JPH07213504A - Rf coil for mr device - Google Patents

Rf coil for mr device

Info

Publication number
JPH07213504A
JPH07213504A JP6012848A JP1284894A JPH07213504A JP H07213504 A JPH07213504 A JP H07213504A JP 6012848 A JP6012848 A JP 6012848A JP 1284894 A JP1284894 A JP 1284894A JP H07213504 A JPH07213504 A JP H07213504A
Authority
JP
Japan
Prior art keywords
coil
capacitor
conductor
loops
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6012848A
Other languages
Japanese (ja)
Inventor
Kenji Sato
健志 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Healthcare Japan Corp
Original Assignee
GE Yokogawa Medical System Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Yokogawa Medical System Ltd filed Critical GE Yokogawa Medical System Ltd
Priority to JP6012848A priority Critical patent/JPH07213504A/en
Publication of JPH07213504A publication Critical patent/JPH07213504A/en
Pending legal-status Critical Current

Links

Landscapes

  • Magnetic Resonance Imaging Apparatus (AREA)

Abstract

PURPOSE:To provide an RF coil for an MR device, which can form a capacitor without requiring a chip capacitor of an electronic component, has small variations in respective electrical characteristics, and has stable characteristics. CONSTITUTION:An RF coil 10 for an MR device is characterized in that a capacitor is formed by putting a polyimide film 3 between continuous square copper foil loops 1, 2, and the capacitor and the copper foil loops 1, 2 compose a parallel resonance circuit.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、MR(Magnetic Re
sonance)装置用RF(Radio Frequency)コイルに関
し、さらに詳しくは、電子部品のチップコンデンサを必
要とせずにコンデンサを形成できると共に個々の電気的
特性のバラツキが小さく且つ特性の安定性が良いMR装
置用RFコイルに関する。
This invention relates to an MR (Magnetic Re
More specifically, the present invention relates to an RF (Radio Frequency) coil for a sonance device, and more specifically, for an MR device that can form a capacitor without the need for a chip capacitor of an electronic component, has small variations in individual electrical characteristics, and has stable characteristics. Regarding the RF coil.

【0002】[0002]

【従来の技術】MR装置用RFコイルは、MR装置にお
いて、励磁のための高周波磁場を被検体に送信したり、
あるいは前記被検体からのNMR信号を受信するための
高周波コイルである。
2. Description of the Related Art An RF coil for an MR device transmits a high frequency magnetic field for excitation to an object in the MR device,
Alternatively, it is a high frequency coil for receiving an NMR signal from the subject.

【0003】図6に、特開平5−293093号公報に
記載されている従来のMR装置用RFコイルを示す。こ
のMR装置用RFコイル50は、テフロン基材53の両
面に、金属の半ループ51,52を形成し、これら半ル
ープ51,52の一部を前記テフロン基材53を挟んで
対向させてコンデンサ54を形成し、半ループ51とコ
ンデンサ54と半ループ52の直列回路により、MR装
置用RFコイルを実現したものである。
FIG. 6 shows a conventional RF coil for an MR device disclosed in Japanese Patent Laid-Open No. 5-293093. This RF coil 50 for MR device has metal half loops 51 and 52 formed on both sides of a Teflon base material 53, and a part of these half loops 51 and 52 are opposed to each other with the Teflon base material 53 interposed therebetween to form a capacitor. 54, and an RF coil for an MR device is realized by a series circuit of a half loop 51, a capacitor 54 and a half loop 52.

【0004】[0004]

【発明が解決しようとする課題】上記従来のMR装置用
RFコイル50では、半ループ51,52の一部をテフ
ロン基材53を挟んで対向させてコンデンサ54を形成
するため、電子部品のチップコンデンサを必要としない
利点がある。しかし、MR装置用RFコイルの個々の電
気的特性のバラツキが大きい問題点がある。また、温度
係数等の特性の安定性が悪い問題点がある。そこで、こ
の発明の目的は、電子部品のチップコンデンサを必要と
せずにコンデンサを形成できると共に、個々の電気的特
性のバラツキが小さく且つ特性の安定性が良いMR装置
用RFコイルを提供することにある。
In the above-described conventional RF coil for MR device 50, a part of the half loops 51 and 52 are opposed to each other with the Teflon base material 53 sandwiched therebetween to form the capacitor 54. It has the advantage of not requiring a capacitor. However, there is a problem that variations in individual electrical characteristics of the RF coil for MR device are large. There is also a problem that the stability of characteristics such as temperature coefficient is poor. Therefore, an object of the present invention is to provide an RF coil for an MR device, which can form a capacitor without requiring a chip capacitor for an electronic component, has small variations in individual electric characteristics, and has good stability of characteristics. is there.

【0005】[0005]

【課題を解決するための手段】第1の観点では、この発
明は、コイルの働きをする導体部と、その導体部と一体
化されてコンデンサを形成する誘電体部とを設け、前記
導体部のインダクタンスと前記コンデンサとを電気的に
並列接続にしたことを特徴とするMR装置用RFコイル
を提供する。第2の観点では、この発明は、導体をルー
プ状に1周以上させて導体ループを形成し、その導体と
導体の間に誘電体層を挟んだことを特徴とするMR装置
用RFコイルを提供する。第3の観点では、この発明
は、上記構成のMR装置用RFコイルにおいて、導体ル
ープおよび誘電体層が可撓性を有することを特徴とする
MR装置用RFコイルを提供する。
According to a first aspect of the present invention, there is provided a conductor portion functioning as a coil, and a dielectric portion integrated with the conductor portion to form a capacitor. There is provided an RF coil for an MR device, wherein the inductance and the capacitor are electrically connected in parallel. In a second aspect, the present invention provides an RF coil for an MR device, characterized in that a conductor loop is formed by looping a conductor one or more times to form a conductor loop, and a dielectric layer is sandwiched between the conductors. provide. According to a third aspect, the present invention provides an RF coil for an MR device, characterized in that the conductor loop and the dielectric layer have flexibility in the RF coil for an MR device having the above configuration.

【0006】[0006]

【作用】上記第1の観点によるMR装置用RFコイルで
は、コイルの働きをする導体部と一体化されてコンデン
サを形成する誘電体部を設け、前記導体部のインダクタ
ンスと前記コンデンサとを電気的に並列接続して、MR
装置用RFコイルを実現する。また、上記第2の観点に
よるMR装置用RFコイルでは、導体をループ状に少な
くとも1周させて導体ループを形成する。そして、その
導体と導体の間に誘電体層を挟んで、コンデンサを形成
する。これにより、前記導体ループのインダクタンスと
前記コンデンサの並列回路が構成され、MR装置用RF
コイルが実現される。従って、電子部品のチップコンデ
ンサを必要としない利点がある。また、実際に製作した
ところ、個々の電気的特性のバラツキが小さく、所望の
電気的特性のものを好適に製作できた。また、温度係数
等の特性の安定性も良好であった。
In the RF coil for an MR device according to the first aspect, a dielectric portion that is integrated with a conductor portion that functions as a coil to form a capacitor is provided, and the inductance of the conductor portion and the capacitor are electrically connected. In parallel with the MR
Realize a device RF coil. Further, in the RF coil for an MR device according to the second aspect, the conductor is looped at least once to form a conductor loop. Then, a dielectric layer is sandwiched between the conductors to form a capacitor. As a result, a parallel circuit of the inductance of the conductor loop and the capacitor is formed, and the RF for the MR device is formed.
The coil is realized. Therefore, there is an advantage that a chip capacitor for electronic parts is not required. Further, when actually manufactured, variations in individual electric characteristics were small, and those having desired electric characteristics could be preferably manufactured. Further, the stability of characteristics such as temperature coefficient was also good.

【0007】上記第3の観点によるMR装置用RFコイ
ルでは、上記作用に加えて、導体ループおよび誘電体層
に可撓性を持たせる。これにより、被検体の湾曲した表
面への密着性を高めることが出来る。
In the RF coil for MR device according to the third aspect, the conductor loop and the dielectric layer are made to have flexibility in addition to the above-mentioned function. This can enhance the adhesion to the curved surface of the subject.

【0008】[0008]

【実施例】以下、図に示す実施例によりこの発明をさら
に詳細に説明する。なお、これによりこの発明が限定さ
れるものではない。
The present invention will be described in more detail with reference to the embodiments shown in the drawings. The present invention is not limited to this.

【0009】−第1実施例− 図1の(a)は、この発明の第1実施例のMR装置用R
Fコイル10の上面図である。また、図1の(b)は、
MR装置用RFコイル10を開いて見た斜視図である。
このMR装置用RFコイル10は、薄い銅箔で四角形状
のループ1,2を連続して形成し、その銅箔ループ1,
2の間にポリイミドフィルム(例えば東レデュポン社の
カプトンフィルム)3を挟んでコンデンサ4を形成して
いる。銅箔ループ1,2の厚さは0.1mm、幅は5m
m、1辺の長さは40mm×40mmである。銅箔ルー
プ1,2の辺は、ポリイミドフィルム3を挟んで対向し
ている。ポリイミドフィルム3の厚さは0.1mm、幅
は7mm、1辺の長さは42mm×42mmである。上
記銅箔ループ1,2およびポリイミドフィルム3のサイ
ズでは、銅箔ループ1,2のインダクタンスが数10m
Hとなり、形成されるコンデンサのキャパシタンスは数
10pF〜数100pFになり、MR装置の共鳴条件に
適合する。
First Embodiment FIG. 1A shows an R for MR device according to the first embodiment of the present invention.
3 is a top view of the F coil 10. FIG. In addition, FIG.
It is the perspective view which opened and looked at the RF coil 10 for MR apparatuses.
The RF coil 10 for the MR device is formed by continuously forming rectangular loops 1 and 2 with a thin copper foil.
A polyimide film (for example, Kapton film manufactured by Toray DuPont) 3 is sandwiched between 2 to form a capacitor 4. The copper foil loops 1 and 2 have a thickness of 0.1 mm and a width of 5 m.
m, the length of one side is 40 mm × 40 mm. The sides of the copper foil loops 1 and 2 face each other with the polyimide film 3 interposed therebetween. The polyimide film 3 has a thickness of 0.1 mm, a width of 7 mm, and a side length of 42 mm × 42 mm. With the sizes of the copper foil loops 1 and 2 and the polyimide film 3, the inductance of the copper foil loops 1 and 2 is several 10 m.
H, the capacitance of the formed capacitor becomes several tens of pF to several hundreds of pF, which meets the resonance condition of the MR device.

【0010】図1の(c)は、上記MR装置用RFコイ
ル10の等価回路図である。銅箔ループ1,2とコンデ
ンサ4の並列回路により、MR装置用RFコイルを実現
している。図2に示すように、信号の伝達は、バラン
(Balun)のような整合部を介して行う。
FIG. 1C is an equivalent circuit diagram of the RF coil 10 for the MR device. An RF coil for the MR device is realized by a parallel circuit of the copper foil loops 1 and 2 and the capacitor 4. As shown in FIG. 2, the signal is transmitted through a matching unit such as a balun.

【0011】上記MR装置用RFコイル10によれば、
銅箔ループ1,2をポリイミドフィルム3を挟んで対向
させてコンデンサ4を形成するため、電子部品のチップ
コンデンサを必要としない。また、実際に製作した場合
の個々の電気的特性のバラツキが小さく、温度係数等の
特性の安定性も良好である。また、銅箔ループ1,2の
形状やポリイミドフィルム3の厚さや材料を調整するこ
とで、容易に電気的特性を調整できる。
According to the RF coil 10 for the MR device,
Since the copper foil loops 1 and 2 are opposed to each other with the polyimide film 3 interposed therebetween to form the capacitor 4, the chip capacitor of the electronic component is not required. Further, variations in individual electrical characteristics when actually manufactured are small, and stability of characteristics such as temperature coefficient is good. In addition, the electrical characteristics can be easily adjusted by adjusting the shapes of the copper foil loops 1 and 2 and the thickness and material of the polyimide film 3.

【0012】また、可撓性(フレキシビリティ)が高い
ため、図3に示すように、被検体(患者)の身体Bに巻
き付けて、密着性を高くすることが出来る。さらに、図
4に示すように、湾曲させて内視鏡12内に収納するこ
とが出来る。この場合、内視鏡12自身の持つ可撓性を
損うことがないし、銅箔ループ1,2の1辺の長さを内
視鏡12の内径より大きくすることも出来る。また、内
視鏡12内での専有スペースを小さく出来るので、内視
鏡12の本来の機能として必要な照明用光ファイバL
F,観察用光ファイバSF,洗浄水チューブWT,吸出
チューブST,鉗子用ワイヤPKなどを内視鏡12内に
容易に収容できるようになる。なお、ポリイミドフィル
ムに代えて、テフロン材を用いてもよい。
Further, since it has high flexibility, it can be wound around the body B of the subject (patient) to enhance the adhesion, as shown in FIG. Further, as shown in FIG. 4, it can be curved and stored in the endoscope 12. In this case, the flexibility of the endoscope 12 itself is not impaired, and the length of one side of the copper foil loops 1 and 2 can be made larger than the inner diameter of the endoscope 12. In addition, since the space occupied by the endoscope 12 can be reduced, the optical fiber L for illumination necessary for the original function of the endoscope 12 is provided.
F, the observation optical fiber SF, the washing water tube WT, the suction tube ST, the forceps wire PK, etc. can be easily accommodated in the endoscope 12. A Teflon material may be used instead of the polyimide film.

【0013】−第2実施例− 図5は、この発明の第2実施例のMR装置用RFコイル
20を示す上面図である。このMR装置用RFコイル2
0は、フレキシブル・プリント基板13の両面に導体ル
ープパタン11,12を形成し、スルーホール21によ
って前記導体ループパタン11,12を接続し、連続し
たループを形成した構造である。導体ループパタン1
1,12の連続したループと、フレキシブル・プリント
基板13を挟んで対向する導体ループパタン11,12
によるコンデンサ14とによって、第1実施例と同じ並
列回路タイプのMR装置用RFコイルが実現されてい
る。このMR装置用RFコイル20によれば、フレキシ
ブル・プリント基板の製造プロセスを利用できるので、
同じ品質のMR装置用RFコイルを安価に量産できるよ
うになる。
-Second Embodiment- FIG. 5 is a top view showing an RF coil 20 for an MR device according to a second embodiment of the present invention. This RF coil for MR device 2
0 is a structure in which the conductor loop patterns 11 and 12 are formed on both surfaces of the flexible printed circuit board 13 and the conductor loop patterns 11 and 12 are connected by a through hole 21 to form a continuous loop. Conductor loop pattern 1
1 and 12 continuous loops and conductor loop patterns 11 and 12 facing each other with the flexible printed circuit board 13 in between.
With the capacitor 14 according to (1), the same parallel circuit type RF coil for MR device as that of the first embodiment is realized. According to the RF coil 20 for the MR device, since the manufacturing process of the flexible printed board can be utilized,
RF coils for MR devices of the same quality can be mass-produced at low cost.

【0014】−第3実施例− ドーナツ盤レコードの溝のように中心部が空間になった
渦巻状の導体のループを形成し、このループとループの
間に誘電体フィルムを挟んでコンデンサを形成し、その
コンデンサとループの並列回路により、MR装置用RF
コイルを実現しても良い。この場合、導体フィルムの打
ち抜きにより容易にループを製作できる。
-Third Embodiment- A spiral conductor loop having a space at the center like a groove of a donut record is formed, and a dielectric film is sandwiched between the loops to form a capacitor. The parallel circuit of the capacitor and the loop makes it possible to use the RF for MR device.
You may implement a coil. In this case, the loop can be easily manufactured by punching the conductor film.

【0015】[0015]

【発明の効果】この発明のMR装置用RFコイルによれ
ば、電子部品のチップコンデンサを必要とせずにコンデ
ンサを形成できる。また、個々の電気的特性のバラツキ
を小さく、且つ、特性の安定性を良くすることが出来
る。
According to the RF coil for MR device of the present invention, a capacitor can be formed without the need for a chip capacitor for electronic parts. Further, it is possible to reduce variations in individual electric characteristics and improve stability of characteristics.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の第1実施例のMR装置用RFコイル
の上面図と斜視図と回路図である。
FIG. 1 is a top view, a perspective view and a circuit diagram of an RF coil for an MR device according to a first embodiment of the present invention.

【図2】第1実施例のMR装置用RFコイルに対する信
号伝達の説明図である。
FIG. 2 is an explanatory diagram of signal transmission to the RF coil for the MR device of the first embodiment.

【図3】第1実施例のMR装置用RFコイルを湾曲させ
た状態の説明図である。
FIG. 3 is an explanatory view of a state where the RF coil for MR device of the first embodiment is curved.

【図4】第1実施例のMR装置用RFコイルを湾曲させ
て内視鏡に収容した状態の説明図である。
FIG. 4 is an explanatory diagram showing a state in which the RF coil for MR device of the first embodiment is curved and housed in an endoscope.

【図5】この発明の第2実施例のMR装置用RFコイル
の上面図である。
FIG. 5 is a top view of an RF coil for an MR device according to a second embodiment of the present invention.

【図6】従来のMR装置用RFコイルの一例を示す斜視
図および回路図である。
FIG. 6 is a perspective view and a circuit diagram showing an example of a conventional RF coil for an MR device.

【符号の説明】[Explanation of symbols]

10,20 MR装置用RFコイル 1,2,11,12 ループ 3 誘電体フィルム 4,14 コンデンサ 13 フレキシブル・プリント基板 10,20 RF coil for MR device 1,2,11,12 Loop 3 Dielectric film 4,14 Capacitor 13 Flexible printed circuit board

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 コイルの働きをする導体部と、その導体
部と一体化されてコンデンサを形成する誘電体部とを設
け、前記導体部のインダクタンスと前記コンデンサとを
電気的に並列接続にしたことを特徴とするMR装置用R
Fコイル。
1. A conductor part functioning as a coil and a dielectric part which is integrated with the conductor part to form a capacitor are provided, and the inductance of the conductor part and the capacitor are electrically connected in parallel. R for MR device characterized by
F coil.
【請求項2】 導体をループ状に1周以上させて導体ル
ープを形成し、その導体と導体の間に誘電体層を挟んだ
ことを特徴とするMR装置用RFコイル。
2. An RF coil for an MR device, comprising: forming a conductor loop by looping a conductor in one or more loops, and sandwiching a dielectric layer between the conductors.
【請求項3】 請求項2に記載のMR装置用RFコイル
において、導体ループおよび誘電体層が可撓性を有する
ことを特徴とするMR装置用RFコイル。
3. The RF coil for an MR device according to claim 2, wherein the conductor loop and the dielectric layer have flexibility.
JP6012848A 1994-02-04 1994-02-04 Rf coil for mr device Pending JPH07213504A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6012848A JPH07213504A (en) 1994-02-04 1994-02-04 Rf coil for mr device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6012848A JPH07213504A (en) 1994-02-04 1994-02-04 Rf coil for mr device

Publications (1)

Publication Number Publication Date
JPH07213504A true JPH07213504A (en) 1995-08-15

Family

ID=11816823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6012848A Pending JPH07213504A (en) 1994-02-04 1994-02-04 Rf coil for mr device

Country Status (1)

Country Link
JP (1) JPH07213504A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017219518A (en) * 2016-06-10 2017-12-14 株式会社デンソー ESR detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017219518A (en) * 2016-06-10 2017-12-14 株式会社デンソー ESR detector

Similar Documents

Publication Publication Date Title
ES2255241T3 (en) TABLE ANTENNA FOR RADIO DEVICE.
JPH11261325A (en) Coil element and its manufacture
JPH05183319A (en) Wrist mounting type receiver
JPH08180160A (en) Ic card
JPH07321550A (en) Antenna system
US6252487B1 (en) Planar magnetic component with transverse winding pattern
JP2002190417A (en) Choke coil
EP1280103A1 (en) Non-contact type IC card and flat coil used therein
EP0707354B1 (en) Antenna device
JPS62154607A (en) High frequency coil
US20030151485A1 (en) Surface mounted inductance element
KR20060108633A (en) Inductor coil for an ic chip
JPH07213504A (en) Rf coil for mr device
TW552597B (en) Magnetic component
JPH0773282A (en) High frequency circuit device
JPH04183102A (en) Antenna
JPH04245410A (en) Printed coil for double-tuned circuit use
JP3930918B2 (en) Dielectric multilayer substrate coil
US20040231137A1 (en) Method of manufacturing local coils using pre-tuned non-magnetic circuitry modules
JPH03270403A (en) Antenna circuit and compact portable radio equipment
JPS62142395A (en) Multi-function circuit board
JP3383930B2 (en) Thin film coil and thin film coil mounting module
JP2861961B2 (en) Printed wiring board with coil
KR100335610B1 (en) Open-type birdcage radio frequency coil for magnetic resonance imaging apparatus
JPH10145124A (en) Chip antenna