectric resonator Ra facing Rb, and the coupling conductors 9b, 8b are provided on the surfaces of the dielectric resonator Rb facing Ra and Rc, respectively.
The coupling conductor 9 is provided on the surface of the dielectric resonator Rc facing Rb.
forming c.

FIG. 13 is a sectional view showing a state in which the dielectric resonator device is mounted on the circuit board, and FIG.
FIG. 13B is a cross-sectional view taken along line Y1-Y1 in FIG.
FIG. 11 is a cross-sectional view taken along the line Y2-Y2 in FIG.

As shown in FIG. 13A, the dielectric resonator Ra has inner conductors 4a, 3a, which are separated by two gaps 5a on the inner surface of the through hole 2a provided in the dielectric block 1a.
4a, of which the inner conductor 3a acts as a resonant conductor whose axial length is approximately equal to 1/2 wavelength at the resonant frequency. The inner conductors 4a, 4a are continuous with the outer conductor 6a via the first surface and the second surface of the dielectric block, respectively. The signal input / output conductor 7a is provided at a position near one open end of the inner conductor 3a. With such a structure, a stray capacity is generated in the two gaps 5a, 5a,
An electrostatic capacitance Ce as an external coupling capacitance is generated between one open end of the inner conductor 3a and the coupling conductor 7a. The outer conductor of such a dielectric resonator is connected to the ground conductor 2 on the circuit board 20.
1 and the signal input / output conductor 7a is connected to the transmission line 22 on the circuit board for surface mounting.

As shown in FIG. 13B, a capacitance Cab is generated between the inner conductor 3a of the dielectric resonator Ra and the coupling conductor 8a, and the capacitance Cab is coupled to the inner conductor 3b of the dielectric resonator Rb. Capacitances Cba and Cbc between the conductors 9b and 8b, respectively
Occurs. Further, a capacitance Ccb is generated between the inner conductor 3c of the dielectric resonator Rc and the coupling conductor 9c. The three dielectric resonators Ra, Rb, and Rc are joined and integrated with each other at their opposing side surfaces, so that the inner conductor 3a-3 of the dielectric resonator is formed.
The electric field coupling is performed between b through the coupling conductors 8a and 9b, and the electric field coupling is performed between the inner conductors 3b and 3c through the coupling conductors 8b and 9c. In this example, as shown in FIG. 13 (B), by forming the outer conductor part deletion portion 31ab on the side surface of the dielectric resonator and partially deleting the outer conductor around the coupling conductors 8a and 9b, The capacitance between the inner conductors 3a and 3b and the outer conductors 6a and 6b decreases, and the capacitance Cab between the inner conductor 3a and the coupling conductor 8a and the capacitance between the inner conductor 3b and the coupling conductor 9b. Cba apparently increases, and the inner conductors 3a and 3b
The degree of electric field coupling between them increases. In addition, in this example, similarly to the example shown in FIG.
By forming 0c, the inner conductor portion deleted portion 10
The capacitance Ccb between the coupling conductor 9c and one open end of the inner conductor 3c due to the formation of c is reduced.

FIG. 14 is an equivalent circuit diagram of the dielectric resonator device shown in FIGS. 11 to 13. In FIG. 14, Cs is a stray capacitance generated at the open end of the inner conductor of each dielectric resonator. In this way, a dielectric resonator device which is composed of three stages of dielectric resonators and acts as, for example, a bandpass filter is obtained.

Next, FIGS. 15 to 19 show examples of the dielectric resonator device in which both ends of the inner conductor are short-circuited ends.

FIG. 15 is an external perspective view of the entire dielectric resonator device. FIG. 15A is a perspective view seen from diagonally above in a state of being mounted on a circuit board or the like, and FIG. Shows the state. In FIG. 15, Ra, Rb, R
Reference numeral c is a dielectric resonator formed by forming various conductors on a prismatic dielectric block having through holes 2a, 2b and 2c therein. As shown in FIG. 3B, the dielectric resonators Ra and Rc have signal input / output conductors 7a and 7c, respectively.
forming c. In this example, outer conductor part deleted portions 31ab and 31bc are formed on the side surface of the dielectric resonator.

FIG. 16 is an exploded perspective view of the dielectric resonator device shown in FIG. Each of the dielectric resonators Ra, Rb, Rc includes a dielectric block in which the through holes 2a, 2b, 2c extend between the opposing first surface S1 and second surface S2,
An inner conductor is formed in each through hole 2a, 2b, 2c,
Outer conductors 6a, 6b and 6c are formed on the first surface S1, the second surface S2 and the four side surfaces of the dielectric block, respectively.
Further, the coupling conductor 8a is provided on the surface of the dielectric resonator Ra facing Rb, and the coupling conductors 9b, 8b are provided on the surfaces of the dielectric resonator Rb facing Ra and Rc, respectively.
The coupling conductor 9 is provided on the surface of the dielectric resonator Rc facing Rb.
forming c.

FIG. 17 is a sectional view showing a state in which the dielectric resonator device is mounted on a circuit board, and FIG. 17 (A) is shown in FIG.
FIG. 17B is a cross-sectional view taken along line Y1-Y1 in FIG.
FIG. 16 is a sectional view of a Y2-Y2 portion in FIG.

As shown in FIG. 17A, in the dielectric resonator Ra, the inner conductor 3a having both ends as short-circuited ends is formed on the inner surface of the through hole 2a provided in the dielectric block 1a. The inner conductor 3a acts as a resonance conductor whose axial length is approximately equal to 1/2 wavelength at the resonance frequency. Signal input / output conductor 7
a is provided at a position close to the substantially central portion of the inner conductor 3a. Due to such a structure, an electrostatic capacitance Ce as an external coupling capacitance is generated between the central portion of the inner conductor 3a and the coupling conductor 7a. Surface mounting is performed by connecting the outer conductor of such a dielectric resonator to the ground conductor 21 on the circuit board 20 and connecting the signal input / output conductor 7a to the transmission line 22 on the circuit board.

Further, as shown in FIG. 17B, a capacitance Cab is generated between the inner conductor 3a of the dielectric resonator Ra and the coupling conductor 8a, and the capacitance Cab is coupled to the inner conductor 3b of the dielectric resonator Rb. Capacitances Cba and Cbc between the conductors 9b and 8b, respectively
Occurs. Further, a capacitance Ccb is generated between the inner conductor 3c of the dielectric resonator Rc and the coupling conductor 9c. Inner conductor 3
An electrostatic capacitance Ce as an external coupling capacitance is generated between c and the signal input / output conductor 7c. These three dielectric resonators Ra and R
b and Rc are formed by joining and integrating the opposite side surfaces so that the coupling conductor 8 is provided between the inner conductors 3a-3b of the dielectric resonator.
Electric field coupling is performed via a and 9b, and electric field coupling is performed between the inner conductors 3b and 3c through coupling conductors 8b and 9c. On the other hand, the ground conductor 21 and the transmission lines 22 and 23 are formed on the circuit board 20, and the outer conductor of the dielectric resonator device integrally joined is connected to the ground conductor 21 on the circuit board for signal input / output. Surface mounting is performed by connecting the conductors 7a and 7c to the transmission lines 22 and 23 on the circuit board. In this example,
As shown in FIG. 7 (B), the outer conductor part deletion portion 31ab is formed on the side surface of the dielectric resonator, and the outer conductor around the coupling conductors 8a and 9b is partially deleted.
The capacitance between a and 3b and the outer conductors 6a and 6b decreases, and the capacitance Cab between the inner conductor 3a and the coupling conductor 8a and the capacitance Cba between the inner conductor 3b and the coupling conductor 9b are reduced. It apparently increases and the degree of electric field coupling between the inner conductors 3a and 3b increases. In addition, by forming the outer conductor part deletion portion 31bc and partially deleting the outer conductor around the coupling conductors 8b and 9c, the capacitance between the inner conductors 3b and 3c and the outer conductors 6b and 6c is reduced. Is decreased, and the electrostatic capacitance Cbc between the inner conductor 3b and the coupling conductor 8b and the electrostatic capacitance Ccb between the inner conductor 3c and the coupling conductor 9c are apparently increased, and the inner conductors 3b and 3c are increased.
The degree of electric field coupling between them increases.

In the examples shown in FIGS. 15 to 17, the outer conductor part deleted portion is formed in a state where a plurality of dielectric resonators are joined and integrated, but the dielectric resonators are joined and integrated. The outer conductor portion deleted portion may be formed in a single state of the dielectric resonator before the step. FIG. 18 is a perspective view showing the example. In this example, the outer conductor 6a is partially deleted around the coupling conductor 8a, and the outer conductor part deleted portions 11a, 12a, 1 are formed.
3a and 14a are formed. It is not necessary to form all of them at the same time, and it suffices to form a predetermined outer conductor part deleted portion at a predetermined position according to the adjustment amount. In that case, as shown by 12a and 14a in FIG. 18, it may be formed by expanding the outer conductor non-forming portion around the coupling conductor 8a.

An equivalent circuit diagram of the dielectric resonator device shown in FIGS. 15 to 18 is shown in FIG. In this way, a dielectric resonator device which is composed of three stages of dielectric resonators and acts as, for example, a bandpass filter is obtained.

In each of the embodiments, the dielectric block is provided with a through hole extending between the first surface and the second surface, and the inner conductor is formed on the inner surface of the through hole. The portion does not necessarily have to penetrate, and the point is that the inner conductor may be provided in the void provided in the dielectric block. Further, in each of the embodiments, an example in which the outer conductor is formed on each of the first surface and the second surface of the dielectric block is shown, but the outer conductor is formed on the first surface or the second surface which should be the open end of the inner conductor. The surface may be an open end surface without being formed. Furthermore, in each of the embodiments, an example is shown in which the open end portion of the inner conductor is formed by providing a gap portion in the through hole in which the inner conductor is formed, but the gap portion is not provided in the recessed portion in the through hole, It may be provided in the opening. This facilitates formation of the gap.

[0076]

According to the present invention, the conventional shield case and the mounting bracket are unnecessary, the manufacturing cost is low,
A compact dielectric resonator device having multiple stages of resonators,
It can be easily manufactured without the need for a dedicated mold for each stage resonator, and the resonance frequency of each resonator and the degree of coupling between the resonators are set or adjusted independently of each other. A body resonator device is obtained. In particular, claim 1,
In the dielectric resonator device according to 2, 3, and 4, the presence of the outer conductor portion-removed portion allows the degree of coupling between adjacent resonators to be set and adjusted via the coupling conductor, and has a desired characteristic. A resonator device is obtained. In addition, claims 5 and 6,
In the method of adjusting the characteristics of the dielectric resonator device according to the seventh and eighth aspects, the outer conductor part deletion portion is formed in a part of the periphery of the coupling conductor, so that the dielectric resonators adjacent to each other through the coupling conductor. The capacitance between the inner conductors changes, and the degree of electric field coupling between the dielectric resonators is adjusted thereby, so that a dielectric resonator device having desired characteristics can be easily obtained. The dielectric resonator device according to any one of claims 9, 10 and 11 has desired characteristics in which the degree of coupling between adjacent resonators is set and adjusted through the coupling conductor due to the presence of the inner conductor portion deleted portion. A dielectric resonator device is obtained. In addition, claim 1
In the method of adjusting the characteristics of the dielectric resonator device according to 2, 13, 14, 15 and 16, the inner conductor part deleted portion is formed at a position close to the joint conductor of the inner conductor, so that the joint conductor is removed. The capacitance between the inner conductors of the adjacent dielectric resonators is changed via this, the electric field coupling degree between the dielectric resonators is adjusted by this, and a dielectric resonator device having desired characteristics is easily obtained. . Furthermore, in the dielectric resonator device according to claim 17, the presence of the outer conductor portion-removed portion and the inner conductor portion-removed portion causes the degree of coupling between adjacent resonators to be set and adjusted via the coupling conductor, which is desirable. A dielectric resonator device having the following characteristics is obtained. Further, in the characteristic adjusting method of the dielectric resonator device according to the eighteenth aspect, the outer conductor portion deleted portion is formed in a part of the periphery of the coupling conductor, and the inner conductor portion is provided at a position close to the coupling conductor of the inner conductor. By forming the deleted portion, the capacitance between the inner conductors of the adjacent dielectric resonators is changed via the coupling conductor, and thereby the degree of electric field coupling between the dielectric resonators is adjusted, and the desired value is obtained. A dielectric resonator device having the above characteristics can be easily obtained.

[Brief description of drawings]

FIG. 1 is an external perspective view of a dielectric resonator device according to a first embodiment, where (A) is a perspective view of a state where the dielectric resonator device is mounted on a circuit board or the like, and (B) is a state shown in (A). FIG. 3 is an external perspective view of the state in which the upper and lower surfaces of the dielectric resonator device are inverted.

FIG. 2 is an exploded perspective view of the dielectric resonator device according to the first embodiment.

FIG. 3 is a cross-sectional view of the dielectric resonator device according to the first embodiment mounted on a circuit board, FIG.
Sectional drawing of Y1-Y1 part in (A), (B) is FIG.
It is sectional drawing of the Y2-Y2 part in (A).

FIG. 4 is an external perspective view showing a state after characteristic adjustment of the dielectric resonator device of the first embodiment.

5A and 5B are cross-sectional views of the dielectric resonator device according to the first embodiment, where FIG. 5A is a cross-sectional view taken along the line Y2-Y2 of FIG. 4 in a state of being mounted on a circuit board, and FIG. 3 is a cross-sectional view of the XX portion of FIG.

FIG. 6 is an external perspective view showing another example of the dielectric resonator device according to the first embodiment after characteristic adjustment.

FIG. 7 is an external perspective view showing the configuration of one dielectric resonator in the dielectric resonator device of the second embodiment.

FIG. 8 is a cross-sectional view showing an example of formation of an inner conductor portion deleted portion in the dielectric resonator device of the third embodiment.

FIG. 9 is a cross-sectional view showing another example of formation of the inner conductor portion deleted portion in the dielectric resonator device of the third embodiment.

FIG. 10 is an equivalent circuit diagram of a dielectric resonator device having the configuration shown in FIGS.

11A and 11B are external perspective views showing the configuration of the dielectric resonator device after the characteristic adjustment according to the fourth embodiment, where FIG. 11A is a perspective view in a mounted state on a circuit board or the like, and FIG. FIG. 4 is an external perspective view of the state in which the upper and lower surfaces of the dielectric resonator device are inverted from the state shown in A).

FIG. 12 is an exploded perspective view of a dielectric resonator device according to a fourth embodiment.

13 is a cross-sectional view of the dielectric resonator device according to the fourth embodiment in a mounted state on a circuit board, FIG.
1A is a cross-sectional view of the Y1-Y1 portion, and FIG. 11B is a cross-sectional view of the Y2-Y2 portion in FIG.

FIG. 14 is an equivalent circuit diagram of a dielectric resonator device having the configuration shown in FIGS. 11 to 13.

15A and 15B are external perspective views showing a configuration of a dielectric resonator device after characteristic adjustment according to a fifth embodiment, FIG. 15A is a perspective view in a state of being mounted on a circuit board, and FIG. FIG. 4 is an external perspective view of the state in which the upper and lower surfaces of the dielectric resonator device are inverted from the state shown in A).

FIG. 16 is an exploded perspective view of a dielectric resonator device according to a fifth embodiment.

FIG. 17 is a cross-sectional view of the dielectric resonator device according to the fifth embodiment mounted on a circuit board, FIG.
5A is a cross-sectional view of the Y1-Y1 portion, and FIG. 5B is a cross-sectional view of the Y2-Y2 portion in FIG.

FIG. 18 is an external perspective view showing the configuration of one dielectric resonator in the dielectric resonator device of the sixth embodiment.

FIG. 19 is an equivalent circuit diagram of the dielectric resonator device having the configuration shown in FIGS.

[Explanation of symbols]

Ra, Rb, Rc-Dielectric resonator 1a, 1b, 1c-Dielectric block 2a, 2b, 2c-Through hole (gap) 3a, 3b, 3c-Inner conductor (resonant conductor) 4a-Inner conductor 5a-Gap 6a , 6b, 6c-outer conductors 7a, 7c-signal input / output conductors 8a, 8b, 9b, 9c-coupling conductors 10b, 10c-inner conductor portion deleted portions 11a, 12a, 13a, 14a-inner conductor portion deleted portions 20- Circuit board 21-Ground conductor 22,23-Transmission line 31ab, 31bc, 32ab, 32bc, 34ab-
Inner conductor part deleted part

Claims (18)

[Claims] 1. A dielectric block having a side surface extending between a first surface and a second surface facing each other, and a void extending inside the first surface and the second surface, the interior of the dielectric block. A plurality of dielectric resonators, each having an inner conductor formed on one side and a coupling conductor that forms a capacitance between the inner conductor and the outer conductor formed on at least a side surface, are joined and integrated side by side, and are adjacent to each other. A dielectric resonator device in which dielectric resonators are coupled to each other, wherein all of the dielectric resonators of a plurality of dielectric resonators or a predetermined dielectric resonator are provided on a part of the periphery of the coupling conductor. A dielectric resonator device, wherein an outer conductor portion deleted portion is formed. 2. The dielectric resonator device according to claim 1, wherein the outer conductor portion deletion portion is provided on the first surface or the second surface of the dielectric resonator. 3. The dielectric resonator device according to claim 1, wherein the outer conductor part deletion portion is provided on a side surface of the dielectric resonator. 4. The dielectric resonator device according to claim 1, wherein the outer conductor part deletion portion is provided on the first surface or the second surface together with the side surface of the dielectric resonator. 5. A dielectric block is provided with a side surface extending between a first surface and a second surface facing each other, and an air gap extending inside the first surface and the second surface, the interior of the dielectric block. A plurality of dielectric resonators, each having an inner conductor formed on one side and a coupling conductor that forms a capacitance between the inner conductor and the outer conductor formed on at least a side surface, are joined and integrated side by side, and are adjacent to each other. A method for adjusting the characteristics of a dielectric resonator device in which dielectric resonators are coupled to each other, wherein all of the dielectric resonators of a plurality of dielectric resonators or a predetermined dielectric resonator surround the coupling conductor. A part of the outer conductor is removed to adjust the capacitance between the inner conductors of the adjacent dielectric resonators via the coupling conductor to adjust the characteristics of the dielectric resonator device. A characteristic adjusting method for a dielectric resonator device, comprising: 6. The characteristic adjusting method for a dielectric resonator device according to claim 5, wherein the outer conductor part removing portion is formed in a state where a plurality of dielectric resonators are joined and integrated. 7. The method of adjusting the characteristics of a dielectric resonator device according to claim 5, wherein the outer conductor portion removing portion is formed in a state before a plurality of dielectric resonators are joined and integrated. 8. The characteristic adjusting method for a dielectric resonator device according to claim 5, 6 or 7, wherein the capacitance is adjusted according to the shape, size or formation position of the outer conductor portion deleted portion. 9. A dielectric block is provided with a side surface extending between a first surface and a second surface facing each other, and a void extending inside the first surface and the second surface. A plurality of dielectric resonators, each having an inner conductor formed on one side and a coupling conductor that forms a capacitance between the inner conductor and the outer conductor formed on at least a side surface, are joined and integrated side by side, and are adjacent to each other. What is claimed is: 1. A dielectric resonator device in which dielectric resonators are coupled to each other, wherein an inner conductor part deletion portion is formed at a portion of the inner conductor adjacent to the coupling conductor. 10. The dielectric resonator device according to claim 9, wherein the inner conductor part deletion portion extends by a predetermined length in the axial direction of the inner conductor. 11. The dielectric resonator device according to claim 9, wherein the inner conductor part deletion portion extends by a predetermined amount in a direction around the axis of the inner conductor. 12. A dielectric block is provided with a side surface extending between a first surface and a second surface facing each other, and an air gap extending inside the first surface and the second surface, the interior of the dielectric block. An inner conductor is formed on at least one side surface, and a plurality of dielectric resonators formed by forming a coupling conductor that forms a capacitance with the inner conductor on at least a side surface together with the outer conductor, are joined together side by side,
A method for adjusting the characteristics of a dielectric resonator device in which adjacent dielectric resonators are coupled to each other, wherein an inner conductor part deletion portion is formed at a location of the inner conductor adjacent to the coupling conductor, A method for adjusting the characteristics of a dielectric resonator device, which comprises adjusting the capacitance between the inner conductors of adjacent dielectric resonators via a conductor. 13. A dielectric block having a side surface extending between a first surface and a second surface facing each other, and an air gap extending inside the first surface and the second surface, the interior of the dielectric block. An inner conductor is formed on at least one side surface, and a plurality of dielectric resonators formed by forming a coupling conductor that forms a capacitance with the inner conductor on at least a side surface together with the outer conductor, are joined together side by side,
A method for adjusting the characteristics of a dielectric resonator device in which adjacent dielectric resonators are coupled to each other, wherein an inner conductor part deletion portion is formed at a location of the inner conductor adjacent to the coupling conductor, A method for adjusting a characteristic of a dielectric resonator device, which comprises adjusting an electrostatic capacitance between an inner conductor of an adjacent dielectric resonator via a conductor and adjusting an equivalent axial length of the inner conductor. 14. The method of adjusting a characteristic of a dielectric resonator device according to claim 12, wherein the inner conductor part removing portion is formed in a state where a plurality of dielectric resonators are joined and integrated. 15. The inner conductor portion deleted portion is formed in a state before a plurality of dielectric resonators are joined and integrated.
Alternatively, the method of adjusting the characteristics of the dielectric resonator device according to Item 13. 16. The capacitance, the equivalent axial length of the inner conductor, or the equivalent axial length of the inner conductor is adjusted according to the shape, size, or formation position of the inner conductor portion deleted portion.
A method for adjusting a characteristic of a dielectric resonator device as described. 17. A dielectric block having a side surface extending between a first surface and a second surface facing each other, and an air gap extending inside the first surface and the second surface, the interior of the dielectric block. An inner conductor is formed on at least one side surface, and a plurality of dielectric resonators formed by forming a coupling conductor that forms a capacitance with the inner conductor on at least a side surface together with the outer conductor, are joined together side by side,
A dielectric resonator device in which adjacent dielectric resonators are coupled to each other, wherein all the dielectric resonators of a plurality of dielectric resonators or a predetermined dielectric resonator have one of the surroundings of the coupling conductor. A dielectric resonator device, wherein an outer conductor portion-removed portion is formed in the portion, and an inner conductor portion-removed portion is formed in a portion of the inner conductor adjacent to the coupling conductor. 18. A dielectric block having a side surface extending between a first surface and a second surface facing each other, and an air gap extending inside the first surface and the second surface, the interior of the dielectric block. An inner conductor is formed on at least one side surface, and a plurality of dielectric resonators formed by forming a coupling conductor that forms a capacitance with the inner conductor on at least a side surface together with the outer conductor are joined together side by side,
A method for adjusting the characteristics of a dielectric resonator device in which adjacent dielectric resonators are coupled to each other, wherein the coupling conductor is used in all the dielectric resonators of a plurality of dielectric resonators or in a predetermined dielectric resonator. An outer conductor part deletion part is formed in a part of the periphery of the inner conductor part, and an inner conductor part deletion part is formed in a portion of the inner conductor close to the coupling conductor, and the dielectric resonance is adjacent to the coupling part through the coupling conductor. A method for adjusting the characteristics of a dielectric resonator device, which comprises adjusting the capacitance between inner conductors of a resonator or the equivalent axial length of the inner conductor.