JPH0722544U - Workpiece picking device for semiconductor molding - Google Patents

Abstract

(57) [Summary] [Purpose] In molding a semiconductor, the time required for cooling the work 10 taken out from the molding die is shortened. Bending and distortion of the resin that occur during the cooling of the work 10 are suppressed, and inadvertent gate breaks are eliminated. [Structure] The cull runner portion 12 of the work 10 taken out from the molding die by the take-out device body 20 is attached to the cooling body 3.
Contact 0. The cooling body 30 is made of a material having good thermal conductivity such as aluminum, and forcibly cools it by contact with the cal / runner portion 12.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a work take-out device for taking out a work after completion of molding from a molding die for molding a semiconductor.

[0002]

[Prior art]

 In the molding of semiconductors, a work that has been molded by a molding die is automatically taken out of the die by a take-out device. The shape of the work taken out from the mold will be described with reference to FIG.

The work 10 taken out from the mold usually has a shape in which a plurality of product parts 11 are interconnected by a cull runner part 12 with respect to the structure of the molding mold. The product portion 11 is, for example, a semiconductor element mounted on each leg 11b of the lead frame 11a and molded with a resin 11c. Further, the cull / runner portion 12 is specifically a cull 12a remaining in the resin injection portion of the molding die and a runner 12b remaining in the resin flow path extending outward from the resin injection portion.

In such a workpiece 10, unless the cal / runner portion 12 is sufficiently cooled, the product portion 11 and the cal / runner portion 12, which is called a gate break, cannot be separated well.

Therefore, the conventional work take-out device has a structure in which, after taking out the work 10 from the molding die, the work 10 is kept held until the cull runner portion 12 is sufficiently cooled and solidified. There is. Alternatively, the work 10 taken out from the mold is temporarily placed on a work table before being conveyed to the gate break process, and the cull runner portion 12 is naturally cooled here.

[0006]

However, in any case, since the work is naturally cooled, the time required for cooling becomes long and the efficiency of the molding operation is reduced. Further, since the molded resin is gradually cooled, the resin may be bent or distorted during cooling, and the product part and the cal / runner part may be inadvertently separated. The defect rate becomes higher in the product section separated due to bending and distortion.

In order to solve these problems, an object of the present invention is to provide a work take-out device that rapidly cools a work taken out from a molding die in a short time.

[0008]

[Means for Solving the Problems]

 The work take-out device of the present invention is formed in a shape corresponding to the cull runner part so that the cull runner part connected to the product part of the work taken out from the molding die for molding the semiconductor comes into contact. Further, it comprises a cooling body having a good thermal conductivity, and a take-out device main body for taking out the finished work from the forming die and for bringing the cull runner portion of the work into contact with the cooling body.

[0009]

[Action]

 Since the cul-runner part of the work taken out from the molding die is brought into contact with the cooling body, the cul-runner part is forcibly subjected to sufficient cooling in a short time.

[0010]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a front view showing a schematic structure of an example of a work removing device embodying the present invention, and FIG. 3 is a perspective view showing a detailed structure of a cooling body.

The present work take-out device includes a take-out device body 20 for taking out the work 10 from the molding die, and a cooling body 30 arranged in the work carrying area of the take-out device body 20.

The take-out device main body 20 includes a flat frame 21, a work hand 22 that clamps the product part 11 of the work 10 to hold the work 10 below the frame 21, and a work 10 held by the work hand 22. And a pressing mechanism 23 that presses the runner 12b of FIG. The pressing mechanism 23 is composed of a cylinder 23a mounted downward on the upper surface of the frame 21, and a pressing head 23b mounted on the tip of a piston rod extending downward from the cylinder 23a.

The cooling body 30 is made of, for example, a metal having good thermal conductivity such as aluminum, and has a configuration in which a contact cooling section 32 is provided in a box-shaped frame 31 which also functions as a heat dissipation plate. The contact cooling part 32 is formed in a shape corresponding to the cull runner part 12 of the work 10. In the case where the cull runner part 12 is shown in FIG. The cull cooling part 32a and the runner cooling part 32b extending forward and backward from both sides of the cull cooling part 32a.

The pressing head 23b of the pressing mechanism 23 in the take-out device 20 also has a shape corresponding to the shape of the runner 12b of the work 10, like the contact cooling section 32.

The take-out device main body 20 takes out the work 10 from the molding die and positions the work 10 directly above the cooling body 30. Then, the cull runner portion 12 of the work 10 makes the contact cooling portion 32 of the cooling body 30. The work 10 is lowered until it comes into contact with. When the cull runner portion 12 of the work 10 comes into contact with the contact cooling portion 32 of the cooling body 30, the pressing mechanism 23 presses the runner 12b of the work 10 downward. As a result, the cull runner portion 12 of the workpiece 10 comes into close contact with the contact cooling portion 32 of the cooling body 30, and the contact cooling portion 32 forcibly removes heat. As a result, the time required to cool the work 10 is shortened. Further, since the cull runner portion 12 of the workpiece 10 is rapidly cooled and the cull runner portion 12 being cooled is supported by the contact cooling portion 32 of the cooling body 30, the bend and distortion of the cull runner portion 12 are caused. Is prevented, and careless separation of the product portion 11 and the cal runner portion 12 due to bending or distortion is prevented.

When the cull runner portion 12 of the work 10 is sufficiently cooled, the work 10 is lifted by the take-out device main body 20 and the pressing head 23b of the pressing mechanism 23 is further lowered. As a result, the cal / runner portion 12 is separated and removed from the product portion 11 of the work 10. This step is called gate break as described above.

In the above embodiment, the pressing mechanism 23, 23 used for the gate break of the work 10 is used to press the cull runner portion 12 of the work 10 against the cooling body 30, but the take-out device main body having no pressing mechanism. Then, the descent operation may be used to press the cull runner portion 12 against the cooling body 30.

[0018]

[Effect of device]

 As explained above, the work picking device of the present invention promotes the cooling of the cull runner part by bringing the cull runner part of the work taken out from the molding die into contact with the cooling body to forcibly cool it. Therefore, the time required for the cooling can be shortened and the efficiency of the molding operation can be improved. Moreover, in addition to promoting the cooling, since the cooling cull runner portion is supported by the cooling body, the bending and distortion of the cull runner portion can be prevented. Therefore, unnecessary gate breaks due to bending and distortion are prevented, and there is also an effect that the product defect rate is reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor molded product.

FIG. 2 is a front view showing a schematic configuration of an example of a work picking device embodying the present invention.

FIG. 3 is a perspective view showing a detailed structure of a cooling body.

[Explanation of symbols]

 10 Work (Semiconductor Molded Product) 11 Product Section 12 Cull Runner Section 20 Extractor Main Body 30 Cooling Body

Claims (1)

[Scope of utility model registration request] 1. A thermal conductivity formed in a shape corresponding to a cal runner portion so that a cal runner portion connected to a product portion of a work taken out from a molding die for molding a semiconductor comes into contact with the workpiece. And a take-out apparatus main body for taking out a work after finishing the molding from the molding die and for bringing a Cull runner portion of the work into contact with the cooling body. Mold work removal device.