JPH07211409A - Connector surface mounting mechanism - Google Patents

Connector surface mounting mechanism

Info

Publication number
JPH07211409A
JPH07211409A JP6021856A JP2185694A JPH07211409A JP H07211409 A JPH07211409 A JP H07211409A JP 6021856 A JP6021856 A JP 6021856A JP 2185694 A JP2185694 A JP 2185694A JP H07211409 A JPH07211409 A JP H07211409A
Authority
JP
Japan
Prior art keywords
connector
board
lock
housing
cream solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6021856A
Other languages
Japanese (ja)
Inventor
Norio Sugiyama
典男 杉山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP6021856A priority Critical patent/JPH07211409A/en
Publication of JPH07211409A publication Critical patent/JPH07211409A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE:To push out cream solder and remove bias by holding up a connector terminal, and hooking the end of a board with the hook of a connector, and rotating the connector with this as a fulcrum, and setting the lock part on connector side in the locking hole on board side. CONSTITUTION:A board 13 is provided with a cut 17 for mounting a connector 2, and a locking hole 16 is formed between this and a conductive part 14. Here, the width d2 of the cut 17 is made the same as the width of the hook 6 of an insulating housing 5, and the width d1 of the locking hole 16 is also made same, whereby it is made equal to the width of the lock 7 of the housing 5. The connector 2 is provided with a housing 5 and a plurality of thin-plate-shaped terminals 3 projecting here, and at this tip, a junction part 4 contacting by face with each conductive part 14 of the board 13 is formed. To incorporate the connector 2, the cut 17 is hooked with a hook 6 while holding up the terminal 3, and the connector 3 is brought down to bring the lock part 7 close to locking hole 16, and the junction part 4 is brought close to a conductive part 14 where cream solder 15 is applied.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はコネクタ表面実装機構、
とりわけSMT(表面実装技術)対応のコネクタの実装
機構に関するものである。
BACKGROUND OF THE INVENTION The present invention relates to a connector surface mounting mechanism,
In particular, the present invention relates to a mounting mechanism of an SMT (surface mounting technology) compatible connector.

【0002】[0002]

【従来の技術】この種の表面実装型コネクタとしては、
図8に斜視図を、また図9に側面図を示すものが知られ
ている。これは表面実装方式として、まず、リフローの
ためのクリーム半田105を基板102のパッド面に塗
布し、この基板102のパッド面にコネクタ103の接
続面107を固定して接続するもので、固定の際、コネ
クタ103の固定片を基板穴に合わせて位置決めし、ネ
ジ106にて固定する。この後、クリーム半田105を
リフロー炉にて溶融して半田付けがなされる。
2. Description of the Related Art As a surface mount type connector of this type,
Known is a perspective view in FIG. 8 and a side view in FIG. This is a surface mounting method. First, cream solder 105 for reflow is applied to the pad surface of the substrate 102, and the connection surface 107 of the connector 103 is fixed to the pad surface of the substrate 102 for connection. At this time, the fixing piece of the connector 103 is aligned with the board hole and positioned, and fixed with the screw 106. After that, the cream solder 105 is melted in a reflow furnace to be soldered.

【0003】また、図10に示す実開昭63ー6597
8号公報で開示されているものは、基板201上のパッ
ド面206にクリーム半田を塗布し、前方にピン204
(電極)を露出したハウジング203下部に引掛片20
7を設けて、引掛片207を基板201に片方からスラ
イドさせて挿入し、このときピン204を、クリーム半
田を塗布したパッド206と摺動させて接触させるもの
である。
[0003] In addition, as shown in FIG.
The one disclosed in Japanese Patent No. 8 is such that cream solder is applied to the pad surface 206 on the substrate 201 and the pin 204
The hooking piece 20 is provided at the bottom of the housing 203 where the (electrode) is exposed.
7, the hook piece 207 is slid and inserted into the substrate 201 from one side, and at this time, the pin 204 is slid and brought into contact with the pad 206 coated with cream solder.

【0004】[0004]

【発明が解決しようとする課題】ところが、このような
従来技術においては、回路基板へのコネクタの位置決め
後、リフロー炉等での半田付け加工に先立って、両者を
取付け固定加工を行なうのが常である。
However, in such a prior art, after the connector is positioned on the circuit board, both are usually fixed and fixed prior to soldering in a reflow furnace or the like. Is.

【0005】例えば、前記のうちで前者の構成において
は、固定用ネジを用いて図9に示すように、ネジ106
による係合を行なう。しかしながら、この締め付け作業
によって、ネジ106を軸としてコネクタ103が共に
回動し、この回動によって、ターミナル104が位置移
動し、接続面107が位置ずれを生じて、均一量に設定
したクリーム半田の位置がずれ、よって、半田量をばら
つかせるために、電気接続信頼性が低下するという由々
しき問題が発生する恐れがある。
For example, in the former configuration of the above, a fixing screw is used, as shown in FIG.
Engage with. However, this tightening work causes the connector 103 to rotate together with the screw 106 as an axis, and this rotation causes the terminal 104 to move in position and the connecting surface 107 to shift in position, so that a uniform amount of cream solder is set. There is a risk of causing a serious problem that the reliability of the electrical connection is lowered because the position is displaced and thus the amount of solder is varied.

【0006】また、後者においても、一方向にスライド
させる構成では、ハウジングがクリーム半田を押し出し
つつ進行するために、クリーム半田を掻き取り、あるい
は押しやって片方向に集めたり、さらにはパッドからク
リーム半田をはみ出させて、絶縁部上に滞留させる等の
好ましからざる状態を惹起させていた。これらは半田量
の不足などの不都合を招いて確実な半田付けを困難にす
るために、不良品発生の原因になるばかりか、現場にお
ける作業性を著しく損なう原因になっていた。
Also, in the latter case, in the structure of sliding in one direction, since the housing advances while pushing out the cream solder, the cream solder is scraped or pushed to collect in one direction, and further, the cream solder is pushed from the pad. Was extruded to cause an undesirable state such as staying on the insulating portion. These lead to inconvenience such as insufficient amount of solder and make reliable soldering difficult, which not only causes defective products but also significantly impairs workability in the field.

【0007】本発明はこのような課題や欠点を解決する
ためなされたもので、その目的はコネクタの組み付け工
程にあって、基板と端子の位置ずれの発生がなく、しか
も容易な作業で信頼度の高い電気的接続を低コストで実
現するコネクタ表面実装機構を提供するものである。
The present invention has been made in order to solve the above problems and drawbacks, and its purpose is to prevent the positional deviation between the board and the terminal during the assembly process of the connector, and to perform the reliability easily and easily. The present invention provides a connector surface mounting mechanism that realizes high electrical connection at low cost.

【0008】[0008]

【課題を解決するための手段】前記課題を実現するため
本発明に係るコネクタ表面実装機構は、半田材料が載せ
られた電気接続用のパッド面をその表面に有する基板
と、絶縁ハウジングから突出して設けられ、かつ先端に
接続面を有する少なくとも1個の端子を備え、該絶縁ハ
ウジングを前記基板へ装着して前記端子を前記パッド面
に接続させるコネクタとで構成されるものにおいて、前
記基板上の前記ハウジング装着位置の端縁に切欠部を設
け、前記基板上の前記ハウジング装着位置の、前記切欠
部から離れた場所にロック係止孔を設け、前記コネクタ
のハウジング底部の前記切欠部に対応する位置に、前記
切欠部に嵌合する引掛部を設け、前記コネクタのハウジ
ング底部の前記ロック孔に対応する位置に、押圧によっ
て前記ロック係止孔に嵌合するロック部を設けて構成し
たことを特徴とするものである。
In order to achieve the above object, a connector surface mounting mechanism according to the present invention comprises a board having a pad surface for electrical connection on which a solder material is placed, and a board protruding from an insulating housing. A connector provided with at least one terminal having a connecting surface at a tip thereof, the connector being mounted on the board to connect the insulating housing to the pad surface, A notch is provided at an edge of the housing mounting position, and a lock locking hole is provided at a position of the housing mounting position on the substrate, which is apart from the notch, and corresponds to the notch at the housing bottom of the connector. A hook portion that fits into the cutout portion is provided at a position, and the lock locking hole is pressed by pressing at a position corresponding to the lock hole at the housing bottom portion of the connector. It is characterized in that which is configured by providing a lock portion fitted.

【0009】[0009]

【作用】本発明に係るコネクタ表面実装機構は、端子が
上方に持ち上げられた状態で基板の端部の切欠部にコネ
クタの引掛部を引っ掛け、引掛部を支点に、コネクタを
回動させて基板上に倒してゆき、コネクタ側のロック部
と、基板側のロック係止孔とを嵌合させて、コネクタを
基板に係止するとともに、端子の接合部を基板の導電部
に接合させるので、コネクタの摺動などでクリーム半田
が押し出されたり片寄せされずに端子をパッド面に接合
できる。
In the connector surface mounting mechanism according to the present invention, the hook portion of the connector is hooked on the cutout portion of the end portion of the board with the terminal being lifted upward, and the connector is rotated about the hook portion as a fulcrum. As it goes down, the lock part on the connector side and the lock locking hole on the board side are fitted to lock the connector to the board and the joint part of the terminal is joined to the conductive part of the board. The terminals can be bonded to the pad surface without the cream solder being pushed out or biased due to sliding of the connector.

【0010】また、ロック部とロック係止孔は、コネク
タのX方向のずれと縦方向(Z方向)のガタを防止する
よう作用する。さらに、Y方向のずれは、引掛部と切欠
部との作用によって著しく改善される。
Further, the lock portion and the lock engaging hole act so as to prevent the connector from being displaced in the X direction and loose in the vertical direction (Z direction). Further, the deviation in the Y direction is remarkably improved by the action of the hook portion and the notch portion.

【0011】[0011]

【実施例】以下、この発明の実施例を添付図面の図1〜
図6に基づいて説明する。図1は本発明に係るコネクタ
表面実装機構の基本的形態を示す斜視図である。同図に
おいて、13は基板で、その表面にはコネクタ2の接合
部4との電気的接続のための導電部(パッド面)14が
形成されている。導電部14表面には、クリーム半田1
5が塗布されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will now be described with reference to FIGS.
It will be described with reference to FIG. FIG. 1 is a perspective view showing a basic form of a connector surface mounting mechanism according to the present invention. In the figure, 13 is a substrate, on the surface of which a conductive portion (pad surface) 14 for electrical connection with the joint portion 4 of the connector 2 is formed. On the surface of the conductive portion 14, cream solder 1
5 is applied.

【0012】基板13には、コネクタ2が装着される位
置の端縁に切欠部17を設け、切欠部17と導電部14
との間の位置に、ロック係止孔16を備える。切欠部1
7の幅d2は、後述するハウジング5の引掛部6の幅に
ほぼ等しくする。また、ロック係止孔16の幅d1は同
じく、後述するハウジング5のロック部7の幅にほぼ等
しくする。
The board 13 is provided with a notch 17 at the edge where the connector 2 is mounted, and the notch 17 and the conductive portion 14 are provided.
A lock engagement hole 16 is provided at a position between and. Notch 1
The width d2 of 7 is made substantially equal to the width of the hooking portion 6 of the housing 5 which will be described later. Similarly, the width d1 of the lock engaging hole 16 is made substantially equal to the width of the lock portion 7 of the housing 5 described later.

【0013】コネクタ2は、絶縁ハウジング5と、これ
より突出する複数の細い板状の端子3を有する。端子3
はハウジング5後面の縦横の複数位置に配設され、基板
13に平行にハウジング5から突出した後、クランク状
に基板側へ屈曲され、さらに先端部には基板13の各導
電部14に接面する接合部4を有している。
The connector 2 has an insulating housing 5 and a plurality of thin plate-like terminals 3 projecting from the insulating housing 5. Terminal 3
Are arranged at a plurality of vertical and horizontal positions on the rear surface of the housing 5, project from the housing 5 in parallel to the board 13, and are bent in a crank shape toward the board side. Further, the tip end portion is in contact with each conductive portion 14 of the board 13. It has the joining part 4 which does.

【0014】ハウジング5の底面2Aには、端縁に引掛
部6を設ける。引掛部6は基板13の切欠部17に嵌合
し、このときロック係止孔16に対応する底面2A上の
位置に、斜面7Aを有するロック部7を設ける。
On the bottom surface 2A of the housing 5, a hook portion 6 is provided at the edge. The hook portion 6 is fitted in the notch portion 17 of the substrate 13, and at this time, the lock portion 7 having the inclined surface 7A is provided at the position on the bottom surface 2A corresponding to the lock engaging hole 16.

【0015】コネクタの組み付けにおいては、先ず図2
に示すように、端子3を上方に保持しながら、基板13
の切欠部17にコネクタ2の引掛部6を引っ掛け、図
中、太矢印で示す方向に、コネクタ2を倒していく。こ
れにより、ロック部7はロック係止孔16に近づき、接
合部4はクリーム半田15が塗布された導電部14に近
づく。しかしこの時点まで、接合部4とクリーム半田1
5が塗布された導電部14との接触は一切ない。
When assembling the connector, first, referring to FIG.
As shown in FIG.
The hooking portion 6 of the connector 2 is hooked on the notch 17 and the connector 2 is tilted in the direction indicated by the thick arrow in the figure. As a result, the lock portion 7 approaches the lock engaging hole 16, and the joint portion 4 approaches the conductive portion 14 to which the cream solder 15 is applied. However, until this point, the joint 4 and the cream solder 1
There is no contact with the conductive part 14 coated with 5.

【0016】やがてコネクタ2の底面2Aが基板13に
密着すると、ロック部7はロック係止孔16に完全に嵌
合し、ロック部7の水平面が基板13の裏面に密着し
て、コネクタ2を基板13に堅固に係止する。
When the bottom surface 2A of the connector 2 comes into close contact with the board 13 in due course, the lock portion 7 is completely fitted into the lock engagement hole 16, and the horizontal surface of the lock portion 7 comes into close contact with the back surface of the board 13 to secure the connector 2 in place. Firmly locked to the substrate 13.

【0017】このとき、端子の接合部14は基板13の
導電部14に接合し、図3に示すように、クリーム半田
15は接合部14に均等に、過不足なく接することにな
る。従って、クリーム半田が片寄せられたり、押しやら
れてパッド面からはみでる等の不都合が全く発生するこ
となく、コネクタの基板への係合が完了して、つぎの半
田付け工程に移行出来るのである。
At this time, the joint portion 14 of the terminal is joined to the conductive portion 14 of the substrate 13, and as shown in FIG. 3, the cream solder 15 contacts the joint portion 14 evenly and without excess or deficiency. Therefore, the soldering of the connector to the substrate can be completed and the next soldering step can be performed without causing any inconvenience such as the cream solder being biased to one side or being pushed out and protruding from the pad surface.

【0018】図4に、本発明に係るコネクタ表面実装機
構の別の実施例の斜視図を示す。同図の構成と、図1の
構成とは、係止手段、すなわちロック部7のみが異なっ
ており、その他は同じ構成である。図4は係止手段とし
て可撓性に優れた二股形状を用いたものである。
FIG. 4 is a perspective view of another embodiment of the connector surface mounting mechanism according to the present invention. The configuration of FIG. 1 and the configuration of FIG. 1 are different only in the locking means, that is, the lock portion 7, and the other configurations are the same. In FIG. 4, a bifurcated shape having excellent flexibility is used as the locking means.

【0019】中央部に大きな切欠7Aを有し、2本の係
止突設脚7Cから成るロック部7は、一対の係止突設脚
7Cが斜面7Bと係止面7Dを備えるもので、ロック部
7を上方から、基板13に設けたロック係止孔16に押
し込むと、図6に示すように、ロック係止孔16の稜1
6Aに係止突設脚7Cの斜面7Bが当接し、内側に変形
する力Wが働いて係止突設脚7Cは変形し、ロック係止
孔16内に押し込まれる。さらに下方に押し込むと、図
7に示すように、係止面7Dが基板13の裏側に突き出
て変形から復元し、係止面7Dと基板13の裏側とでコ
ネクタ2を係止する。
In the lock portion 7 having a large cutout 7A in the central portion and consisting of two locking projecting legs 7C, a pair of locking projecting legs 7C has a sloped surface 7B and a locking surface 7D. When the lock portion 7 is pushed from above into the lock engaging hole 16 provided in the substrate 13, as shown in FIG.
The inclined surface 7B of the locking projection leg 7C comes into contact with 6A, and the force W for inward deformation acts to deform the locking projection leg 7C and push it into the lock locking hole 16. When pushed further downward, as shown in FIG. 7, the locking surface 7D projects to the back side of the board 13 and restores from the deformation, and the locking surface 7D and the back side of the board 13 lock the connector 2.

【0020】図5はさらに他のロック部7の例を示す。
中央部にスリット7Aのある円柱状のロック部7は、円
形のロック係止孔16に押し込まれて変形するが、基板
13の裏側に突き出て変形から復元し、係止面7Dと基
板13の裏側とでコネクタ2を係止する。これらはワン
タッチで係止が成立するから、作業性は極めて顕著に改
善されるという効果がある。
FIG. 5 shows still another example of the lock portion 7.
The column-shaped lock portion 7 having the slit 7A in the center is deformed by being pushed into the circular lock engagement hole 16, but protrudes to the back side of the substrate 13 and is restored from the deformation, and the engagement surface 7D and the substrate 13 are separated. The connector 2 is locked on the back side. Since these are locked with one touch, the workability is significantly improved.

【0021】このように、コネクタの基板への装着過程
にあって、本発明による構成では導電部上に載せられた
クリーム半田が接合部と接触することがないから、クリ
ーム半田が片寄せられたり、押しやられてパッド面から
はみでる等の問題は発生しない。
As described above, in the process of mounting the connector on the substrate, in the structure according to the present invention, the cream solder placed on the conductive portion does not come into contact with the joint portion, so that the cream solder is offset. The problem of being pushed out of the pad surface does not occur.

【0022】[0022]

【発明の効果】以上説明した様に、本発明に係るコネク
タ表面実装機構は、コネクタの端子が上方に持ち上げら
れた状態で基板の端部にコネクタの引掛部を引っ掛け、
引掛部を支点に、コネクタを回動させて基板上に倒して
ゆき、コネクタ側のロック部と、基板側のロック係止孔
とを嵌合させて、コネクタを基板に係止するとともに、
端子の接合部を基板の導電部に接合させるから、一連の
工程において、端子の接合部と基板の導電部の接触が全
く起きないから、摺動などでクリーム半田が押し出され
たり片寄せされずに係合できる。
As described above, in the connector surface mounting mechanism according to the present invention, the hook portion of the connector is hooked on the end portion of the board while the terminal of the connector is lifted upward.
The connector is rotated around the hook as a fulcrum to bring it down on the board, and the connector-side lock portion and the board-side lock locking hole are fitted to lock the connector on the board.
Since the joint part of the terminal is joined to the conductive part of the board, there is no contact between the joint part of the terminal and the conductive part of the board in a series of steps, so cream solder is not pushed out or misaligned due to sliding etc. Can be engaged with.

【0023】即ち、塗布されているクリーム半田の片寄
せ、移動やパッド面からの排除といった不都合が発生す
ることがない。この結果、確実な半田付けが可能にな
り、確実な電気的接続の実現によって回路の信頼性を向
上させ得る。
In other words, the inconvenience of the applied cream solder being offset, moved, or removed from the pad surface does not occur. As a result, reliable soldering is possible, and the reliability of the circuit can be improved by realizing reliable electrical connection.

【0024】さらにコネクタの固定においては、ワンタ
ッチ作業でしかも極めて容易であるから、不良の発生率
を低くでき、ネジ止めの必要がないから作業性が大幅に
改善されるという利点があり、著しいコスト低減を実現
できるものである。
Further, in fixing the connector, it is extremely easy to carry out by one-touch work, and the defect occurrence rate can be reduced, and there is an advantage that workability is greatly improved because there is no need for screwing. Reduction can be realized.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係るコネクタ表面実装機構の一実施例
による斜視図である。
FIG. 1 is a perspective view of an embodiment of a connector surface mounting mechanism according to the present invention.

【図2】図1のコネクタ表面実装機構の側面図である。2 is a side view of the connector surface mounting mechanism of FIG. 1. FIG.

【図3】図2のコネクタ表面実装機構の嵌合時の側面図
である。
FIG. 3 is a side view of the connector surface mounting mechanism of FIG. 2 when fitted.

【図4】本発明に係るコネクタ表面実装機構の別の実施
例による要部斜視図である。
FIG. 4 is a perspective view of an essential part of another embodiment of the connector surface mounting mechanism according to the present invention.

【図5】本発明に係るコネクタ表面実装機構のさらに別
の実施例による要部の斜視図である。
FIG. 5 is a perspective view of an essential part of a connector surface mounting mechanism according to still another embodiment of the present invention.

【図6】図4のコネクタ表面実装機構の嵌合部分の説明
図である。
6 is an explanatory view of a fitting portion of the connector surface mounting mechanism of FIG.

【図7】図4のコネクタ表面実装機構の嵌合部分の説明
図である。
7 is an explanatory view of a fitting portion of the connector surface mounting mechanism of FIG.

【図8】従来の表面実装型コネクタの斜視図である。FIG. 8 is a perspective view of a conventional surface mount connector.

【図9】図8の側面図である。9 is a side view of FIG.

【図10】従来の他の表面実装型コネクタで、(A)は
斜視図、(B)は側面図である。
FIG. 10 is another conventional surface mount type connector, in which (A) is a perspective view and (B) is a side view.

【符号の説明】[Explanation of symbols]

1 コネクタ表面実装機構 2 コネクタ 2A 底面 3 端子 4 接合部 5 ハウジング 6 引掛部 7 ロック部 7A 斜面 8 固定片 8A 固定孔 13 基板 14 導電部(パッド面) 15 クリーム半田 16 ロック係止孔 17 切欠部 1 Connector surface mounting mechanism 2 Connector 2A Bottom surface 3 Terminal 4 Joining part 5 Housing 6 Hooking part 7 Lock part 7A Slope 8 Fixing piece 8A Fixing hole 13 Board 14 Conductive part (Pad surface) 15 Cream solder 16 Lock locking hole 17 Notch

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 半田材料が載せられた電気接続用のパッ
ド面をその表面に有する基板と、絶縁ハウジングから突
出して設けられ、かつ先端に接続面を有する少なくとも
1個の端子を備え、該絶縁ハウジングを前記基板へ装着
して前記端子を前記パッド面に接続させるコネクタとで
構成されるものにおいて、前記基板上の前記ハウジング
装着位置の端縁に切欠部を設け、前記基板上の前記ハウ
ジング装着位置の、前記切欠部から離れた場所にロック
係止孔を設け、前記コネクタのハウジング底部の前記切
欠部に対応する位置に、前記切欠部に嵌合する引掛部を
設け、前記コネクタのハウジング底部の前記ロック係止
孔に対応する位置に、押圧によって前記ロック係止孔に
嵌合するロック部を設けて構成したことを特徴とするコ
ネクタ表面実装機構。
1. A substrate having a pad surface for electrical connection on which a solder material is placed and having at least one terminal projecting from an insulating housing and having a connecting surface at a tip thereof. A connector configured to mount a housing on the board and connect the terminals to the pad surface, wherein a notch is provided at an edge of the housing mounting position on the board, and the housing is mounted on the board. A lock engaging hole is provided at a position away from the cutout portion, and a hook portion that fits into the cutout portion is provided at a position corresponding to the cutout portion of the housing bottom portion of the connector, and the housing bottom portion of the connector is provided. 2. A connector surface mounting mechanism, characterized in that a lock portion that fits into the lock engaging hole by pressing is provided at a position corresponding to the lock engaging hole. .
JP6021856A 1994-01-24 1994-01-24 Connector surface mounting mechanism Pending JPH07211409A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6021856A JPH07211409A (en) 1994-01-24 1994-01-24 Connector surface mounting mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6021856A JPH07211409A (en) 1994-01-24 1994-01-24 Connector surface mounting mechanism

Publications (1)

Publication Number Publication Date
JPH07211409A true JPH07211409A (en) 1995-08-11

Family

ID=12066766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6021856A Pending JPH07211409A (en) 1994-01-24 1994-01-24 Connector surface mounting mechanism

Country Status (1)

Country Link
JP (1) JPH07211409A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081998A (en) * 1997-10-03 2000-07-04 Fujitsu Limited Method of surface mounting a connector
US9069492B2 (en) 2013-05-22 2015-06-30 Seiko Epson Corporation Control systems for repetitive printing
JP2016152282A (en) * 2015-02-17 2016-08-22 日立オートモティブシステムズ株式会社 Resin-sealed vehicle-mounted electronic control device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081998A (en) * 1997-10-03 2000-07-04 Fujitsu Limited Method of surface mounting a connector
US6655990B2 (en) 1997-10-03 2003-12-02 Fujitsu Limited Method of surface mounting a connector and connector
US9069492B2 (en) 2013-05-22 2015-06-30 Seiko Epson Corporation Control systems for repetitive printing
JP2016152282A (en) * 2015-02-17 2016-08-22 日立オートモティブシステムズ株式会社 Resin-sealed vehicle-mounted electronic control device

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