JPH07239553A - Film peeling device - Google Patents

Abstract

PURPOSE:To easily peel a cover film at a high speed by providing this device with peeling means having projecting parts which hook and lift a film by coming into contact with the film surface and recessed parts which hold the part of the lifted film and sticking roller which sticks the peeled part by coming into contact with this part and peels the film from an object. CONSTITUTION:This end part peeling device 15 for supporting 10b, a pilot roller 13 and a lifting device 15 for supporting these knurlings and roller freely movably forward and backward relative to the substrate W and peels a part of the film F by coming into contact with the film F of the substrate W at need. The peeling device is also provided with substrate front end sensors 16, 17 for obtaining the timing for advance and retreat by the lifting device 15. The pawl-shaped projections 11 of the knurls 10 are brought into contact with the end of the film F of the substrate W by the lifting device 15 and the end of the film F is hooked by these projections, by which the end is partly lifted and the lifted part is housed and held in the recessed part 12. The film F superposed double protects a photoresist R.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for peeling a film such as a polyester cover film mounted on the surface of a dry film photoresist.

[0002]

2. Description of the Related Art In forming a circuit on a substrate or the like, a lithographic method used in an IC manufacturing technique has been recently used. At that time, a dry film photoresist has been used as a photoresist coated on the substrate. FIG. 8 shows an example thereof. A photoresist R is applied to the front and back of the substrate W, and a protective cover film F made of polyester is stuck on the photoresist R.

[0003]

This film F needs to be peeled off after the exposure step of printing a circuit pattern on the photoresist R, and a device for automatically and efficiently peeling this type of film has been developed. Being tried.
However, when the film F is peeled off, the photoresist R
Satisfactory automatic peeling device has not been developed yet, because there are conditions such as not to be scratched, and the surface of the film F is smooth. That is, as one of the conventional proposals, there is a method of peeling by scratching the film and then blowing it with air, but there is a problem that the tent tears of the photoresist occur and the fragments are reattached to the substrate. Further, in the conventional method, there is a drawback that the tact time becomes long because the work is temporarily stopped and the apparatus becomes long, and normally the peeling work is normally performed manually. The present invention aims to solve the problems of the prior art.

[0004]

In order to achieve the above object, the present invention is a film peeling device for peeling a film adhered to an object, the protrusion being in contact with the film surface and hooking and lifting the film. And a peeling means having a concave portion for holding the lifted portion of the film, and an adhesive roller that abuts on the portion peeled by the peeling means and adheres to peel the film from an object. It is characterized by having.

[0005]

The part of the film is lifted from the object by the peeling means. Peel from this part with an adhesive roller,
Peel the entire film from the object.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the present invention. In this embodiment, the substrate W is provided with the photoresist R and the film F on the front and back surfaces so that the film F on the front and back surfaces can be peeled off at the same time. Substrate W is belt conveyor 5
Is conveyed, and both ends thereof are sandwiched between the front and back sides by the feed rollers 3 and 3 and further conveyed in the arrow direction. An edge peeling device 1 and an adhesive roller 2 are provided on the downstream side of the feed roller 3, and these are provided at both ends of the substrate W so as to sandwich the substrate W from the front and back sides.

In this embodiment, the end peeling device 1 is provided on each of the front and back sides, a total of four. As shown in FIG. 2, the edge peeling device 1 includes knurls 10a and 10b, a pilot roller 13, and elevating devices 15 and 15 that support these components so that they can move back and forth with respect to the substrate W. A part of the film F is peeled off by contacting the film F of W. In addition, substrate tip sensors 16 and 17 for timing the advance / retreat by the elevating device 15 are provided.

As shown in FIG. 3, the pilot roller 13 contacts the substrate W and presses the substrate W from above. The knurl 10a is lowered from the pilot roller 13 by a length substantially corresponding to the thickness of the film F, and is adapted to properly contact the film F. On the downstream side of the knurl 10a in the moving direction of the substrate W, there is provided a knurl 10b that comes into contact with the lower film F. The pilot roller 13, the knurls 10a, and the knurls 10b can be moved up and down by an elevating device 15, but they can move up and down by themselves and are pressed in the film F direction by a pressing means (not shown) such as a spring. There is.

The substrate tip sensor 16 is provided on the downstream side of the knurl 10a, and the substrate tip sensor 17 is provided on the downstream side of the knurl 10b, both of which are movable in the substrate W moving direction. The substrate leading edge sensor 16 and the substrate leading edge sensor 17 detect the leading edge of the substrate W, and drive the lifting device 15 by this detection signal to separate the edge peeling device 1 from the substrate W. Therefore, by adjusting the positions of the substrate leading edge sensor 16 and the substrate leading edge sensor 17, the knurl 1
It is possible to adjust the length of the peeled portion of the film F by 0.

As shown in FIG. 4, the knurl 10 has a disk shape, and a claw-shaped projection 11 is formed in a wavy shape around the disk. A concave portion 12 is provided between the corrugated claw-shaped projections 11 and 11.
It has become. In the case of this embodiment, one claw projection 11
If it wears, the knurl 10 may be rotated to use the next adjacent claw-shaped projection 11, and the time and effort for replacement can be reduced. Further, as shown in FIG. 5, since the vertical position of the claw-shaped projection 11 is slightly displaced, there is an advantage that only a suitable single claw-shaped projection 11 comes into contact with the film F.

The mechanism of peeling the film F by the knurl 10 will be described with reference to FIG. The claw-shaped projection 11 of the knurl 10 is brought into contact with the end of the film F of the substrate W by the lifting device 15 (A). In this state, when the substrate W advances in the direction of the arrow, the end of the film F is caught by the tip of the claw-shaped projection 11 and a part is lifted, and the lifted part is stored and held in the recess 12 (B, C). Further substrate W
, The claw-shaped projection 11 is movable in the vertical direction, so that it rides on the film F and the film F is doubled (D). Since the doubled film F protects the photoresist R, the nail R does not scratch the photoresist R. Then, when the front end of the substrate W is detected by the front end sensor 16 (E), the elevating device 15 operates to raise the edge peeling device 1 (F). By adjusting the position of the board front end sensor 16,
For example, it is also possible to raise the end peeling device 1 in the state of (C), and it is possible to obtain an operation that meets the needs of the user. In addition, the lower film F is knurled 1
The operation of peeling by 0b is also similar to the above, and thus the description thereof is omitted.

As described above, the film F of the substrate W that has passed through the edge peeling device 1 is formed with the peeling portion T at the edge as shown in FIG. 7, and the edge of the film F is floated from the substrate W. It can be in a state.

An adhesive roller 2 is provided on the downstream side of the edge peeling device 1. In this embodiment, two adhesive rollers 2 are provided on each of the front and back sides, for a total of four adhesive rollers 2. The adhesive roller 2 is provided at a position on the straight line of the edge peeling device 1, and adheres to the peeling portion T formed by the edge peeling device 1 to peel the film F from the photoresist R of the substrate W. It has become. The adhesive roller 2 is provided with an adhesive material on its surface and adheres to the film F to form the film F.
Is peeled from the photoresist R.

The adhesive roller 2 and the feed roller 3 are also provided so as to be able to come into contact with and separate from the substrate W.

Next, the operation will be described. The substrate W transferred by the belt conveyor 5 is transferred in the direction of the edge peeling device 1 and the adhesive roller 2 whose both ends are held by the feed roller 3. When the substrate W comes to the position of the edge peeling device 1, the elevating device 15 operates and the knurls 10 come into contact with the front and back of the substrate W, and the claw-shaped projections 11 of the knurls 10 peel the edges of the film F of the substrate W. Then, as shown in FIG. 7, the peeled portion T is formed on the film F. Next, when the tip of the substrate W reaches the position of the adhesive roller 2, the adhesive roller 2 adheres to the film F. Since the peeling portion T is formed in the contact portion of the film F with the adhesive roller 2, the film F is peeled from the photoresist R by the adhesive force of the adhesive roller 2. Then, this peeling portion T
The peeling progresses, and the film F is entirely peeled off by the adhesive roller 2 as the substrate W advances.

As described above, according to the above configuration, the film F is partially peeled from the photoresist R on the substrate W by the edge peeling device 1 to form the peeled portion T,
Next, the adhesive roller 2 peels the film F entirely. In addition, this operation does not stop the substrate W,
Since it can be performed continuously, there are advantages such as extremely high work efficiency.

[0017]

As described above, the present invention is a film peeling device for peeling a film attached to an object, which comprises a protrusion for abutting the film surface and hooking the film to lift the film. Since it is provided with a peeling means having a concave portion for holding a portion of the film, and an adhesive roller that comes into contact with the portion peeled by the peeling means and adheres to peel the film from the object, Moreover, the cover film of the dry film photoresist can be peeled off at high speed. Further, there is an effect that the photoresist is not scratched.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an embodiment of the present invention.

FIG. 2 is a schematic side view showing an embodiment of the present invention.

FIG. 3 is a partially enlarged view of FIG.

FIG. 4 is an enlarged view of the knurling, (A) is a side view and (B) is a front view.

FIG. 5 is an enlarged view of a claw-shaped projection 11 of the knurled body 10.

FIG. 6 is an explanatory diagram of an operation of peeling by the knurl 10 in the present invention.

FIG. 7 is an operation explanatory diagram of the embodiment of the present invention.

FIG. 8 is a cross-sectional view showing the structure of a circuit board W provided with a dry film photoresist.

[Explanation of symbols]

1: Edge peeling device, 2: Adhesive roller, 3: Feed roller,
5: belt conveyer, 10: knurl, 11: claw-like protrusion, 12: recess, 13: pilot roller, 15: lifting device, 16: substrate tip sensor, 17: substrate tip sensor.

Claims (7)

[Claims] 1. A film peeling device for peeling a film adhered to an object, comprising: a protrusion that abuts on the surface of the film to catch and lift the film; and a recess that holds the lifted portion of the film. A film peeling apparatus comprising: a peeling unit including: and a pressure-sensitive adhesive roller that comes into contact with a portion peeled by the peeling unit and adheres to peel the film from an object. 2. The object moves relative to the peeling device, the projection moves relative to the film and is lifted, and the adhesive roller adheres to and peels the film relatively moving. The film peeling device according to claim 1. 3. The projection is provided so as to be movable up and down, and is provided with a means for pressing the projection against the film surface, and the projection is movable up and down in response to the vertical displacement of the film surface. The film peeling device according to claim 1 or 2. 4. The protrusion according to claim 1, 2 or 3, wherein a plurality of the protrusions are regularly arranged on the peripheral side surface of the disc at a predetermined interval, and the recesses are provided between the protrusions. Film peeling device. 5. The film peeling device according to claim 1, further comprising a driving device for bringing the peeling means into and out of contact with an object. 6. The film is adhered to the front and back of the object, and the peeling means and the adhesive roller are provided in a pair or more so as to face the front and back of the object, and 1 or 2 or 3 or 4 or 5, respectively. The film peeling apparatus according to. 7. The object is a circuit board and a photoresist provided on the board, and a film is stuck on the photoresist, 1 or 2 or 3 or 4 or 5 or 6 The film peeling apparatus according to.