JPH0722369A - Chemical mixing device for substrate treating apparatus - Google Patents

Abstract

PURPOSE:To provide a chemical mixing equipment which is simple in structure but capable of stably feeding chemicals independent of the influence of adventitious factors. CONSTITUTION:A chemical mixing equipment is a device which supplies chemicals and pure water to a substrate cleaning tank 12 of a substrate treating apparatus mixing them together. The equipment is equipped with a pure water feed pipe 18, a chemical storing vessel 22A, a chemical feed pipe 40, and a nitrogen gas piping 39 provided with a corrosion-resistant regulator 34. The pure water feed pipe 18 in which pure water flows is connected to a substrate cleaning tank 12. The chemical storing vessel 22A is a hermetically closed vessel. Chemical introducing valves 20A to 20D, are provided to the tip of the chemical feed pipe 40 to introduce chemicals to the pure water feed pipe 18 from the chemical storing vessel 22A. The nitrogen gas piping 39 is used for forcibly feeding chemicals to the chemical feed pipe 40 from the chemical storing vessel 22A, so that the chemical storing vessel 22A, is pressurized by nitrogen gas of certain pressure controlled by the corrosion-resistant regulator 34.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to a chemical liquid mixing apparatus for a substrate processing apparatus, which mixes and supplies a chemical solution and pure water to a substrate processing tank of the substrate processing apparatus.

[0002]

2. Description of the Related Art When surface-treating a thin substrate to be treated (hereinafter, simply referred to as a substrate) such as a semiconductor substrate or a glass substrate for liquid crystal, the substrate is immersed in a treatment tank for treatment. A substrate processing apparatus is generally used. An example of this type of conventional device is the device disclosed in Japanese Utility Model Laid-Open No. 4-99269.

This apparatus is composed of a substrate processing bath for performing a surface treatment of a substrate and a processing liquid supply section for supplying a processing liquid into the substrate processing bath. The treatment liquid supply unit is provided with a treatment liquid supply pipe and a chemical liquid storage container, and a chemical liquid introduction valve is provided between the treatment liquid supply pipe and the chemical liquid storage container. Further, a pump is provided so as to introduce a certain amount of the chemical liquid upstream of the chemical liquid introduction valve. By pumping the chemical liquid by this pump and circulating the chemical liquid upstream of the chemical liquid introduction valve, a desired amount of the chemical liquid can be immediately introduced into the treatment liquid supply pipe when the chemical liquid introduction valve is opened. Therefore, the chemical solution having the desired concentration can be immediately supplied into the substrate processing bath.

[0004]

SUMMARY OF THE INVENTION In the above conventional configuration,
In order to pump the chemical liquid, a plurality of pumps for pressure feeding are required corresponding to each chemical liquid storage container. Generally, the substrate processing apparatus is installed in a clean room, but if a plurality of pumps for pressure feeding are provided in the substrate processing apparatus, a large space is required and the substrate processing apparatus must be made large. Also,
Since the pump has a movable part, there is a possibility that the substrate processing chemical may be contaminated by dust generation.

In order to suppress these two factors, the present applicant has already proposed a chemical liquid mixing device using an aspirator. This chemical liquid mixing device includes a pure water supply passage, an aspirator portion arranged in the pure water supply passage to form a decompression space by the flow of pure water, and a chemical liquid supply passage through which one end is opened to the aspirator portion and the chemical liquid passes through. And a liquid medicine introducing valve arranged at the opening of the aspirator of the liquid medicine supply passage.
In this chemical liquid mixing apparatus, pure water is supplied to the substrate processing apparatus via the pure water supply passage. By supplying this pure water, a depressurized space is formed in the aspirator portion. Since this depressurized space is connected to the chemical liquid supply passage, when the chemical liquid introduction valve is opened, the chemical liquid corresponding to the flow rate of pure water is sucked into the depressurized space.

However, when the aspirator is used, the amount of the introduced chemical solution is easily affected by external factors such as piping conditions for the chemical solution or pure water and pressure fluctuations of the chemical solution or pure water. Further, since the aspirator structure is formed, the structure of that portion becomes complicated. An object of the present invention is to stably supply a chemical solution with a simple structure without being affected by external factors while suppressing chemical solution contamination due to dust generation.

[0007]

A chemical mixing apparatus according to the present invention is an apparatus for mixing and supplying a chemical solution and pure water to a substrate processing tank of a substrate processing apparatus, which comprises a liquid supply path and a pressure-proof sealed tank. It is provided with a chemical liquid carrier and a pressurizing means. The liquid supply path is connected to the substrate processing tank and allows pure water to pass therethrough. The pressure-resistant closed tank stores the chemical solution. The chemical liquid transfer section has a chemical liquid transfer path for guiding the chemical liquid from the pressure tight sealed tank to the liquid supply path, and a chemical liquid introduction valve provided in the chemical liquid transfer path. The pressurizing means pressurizes the inside of the pressure-resistant sealed tank in order to pump the chemical solution from the pressure-resistant sealed tank to the chemical liquid transport path.

[0008]

In the chemical liquid mixing apparatus according to the present invention, pure water is introduced into the substrate processing bath through the liquid supply passage. Further, the chemical solution stored in the pressure-resistant closed tank is supplied to the solution supply path via the chemical solution transport path and the chemical solution introduction valve. The pressure feeding of the chemical liquid is performed by the pressurizing means pressurizing the inside of the pressure-resistant closed tank.

Here, since the chemical solution is supplied to the liquid supply path by pressurization of the pressure-resistant closed tank, the introduction amount of the chemical solution can be determined without depending on the supply amount of pure water. Therefore, the chemical liquid can be stably supplied with a simple structure without being affected by fluctuations in external factors. Further, since a pump is not required, it is possible to suppress chemical solution contamination due to dust generation.

[0010]

1 and 2, an immersion type substrate cleaning apparatus 1 adopting an embodiment of the present invention is a loading / unloading section 2 for a carrier C containing a large number of substrates and a substrate W from the carrier C. A substrate transfer section 3 for taking out the wafer or loading the substrate W on the carrier C, a carrier cleaning unit 3a for cleaning the carrier C, a loading / unloading section 2, a substrate transfer section 3, and a carrier cleaning unit 3a. A carrier transfer robot 4 for transferring the carrier C between them, an immersion type substrate cleaning processing unit 5 for cleaning a plurality of substrates at a time, a substrate drying unit 6 for draining and drying the substrates, The substrate transfer unit 3 is configured to include a substrate transfer robot 7 that collectively holds a plurality of substrates taken out from the carrier C and transfers the substrates to the substrate cleaning processing unit 5 and the substrate drying unit 6.

The substrate transfer section 3 has two rotatable tables 8 on which the carrier C is placed. Table 8 is
The carrier C is rotated 90 ° if necessary. A rectangular opening is formed in the center of the table 8. Below this opening, the substrates W can be collectively taken out from the carrier C and can be moved up and down so that the carriers C can be collectively loaded. The substrate receiving portion 8a is arranged.

The carrier transfer robot 4 is vertically movable and rotatable, and is movable in the direction of arrow A in FIG. The carrier transfer robot 4 transfers the carrier C carried into the carry-in / carry-out section 2 onto the table 8 and takes the carrier C in and out between the carrier cleaning device 3a and the table 8 during substrate cleaning, and The carrier C containing the cleaned substrate W is transferred from the table 8 to the loading / unloading section 2.

The substrate transfer robot 7 is movable in the direction of arrow B in the moving unit 10 and has a substrate holding arm 9 for holding a plurality of substrates W received from the substrate receiving unit 8a of the substrate transfer unit 3. ing. The robot 7 sequentially conveys the plurality of substrates W held by the substrate holding arm 9 along the moving unit 10 to the substrate cleaning processing unit 5 and the substrate drying unit 6. The substrate cleaning processing unit 5 is of an overflow type and is provided with three substrate cleaning tanks 12 and a substrate holder 11 provided in the substrate cleaning tank 12 so as to be vertically movable. A plurality of substrates W received from the substrate transport robot 7 are held and dipped in each cleaning tank 12 by the substrate holder 11.

The substrate cleaning tank 12 is made of quartz glass,
It is formed in a substantially V shape in a side view and a substantially rectangular shape in a plan view. The inside of the substrate cleaning tank 12 is configured as an overflow tank capable of forming a uniform upward flow of the cleaning liquid to surface-treat the substrate W and quickly replace the cleaning liquid in each of a plurality of types of cleaning processing steps. It should be noted that the substrate cleaning tank 12 is not limited to being made of quartz glass. For example, when hydrofluoric acid or the like that wipes the quartz glass is used as the cleaning liquid, it may be made of a resin material such as tetrafluoroethylene resin. .

As shown in FIG. 3, the cleaning processing unit 5 includes a cleaning liquid supply unit 13 for supplying a plurality of kinds of cleaning liquid to each substrate cleaning tank 12 from below, and a cleaning liquid for discharging the cleaning liquid overflowing from each substrate cleaning tank 12. And a discharge unit 14. Around the substrate cleaning tank 12, an overflow liquid recovery unit 15 that constitutes the cleaning liquid discharge unit 14 is provided.
A drain pipe 16 is connected to the overflow liquid recovery unit 15, and a drain drain 17 is connected to the drain pipe 16. Here, the cleaning liquid overflowed in the overflow liquid recovery unit 15 is discharged to the drain drain 17 via the drain pipe 16.

The cleaning liquid supply unit 13 includes pure water supply pipes 18 connected to the lower portions of the respective substrate cleaning tanks 12. Into the pure water supply pipe 18, an introduction valve connecting pipe 19, a flow meter 26 and a control valve 27 are arranged in this order from the substrate cleaning tank 12 to the upstream side. Pure water D _W heated to room temperature or a predetermined temperature is supplied to the pure water supply pipe 18. The introduction valve connecting pipe 19 is provided with a pure water supply valve 23, a drainage valve 25, and a plurality of chemical liquid introduction valves 20 _{A to} 20 _{D in this} order from the upstream side (opposite side to the cleaning tank 12). Has been. Each chemical liquid introduction valve 2
0 _A The to 20 _D, (shown only for chemical introducing valve 20 _A) the chemical solution Q _A to Q _D chemical pumping unit 21 for supplying is connected to. The chemical liquid introduction valves 20 _{A to} 20 _D are selectively opened / closed to introduce a predetermined chemical liquid from the chemical liquid pressure-feeding section 21 into the pure water supply pipe 18.

Inside the introduction valve connecting pipe 19, as shown in FIG. 4, a linear fluid passage 24 is formed from the upstream end to the downstream (cleaning tank 12 side) end. A connection port 24a to which a pipe from the cleaning tank 12 is connected is formed at the downstream end, and the four chemical liquid introduction valves 20 are provided on the inner wall of the intermediate portion.
Secondary flow path _A to 20 _D are opened along the feed direction of the fluid. Further, chemical liquid inlets 20a to 20d (only 20d is shown) are formed on the side surface of the introduction valve connecting pipe 19, and pipes from the chemical liquid pressure feeding section 21 are connected to the chemical liquid inlets 20a to 20d. Further, the introduction valve connecting pipe 19
A pure water supply port 23a communicating with the fluid passage 24 is formed at the upstream end of the. A pure water supply pipe 18 is connected to the pure water supply port 23a. Pure water supply port 23a
A drainage port 25a communicating with the fluid passage 24 is formed adjacent to the downstream side of the. The drainage pipe 16 is connected to the drainage port 25a. The pure water supply port 23a and the drainage port 25a are opened and closed by the pure water supply valve 23 and the drainage valve 25, respectively.

Further, in the introduction valve connecting pipe 19, as shown in FIG. 5, a flow passage 30 connecting the secondary flow passage of the drainage valve 25 and the primary flow passage of the pure water supply valve 23 is formed. In this flow path 30, dead water in the pipe (liquid stays in the passage)
A drain valve 29 for preventing the above is arranged. Each chemical liquid pumping unit 21 has a chemical liquid storage container 22 _A (22 _{B to} 22 _D ) for storing one type of chemical liquid. Chemical reservoir container 22 _A (22 _B ~22 _D) is the container sealed, this container 22 _A, and the nitrogen gas pipe 39 and the chemical liquid supply pipe 40 is connected. The nitrogen gas pipe 39 is opened at the upper part of the container 22 _A , and the chemical liquid supply pipe 40 is connected to the container 2
It has reached near the bottom of 2 _A. Nitrogen gas is supplied to the chemical liquid storage container 22 _A from a nitrogen gas source 31 through a nitrogen gas pipe 39. Chemical liquid storage container 22 _A and nitrogen gas source 3
A nitrogen gas supply valve 32, a filter 33, and a corrosion-resistant regulator 34 for pressure adjustment are arranged in this order from the upstream side in the nitrogen gas pipe 39 between the first and the second parts. The reason why the corrosion resistant regulator 34 is used is that the corrosive chemical solution gas may flow back from the chemical solution storage container 22 _A.

Air whose pressure is adjusted is supplied from an electropneumatic regulator 35 to the pilot port of the corrosion resistant regulator 34. The electropneumatic regulator 35 is a valve that controls the air pressure by an electric signal, to which pressurized air is supplied from an air pressure source 36. Electropneumatic regulator 35
A programmable controller 37 is connected to the. The programmable controller 37 is supplied with a pressure signal from a pressure sensor 38 that detects the pressure in the chemical liquid supply pipe 40. The programmable controller 37 gives a feedback signal according to the detected pressure value to the electropneumatic regulator 35.

The chemical liquid supply pipe 40 is branched to the chemical liquid introduction valve 20 _A of each cleaning tank 12. A flow meter 41 and a filter 42 are arranged on the upstream side of the branch portion of the chemical liquid supply pipe 40. A stop valve 44 for pressurized drain is connected to the filter 42. The stop valve 44 is connected to the drain 17. Also the drug solution reservoir container 22 _A, control valve 43 of the relief is also connected.

Next, the control valve 27 of the cleaning liquid supply section 13 will be described. The control valve 27 is for controlling the pure water D _W at a constant flow rate and a constant pressure, and as shown in FIG.
A valve body 48 made of resin such as F, a valve cover 49 arranged on the valve body 48, a diaphragm 50 arranged between the valve body 48 and the valve cover 49, and a diaphragm 50.
And a valve element 51 that can move up and down in the valve body 48.

At the upper portion of the valve body 48, the discharge side (secondary side)
A hydraulic pressure introducing chamber 52 into which pure water of is introduced is formed.
Further, inside the valve body 48, the pure water flow path 5 through which pure water flows
3 is formed. The pure water channel 53 has an inlet 5 at the base end.
4 is formed, a valve passage 56 extending upward from the tip of the introduction passage 55, and a discharge passage 57 extending from the tip of the valve passage 56 to the right in FIG. Has been done. A valve seat 72 is formed in the valve body flow path 56. A discharge port 58 is formed at the tip of the discharge flow path 57. A communication hole 59 is formed between the discharge flow path 57 and the hydraulic pressure introduction chamber 52 to connect them.

An air chamber 60 is formed below the valve body flow path 56. In the air chamber 60, a piston 61 that can contact the valve body 51 is arranged so as to be vertically movable. The air chamber 60 is hermetically sealed by a cover 62. An air inlet 63 is formed in this cover 62.
Further, an air hole 65 communicating with an air introduction port 64 formed in a side portion of the valve body 48 is opened in an upper portion of the air chamber 60.

An air introducing chamber 66 is formed in the lower portion of the valve cover 49. The air introducing chamber 66 is airtightly separated from the hydraulic pressure introducing chamber 52 by the diaphragm 50. An air introduction port 67 communicates with the air introduction chamber 66. Further, a piston 68 that is vertically movable is arranged in the air introduction chamber 66. A large-diameter flange portion 69 is formed at the lower end of the piston 68.

The valve body 51 has a flange portion 70 with the flange portion 69 sandwiching the diaphragm 50 in the upper portion. As a result, the valve body 51 moves up and down in conjunction with the diaphragm 50. The diameter of the lower portion of the valve body 51 is larger than that of the upper portion. A tapered portion 71 is formed between the upper portion and the lower portion of the valve body 51. The taper portion 71 can be fitted into the valve seat 72 formed in the valve body flow passage 56 of the valve body 48 to shut off the introduction flow passage 35 and the discharge flow passage 37.
Note that the valve body 51 and the valve seat 72 may have any shape as long as they fit into each other.

The vertical position of the valve element 51 is determined by the pressure difference between the pressure of the air introduced into the air introduction chamber 66 and the pressure of the pure water on the secondary side introduced into the hydraulic pressure introduction chamber 52. Therefore, at the time of pressure adjustment, by introducing a desired pressure into the air introduction chamber 66, the pressure of the pure water flow passage 53 on the discharge flow passage 57 side becomes a constant pressure and the flow rate becomes a constant flow rate. Further, a small amount of pure water can be made to flow by introducing low pressure air into the air introducing chamber 66. Thereby, the water saving function can be realized. Further, by introducing high-pressure air from the air introduction port 63, the valve body 51 is pushed up and the pure water flow path 53 is shut off.

Next, the corrosion resistant regulator 34 will be described. As shown in FIG. 7, the corrosion resistance regulator 34 is
It mainly has a valve main body 81 made of resin such as DF, an upper cover 82 arranged above the valve main body 81, and a lower cover 83 arranged below the valve main body 81. A gas pressure introducing chamber 86 is formed in the upper portion of the valve body 81. Further, inside the valve body 81, a gas flow path 84 through which nitrogen gas flows is formed. The gas flow passage 84 includes an inlet-side flow passage 87 that is continuous with an inlet-side port 85 that opens to the left side surface of FIG.
A valve body flow passage 88 extending upward from the tip of the inlet side flow passage 87 toward the gas pressure introduction chamber 86, and a valve body flow passage 88 extending downward from the gas pressure introduction chamber 86, bent at 90 ° and opened to the right side surface of the valve body 81 in FIG. 7. And an outlet-side flow channel 89 that An outlet port 90 is formed at the tip of the outlet passage 89. Further, a gas pressure introducing chamber 86 is provided on the lower surface of the upper cover 82 in which a tapered valve seat 91 is formed in the middle of the valve body flow passage 88.
An air pressure introducing chamber 94 is formed opposite to. The air pressure introducing chamber 94 communicates with the pilot port 101 opening on the right side surface of the upper cover 82. The gas pressure introducing chamber 86 and the air pressure introducing chamber 94 are airtightly separated by a diaphragm 92 arranged between the valve body 81 and the upper cover 82. A piston 93 is integrally attached to the diaphragm 92, and the piston 93 is attached to the air pressure introducing chamber 9
It is possible to move up and down in 4. An exhaust port 95 is formed in the upper cover 82 above the piston 93.

At the lower part of the piston 93, a valve body 96 which can move up and down in the valve body flow passage 88 is arranged in contact. The valve body 96 has an enlarged diameter portion 102 in the middle, the diameter of which gradually increases as it goes downward, and the enlarged diameter portion 102 engages with the valve seat 91. A seal 97, whose upper part is extendable and whose lower part seals the valve body 81 and the lower cover 83, is fitted to the lower part of the valve body 96. A spring receiver 99 that moves up and down is fitted into the seal 97.

A spring chamber 98 is formed on the upper surface of the lower cover 83, and a spring 100 that abuts a spring receiver 99 is arranged in a compressed state inside the spring chamber 98. As a result,
The valve body 96 is constantly urged upward by a spring 100 via a spring receiver 99 and a seal 97. Therefore, the anticorrosion regulator 34 uses the biasing force of the spring 100 and the air chamber 94.
It moves up and down depending on the balance with the air pressure introduced into
Nitrogen gas at a pressure which is adjusted by the air pressure can be supplied to the chemical liquid reservoir container 22 _A.

Next, the operation of the above embodiment will be described. When the carrier C accommodating the substrate W is placed on the loading / unloading unit 2, the carrier transfer robot 4 receives it and places it on the substrate transfer unit 3. When the carrier C is transferred to the substrate transfer unit 3, the substrate receiving unit 8 a takes out the substrate W from the carrier C and transfers the substrate W to the substrate transfer robot 7.
The substrate transfer robot 7 transfers the substrate W to any one substrate cleaning tank 12 of the cleaning processing unit 5. When the cleaning process is completed, the immersed substrate W is carried to the next step by the substrate transfer robot 7.

In the cleaning step, the substrate cleaning tank 12
Is filled with the substrate cleaning liquid. The following operations are performed when the cleaning liquid is supplied to the substrate cleaning tank 12. Before starting the supply operation, the flow rate and pressure of pure water supplied by the control valve 27 are adjusted. Also, electro-pneumatic regulator 3
5, the air pressure from the air pressure source 36 is adjusted to a predetermined pressure, and the corrosion resistance regulator 34 is adjusted by the air pressure. Thereby, the gas supplied from the nitrogen gas source 31 is adjusted to a predetermined gas pressure.

In this state, the nitrogen supply valve 32 is opened,
The nitrogen gas pressure regulator is introduced into the drug solution reservoir container 22 in _A. When nitrogen gas is introduced into the chemical liquid storage container 22 _A ,
The pressure causes the chemical liquid in the container 22 _A to be introduced into the chemical liquid introduction valve 20 _A via the flow meter 41 and the filter 42. The pressure in the chemical liquid supply pipe 40 is detected by the pressure sensor 38. Here, when the pressure in the chemical liquid supply pipe 40 fluctuates due to the opening and closing of the adjacent valve of the other system, a deviation occurs between the pressure detected by the pressure sensor 38 and the target pressure.
The programmable controller 37 calculates this deviation,
A command voltage according to the deviation is output to the electropneumatic regulator 35. Then, the air having the pressure controlled by the electropneumatic regulator 35 is given to the corrosion resistant regulator 34 as the pilot pressure, the valve body 96 of the corrosion resistant regulator 34 moves up and down, and the nitrogen gas having the pressure corresponding to the pilot pressure is supplied to the container 22 _A.
Given to. As a result, the pressure of the nitrogen gas becomes constant regardless of fluctuations in external factors, a predetermined amount of liquid medicine from the container 22 _A is discharged.

Here, since the pure water is controlled by the control valve 27 to a constant amount and a constant pressure and the chemical liquid is controlled to a constant flow rate by the corrosion resistant regulator 34 and the electropneumatic regulator 35, the introduction pressure of the chemical liquid and the supply pressure of pure water are controlled. Even if it changes, the chemical solution and pure water can be mixed at a constant flow rate. Therefore, it is possible to obtain a chemical solution having a predetermined mixing ratio without being affected by fluctuations due to external factors.

In addition, the introduction valve connecting portion 19 is provided with a chemical liquid introduction valve and a discharge valve.
The liquid valve 25 and the pure water supply valve 23 are integrally arranged.
Therefore, the piping space becomes smaller. In addition, there are few piping materials
Piping cost is reduced because it is not necessary. Further maintainer
The maintenance cost is also reduced because the maintenance area is reduced.
It [Other Embodiments] As shown in FIG.
At the upstream end of the fluid passage 24, the drain port 25_aShape
May be done. Here, the chemical liquid introducing valve 20_AAnd drainage port
To 25 _aA pure water supply port 23a is formed between
It With this configuration, the liquid that remains in the fluid passage 24 during drainage
Will be even less.

[0035]

In the chemical liquid mixing device according to the present invention, the chemical liquid is pressure-fed through the chemical liquid conveying path by pressurizing the pressure-resistant sealed tank. Therefore, while suppressing chemical liquid contamination due to dust generation, the influence of fluctuations in external factors can be reduced. The chemical solution can be stably supplied without receiving it with a simple structure.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a substrate processing apparatus in which an embodiment of the present invention is adopted.

FIG. 2 is a schematic vertical sectional view thereof.

FIG. 3 is a piping circuit diagram of the processing liquid supply unit.

FIG. 4 is a vertical sectional view of an introduction valve connecting pipe.

FIG. 5 is a piping circuit diagram thereof.

FIG. 6 is a vertical sectional view of a control valve.

FIG. 7 is a vertical sectional view of a corrosion resistant regulator.

FIG. 8 is a view corresponding to FIG. 4 of another embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate cleaning device 12 Substrate cleaning tank 19 Introducing valve connecting pipe 20 _{A to} 20 _D Chemical solution introducing valve 22 _{A to} 22 _D Chemical solution storage container 31 Nitrogen gas source 34 Corrosion resistant regulator 35 Electro-pneumatic regulator 37 Programmable controller 38 Pressure sensor 39 Nitrogen gas piping 40 Chemical supply pipe

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junichi Yonemura 2426-1 Kuchinogawara, Mikami, Yasu-machi, Yasu-gun, Shiga Prefecture Dai-Nippon Screen Mfg. Co., Ltd., Yasu Works (72) Inventor Hiroyuki Araki Yasu-gun, Shiga Prefecture 2426-1 Kuchinogawara, Sansu, Yasu-machi Dainippon Screen Mfg. Co., Ltd. Inside the Yasu Plant (72) Inventor Fumihiro Ikeda 2426-1 Kuchinogawara, Sansu, Yasu-machi, Yasu-gun, Shiga Prefecture Dainippon Screen Mfg. Co., Ltd. Yasu Plant

Claims (1)

[Claims] 1. A chemical solution mixing device for a substrate processing apparatus, which mixes and supplies a chemical solution and pure water to a substrate processing tank of the substrate processing apparatus, the solution being connected to the substrate processing tank and passing the pure water. A supply passage, a pressure-resistant sealed tank for storing the chemical liquid, a chemical liquid transport section for guiding the chemical liquid from the pressure-resistant sealed tank to the liquid supply passage, and a chemical liquid transfer section having a chemical liquid introduction valve provided in the chemical liquid transport path. A chemical mixing device for a substrate processing apparatus, comprising: a pressurizing unit that pressurizes the inside of the pressure-resistant closed tank in order to pump the chemical liquid from the pressure-resistant closed tank to the chemical liquid transport path.