JPH0720959Y2 - Forming device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a forming apparatus for performing a forming process for cutting or bending a lead wire of an electronic component.

[Conventional technology]

4 (a) and 4 (b) are a plan view and a side view showing a base of a feedthrough capacitor as an example of an electronic component which has been conventionally used, in which 1 is a feedthrough capacitor and 2 and 3 are the feedthrough capacitors 1. 1 lead wire and 2nd lead wire, 4 is a conductive substrate (for example, a metal plate) on which a plurality of the feedthrough capacitors 1 are mounted, 5 is a bent portion formed at both ends of the substrate 4, and 6 is a bent portion. It is a through hole formed in the bent portion 5.

Thus, the feedthrough capacitor 1 that has been used conventionally
Each of the lead wires 2 and 3 was cut or bent by a press machine or a forming machine.

[Problems to be solved by the device]

By the way, in forming each lead wire 2 and 3 of the feedthrough capacitor 1, after cutting the first lead wire 2 with a cutter, bending the first and second lead wires 2 and 3 with a press machine or a forming machine. Therefore, it takes two steps, that is, a cutting step and a bending step, and it takes a lot of time to perform the forming work. Further, since the shape of the feedthrough capacitor 1 is small, once it is attached to a press machine or a forming machine and is bent by the press machine. There was a problem that it was difficult to remove.

The present invention has been made to solve the above-mentioned problems, and a method of cutting a lead wire and bending it in one step and removing the board of the attached feedthrough capacitor by one-touch operation are provided. An object of the present invention is to obtain a forming device equipped with.

[Means for Solving the Problems]

A forming apparatus according to the present invention is a pedestal for mounting a substrate on which an electronic component having a first lead wire and a second lead wire is mounted; a lower blade fixed to the pedestal; and an upper portion corresponding to the lower blade. An upper blade that holds the first lead wire by pressing it in cooperation with the lower blade and holding the upper blade; and a vertically movable forming case that fixes the upper blade, and the first lead is provided in the forming case. A first press plate that bends the wire after cutting it to a predetermined length in cooperation with the lower blade, and a second press plate.
The second press plate for bending the lead wire is provided so as to be vertically movable.

In addition, a fixed shaft that is horizontally fixed to a pedestal on which a board on which electronic components are mounted is mounted, and a tip of the fixed shaft that is fitted to the fixed shaft and abuts against the lower surface of the board to push up the board. The pedestal is provided with a substrate take-out means including a rotating plate taken out from the pedestal.

[Action]

In this invention, the lower blade and the first press plate cooperate with each other to cut the first lead wire so that the lower blade and the upper blade cooperate to bite and hold it, and then, Fold.
Also, the second lead wire is bent by the second press plate.
Further, the substrate can be pushed up and taken out from the pedestal by bringing the tip of the rotating plate into contact with the lower surface of the substrate and then rotating the rotating plate.

〔Example〕

1 (a) to 1 (c) show an embodiment of the present invention. FIG. 1 (a) is a partially cutaway front view, and FIG. 1 (b) is
FIG. 1 (c) is a side sectional view taken along line I-I of FIG. 1 (a).
1A and 1B are cross-sectional views showing a state after the operation of FIGS. 1A and 1B, the same reference numerals as those in FIG. 4 denote the same parts, 11 denotes the entire forming device, and 12 denotes the feedthrough capacitor 1. Pedestal for mounting, 13 is a forming case, 14 is an upper blade attached to the lower end portion 13a of the forming case 13, 14a is a cutting edge, 15 is a lower blade attached to the pedestal 12, 15a is a cutting edge, 16,
17 is the first attached inside the forming case 13
Press plate and second press plate, 18 is a lead wire clamp portion, 19 and 20 are convex portions of the forming case 13, 21 and 22 are convex portions of the pedestal 12, and 23 is vertically movable in the forming case 13. Piston, 24 is a pin fixed to the lower part of the piston 23, 25 is a spring fitted to the pin 24, 26 is a chuck fixed to the piston 23, and the handle of a press machine (not shown) is operated. Vertical shaft 27 that moves up and down by
Is attached to.

Next, the operation will be described.

The lead wires 2 and 3 of the feedthrough capacitor 1 are placed on the pedestal 12. Next, when the handle of the press machine (not shown) is operated to lower the piston 23, the spring 25 is pressed, so that the restoring force of the spring 25 acts to lower the forming case 13 and the upper blade 14 to the first lead wire 2. Abut. At this time, the first
The second press plates 16 and 17 also descend at the same time, and the first press plate as a whole
The positions indicated by the two-dot chain lines are changed from the positions indicated by the solid lines in FIGS. At this time, the upper blade 14 and the lower blade 15 cooperate with each other to hold the first lead wire 2 in a tightly pressed state and hold it in a state as shown in FIG. 2 (a). The upper blade 14 connects the first lead wire 2 and the second lead wire 3 of the feedthrough capacitor 1 to the protrusions 19 to 22.
Since the descent is stopped by being pressed by the lead wire clamp portion 18 consisting of, the upper blade 14 and the lower blade 15 come into contact with each other without cutting the first lead wire 2, and the respective cutting edges 14a, 15
There is no lack of a. Next, when the handle of the press machine is operated to further lower the piston 23, the first press plate 16 at the position indicated by the solid line in FIG. 2 (a) is lowered, and the two points in FIG. The first lead wire 2 at the position of the chain line
Then, the first lead wire 2 is cut and bent in cooperation with the lower blade 15 as shown in FIGS. 1 (c) and 2 (b). At the same time, the second press plate 17 is also lowered to bend the second lead wire 3.

After the bending of the lead wires 2 and 3, the handle of the press is operated to pull up the piston 23 at the position shown in FIG. 1 (c) and bring the piston 23 into contact with the forming case 13, thereby forming the forming case. Raise 13 to 1st
The original position shown in FIGS. (A) and (b) is restored.

3 (a) to 3 (c) show a means for taking out the substrate 4 placed on the forming device 11. FIG. 3 (a) is a plan view, FIG. 3 (b) is a side view, and FIG. FIG. 3C is a sectional view taken along the line II-II of FIG. In these drawings, the same reference numerals as those in FIG. 1 denote the same parts, 31 is a rotating plate for removing the substrate 4 placed on the pedestal 12, 32 is the rotating plate 31 attached to the pedestal 12 and the rotating plate 31. A rotating shaft fitted rotatably, 33 is a piston which is attached to the pedestal 12 and engages with the through hole 6 of the substrate 4 placed on the pedestal 12, and 34 is a spring which presses the pin 33.

Next, the operation will be described.

To remove the substrate 4 on which the lead wires 2 and 3 have been formed, push the base end portion 31a of the rotating plate 31 downward to rotate the rotating plate 3
1 rotates about the fixed shaft 32. Therefore, as shown in FIG. 3 (b), the tip 31b rises to push up the bent portion 5 of the substrate 4 to the position indicated by the chain double-dashed line in FIG. 3 (b), so that the substrate 4 is taken out. be able to. At this time, the pin 33 engaged with the through hole 6 of the bent portion 5 presses the spring 34 when the substrate 4 is removed, so that the engagement with the through hole 6 is released.

[Effect of device]

As described above, the present invention corresponds to the pedestal for mounting the substrate on which the electronic component having the first lead wire and the second lead wire is mounted; the lower blade fixed to the pedestal; and the lower blade. An upper blade that holds the first lead wire in cooperation with the lower blade to hold it by pressing it; and a vertically movable forming case that fixes the upper blade. Since the first press plate that bends the lead wire of No. 2 after cutting it to a predetermined length in cooperation with the lower blade and the second press plate that bends the second lead wire are vertically movable, Since the cutting and bending of the lead wire can be performed in one step, the work efficiency of the cutting and bending is increased, and the fixed shaft fixed in the horizontal direction to the pedestal on which the board on which the electronic component is mounted is placed, It is fitted to this fixed shaft and The pedestal is equipped with a substrate take-out unit consisting of a rotating plate that pushes up the substrate by bringing its tip end into contact with the lower surface of the pedestal and takes it out from the pedestal. There are advantages to rise.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 (a) is a partially cutaway front view, and FIG. 1 (b) is a side sectional view taken along line I-I of FIG. 1 (a). FIG. 1 (c) is a sectional view showing a state after the operation of FIG. 1 (a), (b), and FIG.
(A) and (b) are enlarged cross-sectional views showing the operation of FIG.
FIGS. 3 (a) to 3 (c) show a means for taking out the substrate placed on the forming apparatus, and FIG. 3 (a) is a plan view.
3 (b) is a side view and FIG. 3 (c) is FIG. 3 (a).
2 is a cross-sectional view taken along line II-II, and FIGS. 4 (a) and 4 (b) are a plan view and a side view showing a shape of a feedthrough capacitor which has been conventionally used. In the figure, 1 is a feedthrough capacitor, 2 is a first lead wire, 3 is a second lead wire, 4 is a substrate, 5 is a bent portion, 11 is a forming device, 12 is a pedestal, 13 is a forming case, and 14 is An upper blade, 15 is a lower blade, 16 is a first press plate, 17 is a second press plate, 31 is a rotating plate, 31a is a base end portion, and 31b is a tip end portion.

Claims (2)

[Scope of utility model registration request] 1. A pedestal for mounting a substrate on which an electronic component having a first lead wire and a second lead wire is mounted; a lower blade fixed to the pedestal; and an upper position corresponding to the lower blade. An upper blade that holds the first lead wire by pressing it in cooperation with the lower blade; and a vertically movable forming case that fixes the upper blade, and the first lead is provided in the forming case. A first press plate that bends the wire after cutting the wire into a predetermined length in cooperation with the lower blade and a second press plate that bends the second lead wire are both vertically movable. Forming device. 2. A fixed shaft horizontally fixed to a pedestal on which a board on which electronic components are mounted is mounted, and a tip end portion of the fixed shaft fitted to the fixed shaft and abutted against the lower surface of the board. 2. The forming apparatus according to claim 1, wherein the base is provided with a substrate take-out means including a rotating plate that pushes up the substrate and takes it out from the base.