JPH0720922Y2 - 電子基板の冷却構造 - Google Patents

電子基板の冷却構造

Info

Publication number
JPH0720922Y2
JPH0720922Y2 JP1989060433U JP6043389U JPH0720922Y2 JP H0720922 Y2 JPH0720922 Y2 JP H0720922Y2 JP 1989060433 U JP1989060433 U JP 1989060433U JP 6043389 U JP6043389 U JP 6043389U JP H0720922 Y2 JPH0720922 Y2 JP H0720922Y2
Authority
JP
Japan
Prior art keywords
refrigerant
coupler
drain
electronic substrate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989060433U
Other languages
English (en)
Japanese (ja)
Other versions
JPH031541U (enFirst
Inventor
晃 植田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989060433U priority Critical patent/JPH0720922Y2/ja
Publication of JPH031541U publication Critical patent/JPH031541U/ja
Application granted granted Critical
Publication of JPH0720922Y2 publication Critical patent/JPH0720922Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989060433U 1989-05-26 1989-05-26 電子基板の冷却構造 Expired - Lifetime JPH0720922Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989060433U JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Publications (2)

Publication Number Publication Date
JPH031541U JPH031541U (enFirst) 1991-01-09
JPH0720922Y2 true JPH0720922Y2 (ja) 1995-05-15

Family

ID=31587792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989060433U Expired - Lifetime JPH0720922Y2 (ja) 1989-05-26 1989-05-26 電子基板の冷却構造

Country Status (1)

Country Link
JP (1) JPH0720922Y2 (enFirst)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6369004B2 (ja) * 2013-10-22 2018-08-08 富士通株式会社 電子機器

Also Published As

Publication number Publication date
JPH031541U (enFirst) 1991-01-09

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