JPH07202119A - Connecting device for semiconductor device - Google Patents

Abstract

PURPOSE:To provide a semiconductor device connecting device with which mounting density can be enhanced, and also an electronic apparatus and the like can be miniaturized, enhanced in efficiency and also can be increased in operating speed. CONSTITUTION:The input-output terminal 2 of an IC chip 21, to be electrically connected to the corresponding external terminal, is provided on the side face 24 of the IC chip 21 or on the opposed surface 23 of the circuit constituting surface 22, and they are electrically connected by bringing them into contact with the external terminal. As a result, a wiring and the like is unnecessary when the IC chip is mounted on a substrate, the area of substrate required for mounting can be made small, and the outer terminal, corresponding to an input-output terminal 25, is electrically connected directly. As a result, the area of substrate required for mounting can be made small, the mounting density of the IC chip 21 can be increased, and an electronic apparatus, on which the IC chip 21 is mounted, and the like can be miniaturized, its function can be enhanced and it can be operated at high speed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device connecting device.

[0002]

2. Description of the Related Art A conventional example will be described with reference to the drawings. FIG.
1 is a schematic side view showing a first conventional example, in which an IC chip 1 is bonded and fixed to a substrate 2 such as a package or a wiring substrate with an adhesive 3 or the like. The input / output terminal 4 provided on the upper surface of the IC chip 1 fixed to the substrate 2,
The terminals 5 of the substrate 2 corresponding to these are connected by tensioning a lead wire 6 between the terminals 4 and 5 by a wire bonding device. As a result, signals can be transferred between the terminals 4 of the IC chip 1 and the terminals 4 of the substrate 2.

FIG. 14 is a schematic side view showing a second conventional example, in which bumps 8 for forming input / output terminals provided on the lower surface of the IC chip 7 correspond to a substrate 9 such as a package or a wiring substrate. It is joined to the terminal 10 by soldering. As a result, signals can be transferred between the bumps 8 of the IC chip 7 and the terminals 10 of the substrate 9.

Then, in the connection device using the lead wire 6 and the bump 8 in the above-mentioned first and second conventional examples,
In either case, the signals of the IC chips 1 and 7 are transferred via the substrates 2 and 9 to other IC chips located in the vicinity. Therefore, when mounting the IC chips 1 and 7, the mounting space becomes large, and the wiring becomes long, so that the mounting density cannot be increased, and the electronic devices and the like in which the IC chips 1 and 7 are mounted. It is difficult to reduce the size, increase the functionality, and increase the speed.

Further, in the connection device according to the first conventional example, the following occurs when repairing when the IC chip 1 is broken. That is, for example, in a case where a plurality of IC chips 1 are mounted in one package such as a multi-chip module, it is not easy to remove because it is necessary to peel off at an adhesive portion when performing repair, and other IC chips cannot be removed. It has an adverse effect. Further, in this case, the package is expensive, and there is a demand for avoiding the disposable use as much as possible in terms of cost.

The same applies to the connection device in the second conventional example. This is because if the IC chip 7 is to be repaired when it is broken, the bumps 8 of the IC chip 7 must be removed while being held at a high temperature. Therefore, the high temperature applied at this time causes other IC
There is a risk that the chips and the substrate will be adversely affected.

FIG. 15 is a schematic side view showing a third conventional example, in which a package 11 including an IC chip, such as a surface mounting package QFP or a substrate insertion type PGA, is mounted. At the time of mounting on the board 12, the input / output terminals 13 are connected to the corresponding terminals 14 of the mounting board 12 by soldering or the like. As a result, the package 11 is connected to another semiconductor device such as the IC 15 mounted on the same mounting substrate 12 via the wiring provided on the mounting substrate 12, and signals are transferred.

In the connection device using the package 11 as described above, a signal is transferred via the mounting substrate 12 to another IC 15 or the like mounted on the same mounting substrate 12 as the package 11. Becomes large, and the wiring becomes long, so that the packaging density cannot be increased, and it becomes difficult to reduce the size, increase the functionality, and increase the speed of an electronic device or the like in which the package 11 is mounted. ing.

[0009]

SUMMARY OF THE INVENTION As described above, conventionally,
First, the IC chip connects its input / output terminals to the corresponding board terminals by lead wires or bumps and mounts it on the board, resulting in a large mounting space and long wiring, thus increasing the mounting density. In other words, it is difficult to reduce the size, increase the functionality, and increase the speed of electronic devices and the like that include an IC chip.

Another problem is that when the IC chip is repaired, when the adhesive portion is peeled off or the soldering portion is removed, the repair may be difficult and the other IC chips and the substrate may be adversely affected.

Furthermore, when mounting a package containing an IC chip, the input / output terminals are mounted on the corresponding terminals of the mounting board by soldering, etc., so that the mounting space is also large and the wiring is long. As a result, the packaging density cannot be increased, and it is difficult to reduce the size, increase the functionality, and increase the speed of electronic devices and the like that incorporate the package.

The present invention has been made in view of the above circumstances. One of the objects of the present invention is to increase the mounting density of IC chips on a substrate. Another object of the present invention is to provide a connecting device for a semiconductor device, which enables miniaturization, high functionality, and high speed of other electronic devices.

Another object is to provide a semiconductor device connecting device which can easily perform repair of an IC chip mounted on a substrate without adversely affecting other IC chips mounted on the substrate or the substrate. is there.

Furthermore, it is possible to increase the mounting density of a package containing an IC chip on a mounting board, and to make electronic equipment and the like mounted with this package smaller, more sophisticated and faster. Another object of the present invention is to provide a semiconductor device connecting device.

[0015]

A semiconductor device connecting device of the present invention is a semiconductor device connecting device configured to electrically connect an input / output terminal of an IC chip to a corresponding external terminal. It is characterized in that the input / output terminals are provided on the side surface of the IC chip or on the opposite side of the circuit configuration surface of the IC chip, and are electrically connected by contacting the external terminals. Further, in a semiconductor device connecting device configured to electrically connect input / output terminals of a package containing an IC chip to corresponding external terminals, the input / output terminals have side surfaces of the package or upper or lower surfaces of the package. And is electrically connected by being brought into contact with an external terminal. In a connecting device of a semiconductor device configured to exchange a predetermined signal between an input / output terminal of a chip and a corresponding external terminal, the input / output terminal and the external terminal have a communication function, and both terminals are provided. It is characterized in that a predetermined gap is provided between them, and further, the communication function is an optical communication function, and the input / output terminals of the IC chip are connected to the corresponding external device. In a semiconductor device connecting device configured to be connected to a terminal, the input / output terminal and the external terminal are connected by a removable connecting member.

[0016]

In the semiconductor device connecting device having the above-mentioned structure, one connecting device electrically connects to the corresponding external terminal.
The input / output terminals of the C chip are provided on the side surface of the IC chip or on the opposite side of the circuit configuration surface of the IC chip, and are electrically connected by contacting with external terminals, This eliminates the need for wiring, etc., and the direct input / output terminals and external terminals are electrically connected to each other, so that the mounting density of the IC chips on the substrate can be increased, and the electronic device mounted with the IC chips. It is possible to reduce the size of the package, increase the functionality, and increase the speed. Also, in one, the input / output terminals of the package that are electrically connected to the corresponding external terminals are provided on the side surface of the package or on the top surface or the bottom surface of the package. In addition, it is designed to be electrically connected by making contact with the external terminals, which eliminates the need for wiring, etc., and allows direct input / output terminals and external terminals to be electrically connected. Connection, the mounting density of the package on the mounting board can be increased, and the electronic device and the like in which the package is mounted can be downsized, have high functionality, and can operate at high speed. The input / output terminals of the IC chip for exchanging predetermined signals with each other and the corresponding external terminals have a communication function, and a predetermined gap is provided between both terminals, so that they are mounted on the substrate. The repair of the IC chip can be easily performed without adversely affecting other IC chips and the substrate on which the IC chip is mounted. Further, in one, the input / output terminals of the IC chip and the corresponding external terminals are They are connected by a detachable connecting member, which also allows repair of the IC chip mounted on the substrate to be performed without adversely affecting other IC chips and the substrate. It can be carried out in.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment of the present invention will be described with reference to FIGS. 1 to 5. 1 is a perspective view of an IC chip, FIG. 2 is a plan view of a first IC chip group, FIG. 3 is a plan view showing a state in which a second IC chip group is mounted, and FIG. 4 is an IC. It is a top view showing the 1st modification of a chip, and Drawing 5 is a top view showing the 2nd modification of an IC chip.

1 to 3, an IC chip 21 composed of a large scale integrated circuit (LSI) or an integrated circuit (IC) is a semiconductor wafer having a plurality of predetermined circuits formed on its surface. It is obtained by dicing so as to be cut out, and the upper surface is a circuit constituent surface 22 on which a predetermined circuit is formed, and a facing surface 23 parallel to the circuit constituent surface 22 and the circuit constituent surface 22 are processed orthogonally. Done 4
It has a rectangular shape with two side surfaces 24.

Input / output terminals 25 are provided on the side surface 24 so as to be exposed on the surface. The input / output terminals 25 on the side surface 24 are formed, for example, by bending a terminal portion metal film extending outward from the upper end portion after the dicing process so as to be in close contact with the side surface 24.

The IC chip 21 has a side surface 24
When the output terminal 25 is connected to the corresponding external terminal to operate, for example, the first IC chip group 26 is used in combination with other IC chips 27, 28, 29, 30, 31. At this time, the IC chip 21 has the input / output terminals 25 on the side surface 24 adjacent to the respective IC chips 27, 28, 29,
An IC chip fixing member 32 made of an insulating material, which is brought into contact with corresponding input / output terminals on a side surface (not shown) of 30 and is fitted to the outer periphery of the first IC chip group 26, is securely pressed to maintain electrical connection. To be done.

By configuring the connection device in this way, the IC
Since the chip 21 can directly connect the input / output terminals 25 of the side surface 24 to the corresponding external terminals, the first IC chip group 26 formed by connecting the IC chips 21 can be realized in a small occupied area and mounted. The density can be small above. Further, it becomes possible to miniaturize, increase the functionality, and increase the speed of an electronic device or the like equipped with the IC chip 21.

When repairing the IC chip 21, the IC chip 21 can be easily removed by removing the IC chip fixing member 32 fitted to the outer periphery of the first IC chip group 26, and a new IC chip 21 that has been replaced is replaced. Then, by fitting the IC chip fixing member 32, the electrical connection is held again and the repair is completed.

Further, FIG. 3 shows a first IC chip group 26.
IC chips 27 and 2 including the IC chip 21 constituting the
The case where the connections of 8, 29, 30, 31 are rearranged and, for example, the second IC chip group 33 that forms circuits having different operations is mounted on the substrate 34 is shown. The second on the substrate 34
Is formed with a recess 35 having a shape that follows the outer shape of the IC chip group 33.
By mounting 7, 28, 29, 30, and 31, terminals on the side surfaces of adjacent ones are pressed to be electrically connected.

That is, the input / output terminals 25 on the side surface 24 of the IC chip 21 are newly adjacent to the IC chips 28 and 2.
Touch the corresponding input / output terminals on the side of 9, 30. Then, the corresponding terminals of the IC chips 21, 27, 28, 29 and the substrate 34 are connected by the lead wires 36. Reference numeral 37 is a semiconductor element mounted on the substrate 34 by a lead wire 38.

Even with such a configuration, the IC chip 21 can directly connect the input / output terminals 25 of the side surface 24 to the corresponding external terminals, and the occupied area of the second IC chip group 33 including the IC chip 21 becomes small. , The packaging density can be increased.

As shown in FIGS. 4 and 5, if the input / output terminals 25 are provided on the side surface 24 of the IC chip 39 having a pentagonal planar shape or the polygonal IC chip 40 having a complex planar shape. A large number of input / output terminals 25 can be provided in accordance with various mounting modes having different operations, and the mounting density can be further increased.

Next, a second embodiment will be described with reference to FIG.
FIG. 6 is a perspective view of the IC chip. In FIG. 6, the IC chip 41 has a rectangular shape obtained by dicing a semiconductor wafer having a plurality of predetermined circuits formed on its surface so that the predetermined circuits are cut out. An input / output terminal 43 is provided on the side surface 42 so as to be exposed on the surface. The input / output terminals 43 on the side surface 42 are formed, for example, by laminating a plurality of terminal metal films 44 on a portion where the input / output terminals 43 are formed when forming a predetermined circuit on a semiconductor wafer, and after dicing processing. A plurality of terminal portion metal films 44 are formed on the side surface 42 so as to be continuously exposed in the stacking direction.

Therefore, in this embodiment, the same operation and effect as those of the first embodiment can be obtained.

Next, a third embodiment will be described with reference to FIG.
FIG. 7 is a perspective view of an IC chip. In FIG. 7, the IC chip 45 has a rectangular shape obtained by dicing a semiconductor wafer having a plurality of predetermined circuits formed on its surface so that the predetermined circuits are cut out. The surface shown as the lower surface side in the drawing is the circuit constituent surface 22 on which the predetermined circuit is formed, and the facing surface 46 parallel to the circuit constituent surface 22 and the circuit constituent surface 22 are processed so as to be orthogonal to the circuit constituent surface 22. It has a rectangular shape with four side surfaces 47. Then, in the meeting 46,
The output terminal 48 is provided so as to be exposed on the surface.

Since the connecting device is constructed in this manner, the input / output terminals 48 of the facing surface 46 are fixed to the corresponding external terminals (not shown) by fixing the IC chip 45 or mounting the IC chip 45 on the frame member. Are pressed in the contact direction by the contact and electrically connected.

Then, the input / output terminals 48 of the IC chip 45 are directly connected to the corresponding external terminals, and this embodiment can also obtain the same operation and effect as those of the first embodiment.

Next, a fourth embodiment will be described with reference to FIG.
FIG. 8 is a perspective view showing a package mounting state.
In the package 49a, an IC chip (not shown) is housed, and a side surface 50a thereof is provided with input / output terminals 51a exposed on the surface. The input / output terminals 51a on the side surface 50a are, for example, mounted boards 5
It is combined so as to contact the input / output terminal 51b of the side surface 50b when it is mounted together with the other package 49b having the same structure on the second side.

A fixing member 53 made of an insulating material is provided on the outer circumferences of the package 49a and the package 49b which are combined with each other, and they are pressed against each other in the contact direction to be electrically connected.

Since the connecting device is configured as described above, the input / output terminals 51a of the package 49a and the input / output terminals 51b of the package 49b that correspond to each other are directly connected to each other, and are occupied on the mounting substrate 52. The area is reduced and the packaging density can be increased. Further, it becomes possible to miniaturize, increase the functionality, and increase the speed of an electronic device or the like equipped with the packages 49a and 49b.

The packages 49a and 49b are not limited to those shown in the figure, and may be formed in a polygonal shape to increase the side surface area so that more input / output terminals can be provided.

Next, another embodiment of the present invention will be described with reference to FIGS. 9 and 10 which shows a fifth embodiment showing the same. Figure 9
Is a side view showing a mounted state, and FIG. 10 is a perspective view showing a mounted state.

In FIGS. 9 and 10, an IC chip 61 composed of a large scale integrated circuit (LSI) or an integrated circuit (IC) is a circuit surface on the lower surface side of which a predetermined circuit or a communication circuit is formed. At 62, an antenna terminal 63 which is an input / output terminal and constitutes an antenna for reception or transmission is formed. On the upper surface side of the IC chip 61, the IC
A power supply terminal 64 for supplying power to each circuit of the chip 61 is provided.

On the other hand, on the substrate 65 such as a package or a wiring substrate on which the IC chip 61 is mounted, the transmission or reception corresponding to the antenna terminal 63 which is an input / output terminal and constitutes an antenna for reception or transmission of the IC chip 61. An antenna terminal 66 that constitutes a receiving antenna is provided. Each antenna has its own unique frequency, and each antenna terminal 63, 66 can transmit and receive on a one-to-one basis. Further, the substrate 65 is provided with a power supply terminal 68 for supplying power to the power supply terminal 64 of the IC chip 61 via the wire 67.

Further, on the substrate 65, two guide rods 69 for positioning the IC chip 61 are provided upright in the vicinity of the portion where the antenna terminal 66 is provided. Further, a hole 70 formed in the IC chip 61 is inserted into the guide rod 69 when the IC chip 61 is mounted.

As a result, the IC chip 6 is
1 can accurately set the distance from the surface of the substrate 65 and the position in the parallel plane, and the antenna terminals 63 and 66 for transmitting and receiving are positioned so as to correspond to each other exactly one to one so that they are in close proximity to each other. Become. Then, even weak radio waves can be stably communicated between the corresponding antenna terminals 63 and 66.

By constructing the connection device in this manner, repairability is improved, other chips can be easily replaced without damaging them, and the manufacturing process can be simplified.
Further, it is possible to reduce the defective rate of the IC chip 61, the package in which the IC chip 61 is mounted, and the like, and to significantly reduce the cost.

In this embodiment, the IC chip 61 and the substrate 65 are provided with a communication function using radio waves, but each is provided with an optical communication function, and the antenna terminals 63 and 66 are used for the optical communication antenna. Even if the light emitting portion and the light receiving portion that become the same are used, the same action and effect can be obtained.

Next, a sixth embodiment showing another one of the present invention will be described with reference to FIG. Figure 11
11 is a side view showing a mounted state. In FIG. 11, an IC chip 71 composed of a large scale integrated circuit (LSI), an integrated circuit (IC), etc.
2, a male side input / output terminal 73 is provided. The male input / output terminal 73 is made of a conductive material and has a tip portion formed into a substantially elliptical shape.

On the other hand, a board 74 such as a package or a wiring board is provided with female input / output terminals 75 corresponding to the male input / output terminals 73. Enter this female side
The output terminal 75 is made of an elastic material having conductivity and has a spring property, and when the IC chip 71 is mounted on the substrate 74, the male side input / output terminal 73 is engaged, and the output terminal 75 is electrically and mechanically strong. Securely connected. The female input / output terminal 75 retains its spring property without being deformed even when the IC chip 71 is removed from the substrate 74, and can be mounted again.

Since the connection device is configured in this manner, the repairability when the IC chip 71 is mounted on the substrate 74 is improved, and other chips can be easily replaced without damaging them, and the chips and the package can be easily replaced. It is possible to reduce the defect rate and to significantly reduce the cost.

Next, a seventh embodiment will be described with reference to FIG. FIG. 12 is a side view for explaining the mounting state,
In FIG. 12, the IC chip 76 is erected so that the male input / output terminal 78 is formed of a conductive material into a tapered columnar shape on a circuit forming surface 77 on which a circuit is formed.

On the other hand, a board 79 such as a package or a wiring board is provided with a cylindrical female input / output terminal 80 corresponding to the male input / output terminal 78. The female input / output terminal 80 is configured to have conductivity and elasticity, and the surface of the substrate 79 is filled with a space between the female input / output terminals 80 to provide female input / output terminals. 80
Therefore, an insulator 81 such as a polyimide resin is provided to surely give elasticity.

An IC is connected to the input / output terminal 80 on the female side.
When the chip 76 is mounted on the substrate 79, the male side input / output terminal 78 is engaged with the inner cylindrical portion of the chip 76 for reliable electrical and strength connection, and the IC chip 76 is removed from the substrate 79. In this case, the spring property is maintained without being deformed, and the mounting can be performed again.

The female input / output terminal 80 as described above is manufactured through a process similar to the manufacturing process of a semiconductor device, for example. That is, a metal film for forming the female input / output terminals 80 is deposited on the upper surface of the substrate 79 by a deposition process. A cylindrical female input / output terminal 80 is formed by using a semiconductor process such as etching the metal film or forming a pattern by EB. Then the substrate 79
An insulator 81 such as a polyimide resin is provided on the surface of the so as to fill up the periphery of the input / output terminal 80 on the female side.

The female input / output terminal 80 and the male input / output terminal 78 thus formed can be electrically connected to each other, and the size of the female input / output terminal 80 is , Can be defined as follows according to the metal deposited. ε = σ / E ε: Deformation amount σ: Elastic limit stress E: Longitudinal elastic modulus The elastic limit stress σ and the longitudinal elastic coefficient E are determined by the vapor-deposited material. The elastic limit stress σ does not exceed the female side. It is sufficient to determine the aspect ratio of the input / output terminal 80. However, this is not the case when it is possible to deform without requiring repair. Similarly, an insulator 81, such as a polyimide resin, is provided in order to give more reliable elasticity between the female input / output terminals 80. However, depending on the metal or the like used for the female input / output terminals 80, an insulator may be used. Need not be provided.

By constructing the connection device in this way, the repairability is improved, other chips can be easily replaced without damaging them, and the manufacturing process can be simplified. Further, it is possible to reduce the defective rate of chips and packages, and to significantly reduce the cost.

[0052]

As is apparent from the above description, according to the present invention, the following effects can be obtained. According to one aspect of the present invention, it is possible to increase the mounting density of an IC chip on a substrate, and to reduce the size, functionality, and speed of an electronic device or the like having an IC chip mounted thereon. In this case, the repair of the IC chip mounted on the substrate can be easily performed without adversely affecting other IC chips mounted on the substrate and the substrate. According to yet another aspect of the present invention, the package of the IC chip is stored. It is possible to increase the mounting density on the mounting board, and it is possible to miniaturize, increase the functionality, and increase the speed of electronic devices and the like in which the package is mounted.

[Brief description of drawings]

FIG. 1 is a perspective view of an IC chip according to a first embodiment of the present invention.

FIG. 2 is a plan view of a first IC chip group according to the first embodiment of the present invention.

FIG. 3 is a plan view showing a state in which a second IC chip group according to the first embodiment of the present invention is mounted.

FIG. 4 is a first IC chip according to a first embodiment of the present invention.
It is a top view which shows the modification of.

FIG. 5 is a second IC chip according to the first embodiment of the present invention.
It is a top view which shows the modification of.

FIG. 6 is a perspective view of an IC chip according to a second embodiment of the present invention.

FIG. 7 is a perspective view of an IC chip according to a third embodiment of the present invention.

FIG. 8 is a perspective view showing a mounted state of a package according to a fourth embodiment of the present invention.

FIG. 9 is a side view showing a mounted state of an IC chip according to a fifth embodiment of the present invention.

FIG. 10 is a perspective view showing a mounted state of an IC chip according to a fifth embodiment of the present invention.

FIG. 11 is a side view showing a mounted state of an IC chip according to a sixth embodiment of the present invention.

FIG. 12 is a side view for explaining a mounted state of an IC chip according to a seventh embodiment of the present invention.

FIG. 13 is a schematic side view showing a first conventional example.

FIG. 14 is a schematic side view showing a second conventional example.

FIG. 15 is a schematic side view showing a third conventional example.

[Explanation of symbols]

 21 ... IC chip 22 ... Circuit configuration surface 23 ... Facing surface 24 ... Side surface 25 ... Input / output terminal

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsu Ishizuka No. 1 Komukai Toshiba-cho, Saiwai-ku, Kawasaki-shi, Kanagawa Incorporated Toshiba Research and Development Center

Claims (5)

[Claims] 1. A semiconductor device connecting device configured to electrically connect input / output terminals of an IC chip to corresponding external terminals, wherein the input / output terminals are the ICs.
A connecting device for a semiconductor device, which is provided on a side surface of a chip or on a surface opposite to a circuit configuration surface of the IC chip, and is electrically connected by contacting with the external terminal. 2. A package containing an IC chip is inserted.
In a semiconductor device connecting device configured to electrically connect an output terminal to a corresponding external terminal, the input / output terminal is provided on a side surface of the package or the package upper surface or lower surface, and A connecting device for a semiconductor device, wherein the connecting device is electrically connected by being brought into contact with an external terminal. 3. A connection device of a semiconductor device configured to exchange a predetermined signal between an input / output terminal of an IC chip and a corresponding external terminal, wherein the input / output terminal and the external terminal are A connection device for a semiconductor device, which has a communication function and is provided with a predetermined gap between the terminals. 4. The connection device for a semiconductor device according to claim 3, wherein the communication function is an optical communication function. 5. A connecting device for a semiconductor device, configured to connect input / output terminals of an IC chip to corresponding external terminals, wherein the input / output terminals and the external terminals are detachable. A connection device for a semiconductor device, wherein the connection device is connected by.