JPH07227999A - Image apparatus - Google Patents

Abstract

PURPOSE:To form a latent image of high image quality on a photosensitive member by accurately irradiating the surface of the photosensitive member with light emitted from a light emitting diode element through a lens or to accurately forming external image data into an image on a solid-state imaging element array through a lens and to generate the accurate electric signal corresponding to the external image data in the solid-state imaging element array. CONSTITUTION:A base plate 1 having a large number of image element arrays 2 linearly arranged thereto and a transparent cover member 4 composed of inorg. matter are parallelly attached to a support 5 and a plurality of lenses 3 are arranged between the base plate l and the transparent cover member 4 so as to correspond to the respective image element arrays 2 in relation of 1:1 and the reference surface 3a provided to the outer peripheral parts of the lenses are in contact with the transparent cover member 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming apparatus used in an image forming apparatus such as an optical printer head or an image reading apparatus such as an image sensor.

[0002]

2. Description of the Related Art In a conventional image forming apparatus such as an image forming apparatus such as an optical printer head, a plurality of lenses are usually arranged and fixed linearly at a predetermined interval via an adhesive such as an epoxy resin. Each lens and each light emitting diode element array have a one-to-one correspondence between a lens plate made of resin such as polycarbonate and a base plate made of resin such as polycarbonate on which a large number of light emitting diode element arrays are linearly arranged and mounted. The light emitting diode elements of each light emitting diode element array emit light individually and selectively in response to an external electrical signal. It functions as an image forming device by forming an image of light on an external photoconductor through a lens and forming a latent image on the photoconductor.

The light emitting diode element array linearly arranged and mounted on the base plate is generally composed of 64 light emitting diode elements linearly arranged therein, and is a B4 size image forming apparatus. In the case of using the above, the 32 light emitting diode element arrays are mounted on the base plate such that 32 of them correspond to the respective lenses one to one.

Further, when each lens fixed to the lens plate and each light emitting diode element array mounted on the base plate are deviated from each other in position, bleeding, white lines, and black are formed on the image formed on the photoconductor surface. Since it is impossible to form a sharp and accurate latent image by generating streaks or the like, it is necessary to align each lens and each light emitting diode element array with extremely high accuracy.

[0005]

However, in this conventional image device, the lens plate is made of a resin such as polycarbonate, and the resin such as polycarbonate is soft and difficult to be flattened, so that the flatness is ± 5 μm or more. As a result, when a plurality of lenses are fixed to the lens plate, variations occur in the fixed position (fixed height) of each lens, and the light emitted from the light emitting diode element that is irradiated and imaged on the photoconductor through the lenses is also generated. It has a drawback that bleeding occurs and a clear and accurate latent image cannot be formed on the photoreceptor.

Further, in this image device, the lens is fixed to the lens plate via an adhesive such as an epoxy resin, and the adhesive such as the epoxy resin must be heated at 150 ° C. for about one hour for thermosetting. Inevitably, it takes a long time to bond and fix the lens to the lens boot, resulting in poor productivity. At the same time, since it takes a long time to bond and fix the lens to the lens boot, it is easy for each lens to tilt or become uneven in height during bonding and fixing. It is also impossible to accurately form the emitted light on the surface of the photoconductor through the lens, and there is also a drawback that an accurate latent image cannot be formed on the photoconductor.

Further, in this image device, a plurality of light emitting diode element arrays are mounted on a base plate made of polycarbonate resin, and the polycarbonate resin has low rigidity, so that it is suitable for use as an image forming apparatus. When external force or thermal stress is applied, deformation such as warpage or twist easily occurs, and when deformation occurs in the base plate, there is a positional shift between the light emitting diode element array mounted on the base plate and the lens. It also has a drawback that it becomes impossible to form a clear and accurate latent image on the surface of the photoreceptor.

Further, in this image device, when the lens is made of a transparent resin, the transparent resin is soft, so that when the lens is used as an image forming device, it is easily applied to the lens when an external force is applied to the lens. As a result, scratches are formed, and as a result, it becomes impossible to accurately form the light emitted by the light emitting diode element on the photoconductor due to the scratches, and it is not possible to form an accurate latent image on the photoconductor. Was.

Furthermore, in the above-mentioned conventional example, an image device used in an image forming apparatus such as an optical printer head has been described as an example, but it is used in an image reading apparatus such as an image sensor using a solid-state image sensor array. Even in the image device described above, the image formation of the external image information on the solid-state image sensor array becomes non-uniform due to the positional deviation between the lens and the solid-state image sensor array, and the solid-state image sensor array does not accurately correspond to the image information. It has a drawback that it is impossible to generate an electric signal.

[0010]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and an object of the invention is to accurately irradiate light emitted from a light emitting diode element onto a surface of a photoconductor through a lens so that the photoconductor has a latent image of high image quality. An image that can form an image or can accurately form external image information on a solid-state image sensor array through a lens and generate an accurate electrical signal corresponding to the external image information on the solid-state image sensor array. To provide a device.

[0011]

In the image device of the present invention, a base plate on which a large number of image element arrays are linearly arranged and a transparent cover member made of an inorganic material are attached in parallel to a support. A plurality of lenses are arranged between the base plate and the transparent cover member so that each lens has a one-to-one correspondence with each image element array, and each lens has a reference surface provided on its outer peripheral portion. It is characterized by being in contact with the transparent cover member.

[0012]

According to the image device of the present invention, the reference surface is provided on the outer peripheral portion of the lens, and the reference surface is brought into contact with the transparent cover member made of an inorganic material having a flatness of 5 μm or less. The fixed position of all the lenses is always constant, and as a result, a clear and accurate latent image can be formed on the photoconductor when it is used as an image forming device, and when it is used as an image reading device. Can generate an accurate electric signal corresponding to external image information in the solid-state image sensor array.

Further, according to the image apparatus of the present invention, the lens is fixed by pressing the reference surface provided on the outer peripheral portion of the lens against the transparent cover member with, for example, a spring member to bring it into contact with the transparent cover member. The fixing time of the lens becomes extremely short, and the productivity of the image device becomes extremely excellent.

Further, according to the image device of the present invention, the lens is protected by the transparent cover member, and the transparent cover member is made of an inorganic material having a Vickers hardness (Hv) of Hv ≧ 2.8 (GPa). Therefore, the lens and the transparent cover member are scarcely scratched, and as a result, when this is used as an image forming apparatus, the light emitted from the light emitting diode element is accurately irradiated onto the photoconductor surface through the lens, A latent image with high image quality can be formed on the photoconductor, and when used as an image reading device, external image information is accurately formed on the solid-state image sensor array via the lens,
An accurate electric signal corresponding to external image information can be generated in the solid-state image sensor array.

Further, according to the image device of the present invention, if the base plate on which the image element array is mounted is made of a highly rigid material, the base plate is warped or twisted even if external force or thermal stress is applied. Therefore, each image element array mounted on the base plate always accurately faces each lens, and when used as an image forming apparatus, it is clear and accurate on the photoconductor. A latent image can be formed, and when used as an image reading device, an accurate electric signal corresponding to external image information can be generated in the solid-state image sensor array.

[0016]

The present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment in which the image device of the present invention is used in an optical printer head as an image forming device, 1 is a base plate, 2 is a light emitting diode element array, 3 is a lens, 4 is a transparent cover member, and 5 is a transparent cover member. Is a support.

The base plate 1 is made of, for example, a highly rigid material such as aluminum oxide sintered body, crystallized glass, or quartz, which is hard to be deformed such as warped or twisted. Diode element array 2
Are arranged linearly.

The base plate 1 acts as a supporting member for supporting the light emitting diode element array 2, and, for example,
When it is composed of an aluminum oxide sintered body, alumina, silica, calcia, magnesia and other raw material powders are mixed with an appropriate organic solvent and a solvent to form a sludge, which is conventionally known as a doctor blade method or calender. A ceramic green sheet (ceramic green sheet) is obtained by adopting a roll method or the like, and then the ceramic green sheet is punched into a predetermined shape and fired at a high temperature (about 1500 ° C.).

Further, the light emitting diode element array 2 arranged and mounted on the base plate 1 comprises a plurality of light emitting diode elements 2a, and the light emitting diode elements 2a individually and selectively emit light in response to an external electric signal. Then, by irradiating the surface of the photoconductor P with the emitted light, a latent image for forming an image is formed on the photoconductor P.

The light emitting diode element 2a is made of GaAsP.
-Based, GaP-based light-emitting diodes are used, for example, GaAs
In the case of P-based light-emitting diodes, as well as heating to a high temperature the GaAs substrate at furnace First AsH ₃ and (arsine) PH
A gas containing an appropriate amount of ₃ (phosphine) and Ga (gallium) is contacted to grow a single crystal of n-type semiconductor GaAsP (gallium-arsenic-phosphorus) on the substrate surface, and then Si on the GaAsP single crystal surface.
₃ N ₄ (Silicon Nitride) windowed film is deposited and Zn (zinc) gas is exposed to the window part to diffuse Zn into a part of GaAsP single crystal of n-type semiconductor to form p-type semiconductor Then, it is formed by providing a pn junction.

In the case of a B4 size optical printer head, the number of the light emitting diode elements 2a is 2048 (8 per 1 mm).
Are arranged linearly, and specifically, a light emitting diode element array in which 64 light emitting diode elements 2a are one unit
32 light emitting diode elements 3a are arranged on the base plate 1 by linearly arranging 32 light emitting diode elements.

The base plate 1 on which the light emitting diode element array 2 is placed is
A support body 5 is attached to the upper surface between the two, and the support body 5 fixes the base plate 1 and the transparent cover member 4 and the lens 3 described later in parallel, and at the same time, the light emitting diode elements 2a of each light emitting diode element array 2 are fixed. This effectively prevents the light emitted by the element from leaking to the adjacent light emitting diode element array 2 side.

The support 5 is made of, for example, a liquid crystal polymer resin, and is formed into a predetermined shape by adopting a conventionally known injection molding method or the like.

A transparent cover member 4 is attached to the upper portion of the support 5, and a lens 3 is provided between the base plate 1 and the transparent cover member 4 for each light emitting diode element array 1 to 1. Arranged and fixed to correspond to.

The transparent cover member 4 has a function of protecting the lens 3 and fixing the lens 3 at a fixed position, and is made of an inorganic material such as quartz, soda glass or crystallized glass.

The lens 3 arranged and fixed between the transparent cover member 4 and the base plate 1 has a function of irradiating the photoconductor P with light emitted from each light emitting diode element 2a, such as acrylic resin or polycarbonate resin. A lens formed of the transparent resin or transparent inorganic material such as glass is preferably used.

To fix the lens 3, first, the reference surface 3a is formed on the outer peripheral portion of the upper surface of the lens 3 and the projection 5a is formed on the support 5, and then the upper surface of the projection 5a formed on the support 5 is fixed. The lens 3 is inserted between it and the lower surface of the transparent cover member so that the reference surface 3a provided on the lens 3 faces the transparent cover member 4, and then the lens 3 is made of an elastic material such as rubber or plastic. It is performed by pressing the transparent cover member 4 side with the material 6. In this case, the transparent cover member 4
Is composed of an inorganic substance, and has a hardness of Vickers hardness (Hv) H
Hardness of v ≧ 2.8 (GPa) and excellent flat workability, and flatness of 5
Since each lens 3 can be made flat and the reference surface 3a provided on the outer peripheral surface of each lens 3 is in contact with the transparent cover member 4, the fixing position of each lens 3 is the same. As a result, the light emitted from the light emitting diode element 2a of each light emitting diode element array 2 is a lens.
The image is well radiated and imaged on the surface of photoconductor P via
It is possible to form a clear and accurate latent image.

At the same time, the lens 3 is abutted and fixed to the transparent cover member 4 by being pressed by a spring member 6 made of an elastic material such as rubber or plastic.
Fixing 3 can be done easily and in a short time, and the productivity of the imaging device will be extremely excellent.

Further, since the lens 3 is protected by the transparent cover member 4 made of an inorganic material such as quartz or soda glass, the lens 3 is not scratched by the application of an external force, and is made of an inorganic material such as quartz or soda glass. Transparent cover member
The hardness of 4 is Vickers hardness (Hv) and Hv ≧ 2.8.
Since it is hard (GPa), it is scarcely scratched even when an external force is applied to the transparent cover member 4, and as a result, the light emitted from the light emitting diode element 2a is accurately applied to the P surface of the photoconductor through the lens 3. An image can be formed and a latent image with high image quality can be formed on the photoconductor P.

Thus, according to the image device of the present invention, a predetermined electric power is applied to each light emitting diode element 2a of the light emitting diode element array 2 to cause each light emitting diode element 2a to individually and selectively emit light, and each light emitting diode The light emitted by the element 2a is imaged on the surface of the external photoconductor P 1 via the lens 3 and a predetermined latent image is formed on the photoconductor P 1 to function as an image forming apparatus.

Since the base plate 1 on which the light emitting diode element array 2 is mounted is made of a highly rigid material such as an aluminum oxide sintered body, when it is used as an image forming apparatus, an external force or heat is applied to the base plate 1. Even if stress is applied, the base plate 1 is not deformed, such as warped or twisted.As a result, each light-emitting diode element array 2 mounted on the base plate 1 is always lens-shaped.
3 can face exactly, the light emitting diode element
The light emitted from 2a can be accurately irradiated and imaged on the surface of the photoconductor P via the lens 3, and a latent image with high image quality can be formed on the photoconductor P.

The present invention is not limited to the above-described embodiments, but various modifications can be made without departing from the scope of the present invention. For example, in the above-described embodiments, the optical printer head or the like can be changed. The case where the light emitting diode element array is used in the image forming apparatus has been described as an example, but the light emitting diode element array may be used in an image reading device such as an image sensor instead of the solid-state imaging element array. In this case, the solid-state image sensor array and the lens are aligned extremely accurately, and as a result, the external image information is accurately formed on the solid-state image sensor array through the lens, and the solid-state image sensor array corresponds to the external image information. It becomes possible to generate an accurate electric signal.

[0033]

According to the image device of the present invention, the reference surface is provided on the outer peripheral portion of the lens and the reference surface has a flatness of 5
Since all of the lenses have fixed positions at all times because they are brought into contact with a transparent cover member made of an inorganic material that can be made to have a size of less than or equal to μm, as a result, when used as an image forming apparatus, they are clear on the photoreceptor and An accurate latent image can be formed, and when used as an image reading device, an accurate electric signal corresponding to external image information can be generated in the solid-state image sensor array.

Further, according to the image device of the present invention, the lens is fixed by pressing the reference surface provided on the outer peripheral portion of the lens against the transparent cover member, for example, with a spring material to bring it into contact therewith. The fixing time of the lens becomes extremely short, and the productivity of the image device becomes extremely excellent.

Further, according to the image device of the present invention, the lens is protected by the transparent cover member, and the transparent cover member is formed of an inorganic material having a Vickers hardness (Hv) of Hv ≧ 2.8 (GPa). Therefore, the lens and the transparent cover member are scarcely scratched, and as a result, when this is used as an image forming apparatus, the light emitted from the light emitting diode element is accurately irradiated onto the photoconductor surface through the lens, A latent image with high image quality can be formed on the photoconductor, and when used as an image reading device, external image information is accurately formed on the solid-state image sensor array via the lens,
An accurate electric signal corresponding to external image information can be generated in the solid-state image sensor array.

Further, according to the image device of the present invention, if the base plate on which the image element array is mounted is made of a highly rigid material, the base plate is warped or twisted even if an external force or thermal stress is applied. Therefore, each image element array mounted on the base plate always accurately faces each lens, and when used as an image forming apparatus, it is clear and accurate on the photoconductor. A latent image can be formed, and when used as an image reading device, an accurate electric signal corresponding to external image information can be generated in the solid-state image sensor array.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment in which an image forming apparatus of the present invention is applied to an optical printer head as an image forming apparatus.

[Explanation of symbols]

 1 ... Base plate 2 ... Light emitting diode element array 2a ... Light emitting diode element 3 ... Lens 3a ... Reference surface 4 ... Transparent cover member 5 ... Support 5a ... Protrusions 6 ... Spring materials

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical display location G02B 7/00 H 7/02 A H01L 27/14 33/00 MH04N 1/028 Z 1/036 A

Claims (6)

[Claims] 1. A base plate, on which a large number of image element arrays are linearly arranged, and a transparent cover member made of an inorganic material are attached in parallel to a support, and a plurality of them are provided between the base plate and the transparent cover member. Lens is arranged so that each lens corresponds to each image element array in a one-to-one manner, and the reference surface provided on the outer peripheral portion of each lens is in contact with the transparent cover member. Image device. 2. The image device according to claim 1, wherein the flatness of the transparent cover member is 5 μm or less. 3. The image device according to claim 1, wherein the transparent cover member has a Vickers hardness (Hv) of Hv ≧ 2.8 (GPa). 4. The image device according to claim 1, wherein the transparent cover member is made of at least one of quartz, soda glass and crystallized glass. 5. The contact of the lens with the transparent cover member,
The image device according to claim 1, wherein the pressing is performed by a pressing force of a spring material arranged between the support and the lens. 6. The imaging device according to claim 1, wherein the base plate is made of a highly rigid material.