JPH07202475A - Electronic device - Google Patents

Abstract

PURPOSE:To enhance the shielding structure for an electronic device while simplifying the structure for mounting a high frequency device. CONSTITUTION:A lead-out metal electrode 2, a lower shield electrode 13 and an insulating layer 3 are provided on an alumina substrate 1 and an annular shield metal pattern 4 is provided on the insulating layer 3. A high frequency device is then mounted on the insulating layer 3 and a metal cap is bonded to the shield metal pattern 4 through a conductive sealing material. Consequently, the shielding effect is enhanced through a simple structure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield structure for electronic parts.

[0002]

2. Description of the Related Art FIG. 4 shows a sectional view of a conventional electronic component. Reference numeral 1 denotes a ceramic substrate on which a high frequency component 8 is mounted by being attached with an adhesive 7. The high-frequency component 8 has a metal cap 6 at the top.
Is covered with. At this time, the substrate 1 is made of an alumina material having a metal film 23 for shielding attached to its back surface.

[0003]

A problem in the above structure is how to shield the high frequency component 8 on the substrate 1. The metal cap 6 on the upper side and the metal film 23 on the back side contribute to the shield, but if they are left as they are, they are in a floating state where they are not connected to the ground terminal and must be connected again. In addition, there is a problem that a gap corresponding to the thickness of the substrate 1 is formed, and electromagnetic noise leaks from there.

Therefore, an object of the present invention is to improve the electromagnetic shielding property of the high frequency component 8 by a simple structural change.

[0005]

In order to achieve this object, the present invention provides a high heat resistant insulating substrate, and a lead electrode and a lower shield metal electrode provided on the high heat resistant insulating substrate.
A ring-shaped shield is formed on the insulating layer by covering the high heat-resistant insulating substrate other than the joint between the metal electrode and the high-frequency component and the lead-out portion provided at the end of the high heat-resistant insulating substrate. A metal pattern for shielding, the metal pattern for shielding is connected to a ground electrode of a metal electrode, a high frequency component is mounted on the insulating layer, and a metal cap having an end face at a portion corresponding to the metal pattern for shielding is provided. The shield metal pattern is joined with a conductive adhesive and sealed.

[0006]

With the above configuration, the high frequency components inside are completely shielded by the lower shield metal electrode, the ground electrode, the shield metal pattern, the conductive adhesive, and the metal cap, and are resistant to electromagnetic noise. It can be an electronic component.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view of a board portion of an electronic component according to an embodiment of the present invention. FIG. 2 is a plan view thereof. FIG. 3 is a sectional view of a completed electronic component using this substrate.

In FIGS. 1, 2 and 3, 1 is a substrate made of alumina, on which a metal electrode 2 for extraction, an insulating layer 3, and a metal pattern 4 for shielding are provided.
From the KHz band such as a piezoelectric resonator to MHz on the insulating layer 3.
The high frequency components 8 up to the band are mounted. An adhesive 7 is provided between the lower surface of the high frequency component 8 and the surface of the insulating layer 3 and is fixed by this. Then, in this state, the high frequency component 8 and the eight electrodes 2 on the outer periphery thereof are connected via the bonding wires 9 as shown in FIG. The portion to which the wire is connected corresponds to the portion 11 in FIG. Further, a metal cap 6 is arranged on the upper surface of the high-frequency component 8, and is joined to the metal pattern 4 on the substrate 1 so that the high-frequency component 8 therein is sealed via a conductive sealing material 5.

More specifically, in FIG. 1, the insulating layer 3 is an insulating layer provided on the substantially entire surface of the substrate 1 with a uniform thickness and has a hole 3a. A portion 10a of the ground electrode 10 of the electrode 2 and a portion 4a of the shielding metal pattern 4 of the electrode 2 are electrically connected via the hole 3a. The grounding electrode 10 further includes a lower shield electrode 13 provided in the central portion of the substrate 1 on which many high frequency components are mounted.
It is connected to the. On the other hand, regarding the metal pattern 4,
As described above, the metal cap 6 and the conductive sealing material 5 are electrically connected. With these configurations, the high-frequency component 8 is completely grounded and shielded by the metal cap 6, the metal pattern 4, the grounding electrode 10, and the lower shield electrode 13.

In the electronic component having the above-mentioned structure, since the shield is perfect, the high frequency component in the inside is less affected by the electromagnetic noise from the outside, and the electronic component has stable characteristics.

Further, unlike the conventional case, it is not necessary to reconnect the lower shield material and the metal cap to the ground, and the connection is also performed in the process of packaging the electronic parts. It can be easily assembled because it will be broken.

[0012]

As described above, the high-heat-resistant insulating substrate, the metal electrodes for drawing and lower shields provided on the high-heat-resistant insulating substrate, and the joining portion of the high-frequency component of the metal electrode for drawing are left. , An insulating layer covering the high heat resistant insulating substrate, a ring-shaped shield metal pattern provided on the insulating layer, a part of which is joined to the metal electrode, and a portion corresponding to the shield metal pattern. By constructing an electronic component airtightly packaged with a cap provided with an end face and a conductive sealing material for sealingly joining the end face and the shielding metal pattern, a simple assembly and a high level of resistance to electromagnetic noise can be achieved. Shielded electronic components can be realized.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a board of an electronic component according to an embodiment of the present invention.

FIG. 2 is a plan view of the substrate of FIG.

FIG. 3 is a sectional view of an electronic component according to an embodiment of the present invention.

FIG. 4 is a sectional view showing a conventional example.

[Explanation of symbols]

 1 A substrate formed of alumina 2 Metal electrode 3 for extraction 3 Insulating layer 4 Metal pattern for shielding 5 Conductive sealant 6 Metal cap 7 Adhesive 8 High frequency component

Claims (1)

[Claims] 1. A high heat resistant insulating substrate, a metal electrode for extraction and a lower shield provided on the high heat resistant insulating substrate, and a joining portion between the high frequency component of the metal electrode for extraction and the high thermal resistance. An insulating layer covering the insulating substrate, a ring-shaped shield metal pattern provided on the insulating layer and partly joined to the metal electrode, a high-frequency component mounted on the insulating layer, and the shield An electronic component comprising: a cap having an end face provided at a portion corresponding to a metal pattern; and a conductive sealing material for joining the end face and the shielding metal pattern.