JPH0723524U - Injection molding equipment - Google Patents

Abstract

(57) [Summary] [Object] To provide an injection molding apparatus capable of accurately manufacturing a thin-walled molded product such as a card base material for an IC card which has no distortion and has an excellent appearance. [Structure] A fixed mold and a movable mold are arranged on a fixed mold mounting plate and a movable mold mounting plate, respectively, which are arranged to face each other. Is
A fixed-side hot plate for annealing and a movable-side hot plate are arranged in parallel with the fixed mold and the movable mold, respectively. [Effect] It is possible to accurately manufacture a thin-walled molded product such as a card base material for an IC card which has no distortion and has an excellent appearance,
Moreover, since the annealing process can be sequentially performed in parallel with the injection molding process, there is no need for a space for installing an annealing device and a transfer device from the injection molding device to the annealing device as in the conventional case.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an injection molding apparatus for injection molding resin into a cavity formed by a fixed mold and a movable mold, and particularly for injection molding a thin-walled molded product such as a card base material for an IC card. The present invention relates to an injection molding device integrally provided with an injection molding mechanism and a molded product annealing mechanism.

[0002]

[Prior art and its problems]

 Conventionally, as an injection molding device for injecting resin into a cavity formed by a fixed mold and a movable mold to manufacture a resin molded product, a fixed mold is used in order to realize a high cycle and reduce raw material loss. Often injection molding is performed by incorporating a hot runner. Therefore, a temperature difference occurs between the fixed mold and the movable mold, and particularly thin-walled molded products such as IC card base materials are likely to be deformed. Therefore, after performing injection molding or injection compression molding, take out the molded product from the mold, convey it to an annealing device that heats it above the heat distortion temperature of the resin to reduce distortion, and measure the dimensions of the molded product. It was improving the accuracy.

However, in the above-mentioned conventional case, in addition to the injection molding device, a space for separately installing an annealing device and a new heat source are required. Further, there is a problem that a transfer device from the injection molding device to the annealing device is required.

[0004]

[Means for Solving the Problems]

 The present invention is to solve the above problems, and its gist is to dispose a fixed mold and a movable mold on a fixed mold mounting plate and a movable mold mounting plate, respectively, which are arranged to face each other. An injection molding apparatus for injecting resin into a cavity formed by a fixed mold and a movable mold to manufacture a molded product, wherein the fixed mold mounting plate and the movable mold mounting plate are By arranging the fixed-side hot plate and the movable-side hot plate for annealing in parallel with the fixed mold and the movable mold, respectively, an injection molding apparatus capable of sequentially performing the annealing process in parallel with the injection molding process. Regarding

[0005]

[Action]

 The present invention incorporates an annealing process into an injection molding apparatus, wherein a fixed mold mounting plate and a movable mold mounting plate are provided in parallel with a fixed mold and a movable mold, and a fixed side heating plate for annealing is used. By arranging the heat plate on the movable side and the hot plate on the movable side, respectively, the annealing process can be sequentially performed in parallel with the injection molding.

[0006]

【Example】

 Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 1 is a schematic diagram showing an injection molding apparatus of the present invention, and FIG. 2 is a perspective view showing a main part of the injection molding apparatus of the present invention.

As shown in the configuration diagram of FIG. 1 and the perspective view of FIG. 2, the injection molding apparatus of the present invention has a fixed mold mounting plate 10 and a movable mold mounting plate 20 which are arranged to face each other. In addition, the fixed mold 11 and the movable mold 21 are provided respectively. The fixed mold 11 has a convex portion 12 having a size corresponding to the overall shape of the card base material P for an IC card to be molded, and the movable mold 21 has a convex mold 12 for an IC card to be molded. A cavity 22 is formed by the fixed mold 11 and the movable mold 21 having a recess 22 having a size corresponding to the entire shape of the card substrate P, and a resin is injected from the nozzle Q into the cavity. A card substrate P for an IC card, which is a molded product, is injection-molded. Although the above points are the same as in the prior art, in the present invention, in addition to the fixed mold 11 and the movable mold 21, the fixed mold mounting plate 10 and the movable mold mounting plate 20 are fixed in parallel with them for annealing. It is characterized in that the side heating plate 13 and the movable side heating plate 23 are arranged respectively.

In order to injection-mold the card base material P for an IC card according to the present invention, first, ABS resin or the like is injected from the nozzle Q into the cavity formed by the fixed mold 11 and the movable mold 21. A card base material P for an IC card, which is a molded product, is injection-molded, and after cooling the card base material P for an IC card, an ejection device (not shown) ejects the card base material P for an IC card and a take-out robot. The card portion P for the IC card is gripped by the grip portion R. Then, it is moved between the fixed-side hot plate 13 for annealing and the movable-side hot plate 23. The movable-side hot plate 23 holds the IC card card base material P on the movable-side hot plate 23 by providing suction air holes (not shown). It is preferable to provide the holding projections 24 as shown in the drawing, because it becomes easy to hold the IC card card base material P on the movable side heating plate 23.

At the time of the next mold clamping, that is, when the ABS resin or the like is injected from the nozzle Q into the cavity formed by the fixed mold 11 and the movable mold 21, and the next card base material P is injection-molded. At the same time, the movable-side hot plate 23 also moves in the direction of the fixed-side hot plate 13 to sandwich and anneal the IC card card base material P. Note that 25 is a spring, and it is preferable to interpose the spring 25 in the annealing movable side hot plate 23 because the card substrate P which is a molded product can be uniformly pressed and annealed. The spring 25 may be provided on the stationary heating plate 13 for annealing.

A pipe 26 for heating / cooling the movable mold 21 is connected to a pipe for heating / cooling the movable-side hot plate 23 so as to be common, and a pipe 14 for heating / cooling the fixed mold 11 is fixed. If the constant-side heating plate 13 is connected to a pipe for heating / cooling and made common, the same heat source can be used, which is preferable.

[0011]

[Effect of device]

 As described above, according to the present invention, the fixed mold and the movable mold are arranged on the fixed mold mounting plate and the movable mold mounting plate, respectively. Since the fixed plate and the movable plate for the annealing are arranged in parallel with the fixed plate and the movable plate, respectively, the fixed-side hot plate and the movable-side hot plate for annealing are arranged, so that there is no distortion and the IC card has an excellent appearance. It is possible to manufacture thin-walled molded products such as card base materials with high precision, and the annealing process can be performed sequentially in parallel with the injection molding process. There is an advantage that a transfer device from the molding device to the annealing device is unnecessary.

[Brief description of drawings]

FIG. 1 is a block diagram showing the outline of an injection molding apparatus of the present invention.

FIG. 2 is a perspective view showing a main part of the injection molding apparatus of the present invention.

[Explanation of Codes] 10 Fixed Mold Mounting Plate 11 Fixed Mold 12 Convex 13 Fixed Annealing Hot Plate 14 Heating / Cooling Pipe 20 Movable Mold Mounting Plate 21 Movable Mold 22 Recess 23 Moving Side Hot Plate for Annealing 24 Holding projection 25 Spring 26 Heating / cooling piping

Claims (1)

[Scope of utility model registration request] 1. A fixed mold mounting plate and a movable mold mounting plate, which are arranged to face each other, are provided with a fixed mold and a movable mold, respectively, and are formed by the fixed mold and the movable mold. An injection molding device for injecting resin into a cavity to manufacture a molded product, wherein the fixed mold mounting plate and the movable mold mounting plate are annealed in parallel with the fixed mold and the movable mold. A fixed-side hot plate and a movable-side hot plate are respectively arranged.