JPH07201265A - Thin type fuse - Google Patents

Thin type fuse

Info

Publication number
JPH07201265A
JPH07201265A JP34980493A JP34980493A JPH07201265A JP H07201265 A JPH07201265 A JP H07201265A JP 34980493 A JP34980493 A JP 34980493A JP 34980493 A JP34980493 A JP 34980493A JP H07201265 A JPH07201265 A JP H07201265A
Authority
JP
Japan
Prior art keywords
strip
area
melting point
low melting
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34980493A
Other languages
Japanese (ja)
Other versions
JP3304179B2 (en
Inventor
Toshiaki Kawanishi
俊朗 川西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Priority to JP34980493A priority Critical patent/JP3304179B2/en
Publication of JPH07201265A publication Critical patent/JPH07201265A/en
Application granted granted Critical
Publication of JP3304179B2 publication Critical patent/JP3304179B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To provide such a thin type fuse as having excellent sealing property against inner pressure and operativeness by bridging a low melting point fusible metal strip between the exposed portions of band conductors and applying an insulating layer on the surface of an insulating plate. CONSTITUTION:The ratio S1/S0 of the contact area S0 of an insulating plate 1 with a band conductor 2 to the area S1 of the exposed portion 22 of the band conductor 2 is set 0.01-0.2 and the ratio S2/S1 of the area S2 of the exposed portion 22 of the band conductor 2 when jointed to a low melting point fusible metal strip 3 to the area S1 is set 0.7 or lower. A relationship (S1+S2)L>=4 holds among an interval L between the exposed portions of the band conductors, the Volume V of the low melting point fusible metal strip, the area S1 of the exposed portion of the band conductor and the area S2 of the exposed portion of the band conductor when jointed to the low melting point fusible metal strip.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は薄型ヒュ−ズ、例えば、
合金型の薄型温度ヒュ−ズに関するものである。
BACKGROUND OF THE INVENTION The present invention relates to thin fuses, for example,
The present invention relates to an alloy type thin temperature fuse.

【0002】[0002]

【従来の技術】合金型温度ヒュ−ズにおいては、保護し
ようとする電気機器に取り付けて使用され、当該電気機
器が過電流により発熱すると、その発生熱がヒュ−ズエ
レメントである低融点可溶金属片に伝達され、該低融点
可溶金属片が溶断されて電気機器への通電が遮断され、
当該電気機器の異常発熱、ひいては、火災の発生が未然
に防止される。
2. Description of the Related Art In an alloy type temperature fuse, it is used by being attached to an electric device to be protected, and when the electric device generates heat due to an overcurrent, the generated heat is melted by a low melting point which is a fuse element. It is transmitted to the metal piece, the low melting point metal piece is melted and the electric power to the electric equipment is cut off,
It is possible to prevent abnormal heat generation of the electric device and eventually a fire.

【0003】この合金型温度ヒュ−ズにおいては、低融
点可溶金属片上に該金属片よりも低融点のフラツクスが
塗布されており、上記溶融された低融点可溶金属が既に
溶融されたフラックスとの共存下、界面エネルギ−によ
り球状化され、この球状化の進行により溶融金属が分断
され、この分断間に発生したア−クがその分断間の距離
の増大により消滅すると、通電が遮断され、上記の通電
遮断が完了され、その後の電気機器の冷却に伴い分断溶
融金属が冷却固化される。
In this alloy type temperature fuse, a flux having a melting point lower than that of the metal piece is applied onto the low melting point fusible metal piece, and the molten low melting point fusible metal is already melted. Under the coexistence with, the spheroidization is caused by the interfacial energy, the molten metal is divided by the progress of the spheroidization, and when the arc generated during this division disappears due to the increase in the distance between the divisions, the current is cut off. The above-mentioned interruption of energization is completed, and the divided molten metal is cooled and solidified as the electric equipment is cooled.

【0004】上記溶融ヒュ−ズエレメントの球状化分断
においては、リ−ド線端部または電極に対する溶融金属
の接触角が小さく、溶融金属がリ−ド線端部または電極
によく濡れることが、その分断促進に大きく寄与する。
In the spheroidization of the molten fuse element, the contact angle of the molten metal to the lead wire end or the electrode is small, and the molten metal is often wetted to the lead wire end or the electrode. It greatly contributes to the promotion of the division.

【0005】上記溶融ヒュ−ズエレメントの球状化分断
においては、ア−ク熱によるフラックスの蒸気化、ヒュ
−ズエレメントの蒸気化により内圧が発生する。また、
電気機器の負荷電流の通電、停止に基づくヒ−トサイク
ルのために、温度ヒュ−ズの作動温度よりも温度範囲内
で繰返し加熱され、フラックスが膨張されて内圧を発生
することもある。従って、合金型温度ヒュ−ズにおける
絶縁被覆は、これらの内圧に耐え得るように施すことが
必要である。
In the spheroidization of the molten fuse element, internal pressure is generated due to vaporization of flux by arc heat and vaporization of the fuse element. Also,
Due to a heat cycle based on turning on and off of a load current of an electric device, the flux may be repeatedly heated within a temperature range higher than the operating temperature of the temperature fuse to expand the flux to generate an internal pressure. Therefore, the insulating coating in the alloy type temperature fuse must be applied so as to withstand these internal pressures.

【0006】近来、電気機器の小型化に伴い、ヒュ−ズ
においても、小型、薄型化が要求されている。而るに、
本発明者においては、絶縁プレ−トの裏面に一対の帯状
導体の各端部を当接し、これら各端部のほぼ中央部を同
上絶縁プレ−トの表面に表出させると共に絶縁プレ−ト
と帯状導体との間を接着し、前記帯状導体表出部間にヒ
ュ−ズエレメント(低融点可溶金属片)を橋設し、絶縁
プレ−トの表面上に絶縁層を被覆した薄型ヒュ−ズを既
に提案した。
With the recent miniaturization of electrical equipment, the fuses are also required to be smaller and thinner. However,
In the present inventor, each end portion of the pair of strip-shaped conductors is brought into contact with the back surface of the insulating plate, and the substantially central portion of each end portion is exposed on the surface of the insulating plate and the insulating plate. And a band-shaped conductor are adhered to each other, a fuse element (low melting point fusible metal piece) is bridged between the exposed parts of the band-shaped conductor, and an insulating layer is coated on the surface of the insulating plate. -I have already proposed.

【0007】[0007]

【発明が解決しようとする課題】この薄型ヒュ−ズにお
いては、上記した機器のヒ−トサイクルに基づくフラッ
クスの膨張、温度ヒュ−ズ作動時のフラックスの蒸気化
またはヒュ−ズエレメントの蒸気化による内圧に対する
漏洩経路として、帯状導体表出部と絶縁プレ−トとの境
界を経て絶縁プレ−トと帯状導体との間の接着界面を通
過する経路があり、その内圧に対するシ−ル性を確保す
るために、絶縁プレ−トと帯状導体との間の接着面積を
相当に大きくする必要があり、帯状導体表出部がかなり
小さくなることが避けられない。
In this thin fuse, expansion of the flux based on the heat cycle of the above-mentioned equipment, vaporization of the flux during operation of the temperature fuse, or vaporization of the fuse element. As a leakage path against internal pressure due to the internal pressure, there is a path that passes through the boundary between the exposed portion of the strip-shaped conductor and the insulating plate and passes through the adhesive interface between the insulating plate and the strip-shaped conductor. In order to secure it, it is necessary to considerably increase the adhesion area between the insulating plate and the strip conductor, and it is inevitable that the exposed portion of the strip conductor becomes considerably small.

【0008】しかしながら、帯状導体表出部の面積が小
さくなると、ヒュ−ズ作動時に溶融ヒュ−ズエレメント
が帯状導体表出部に濡れる量が少なくなり、溶融ヒュ−
ズエレメントの球状化分断が生じ難くなり、温度ヒュ−
ズの作動性低下が惹起されるに至る。
However, when the area of the exposed portion of the strip-shaped conductor is reduced, the amount of the molten fuse element wetted by the exposed portion of the strip-shaped conductor is reduced during the operation of the fuse, and the fused fuse is melted.
Spherical element splitting is less likely to occur and temperature
This leads to a decrease in the operability of the mouse.

【0009】本発明の目的は、絶縁プレ−トの裏面に一
対の帯状導体の各端部を当接し、これら各端部のほぼ中
央部を同上絶縁プレ−トの表面に表出させると共に絶縁
プレ−トと帯状導体との間を接着し、前記帯状導体表出
部間に低融点可溶金属片を橋設し、絶縁プレ−トの表面
上に絶縁層を被覆した薄型のヒュ−ズにおいて、機器の
ヒ−トサイクルに基づくフラックスの膨張、温度ヒュ−
ズ作動時のフラックスの蒸気化またはヒュ−ズエレメン
トの蒸気化による内圧に対するシ−ル性並びに作動性に
優れた薄型ヒュ−ズを提供することにある。
An object of the present invention is to bring the ends of a pair of strip-shaped conductors into contact with the back surface of the insulating plate so that the substantially central portions of these ends are exposed on the surface of the same insulating plate. A thin fuse in which a plate and a band-shaped conductor are bonded to each other, a low melting point fusible metal piece is bridged between the exposed parts of the band-shaped conductor, and an insulating layer is coated on the surface of the insulating plate. At the same time, the expansion of the flux and the temperature
It is an object of the present invention to provide a thin fuse having excellent sealability and operability against internal pressure due to vaporization of flux during vaporization operation or vaporization of a fuse element.

【0010】[0010]

【課題を解決するための手段】本発明の薄型ヒュ−ズ
は、絶縁プレ−トの裏面に一対の帯状導体の各端部を当
接し、これら各端部のほぼ中央部を同上絶縁プレ−トの
表面に表出させると共に絶縁プレ−トと帯状導体との間
を接着し、前記の帯状導体表出部間に低融点可溶金属片
を橋設し、絶縁プレ−トの表面上に絶縁層を被覆したヒ
ュ−ズにおいて、上記絶縁プレ−トと帯状導体との接着
面積S0と帯状導体表出部面積S1との比S1/S0を0.
01〜0.2とし、帯状導体表出部における低融点可溶
金属片を接合した部分の面積S2と前記面積S1との比S
2/S1を0.7以下とし、帯状導体表出部間の間隔L、
低融点可溶金属片の体積V、帯状導体表出部面積S1
びに帯状導体表出部における低融点可溶金属片を接合し
た部分の面積S2との間には、(S1+S2)L≧4.7
Vの関係を付与したことを特徴とする構成である。
According to the thin fuse of the present invention, the ends of a pair of strip-shaped conductors are brought into contact with the back surface of the insulating plate, and substantially the center of each of these ends is the same as the insulating plate. On the surface of the insulating plate and bonding the insulating plate and the band-shaped conductor to each other, and bridging a low melting point metal piece between the exposed parts of the band-shaped conductor. In the fuse covered with the insulating layer, the ratio S 1 / S 0 of the adhesive area S 0 between the insulating plate and the strip conductor and the strip conductor exposed area S 1 was set to 0.
01 to 0.2, and the ratio S of the area S 2 of the portion of the strip-shaped conductor exposed portion where the low melting point soluble metal piece is joined to the area S 1
2 / S 1 is 0.7 or less, the interval L between the exposed portions of the strip conductor,
Between the volume V of the low melting point soluble metal piece, the area S 1 of the strip-shaped conductor exposed portion and the area S 2 of the portion of the striped conductor exposed portion where the low melting point soluble metal piece is joined, (S 1 + S 2 ) L ≧ 4.7
The configuration is characterized in that the relationship of V is added.

【0011】以下、本発明の構成を図面を参照しつつ詳
細に説明する。図1の(イ)は本発明の構成の一例を示
す断面説明図、図1の(ロ)は同じく平面説明図、図1
の(ハ)は同じく底面説明図である。図1の(イ)乃至
図1の(ハ)において、1は熱可塑性プラスチックから
なる絶縁プレ−トである。2,2は一対の帯状導体であ
り、各導体端部21を絶縁プレ−ト1の裏面に当接し、
その当接端部21のほぼ中央に形成した膨出部22を絶
縁プレ−ト1の表面に表出させると共に、絶縁プレ−ト
1と帯状導体2との接触面を接着してある。この絶縁プ
レ−ト1の裏面に当接される帯状導体端部21の長さ
は、通常、帯状導体巾の0.5〜3倍とされ、また、膨
出部22の形状は、必ずしも四角形に限定されないが、
四角形の場合、長さ/巾の比が1〜3.5とされる。こ
の絶縁プレ−ト1と帯状導体2との間の接着面積S0
帯状導体表出部面積S1との比S1/S0を0.01〜
0.2としてある。
The configuration of the present invention will be described below in detail with reference to the drawings. 1A is a cross-sectional explanatory view showing an example of the configuration of the present invention, and FIG.
Similarly, (C) is a bottom view. In FIGS. 1A to 1C, 1 is an insulating plate made of a thermoplastic. 2 and 2 are a pair of strip-shaped conductors, and each conductor end portion 21 is brought into contact with the back surface of the insulating plate 1,
A bulging portion 22 formed substantially in the center of the abutting end portion 21 is exposed on the surface of the insulating plate 1 and the contact surface between the insulating plate 1 and the strip conductor 2 is adhered. The length of the strip-shaped conductor end portion 21 abutting on the back surface of the insulating plate 1 is usually 0.5 to 3 times the strip-shaped conductor width, and the shape of the bulging portion 22 is not necessarily rectangular. But is not limited to
In the case of a quadrangle, the length / width ratio is 1 to 3.5. The ratio S 1 / S 0 of the adhesion area S 0 between the insulating plate 1 and the strip conductor 2 to the strip conductor exposed portion area S 1 is 0.01 to.
It is set as 0.2.

【0012】3は帯状導体表出部22,22間に溶接ま
たはろう接により橋設した低融点可溶金属片であり、帯
状導体表出部22における低融点可溶金属片3を接合し
た部分の面積S2と前記面積S1との比S2/S1を0.7
以下としてある。また、帯状導体表出部22,22間の
間隔L、低融点可溶金属片3の体積V、帯状導体表出部
面積S1並びに帯状導体表出部における低融点可溶金属
片を接合した部分の面積S2との間には、6000>
(S1+S2)L/V≧4.7の関係を付与してある。4
は低融点可溶金属片上に塗布したフラックスである。5
は絶縁プレ−ト1の表面側に被覆した絶縁層であり、熱
可塑性プラスチックフイルムの熱融着により設けること
ができる。
Reference numeral 3 denotes a low melting point fusible metal piece bridged by welding or brazing between the strip-shaped conductor exposed portions 22 and 22. The low melting point fusible metal piece 3 in the strip-shaped conductor exposed portion 22 is joined. an area S 2 and a ratio S 2 / S 1 between said area S 1 0.7
It is as below. Further, the interval L between the strip-shaped conductor exposed portions 22 and 22, the volume V of the low-melting point soluble metal piece 3, the strip-shaped conductor exposed portion area S 1 and the low-melting point soluble metal piece in the strip-shaped conductor exposed portion were joined. Between the area S 2 of the part, 6000>
The relationship of (S 1 + S 2 ) L / V ≧ 4.7 is given. Four
Is the flux applied on the low melting point metal piece. 5
Is an insulating layer coated on the surface side of the insulating plate 1 and can be provided by heat fusion of a thermoplastic film.

【0013】上記の熱可塑性プラスチックからなる絶縁
プレ−ト1並びに絶縁被覆5用の熱可塑性プラスチック
フイルムには、ポリエチレン、塩化ビニル、ポリプロピ
レン、ポリスチレン、エチレン−プロピレン、ポリイミ
ド、ポリエチレンテレフタレ−ト等を使用でき、絶縁プ
レ−トと絶縁被覆用の熱可塑性プラスチックフイルムと
に同材質のものを使用することが好ましいが、異種材質
のものの使用も可能である。
As the thermoplastic film for the insulating plate 1 and the insulating coating 5 made of the above thermoplastics, polyethylene, vinyl chloride, polypropylene, polystyrene, ethylene-propylene, polyimide, polyethylene terephthalate, etc. are used. It is preferable to use the same material for the insulating plate and the thermoplastic film for insulating coating, but it is also possible to use different materials.

【0014】上記の帯状導体2には、銅の単一体、また
は、図2に示すように、絶縁プレ−トの裏面に当接され
る面を銅201とし、他の部分202を異種の金属、例
えば、ニッケルとした複合体を使用することもできる。
In the above-mentioned strip-shaped conductor 2, a single body of copper, or, as shown in FIG. 2, the surface abutting against the back surface of the insulating plate is copper 201 and the other portion 202 is made of a different metal. It is also possible to use a composite with nickel, for example.

【0015】上記絶縁プレ−トへの帯状導体表出部端部
の接着には、帯状導体端部に膨出部をプレス加工し、ま
た絶縁プレ−トにこの膨出部よりもやや小さい孔を穿設
し、帯状導体端部を絶縁プレ−ト裏面に当接し、帯状導
体端部の膨出部を絶縁プレ−トの孔に嵌めると共に両者
の接触面を加圧熱融着する方法、帯状導体端部に膨出部
をプレス加工し、帯状導体端部を絶縁プレ−ト裏面に当
接し、加熱下でプレス加圧して膨出部を絶縁プレ−トの
表面に向け食い込ませると共に絶縁プレ−トと帯状導体
とを熱融着し、研削によって表出部上の樹脂を除去し、
表出部を表出させる方法等、これらの方法に対し、絶縁
プレ−トと帯状導体との間を熱融着することに代え、接
着剤で接着する方法等を使用できる。
In order to bond the end portion of the strip-shaped conductor exposed portion to the insulating plate, a swollen portion is pressed on the end portion of the strip-shaped conductor, and a hole slightly smaller than the swollen portion is formed in the insulating plate. A method of contacting the end portion of the strip-shaped conductor with the back surface of the insulating plate, fitting the bulging portion of the end portion of the strip-shaped conductor into the hole of the insulating plate, and pressing and heat-sealing both contact surfaces, The bulging part is pressed on the end of the band-shaped conductor, the end of the band-shaped conductor is brought into contact with the back surface of the insulating plate, and pressed under heat to press the bulged part toward the surface of the insulating plate and insulate it. The plate and the belt-shaped conductor are heat-sealed, and the resin on the exposed portion is removed by grinding,
In contrast to these methods such as the method of exposing the exposed portion, instead of heat-sealing the insulating plate and the band-shaped conductor, a method of bonding with an adhesive can be used.

【0016】本発明の上記の構成例は、帯状導体(リ−
ド導体としての役目を営む)を一直線状に配設した、所
謂、アクシャルタイプであるが、図3に示すように、帯
状導体を平行に配設したラジァルタイプとすることもで
きる。図3において、1は絶縁プレ−トを、2,2は一
対の帯状導体を、21は各帯状導体2の端部を、22は
各端部のほぼ中央の帯状導体表出部を、3は低融点可溶
金属片を、4は低融点可溶金属片に塗布したフラックス
を、5は絶縁プレ−トの表面側に被覆した絶縁層をそれ
ぞれ示し、絶縁プレ−ト1と各帯状導体2との間の接着
面積S0と帯状導体表出部面積S1との比S1/S0を0.
01〜0.2とし、帯状導体表出部における低融点可溶
金属片を接合した部分の面積S2と前記面積S1との比S
2/S1を0.7以下とし、また、帯状導体表出部間の間
隔L、低融点可溶金属片の体積V、帯状導体表出部面積
1並びに帯状導体表出部における低融点可溶金属片を
接合した部分の面積S2との間には、6000>(S1
2)L/V≧4.7の関係を付与してある。
The above-described configuration example of the present invention is a strip-shaped conductor (lead).
Is a so-called axial type in which the strip conductors are arranged in a straight line, but a radial type in which strip conductors are arranged in parallel can be used as shown in FIG. In FIG. 3, 1 is an insulating plate, 2 and 2 are a pair of strip-shaped conductors, 21 is an end of each strip-shaped conductor 2, and 22 is a substantially central strip-shaped conductor exposed portion of each end. Is a low melting point soluble metal piece, 4 is a flux applied to the low melting point soluble metal piece, and 5 is an insulating layer coated on the surface side of the insulating plate. Insulating plate 1 and each strip-shaped conductor The ratio S 1 / S 0 of the adhesion area S 0 between the surface of the belt-shaped conductor and the exposed area S 1 of the strip-shaped conductor is set to 0.
01 to 0.2, and the ratio S of the area S 2 of the portion of the strip-shaped conductor exposed portion where the low melting point soluble metal piece is joined to the area S 1
2 / S 1 is 0.7 or less, and the interval L between the strip-shaped conductor exposed portions, the volume V of the low melting point fusible metal piece, the strip-shaped conductor exposed portion area S 1 and the low-melting point in the strip-shaped conductor exposed portion Between the area S 2 of the portion where the soluble metal pieces are joined, 6000> (S 1 +
The relationship of S 2 ) L / V ≧ 4.7 is given.

【0017】[0017]

【作用】機器のヒ−トサイクルに基づくフラックスの膨
張、ヒュ−ズ作動時のフラックス4の蒸気化またはヒュ
−ズエレメント(低融点可溶金属片)3の蒸気化により
内圧が発生し、帯状導体表出部22の周囲と絶縁プレ−
ト1との境界より絶縁プレ−ト1と帯状導体2との間の
接着界面を経て漏洩が生じようとしても、絶縁プレ−ト
1と帯状導体2との接着面積S0と帯状導体表出部面積
1との比S1/S0を0.01〜0.2として、帯状導
体表出部22を囲む絶縁プレ−ト1と帯状導体2との間
の接着界面を充分に広くし、帯状導体表出部22の前後
・左右の接着距離(シ−ル距離)を充分に長くしてある
から、そのような漏洩をよく防止できる。
Function: Expansion of the flux based on the heat cycle of the equipment, vaporization of the flux 4 at the time of fuse operation, or vaporization of the fuse element (low melting point soluble metal piece) 3 causes an internal pressure, resulting in a strip shape. Around the conductor exposed portion 22 and the insulation
Even if leakage occurs from the boundary with the insulating plate 1 through the adhesive interface between the insulating plate 1 and the band-shaped conductor 2, the bonding area S 0 between the insulating plate 1 and the band-shaped conductor 2 and the band-shaped conductor expression. The ratio S 1 / S 0 to the partial area S 1 is set to 0.01 to 0.2 to sufficiently widen the adhesive interface between the insulating plate 1 surrounding the strip-shaped conductor exposed portion 22 and the strip-shaped conductor 2. Since the front and rear and left and right bonding distances (sealing distances) of the strip-shaped conductor exposed portions 22 are sufficiently long, such leakage can be prevented well.

【0018】また、ヒュ−ズ作動時、溶融した低融点可
溶金属片が溶融フラックスとの共存下、界面エネルギ−
により球状化され、帯状導体表出部22に溶融金属が濡
れ現象により引っ張られつつ、球状化分断が進行してい
き、この場合、上記したように絶縁プレ−ト1と帯状導
体2との間の接着面積を広くした結果、帯状導体表出部
22の面積が相当に小さくなり、帯状導体表出部22へ
の溶融金属の濡れに対し消極的な要因となるが、帯状導
体表出部22における低融点可溶金属片3を接合した部
分の面積S2と前記面積S1との比S2/S1を0.7以下
とし、この条件に加え、好ましくは、帯状導体表出部間
の間隔L、低融点可溶金属片の体積V、帯状導体表出部
面積S1並びに帯状導体表出部における低融点可溶金属
片を接合した部分の面積S2との間に、(S1+S2)L
/V≧4.7の関係を付与して、帯状導体表出部が小さ
くても、溶融金属の分断を充分迅速に生じさせるように
してあるから、良好な作動速度を保障できる。このこと
は、次に述べる実施例の作動試験結果から明らかであ
る。なお、6000>(S1+S2)L/Vは、絶縁プレ
−トの小型性を保障するための条件であり、内圧に対す
るシ−ル性並びに作動性を小型化を保障しつつ、達成で
きる。ヒュ−ズの作動は、低融点可溶金属片がその融点
Tに達した時、即ち、低融点可溶金属片のジュ−ル発熱
に基づく温度上昇をΔt1、機器発生熱の受熱に基づく
低融点可溶金属片の温度上昇をΔt2、周囲温度をt0
すれば、t0+Δt1+Δt2=Tの時であり、通電電流
が大であると、Δt1が大となり、Δt2が比較的小のも
とで、ヒュ−ズが作動し、この場合、通電電流が大であ
ってア−クエネルギ−高くなる結果、上記の内圧が特に
高圧となるが、かかる場合でも、絶縁プレ−ト1並びに
絶縁被覆5用の熱可塑性プラスチックフイルム特に、絶
縁被覆5用の熱可塑性プラスチックフイルムの優れた可
撓性(膨張性)のために、内圧をよく吸収でき、上記優
れたシ−ル性と相俟ってヒュ−ズを爆裂を回避して安全
に保持できる。
During operation of the fuse, the melted low melting point metal piece coexists with the molten flux to reduce the interfacial energy.
The molten metal is spheroidized due to the wetting phenomenon and the spheroidization is progressed while the molten metal is pulled by the wetting phenomenon. In this case, between the insulating plate 1 and the strip-shaped conductor 2 as described above. As a result of widening the bonding area of the strip conductor, the area of the strip conductor exposed portion 22 becomes considerably small, which becomes a negative factor against the wetting of molten metal to the strip conductor exposed portion 22. the ratio S 2 / S 1 between the area S 2 of the portion joining the low-melting-soluble metal piece 3 and the area S 1 is 0.7 or less in addition to this condition, preferably, between strip conductor exposed portion Between the distance L, the volume V of the low melting point soluble metal piece, the area S 1 of the strip-shaped conductor exposed portion and the area S 2 of the portion where the low melting point soluble metal piece is joined in the strip-shaped conductor exposed portion, (S 1 + S 2 ) L
The relationship of /V≧4.7 is given so that even if the exposed portion of the strip-shaped conductor is small, the molten metal is fragmented sufficiently quickly, so that a good operating speed can be guaranteed. This is clear from the operation test results of the examples described below. It should be noted that 6000> (S 1 + S 2 ) L / V is a condition for ensuring the compactness of the insulating plate, and it is possible to achieve sealability and operability against internal pressure while ensuring miniaturization. . The operation of the fuse is when the low melting point metal piece reaches its melting point T, that is, the temperature rise due to the Jule heat generation of the low melting point metal piece is Δt 1 , and the heat generated by the equipment is received. If the temperature rise of the low melting point soluble metal piece is Δt 2 and the ambient temperature is t 0 , then t 0 + Δt 1 + Δt 2 = T, and if the energizing current is large, Δt 1 becomes large, and Δt 1 becomes large. The fuse operates when 2 is relatively small, and in this case, the energizing current is large and the arc energy is high, and as a result, the above internal pressure becomes particularly high. The thermoplastic film for the plate 1 and the insulating coating 5 can absorb internal pressure well due to the excellent flexibility (expandability) of the thermoplastic film for the insulating coating 5, and the above-mentioned excellent sheet. Combined with the flexibility, the fuse can be held safely by avoiding explosion.

【0019】[0019]

【実施例】以下の何れの実施例においても、絶縁プレ−
トには長さ10.5mm、巾:6mm、厚み:0.19
mmのポリエチレンテレフタレ−トフィルムを、帯状導
体には、巾:3.5mm、厚み:0.1mmの図2に示
す銅−ニツケル複合体をそれぞれ使用し、各帯状導体の
絶縁プレ−ト裏面への接触長さは4.85mmとした。
温度ヒュ−ズの製造においては、帯状導体の端部の中央
部に膨出部をプレス成形し、絶縁プレ−トにこの膨出部
よりもやや小さい孔を穿設し、帯状導体端部を絶縁プレ
−ト裏面に当接し、帯状導体端部の膨出部を絶縁プレ−
トの孔にはめると共に両者の接触面を加圧熱融着して絶
縁プレ−トに帯状導体の端部を取付け、厚さ:0.19
mmのポリエチレンテレフタレ−トフィルムを上記絶縁
プレ−ト表面の周囲において熱融着して絶縁被覆を施し
た。
EXAMPLES In any of the following examples, the insulation
The length is 10.5 mm, width: 6 mm, thickness: 0.19
mm polyethylene terephthalate film, and for the strip-shaped conductor, the copper-nickel composite shown in FIG. 2 having a width of 3.5 mm and a thickness of 0.1 mm is used, respectively, and is applied to the back surface of the insulating plate of each strip-shaped conductor. The contact length was 4.85 mm.
In manufacturing the temperature fuse, a bulging portion is press-formed in the center of the end portion of the strip-shaped conductor, a hole slightly smaller than the bulging portion is formed in the insulating plate, and the end portion of the strip-shaped conductor is formed. Abut the back surface of the insulating plate and connect the bulging part of the end of the strip conductor to the insulating plate.
To the end of the strip-shaped conductor on the insulating plate by press-fitting the contact surfaces of the both and attaching it to the hole of the belt.
A mm mm polyethylene terephthalate film was heat fused around the surface of the insulating plate to provide an insulating coating.

【0020】実施例における各部の寸法は、図4に示す
通りである。図4において、a1並びにb1は、帯状導体
表出部22の長さ並びに巾を、、Lは帯状導体表出部2
2,22間の間隔を、h並びにdは使用した低融点可溶
金属片(丸線)3の長さ並びに直径をそれぞれ示してい
る。
The dimensions of each part in the embodiment are as shown in FIG. In FIG. 4, a 1 and b 1 are the length and width of the strip-shaped conductor exposed portion 22, and L is the strip-shaped conductor exposed portion 2.
The distance between 2 and 22 and h and d respectively indicate the length and diameter of the low melting point fusible metal piece (circle line) 3 used.

【0021】実施例1 a1:1.62mm、b1:0.8mmであり、帯状導体
表出部面積S1は1.296mm2である。帯状導体表出
部における低融点可溶金属片を接合した部分の面積S2
は0.781mm2である。低融点可溶金属片(共晶合
金)の融点は93℃であり、Lは2.5mmである。
h:6.0mm、d:0.446mmであり、Vは0.
937mm3である。従って、S1/S0は0.08であ
り、S2/S1は0.60であり、(S1+S2)L/V=
5.4>4.7である。
Example 1 a 1 : 1.62 mm, b 1 : 0.8 mm, and the area S 1 of the strip-shaped conductor exposed portion was 1.296 mm 2 . Area S 2 of the portion where the low melting point soluble metal piece is joined in the exposed portion of the strip conductor
Is 0.781 mm 2 . The melting point of the low melting point fusible metal piece (eutectic alloy) is 93 ° C., and L is 2.5 mm.
h: 6.0 mm, d: 0.446 mm, and V is 0.
It is 937 mm 3 . Therefore, S 1 / S 0 is 0.08, S 2 / S 1 is 0.60, and (S 1 + S 2 ) L / V =
5.4> 4.7.

【0022】比較例1 a1:1.62mm、b1:0.8mmであり、帯状導体
表出部面積S1は0.845mm2である。帯状導体表出
部における低融点可溶金属片を接合した部分の面積S2
は0.781mm2である。低融点可溶金属片(共晶合
金)の融点は93℃であり、Lは2.5mmである。
h:6.0mm、d:0.446mmであり、Vは0.
937mm3である。従って、S1/S0は0.04であ
り、S2/S1は0.92であり、(S1+S2)L/V=
4.3<4.7である。
Comparative Example 1 a 1 : 1.62 mm, b 1 : 0.8 mm, and the strip conductor exposed portion area S 1 was 0.845 mm 2 . Area S 2 of the portion where the low melting point soluble metal piece is joined in the exposed portion of the strip conductor
Is 0.781 mm 2 . The melting point of the low melting point fusible metal piece (eutectic alloy) is 93 ° C., and L is 2.5 mm.
h: 6.0 mm, d: 0.446 mm, and V is 0.
It is 937 mm 3 . Therefore, S 1 / S 0 is 0.04, S 2 / S 1 is 0.92, and (S 1 + S 2 ) L / V =
4.3 <4.7.

【0023】実施例1と比較例1につき、各試料数50
箇を微小電流を通電した状態で、温度94℃のオイル浴
に浸漬し、浸漬後20秒以内に電流が遮断される箇数を
測定したところ、実施例品においては、100%合格で
あり、不合格は0箇であったが、比較例品では、17%
が不合格であった。
50 samples for each of Example 1 and Comparative Example 1
The test pieces were immersed in an oil bath at a temperature of 94 ° C. in a state where a small amount of electric current was applied, and the number of cut-off currents was measured within 20 seconds after the immersion. Although the number of rejects was 0, it was 17% for the comparative example product.
Was rejected.

【0024】実施例2 a1:1.39mm、b1:0.5mmであり、帯状導体
表出部面積S1は0.695mm2である。帯状導体表出
部における低融点可溶金属片を接合した部分の面積S2
は0.332mm2である。低融点可溶金属片(共晶合
金)の融点は88℃であり、Lは3.5mmである。
h:5.0mm、d:0.446mmであり、Vは0.
767mm3である。従って、S1/S0は0.04であ
り、S2/S1は0.48であり、(S1+S2)L/V=
4.7である。
Example 2 a 1 : 1.39 mm, b 1 : 0.5 mm, and the strip conductor exposed surface area S 1 was 0.695 mm 2 . Area S 2 of the portion where the low melting point soluble metal piece is joined in the exposed portion of the strip conductor
Is 0.332 mm 2 . The melting point of the low melting point fusible metal piece (eutectic alloy) is 88 ° C., and L is 3.5 mm.
h: 5.0 mm, d: 0.446 mm, and V is 0.
It is 767 mm 3 . Therefore, S 1 / S 0 is 0.04, S 2 / S 1 is 0.48, and (S 1 + S 2 ) L / V =
It is 4.7.

【0025】比較例2 a1:1.39mm、b1:0.5mmであり、帯状導体
表出部面積S1は0.695mm2である。帯状導体表出
部における低融点可溶金属片を接合した部分の面積S2
は0.442mm2である。低融点可溶金属片(共晶合
金)の融点は88℃であり、Lは3.0mmである。
h:5.0mm、d:0.446mmであり、Vは0.
767mm3である。従って、S1/S0は0.04であ
り、S2/S1は0.64であり、(S1+S2)L/V=
4.4<4.7である。
Comparative Example 2 a 1 : 1.39 mm, b 1 : 0.5 mm, and the strip conductor exposed portion area S 1 was 0.695 mm 2 . Area S 2 of the portion where the low melting point soluble metal piece is joined in the exposed portion of the strip conductor
Is 0.442 mm 2 . The melting point of the low melting point fusible metal piece (eutectic alloy) is 88 ° C., and L is 3.0 mm.
h: 5.0 mm, d: 0.446 mm, and V is 0.
It is 767 mm 3 . Therefore, S 1 / S 0 is 0.04, S 2 / S 1 is 0.64, and (S 1 + S 2 ) L / V =
4.4 <4.7.

【0026】実施例2と比較例2につき、各試料数50
箇を微小電流を通電した状態で、温度89℃のオイル浴
に浸漬し、浸漬後20秒以内に電流が遮断される箇数を
測定したところ、実施例品においては、100%合格で
あり、不合格は0箇であったが、比較例品では、43%
が不合格であった。
50 samples for each of Example 2 and Comparative Example 2
The test pieces were immersed in an oil bath at a temperature of 89 ° C. in a state where a small amount of electric current was applied, and the number of cut-off currents was measured within 20 seconds after the immersion. Although the number of rejects was 0, it was 43% for the comparative example product.
Was rejected.

【0027】[0027]

【発明の効果】本発明は、絶縁プレ−トの裏面に一対の
帯状導体の各端部を当接し、これら各端部のほぼ中央部
を同上絶縁プレ−トの表面に表出させると共に絶縁プレ
−トと帯状導体との間を接着し、前記の帯状導体表出部
間に低融点可溶金属片を橋設し、絶縁プレ−トの表面上
に絶縁層を被覆したヒュ−ズにおいて、絶縁プレ−トと
帯状導体との接着面積を充分に広くして内圧に対するシ
−ル性を保障しているから、機器のヒ−トサイクルに基
づくフラックスの膨張、ヒュ−ズ作動時のフラックスの
蒸気化またはヒュ−ズエレメントの蒸気化による内圧
下、漏洩をよく防止できる。
According to the present invention, the ends of the pair of strip-shaped conductors are brought into contact with the back surface of the insulating plate so that the substantially central portions of these ends are exposed on the surface of the insulating plate and insulated. In a fuse in which a plate and a band-shaped conductor are bonded to each other, a low melting point fusible metal piece is bridged between the exposed parts of the band-shaped conductor, and an insulating layer is coated on the surface of the insulating plate. Since the adhesive area between the insulating plate and the band-shaped conductor is wide enough to ensure the sealing property against the internal pressure, the expansion of the flux based on the heat cycle of the equipment and the flux at the time of fuse operation It is possible to well prevent leakage under the internal pressure due to the vaporization of or the fuse element.

【0028】そして、絶縁プレ−トと帯状導体との接着
面積を充分に広くしているために、帯状導体表出部の面
積が小となり、ヒュ−ズ作動時の溶融ヒュ−ズエレメン
トの濡れ面積が小となるが、帯状導体表出部における低
融点可溶金属片を接合した部分の面積S2と前記面積S1
との比S2/S1、帯状導体表出部間の間隔L、低融点可
溶金属片の体積V、帯状導体表出部面積S1並びに帯状
導体表出部における低融点可溶金属片を接合した部分の
面積S2との間に、実験結果に基づく特定の関係を付与
して、帯状導体表出部が小さくても、溶融金属の分断を
充分迅速に生じさせるようにしてあるから、良好な作動
速度を保障できる。
Since the bonding area between the insulating plate and the strip-shaped conductor is made sufficiently wide, the area of the exposed portion of the strip-shaped conductor becomes small and the molten fuse element is wet when the fuse is in operation. Although the area is small, the area S 2 of the portion where the low melting point fusible metal piece is joined in the exposed portion of the strip-shaped conductor and the area S 1 are
To the ratio S 2 / S 1 , the interval L between the exposed portions of the strip conductor, the volume V of the low melting point soluble metal piece, the area S 1 of the exposed portion of the strip conductor and the low melting point soluble metal piece in the exposed portion of the strip conductor. Since a specific relationship based on the experimental result is given to the area S 2 of the portion where the is joined, the molten metal can be fragmented sufficiently quickly even if the strip-shaped conductor exposed portion is small. Can assure a good operating speed.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1の(イ)は本発明に係るヒュ−ズの一例を
示す断面説明図、図1の(ロ)は同じく平面説明図、図
1の(ハ)は同じく底面説明図である。
1A is a cross-sectional explanatory view showing an example of a fuse according to the present invention, FIG. 1B is a plan explanatory view thereof, and FIG. 1C is a bottom explanatory view thereof. is there.

【図2】本発明において使用する帯状導体の一例を示す
斜視図である。
FIG. 2 is a perspective view showing an example of a strip-shaped conductor used in the present invention.

【図3】本発明に係るヒュ−ズの別例を示す平面説明図
である。
FIG. 3 is an explanatory plan view showing another example of the fuse according to the present invention.

【図4】本発明の実施例の寸法を表すために使用した説
明図である。
FIG. 4 is an explanatory diagram used for expressing the dimensions of the embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 絶縁プレ− 2 帯状導体 21 帯状導体端部 22 帯状導体表出部 3 低融点可溶金属片 4 フラックス 5 絶縁被覆層 DESCRIPTION OF SYMBOLS 1 Insulation pre-2 Band-shaped conductor 21 Band-shaped conductor end 22 Band-shaped conductor exposed part 3 Low melting point fusible metal piece 4 Flux 5 Insulation coating layer

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】絶縁プレ−トの裏面に一対の帯状導体の各
端部を当接し、これら各端部のほぼ中央部を同上絶縁プ
レ−トの表面に表出させると共に絶縁プレ−トと帯状導
体との間を接着し、前記の帯状導体表出部間に低融点可
溶金属片を橋設し、絶縁プレ−トの表面上に絶縁層を被
覆したヒュ−ズにおいて、上記絶縁プレ−トと帯状導体
との接着面積S0と帯状導体表出部面積S1との比S1
0を0.01〜0.2とし、帯状導体表出部における
低融点可溶金属片を接合した部分の面積S2と前記面積
1との比S2/S1を0.7以下とし、帯状導体表出部
間の間隔L、低融点可溶金属片の体積V、帯状導体表出
部面積S1並びに帯状導体表出部における低融点可溶金
属片を接合した部分の面積S2との間に、(S1+S2
L≧4.7Vの関係を付与したことを特徴とする薄型ヒ
ュ−ズ。
1. An end face of a pair of strip-shaped conductors is brought into contact with the back surface of an insulating plate, and a substantially central part of each end part is exposed on the surface of the insulating plate. In a fuse in which a band-shaped conductor is adhered, a low melting point fusible metal piece is bridged between the exposed parts of the band-shaped conductor, and an insulating layer is coated on the surface of the insulating plate, The ratio S 1 of the adhesion area S 0 between the belt and the strip conductor and the area S 1 of the exposed portion of the strip conductor
The S 0 and 0.01 to 0.2, a ratio S 2 / S 1 between the partial area S 2 of bonding the low melting point soluble metal pieces in strip conductor exposed portion and the area S 1 0.7 or less And the space L between the exposed portions of the strip-shaped conductor, the volume V of the low melting point soluble metal piece, the area S 1 of the exposed portion of the strip conductor and the area S of the portion where the low melting point soluble metal piece is joined in the exposed portion of the strip conductor. between the 2, (S 1 + S 2 )
A thin fuse having a relationship of L ≧ 4.7V.
JP34980493A 1993-12-30 1993-12-30 Thin fuse Expired - Fee Related JP3304179B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34980493A JP3304179B2 (en) 1993-12-30 1993-12-30 Thin fuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34980493A JP3304179B2 (en) 1993-12-30 1993-12-30 Thin fuse

Publications (2)

Publication Number Publication Date
JPH07201265A true JPH07201265A (en) 1995-08-04
JP3304179B2 JP3304179B2 (en) 2002-07-22

Family

ID=18406231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34980493A Expired - Fee Related JP3304179B2 (en) 1993-12-30 1993-12-30 Thin fuse

Country Status (1)

Country Link
JP (1) JP3304179B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067282A1 (en) * 2001-02-20 2002-08-29 Matsushita Electric Industrial Co., Ltd. Thermal fuse
JP2003007185A (en) * 2001-06-19 2003-01-10 Matsushita Electric Ind Co Ltd Thermal fuse
US7477130B2 (en) 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
JP2010522420A (en) * 2007-03-26 2010-07-01 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Fusible gold element, thermal fuse with fusible gold element, and method for manufacturing a thermal fuse

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002067282A1 (en) * 2001-02-20 2002-08-29 Matsushita Electric Industrial Co., Ltd. Thermal fuse
US7068141B2 (en) 2001-02-20 2006-06-27 Matsushita Electric Industrial Co., Ltd. Thermal fuse
JP2003007185A (en) * 2001-06-19 2003-01-10 Matsushita Electric Ind Co Ltd Thermal fuse
JP4734778B2 (en) * 2001-06-19 2011-07-27 パナソニック株式会社 Thermal fuse
US7477130B2 (en) 2005-01-28 2009-01-13 Littelfuse, Inc. Dual fuse link thin film fuse
JP2010522420A (en) * 2007-03-26 2010-07-01 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Fusible gold element, thermal fuse with fusible gold element, and method for manufacturing a thermal fuse

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