JPH0722476U - Contact pin - Google Patents

Abstract

(57) [Abstract] [Purpose] Even when used in a high temperature environment, the mechanical strength of the soldered part is suppressed from deterioration due to vibration and shock, and the reliability is improved without causing thermal fatigue damage to the soldered part. To provide a contact pin that can be connected to a wiring board. The contact pin 12 includes a terminal portion 13 protruding from the housing 11 and soldered to the wiring board 2, and the terminal portion 13 is provided with a plurality of heat radiation fins 13c and 13d.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a contact pin for an electric component to be soldered to a wiring board, and particularly to a contact pin suitable for use under high temperature environmental conditions.

[0002]

[Prior art]

 Conventionally, a connector shown in FIG. 5 is known as an electric component provided with this type of contact pin. The connector 1 includes a housing 11 and a plurality of contact pins 12 arranged in the housing 11.

The housing 11 is formed of a synthetic resin material into a substantially rectangular parallelepiped shape, and a front surface thereof is provided with a fitting recess (not shown) for receiving a mating connector. The contact pin 12 is made of a conductive material, and has a contact portion (not shown) located in the fitting recess of the housing 11 and connected to the mating connector on one end side. On the other end side, a terminal portion 13 is provided which extends from the rear surface of the housing 11 and is soldered to the wiring board. The terminal portion 13 is a horizontal portion 13a extending horizontally from the rear surface of the housing 11, and a vertical portion 13b bent downward at a right angle from the tip of the horizontal portion 13a and protruding downward from the bottom surface of the housing 11. Become .

FIG. 6 is a partial cross-sectional view showing a state in which the above-described connector 1 is mounted on the wiring board 2. When fixing the connector 1 to the wiring board 2, after inserting the vertical portions 13b of the contact pins 12 arranged in the connector 1 into the through holes 2a formed in the wiring board 2 as shown in FIG. By soldering the vertical portion 13b protruding from the back surface side of the wiring board 2, the soldering portion 2b is formed between the wiring board 2 and the vertical portion 13b, and the connector 1 is electrically and mechanically connected to the wiring board 2. It is fixed.

[0005]

[Problems to be solved by the device]

 By the way, in the connector 1 in which the contact pins 12 are arranged as described above, if the environmental temperature rises and the heat of the connector cannot be sufficiently released to the outside, the heat is transmitted to the contact pins 12 to the soldering portion 2b. There is a risk that the temperature of the soldering portion 2b is raised and the mechanical strength characteristics of the soldering portion 2b are deteriorated. Therefore, when the soldering portion 2b is subjected to mechanical vibration or shock, or when it is used in an environment where the temperature changes repeatedly, the repeated stress due to the difference in thermal expansion coefficient between the housing 11 and the wiring board 2 causes soldering. By adding to the soldering portion 2b, a solder crack 2c may be generated in the soldering portion 2b as shown in FIG. Therefore, there is a possibility that the connection strength between the connector 1 and the wiring board 2 may be reduced, or in the worst case, electrical connection failure may occur, resulting in a lack of connection reliability. The present invention has been made to solve the above-mentioned drawbacks, and does not raise the temperature of the soldering part even when the connector is used in a high temperature environment, and the connection with the wiring board is reliable. To provide a contact pin having an increased number.

[0006]

[Means for solving the problem]

 According to this invention, in a contact pin of an electric component having a terminal portion to be soldered to a wiring board, a radiation fin is provided on the terminal portion. In the contact pin configured as described above, the surface area of the terminal portion can be increased as compared with the contact pin of the conventional example by providing the heat radiation fin on the terminal portion. This increases the heat transfer coefficient that transfers the heat radiated from the terminal section to the surrounding air, thus suppressing the temperature rise of the soldering section that connects the terminal section and the wiring board and increasing the reliability of the wiring board. Contact pins to be connected can be provided.

[0007]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. In the figure, the same shape and purpose as those of the conventional example are designated by the same reference numerals, and detailed description thereof will be omitted. The difference between the present invention and the conventional example is that the vertical fins 13b of the contact pin 12 are integrally formed with heat radiating fins 13c and 13d which project symmetrically from both side surfaces in the left-right direction by press working.

When the contact pin 12 configured as described above is assembled in the housing 11 and soldered to the wiring board 2 as shown in FIG. 2, it flows through the terminal portion 13 of the contact pin 12 to the soldering portion 2b. The heat to be introduced is transmitted to the radiation fins 13c and 13d provided on the vertical portion 13b, and is radiated from the surfaces of the radiation fins 13c and 13d into the air.

As described above, according to the present invention, since the radiation fins 13c and 13d are provided on the vertical portion 13b of the terminal portion 13 of the contact pin 12, the total surface area of the vertical portion 13b of the terminal portion 13 is larger than that of the conventional example. can do. As a result, in the contact pin 12 of the present invention, the amount of heat radiated from the vertical portion 13b is increased, so that the heat transferred to the soldering portion 2b is reduced and the temperature rise of the soldering portion 2b can be suppressed to a low level. Therefore, deterioration of mechanical properties due to a temperature rise of the soldered portion 2b can be prevented, and a connection with the wiring board 2 with improved reliability can be performed.

Next, FIGS. 3A and 3B show a second embodiment of the present invention. That is, in FIG. 3A, two types of contact pins 12-1 and 12-2 in which the positions of the heat radiation fins 13c and 13d are different in the vertical direction of the vertical portion 13b are alternately arranged in the housing 11. Further, in FIG. 3B, the contact pin 12-3 in which the radiating fin 13c protruding from the right side surface of the vertical portion 13b and the radiating fin 13d protruding from the left side surface are displaced from each other in the vertical direction of the vertical portion 13b and protruded from each other. Are arranged in the housing 11.

In the connector configured as described above, the radiation fins 13c and 13d of the adjacent contact pins arranged in the housing 11 are opposed to each other because they project at positions displaced in the vertical direction of the vertical portion 13b. Therefore, the arrangement pitch of the contact pins can be narrowed and the connector can be miniaturized. Further, in the third embodiment shown in FIGS. 4A and 4B, the radiation fins 13c and 13d are provided so as to be inclined with respect to the side surface of the vertical portion 13b.

Although the radiation fins 13c and 13d are provided on the vertical portion 13b side in the above-described embodiment, they may be provided on the horizontal portion 13a side. Further, the contact pin 12 and the heat radiation fins 13c and 13d do not necessarily have to be integrally formed. After forming the heat radiation fins 13c and 13d separately from the contact pin 12, the contact pin 12 and the heat radiation fins 13c and 13d are formed. You may join and. Further, although the present invention has been described in the above embodiment in which the present invention is applied to the contact pins of the angle type, the present invention is not limited to this and can be applied to the contact pins of the straight type. In that case, a heat radiation fin is provided at the tip of the vertical portion of the contact pin, and a cutout is formed in the periphery of the through hole of the wiring board to insert the heat radiation fin, and the heat radiation fin should be located on the back side of the wiring board. It is also possible to change the design.

[0013]

[Effect of device]

 As described above, in the present invention, the heat radiating fins are provided on the side surface of the terminal portion of the contact pin, so that the heat transmitted through the terminal portion is effectively radiated to the atmosphere. As a result, in the present invention, the heat transferred from the terminal part to the soldering part can be reduced, so that even when used in a high temperature environment, the mechanical strength of the soldering part against deterioration due to vibration and shock can be suppressed, and It is possible to provide a contact pin capable of highly reliable connection to a wiring board of a connector without fear of causing thermal fatigue damage to a soldered portion.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a partially sectional side view showing a mounting state of the present invention.

3 (a) and 3 (b) are side views showing a second embodiment of the present invention.

4A and 4B are plan views showing a third embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional example.

FIG. 6 is a side view with a partial cross section showing a mounting state of a conventional example.

FIG. 7 is an enlarged view of an essential part showing a mounting state of the contact pin and the wiring board shown in FIG.

[Explanation of symbols]

 11 housing 12 contact pin 13 terminal portion 13c, 13d heat radiation fin

Claims (1)

[Scope of utility model registration request] 1. A contact pin of an electric component having a terminal portion to be soldered to a wiring board, characterized in that a radiating fin is provided on the terminal portion.