JPH0719159Y2 - Integrated circuit cooling element structure - Google Patents

Integrated circuit cooling element structure

Info

Publication number
JPH0719159Y2
JPH0719159Y2 JP15243388U JP15243388U JPH0719159Y2 JP H0719159 Y2 JPH0719159 Y2 JP H0719159Y2 JP 15243388 U JP15243388 U JP 15243388U JP 15243388 U JP15243388 U JP 15243388U JP H0719159 Y2 JPH0719159 Y2 JP H0719159Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
cooling element
bellows
element structure
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15243388U
Other languages
Japanese (ja)
Other versions
JPH0273742U (en
Inventor
政博 御代
幸寿 勝山
治彦 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15243388U priority Critical patent/JPH0719159Y2/en
Publication of JPH0273742U publication Critical patent/JPH0273742U/ja
Application granted granted Critical
Publication of JPH0719159Y2 publication Critical patent/JPH0719159Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【考案の詳細な説明】 〔概要〕 冷却水を冷媒とする水冷方式コンピュータにおける集積
回路の冷却素子構造に関し、 冷却素子のろう付、溶接等の接合方法を廃止して、廉価
で、しかも冷媒の漏出がなく、システムの信頼性を著し
く向上させる冷却素子構造を提供することを目的とし、 プリント基板上の集積回路に冷媒供給プレート側から冷
媒を供給する冷却素子構造において、 上記集積回路と接触するフラットな冷却用底部と、上端
縁を外方に折曲形成した折曲端縁とを上下に一体形成し
たベローズと、冷媒供給用プレートに固定されるととも
に、内周に切欠段部を備えたフランジとから成り、上記
フランジの切欠段部にベローズ上端の折曲端縁を載置
し、シールリングで押圧固定する構成とする。
DETAILED DESCRIPTION OF THE INVENTION [Overview] Regarding a cooling element structure of an integrated circuit in a water-cooled computer in which cooling water is used as a refrigerant, a joining method such as brazing or welding of the cooling element is abolished, and it is inexpensive and the refrigerant In order to provide a cooling element structure that does not leak and that significantly improves the reliability of the system, in the cooling element structure that supplies the coolant from the coolant supply plate side to the integrated circuit on the printed circuit board, the cooling circuit contacts the integrated circuit. A bellows integrally formed with a flat cooling bottom part and a bent end edge formed by bending the upper end outwardly, and a bellows fixed to the refrigerant supply plate and provided with a notched step part on the inner circumference. A flange, the bent end edge of the upper end of the bellows is placed on the notched step portion of the flange, and is pressed and fixed by a seal ring.

〔産業上の利用分野〕[Industrial application field]

本考案は、冷却水を冷媒とする水冷方式コンピュータに
おける集積回路の冷却素子構造に関する。
The present invention relates to a cooling element structure of an integrated circuit in a water-cooled computer using cooling water as a coolant.

〔従来の技術〕[Conventional technology]

従来、この種の冷却素子は、第2図に示すように、プリ
ント基板1に搭載されている集積回路2と、冷媒(冷却
水)3を供給する冷媒供給プレート4との間に設定され
ており、この構成は、集積回路2に接触する冷却板5
と、冷媒供給プレート4にビス止め固定されるフランジ
6と冷却板5との間に、その上下端が接合される可撓性
を備えたベローズ7とから成っている。
Conventionally, this type of cooling element is set between an integrated circuit 2 mounted on a printed circuit board 1 and a coolant supply plate 4 for supplying a coolant (cooling water) 3, as shown in FIG. In this configuration, the cooling plate 5 that contacts the integrated circuit 2
And a flexible bellows 7 having upper and lower ends joined between a cooling plate 5 and a flange 6 fixed to the coolant supply plate 4 with screws.

そして、冷却板5及びフランジ6に対してベローズ7を
接合する手段としては、軟ろう付(Sn-Pb、Ag-Pbハン
ダ)、あるいは溶接(電子ビーム、TIG溶接)が通常、
行われている。
Then, as a means for joining the bellows 7 to the cooling plate 5 and the flange 6, soft brazing (Sn-Pb, Ag-Pb solder) or welding (electron beam, TIG welding) is usually used.
Has been done.

叉、フランジ6に設けられた室には、設計上の僅かな誤
差等により生ずるプレート4とフランジ6間の隙間から
冷媒3が漏出することを防止するため、Oリング等のシ
ールリング9が埋設されている。
In addition, a seal ring 9 such as an O-ring is embedded in the chamber provided in the flange 6 in order to prevent the refrigerant 3 from leaking through the gap between the plate 4 and the flange 6 caused by a slight design error or the like. Has been done.

〔考案が解決しようとする課題〕[Problems to be solved by the device]

しかし、従来の冷却素子構造においては、冷却板5及び
フランジ6に対して、ベローズ7を、第2図中符号8で
示す接合箇所の周方向に均一に接合しなければならず、
良好な接合状態を得るには、熟練した技術が必要であ
り、万一、接合不良が生じた場合には、冷媒の漏出に伴
い、システムの信頼性が大きく低下するという欠点が指
摘されていた。
However, in the conventional cooling element structure, the bellows 7 must be evenly joined to the cooling plate 5 and the flange 6 in the circumferential direction of the joining portion indicated by reference numeral 8 in FIG.
It has been pointed out that skilled technology is required to obtain a good joining state, and if a joining failure occurs, the reliability of the system will be greatly reduced due to leakage of the refrigerant. .

また、接合手段として溶接方法に依った場合、熟練した
作業に加えてコスト高になる等の問題もあった。
Further, when the welding method is used as the joining means, there is a problem that the cost becomes high in addition to the skilled work.

そこで、本考案の目的とする処は、集積回路における冷
却素子構造において、従来の軟ろう付、溶接といった接
合手段を廃止し、冷却板とベローズを一体化するととも
に、大幅なコストダウンが図れ、しかも冷媒の漏出が確
実に防止でき、システムの信頼性を著しく向上させるよ
うにした冷却素子構造を提供することにある。
Therefore, the object of the present invention is to abolish the conventional joining means such as soft brazing and welding in the cooling element structure in the integrated circuit, integrate the cooling plate and the bellows, and significantly reduce the cost. Moreover, it is another object of the present invention to provide a cooling element structure capable of reliably preventing leakage of the refrigerant and significantly improving the reliability of the system.

〔課題を解決するための手段〕[Means for Solving the Problems]

プリント基板10上の集積回路11に冷媒供給プレート13側
から冷媒を供給する冷却素子構造において、 上記集積回路と接触するフラットな冷却用底部14と、上
端縁を外方に折曲形成した折曲端縁15とを上下に一体形
成したベローズ16と、冷媒供給用プレートに固定される
とともに、内周に切欠段部18を備えたフランジ17とから
成り、上記フランジの切欠段部にベローズ上端の折曲端
縁を載置し、シールリングで押圧固定したことを特徴と
する。
In the cooling element structure for supplying the refrigerant from the side of the refrigerant supply plate 13 to the integrated circuit 11 on the printed circuit board 10, a flat cooling bottom portion 14 which comes into contact with the integrated circuit and a bent portion formed by bending the upper end outwardly. The bellows 16 integrally formed with the end edge 15 in the upper and lower sides, and a flange 17 fixed to the refrigerant supply plate and provided with a notch step portion 18 in the inner periphery, the notch step portion of the flange of the bellows upper end It is characterized in that the bent edge is placed and pressed and fixed by a seal ring.

〔作用〕[Action]

以上の構成に基づき、本考案は、従来、冷媒の漏出防止
機能しか有しなかったシールリングにベローズの固定機
能を付加したもので、この結果、ベローズの一体化と相
まって冷却素子の接合箇所が不要となる。叉、従来、熟
練を要した軟ろう付、あるいは、溶接等の手段を廃止で
き、大幅な工数削減が可能となり、また、接合不良によ
る冷媒の漏出が確実に防止できる。
Based on the above configuration, the present invention adds a bellows fixing function to a seal ring that has conventionally only had a refrigerant leakage prevention function, and as a result, the joint portion of the cooling element is combined with the integration of the bellows. It becomes unnecessary. In addition, the conventional techniques such as soft brazing or welding which require skill can be eliminated, the man-hours can be greatly reduced, and the leakage of the refrigerant due to the defective joint can be reliably prevented.

〔実施例〕〔Example〕

以下、本考案による冷却素子構造の一実施例について、
第1図を基に詳細に説明する。
An embodiment of the cooling element structure according to the present invention will be described below.
A detailed description will be given with reference to FIG.

第1図は、水冷方式コンピュータの集積回路における冷
却素子構造を示す部分断面図であり、図面において、セ
ラミック基板等のプリント基板10の一面に集積回路11が
搭載されており、これらプリント基板10、集積回路11と
対向して、所定距離、離間させて、冷媒(冷却水)12を
供給する冷媒供給プレート13が配設されている。
FIG. 1 is a partial cross-sectional view showing a cooling element structure in an integrated circuit of a water-cooled computer, in which an integrated circuit 11 is mounted on one surface of a printed board 10 such as a ceramic board. A coolant supply plate 13 that supplies a coolant (cooling water) 12 is arranged facing the integrated circuit 11 at a predetermined distance from each other.

そして、集積回路11と冷媒供給プレート13との間に、本
考案による冷却素子が設定されている。
The cooling element according to the present invention is set between the integrated circuit 11 and the coolant supply plate 13.

この冷却素子は、集積回路11と接触するフラットな冷却
用底部14と、上端縁を外方に折曲形成した折曲端縁15と
をその上下に一体形成したベローズ16と、このベローズ
16を冷媒供給プレート13に取付けるフランジ17とから構
成されている。
This cooling element includes a bellows 16 in which a flat bottom portion 14 for contact with the integrated circuit 11 and a bent edge 15 having an upper edge bent outward are integrally formed above and below the bellows 16.
And a flange 17 for mounting the cooling medium supply plate 13 on the cooling medium supply plate 13.

このフランジ17は図示しないビスにより冷媒供給プレー
ト13に固定されるとともに、内周に切欠段部18が形成さ
れており、第1図中拡大して示すように、このフランジ
17の切欠段部18に、ベローズ16の折曲端縁15を載置し、
更に、その上側にOリング19を装入させることにより、
Oリング19の弾性力で、ベローズ16を、冷媒供給プレー
ト13側に強固に取付固定できる。
The flange 17 is fixed to the refrigerant supply plate 13 by a screw (not shown), and a notch step portion 18 is formed on the inner periphery thereof. As shown in an enlarged view in FIG.
Place the bent edge 15 of the bellows 16 on the notch step portion 17 of 17,
Furthermore, by inserting the O-ring 19 on the upper side,
The bellows 16 can be firmly attached and fixed to the refrigerant supply plate 13 side by the elastic force of the O-ring 19.

このように、本考案による冷却素子構造は、ベローズ16
と冷却用底部14とを一体成形するとともに、ベローズ16
上部の折曲端縁15をフランジ17の切欠段部18に掛け止め
載置したうえで、Oリング19により押圧保持するという
ものであるから、簡単に組付けが完了し、大幅なコスト
ダウンが期待でき、しかも冷媒12の漏出も確実に防止で
きることは言う迄もない。
Thus, the cooling element structure according to the present invention has a bellows 16 structure.
And the bottom 14 for cooling are integrally molded, and the bellows 16
Since the upper bent edge 15 is hooked on the notch step portion 18 of the flange 17 and then pressed and held by the O-ring 19, the assembly is completed easily and the cost is greatly reduced. It goes without saying that the refrigerant 12 can be expected and the leakage of the refrigerant 12 can be surely prevented.

更に、ベローズ16と冷却用底部14との一体成形方法は、
ベリリウム銅、リン青銅等のプレート状の素材を筒状に
絞り成形した後、液圧成形によりベローズ16の形状出し
を行い、酸洗行程でバネ定数の調整を行うといった機械
成形でもよい。
Further, the integral molding method of the bellows 16 and the cooling bottom portion 14 is
Mechanical forming may be performed by drawing a plate-shaped material such as beryllium copper or phosphor bronze into a cylindrical shape, then forming the bellows 16 by hydraulic forming, and adjusting the spring constant in the pickling process.

〔考案の効果〕[Effect of device]

以上記載したように、本考案による冷却素子構造によれ
ば、冷却素子の接合箇所をなくし、従来、熟練を要した
軟ろう付、溶接等の煩わしい作業が廃止でき、簡易に組
付けることができるため、大幅なコスト低減が期待でき
るとともに、接合不良による冷媒の漏出も確実に防止で
きるため、システムの信頼性も著しく向上する等の効果
がある。
As described above, according to the cooling element structure of the present invention, it is possible to eliminate the joint portion of the cooling element, eliminate the conventionally troublesome work such as soft brazing, welding, etc., and easily assemble. Therefore, it is possible to expect a significant cost reduction, and it is possible to reliably prevent the leakage of the refrigerant due to a defective joint, so that the reliability of the system is significantly improved.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案による冷却素子構造を示す断面図、 第2図は従来の冷却素子構造を示す断面図である。 図において、 10はプリント基板、11は集積回路、13は冷媒供給用プレ
ート、14は冷却用底部、15は折曲端縁、16はベローズ、
17はフランジ、18は切欠段部、19はOリングである。
FIG. 1 is a sectional view showing a cooling element structure according to the present invention, and FIG. 2 is a sectional view showing a conventional cooling element structure. In the figure, 10 is a printed circuit board, 11 is an integrated circuit, 13 is a coolant supply plate, 14 is a cooling bottom, 15 is a bent edge, 16 is a bellows,
Reference numeral 17 is a flange, 18 is a notch step portion, and 19 is an O-ring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】プリント基板(10)上の集積回路(11)に
冷媒供給プレート(13)側から冷媒を供給する冷却素子
構造において、 上記集積回路(11)と接触するフラットな冷却用底部
(14)と、上端縁を外方に折曲形成した折曲端縁(15)
とを上下に一体形成したベローズ(16)と、冷媒供給用
プレート(13)に固定されるとともに、内周に切欠段部
(18)を備えたフランジ(17)とから成り、上記フラン
ジの切欠段部にベローズ上端の折曲端縁を載置し、シー
ルリングで押圧固定したことを特徴とする集積回路の冷
却素子構造。
1. A cooling element structure for supplying a coolant from a coolant supply plate (13) side to an integrated circuit (11) on a printed circuit board (10), wherein a flat cooling bottom portion which contacts the integrated circuit (11) ( 14) and the bent edge (15) with the upper edge bent outward
A bellows (16) integrally formed on the upper and lower sides, and a flange (17) fixed to the refrigerant supply plate (13) and provided with a notch step portion (18) on the inner circumference. A cooling element structure for an integrated circuit, in which a bent edge at the upper end of a bellows is placed on a step portion and is fixed by pressing with a seal ring.
JP15243388U 1988-11-25 1988-11-25 Integrated circuit cooling element structure Expired - Lifetime JPH0719159Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15243388U JPH0719159Y2 (en) 1988-11-25 1988-11-25 Integrated circuit cooling element structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15243388U JPH0719159Y2 (en) 1988-11-25 1988-11-25 Integrated circuit cooling element structure

Publications (2)

Publication Number Publication Date
JPH0273742U JPH0273742U (en) 1990-06-05
JPH0719159Y2 true JPH0719159Y2 (en) 1995-05-01

Family

ID=31427355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15243388U Expired - Lifetime JPH0719159Y2 (en) 1988-11-25 1988-11-25 Integrated circuit cooling element structure

Country Status (1)

Country Link
JP (1) JPH0719159Y2 (en)

Also Published As

Publication number Publication date
JPH0273742U (en) 1990-06-05

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