JPH07224074A - Organosilicon compound - Google Patents

Abstract

PURPOSE:To obtain a new compound having photocurability and moisture curability, useful as a raw material for the potting agents, sealers or coatings for electrical/electronic parts. CONSTITUTION:The objective compound of formula I [R<1> is a 1-3C alkyl or allyl; R<2> is of formula II or III (R<3> is a 2-3C alkylene); m is 1-5; n is 0 or 1], e.g. a compound of formula IV. The compound of formula I can be obtained by reaction between a hydroxyl-terminated vinyl ether of formula CH2=CH- O-(CH2)m-OH and an epoxy group-terminated silane of formula V (R<3> is a 1-3C alkyl or allyl).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel organosilicon compound, and more particularly to a potting agent, sealing agent for electric and electronic parts,
The present invention relates to an organosilicon compound useful as a raw material for coating agents and the like.

[0002]

2. Description of the Related Art Conventionally, various silicones have been widely used in the fields of electricity and electronics, and various organic silicon compound intermediates have been developed according to their respective applications. Recently, a silicone composition having double-curing properties, such as moisture-curing the shaded areas where light does not reach after curing by photopolymerization, has been proposed, but it is said that those having sufficient performance are still being developed. hard. An object of the present invention is to provide a novel organosilicon compound which can impart characteristics such as excellent double curing performance.

[0003]

The organosilicon compound of the present invention has the general formula

[0004]

[Chemical 4]

However, R ¹ is an alkyl group having 1 to 3 carbon atoms or an allyl group, and R ² is

[0006]

[Chemical 5]

Or

[0008]

[Chemical 6]

Wherein R ³ is an alkylene group having 2 or 3 carbon atoms, m is an integer of 1 to 5, and n is an integer of 1 to 3.

Examples of specific compounds are as follows.

[0011]

[Chemical 7]

The organosilicon compound of the present invention has the general formula

[0013]

[Chemical 8]

A terminal hydroxy vinyl ether represented by

[0015]

[Chemical 9]

However, R ³ is easily produced by reacting with a terminal epoxide group-containing silane represented by R ³ is an alkyl group or an allyl group having 1 to ³ carbon atoms.

This reaction is carried out by contacting the above components in a stream of an inert gas such as nitrogen gas at a temperature near room temperature, preferably in the presence of an organometallic compound-based condensation reaction catalyst such as titanium isopropoxide or dibrutyl tin dilaurate. It progresses easily.

The organosilicon compound of the present invention is a novel compound that has not been published in the literature and can be used for various purposes. For example, a vinyl ether group and an epoxy group as a terminal group have a cationic photopolymerization property, and since they have an alkoxy group on the other end group, because they have a double curing property of photopolymerization and polycondensation, It is possible to have sufficient curing performance even in a shaded area where light does not reach. Further, by reacting the epoxy group of the terminal group with another monomer or oligomer having an amino group at the terminal, a vinyl ether group can be easily introduced into the same monomer or oligomer, whereby a photopolymerizable silicone can be easily obtained. .

Further, by using a compound having two or more alkoxysilyl groups among the organosilicon compounds of the present invention, both functions of photocationic polymerization and condensation polymerization by moisture can be imparted to the monomer and oligomer.

In addition, it is possible to easily synthesize a siloxane polymer having an epoxy group at the terminal by hydrosilation reaction with an organosiloxane polymer having a terminal hydrogen group and a catalyst such as platinum. It is useful as a raw material for sealing agents, coating agents and the like. As described above, various curable resins can be produced by using the organosilicon compound of the present invention, and these are particularly useful as potting agents, sealing agents, coating agents for electric and electronic parts, and as additives to them. It is useful.

[0021]

EXAMPLES The present invention will now be described with reference to examples. Example-1 Hydroxybutyl vinyl ether (GAF CHEMI
CALS CORPORATION, RAPI-CUR
E HBVE MONOMER) 116 grams, β-
(3,4-epoxycyclohexyl) ethyltrimethoxysilane (A-1 manufactured by UNION CARBIDE)
86) 248.8 g was put into the reactor, the inside of the reactor was replaced with nitrogen gas, and 0.075 g of dibutyltin dilaurate was slowly added dropwise while stirring. After dropping
Further, stirring was continued under reduced pressure to adjust the reaction liquid temperature to 80 ° C., and the reaction was terminated after 6 hours. Next, after the reaction is completed, FT-IR analysis of this product is performed to obtain the target substance.

[0022]

[Chemical 10]

It was confirmed that (See FIG. 1) In addition, in order to confirm the photo-curing performance of vinyl ether group and epoxy group, 50 g of the product (4) was added with an allylphenyl-iodium-hexafluoroantimonate salt (GE company) as a photocationic polymerization initiator. Made, UV-93
0.5 g of 10C) was added and mixed with stirring. Next, this composition was applied on an iron plate having a width of 50 mm, a length of 50 mm and a thickness of 1 mm to a thickness of about 0.1-0.5 mm, and 100
When it was irradiated with ultraviolet rays for 30 seconds from a high-pressure mercury lamp with an illuminance of mw / cm ² , it cured into a film.

Example-2 Hydroxybutyl vinyl ether (GAF CHEMI
CALS CORPORATION, RAPI-CUR
E HBVE MONOMER) 116 grams, γ-
Glycidoxypropyltrimethoxysilane (UNION
246.4 g of A-187) manufactured by CARBIDE was placed in the reactor, the inside of the reactor was replaced with nitrogen gas, and 0.075 g of dibutyltin dilaurate was slowly added dropwise while stirring. After the dropping, stirring was further continued under reduced pressure to adjust the reaction liquid temperature to 80 ° C., and the reaction was terminated after 6 hours. Next, after the reaction is completed, FT-IR analysis of this product is performed to obtain the target substance.

[0025]

[Chemical 11]

It was confirmed that (See FIG. 2) In addition, in order to confirm the photo-curing performance of vinyl ether group and epoxy group, 50 g of the product (4) was used as a photo-cationic polymerization initiator for allylphenyl-iodium-hexafluoroantimonate salt (GE company). Made, UV-93
0.5 g of 10C) was added and mixed with stirring. Next, this composition was applied on an iron plate having a width of 50 mm, a length of 50 mm and a thickness of 1 mm to a thickness of about 0.1-0.5 mm, and 100
When it was irradiated with ultraviolet rays for 30 seconds from a high-pressure mercury lamp with an illuminance of mw / cm ² , it cured into a film.

[Brief description of drawings]

FIG. 1 is an infrared absorption spectrum diagram of the product of Example 1.

FIG. 2 is an infrared absorption spectrum diagram of the product of Example 2.

Claims (1)

[Claims] 1. A general formula: However, R ¹ is an alkyl group having 1 to 3 carbon atoms or an allyl group, and R ² is Or And R ³ is an alkylene group having 2 or 3 carbon atoms,
m is an integer of 1 to 5 and n is 0 or 1;